JPH08173874A - Paste applicator - Google Patents

Abstract

(57) [Abstract] [Purpose] When drawing multiple patterns on the same board, the drawing order can be automatically determined by inputting the position data of these patterns. . [Structure] When the position data of the patterns pp1 to pp6 to be drawn on the substrate 7 is input, the pattern to be drawn first is determined based on the position data from the carrying-in direction of the substrate 7 to the paste coating machine. It Now, assuming that the substrate 7 is carried in from the right side, this is determined as the pattern pp1, and this pattern pp1 is applied from the starting point s1. Then, when the end point e1 is reached, from the above position data,
Of the remaining patterns pp2 to pp6, a pattern having a start point (end portion) closest to the end point e1 is searched, and if this is the pattern pp2, this pattern pp2 is started to be drawn from the start point s2, and so on. Patterns pp3 to pp6
Drawing order is determined.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention allows a substrate having a desired shape to be formed on a substrate placed on a table by relatively moving the substrate while ejecting the paste from the nozzle. The present invention relates to a paste applicator that applies and draws a paste pattern, and more particularly to a paste applicator that applies and draws a plurality of paste patterns in a predetermined order on the same substrate.

[0002]

2. Description of the Related Art A nozzle is fixed to the tip of a paste container (also called a syringe) containing paste, the nozzle and a substrate placed on a table are opposed to each other, and the paste is discharged from the paste discharge port of the nozzle. An example of a paste applicator using a discharge drawing technique that applies paste in a desired pattern on the substrate by horizontally moving at least one of the nozzle and the substrate while changing the relative positional relationship between them , For example, JP-A-2-52742
No., published in Japanese Unexamined Patent Publication No. This paste applicator applies and draws a resistance paste in a desired pattern on an insulating substrate.

[0003]

Conventionally, when a plurality of paste patterns are to be coated and drawn on the same substrate by a paste coating machine, an operator paints and paints on each substrate.
It was necessary to input the required data such as the position and length of the stop pattern and the drawing order. In particular, when drawing order data is input, it is necessary to review and re-enter the data, even if it takes the intuition and experience of a skilled worker to determine the order, and it takes a lot of time. It was

Naturally, the paste applicator cannot be used while the required data is being input. Each time the board type changes, the worker inputs the required data for drawing,
Preparatory work called so-called changeover is required, and the more the set-up change, the lower the utilization rate of the paste coating machine.

An object of the present invention is to solve such a problem and to input position data of a plurality of paste patterns,
It is an object of the present invention to provide a paste coating machine in which the drawing order of each paste pattern is automatically determined, and the preparation work for coating drawing can be greatly shortened to improve the productivity.

[0006]

In order to achieve the above object, the present invention provides a first means for inputting position data of a paste pattern, and a plurality of means inputted from the first means. Second means for storing the position data of the paste pattern of
Third means for determining the drawing order of each paste pattern from the position data stored in the second means, and a plurality of paste patterns according to the order determined by the third means. And a fourth means for drawing.

The third means is a paste pattern which first draws a paste pattern having an end portion at a position closest to the position immediately below the nozzle when the substrate is loaded. To do.

Further, the third means is a paste pattern for drawing a paste pattern having an end portion at a position closest to the drawing end point of the drawing pattern for which the drawing order has been determined, to the next paste pattern. To do.

[0009]

The third means connects the end points such as the start point and the end point of the drawing of each of the plurality of paste patterns with the shortest path. The drawing distance of each paste pattern itself does not change regardless of the order in which each paste pattern is applied and drawn. Rather than connecting the end points of each paste pattern with the shortest straight path, even if the straight path between the connected end points is not the shortest, the drawing distance of all paste patterns and each paste pattern are included. There is a drawing order with the shortest total sum that connects the endpoints of -n with a straight path.

However, in order to determine such a drawing order, the total extension distance is calculated for a combination of the numbers connecting the end points of each paste pattern, and the total extension distance is the shortest. The number of combinations must be cumulatively increased as the number of paste patterns drawn on the board increases, and conversely, it takes a lot of time to make decisions and the drawing order is difficult. It will not be decided.

Therefore, in the present invention, even if the total extension distance is slightly long, the drawing means is easily determined, and the third processing means can promptly shift to the drawing processing, so that the third means is the end point of the paste pattern. It connects the two with the shortest straight path. Since the number of shortest straight paths decreases as the number of paste patterns for which the drawing order has been determined increases, the drawing order can be easily determined within a short time.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an embodiment of a paste applicator according to the present invention, in which 1 is a nozzle, 2 is a syringe, 3 is an optical rangefinder, 4 is a Z-axis table, 5 is an X-axis. Table, 6 Y-axis table, 7 substrate, 8 θ-axis table, 9 mount, 10 Z-axis table support, 11a
Is an image recognition camera, 11b is a lens barrel, 12 is a nozzle support, 13 is a suction table, 14 is a controller, 15a to 15c are servomotors, 16 is a monitor, 17 is a keyboard, 19
Is an external storage device.

In FIG. 1, an X-axis table 5 is fixed on a mount 9, and a Y-axis table 6 is mounted on the X-axis table 5 so as to be movable in the X-axis direction. The θ-axis table 8 is mounted on the Y-axis table 6 so as to be movable and rotatable in the Y-axis direction, and the suction table 13 is fixed on the θ-axis table 8. The substrate 7 is adsorbed and fixed on the adsorption table 13 so that its sides are parallel to the X and Y axes.

The substrate 7 mounted on the suction table 13 can be moved in the X and Y axis directions by the control drive of the controller 14. That is, when the servo motor 15b is driven by the controller 14, the Y-axis table 6 moves in the X-axis direction and the substrate 7 moves in the X-axis direction, and the servo motor 1 moves.
When 5c is driven, the θ-axis table 8 moves in the Y-axis direction and the substrate 7 moves in the Y-axis direction. Therefore, the control device 1
When the Y-axis table 6 and the θ-axis table 8 are moved by arbitrary distances by 4, the substrate 7 moves by an arbitrary distance in an arbitrary direction in a plane parallel to the pedestal portion 9.

The θ-axis table 8 is a server shown in FIG.
The motor 15d can be rotated about the center position in the θ direction by an arbitrary amount.

A Z-axis table support 10 is installed on the gantry 9, and a Z-axis table 4 is attached to the Z-axis table support 10 so as to be movable in the Z-axis direction (vertical direction). The nozzle 1, the syringe 2, and the optical distance meter 3 are mounted on the Z-axis table 4, and the control device 14 also controls and drives the Z-axis table 4 in the Z-axis direction. That is, when the servo motor 15a is driven by the controller 14, the Z-axis table 4 moves in the Z-axis direction, and the nozzle 1, the syringe 2 and the optical rangefinder 3 move in the Z-axis direction accordingly. To do.

Although the image recognition camera 11a is installed on the left side of the Z table 4 on the Z axis table support 10, the image recognition camera 11a is a movable type and is installed on the right side of the Z axis table support 10. Alternatively, a beam member (not shown) may be provided in front and rear along the left and right sides of the pedestal unit 9 for easy understanding, and the image recognition camera 11a may be installed on the beam member. 11
The installation location of a corresponds to the loading direction of the substrate 7 described later,
It can be moved appropriately.

FIG. 2 is an enlarged perspective view showing a portion of the syringe 2 and the optical displacement gauge 3 in FIG. 1, and the portions corresponding to those in FIG.

In the figure, a triangular notch is formed at the lower end of the optical displacement meter 3, and a light emitting element and a light receiving element are provided at this notch. At the lower end of the syringe 2, there is provided a nozzle support tool 12 that extends to the lower part of the cut portion of the optical displacement meter 3, and the optical displacement meter 3 is provided on the lower surface of the tip of the nozzle support tool 12. The nozzle 1 is attached so as to be located below the notch.

The optical displacement meter 3 measures the distance from the tip of the nozzle 1 to the surface of the substrate 7 by non-contact triangulation. That is, the laser light L emitted from the light emitting element of the optical displacement meter 3 is irradiated to the lower part of the nozzle 1 on the substrate 7 (this irradiation point is referred to as a measurement point S), and is reflected at this measurement point S to be optically reflected. The light is received by the light receiving element of the displacement meter 3. When the distance between the tip of the nozzle 1 (paste ejection port) and the substrate 7 changes, the measurement point S for the point directly below the nozzle 1 on the substrate 7
Position changes, and the light receiving state of the reflected light at the light receiving element changes accordingly. Therefore, by detecting this change, the distance from the tip of the nozzle 1 to the surface of the substrate 7, that is, the height of the nozzle 1 can be measured.

In this case, the light emitting element and the light receiving element are provided on different side surfaces of the cut portion of the optical displacement meter 3 so that the laser beam L is not blocked by the nozzle support 12, and the laser beam L is emitted. The light is emitted in an oblique direction and reflected in an oblique direction.

Here, the measurement point S by the laser beam L is slightly deviated from the position immediately below the nozzle 1 by dX and dY on the substrate 7, but with such deviation, the measurement point on the surface of the substrate 7 is measured. Since there is almost no difference in the unevenness of the surface of the substrate 7 between S and the position immediately below the tip of the nozzle, the distance from the tip of the nozzle 1 to the surface of the substrate 7 immediately below it can be measured almost accurately by the optical displacement meter 3. it can.

FIG. 3 is a block diagram showing a specific example of the control device 14 shown in FIG. 1 and its controlled system. 14a is a microcomputer, 14b is a motor controller, 14e is an external interface, 14d is an image processing device, 14ca is Z
1 is an axis driver, 14cb is an X axis driver, 14cc is a Y axis driver, 14cd is a θ axis driver, 15d is a θ axis motor, 18 is an A / D converter, E is an encoder, and PP is a paste pattern. The same symbols are attached to the parts to be marked.

In the figure, the microcomputer 14a is a CPU
Or a ROM that stores a software processing program for drawing a paste pattern PP, which will be described later, a RAM that stores processing results by the CPU and input data from the external interface 14e and the motor controller 14b, the external interface 14e and the motor controller 14b. It is equipped with an input / output unit for exchanging data with. This R
The AM also stores various data (nozzle setting height, threshold value, etc.) relating to a paste pattern, which will be described later, input from the keyboard 17 at the time of initial setting.

From the data input device such as the keyboard 17, data for designating the shape of the paste pattern to be drawn or data for designating the distance between the nozzle 1 and the substrate 7 for determining the thickness of the paste pattern. (Nozzle setting height or threshold value) and the like are input and supplied to the microcomputer 14a via the external interface 14e. In the microcomputer 14a, these data are processed using the CPU and RAM according to the software program stored in the ROM.

The motor controller 14 is operated according to the data designating the shape of the paste pattern thus processed.
b is controlled, X-axis driver 14cb, Y-axis driver 1
The X-axis motor 15b, the Y-axis motor 15c, or the θ-axis motor 15d is rotationally driven by the 4 cc or θ-axis driver 14cd. Further, encoders E are provided on the rotary shafts of these motors, and the rotation amounts (driving operation amounts) of the respective motors are detected by the encoders E to drive the X-axis driver 14cb, the Y-axis driver 14cc, the θ-axis driver 14cd, or the motor controller 14b. It is fed back to the microcomputer 14a via the X-axis motor 15b, the Y-axis motor 15c, or the θ-axis motor 15d so that the X-axis motor 15b, the Y-axis motor 15c, or the θ-axis motor 15d accurately rotates by the rotation amount designated by the microcomputer 14a. As a result, the predetermined paste pattern is drawn on the substrate 7.

During the drawing of the paste pattern, the measurement data of the optical displacement meter 3 is converted into digital data by the AD converter 18, supplied to the microcomputer 14a via the external interface 14e, and stored in the RAM by this CPU. The threshold value is compared with the above threshold value.

Therefore, if there is undulation on the surface of the substrate 7,
The microcomputer 14a detects this by the above comparison, controls the motor controller 14b based on the comparison result, and rotationally drives the Z-axis motor 18 by the Z-axis driver 11cd. As a result, the Z-axis table 4 (FIG. 1) is displaced up and down, and the height of the paste discharge port of the nozzle 1 (FIG. 2) from the surface of the substrate 7 is maintained at the nozzle set height. This Z
The rotary shaft of the shaft motor 18 is also provided with an encoder E, which feeds back the rotation amount of the Z-axis motor 18 to the microcomputer 14a via the Z-axis driver 11cd and the motor controller 14b, so that the Z-axis motor 18 operates. The microcomputer 14a is controlled to rotate exactly by the amount of rotation designated.

During this time, air pressure is applied to the syringe 2 to eject the paste from the nozzle 1, and a paste pattern having a desired width and a desired height is applied and drawn on the substrate 7.

Next, the coating and drawing operation of the embodiment shown in FIG. 1 and the determination of the drawing order by the drawing order determining means incorporated in the microcomputer 14a in FIG. 3 will be described.

There are four possible modes of loading the substrate into the paste applicator, as shown in FIGS. That is, (1) carry-in from the left side of the paste applicator as seen from the operator OP (FIG. 4A). (2) carry-in from the right side of the paste coater as seen from the operator OP (FIG. 4). (B)) (3) Carrying in from the front side of the paste applicator viewed from the operator OP (Fig. 4 (c)) (4) Carrying in from the rear side of the paste applicator viewed from the worker OP. (Fig. 4 (d)).

In these cases, the suction table 1 on which the substrate 7 is placed
In order to facilitate the carry-in, 3 is brought close to the carry-in side of the substrate 7, as shown in FIGS. here,
It is assumed that the nozzle 1 is fixed without moving in the X and Y axis directions, that is, left and right and front and rear, and the substrate 7 moves. Therefore, depending on the loading direction of the substrate 7, the nozzle of the substrate 7 closest to the nozzle 1 is moved. The side edges are different.

A paste coating machine of this type is installed in a production line, and the substrate 7 advances along the production flow of the production line. Therefore, the loading direction of the substrate 7 does not change within the manufacturing line. In addition, according to the carrying-in direction, once the image recognition camera 11a is installed on the beam member or the Z-axis table supporting unit 10 not shown, the installation position is changed unless the manufacturing line itself is changed. It never happens.

Now, as shown in FIG. 5, six paste patterns pp1 to pp6 are applied and drawn on the same substrate 7. In this case, the drawing sequence determining means built in the microcomputer 14a, which is the center of this embodiment, has the substrate 7 loaded therein, that is, the suction table 13 as the paste pattern pp for the first application drawing. With the substrate 7 placed, the paste pattern pp closest to the nozzle 1 is selected. For example, as shown in FIG. 4B, when the substrate 7 is loaded from the right side of the paste applicator as seen from the operator OP, the paste pattern pp1 shown in FIG. 5 is first applied and drawn. Set as a paste pattern.

Start points (drawing start points) s1 to s6 and end points (drawing end points) e1 of the respective paste patterns pp1 to pp6.
As e6 is predetermined, the paste pattern
When the application and drawing of the paste pp1 is completed, next, the paste pattern pp2 (starting point s2) having the closest start point to the end point e1 of the paste pattern pp1 is selected as the paste pattern to be applied and drawn next. By repeating the processing, the substrate 7 is moved and the relative positional relationship between the nozzle 1 and the substrate 7 is changed so that coating drawing is performed along the paths shown by the solid line and the dotted line in FIG.

Note that, in FIG. 5, solid arrows indicate drawing and applying paths of paste patterns, and broken arrows indicate moving paths between paste patterns. Here, the paste patterns pp1, pp2, pp3, pp6, pp5, p
Application drawing is performed in the order of p4. The drawing order selection decision will be described later in detail.

In connection with the determination of the drawing order, as shown in FIG. 6, the microcomputer 14a completes the application order data file DF2 based on the application data file DF1 in the RAM, and hereinafter, these data file DF1. , DF2
Based on the above, the coating and drawing operation of each paste pattern pp1 to pp6 is executed.

Next, the operation and operation of this embodiment will be concretely described based on the software chart showing the program stored in the ROM in the microcomputer 14a.

In FIG. 7, first, when the power of the paste applicator (FIG. 1) is turned on (step 100), the paste applicator is initialized (step 20).
0).

This initial setting process, as shown in FIG.
Confirm the origin position of each table 4-8 (Step 20
1) The pattern data of the paste film and the substrate positioning data are set (step 202), and further the data of the paste ejection end position is set (step 20).
3) It is.

When this initial setting process is completed, the process proceeds to the coating order determination processing step (step 300). Figure 9
This will be described below.

First, from the pattern data of the paste film set in step 202 of FIG. 8, the data of all coating start points (start points) are read (step 301), and then the first. The paste pattern to be applied to, that is, the first application pattern is determined, and the application start point data of that pattern is set to the application order 1 in the application sequence data file DF2 shown in FIG. Store in correspondence with the column (step 30
2). Here, the paste pattern pp1 in FIG.
Is determined as the first coating pattern.

Although not shown, the paste pattern in which the order has been determined is the coating data file D in FIG.
The order determination target is released such that a flag is set on each paste pattern of F1 so that it is not subject to the order determination again. According to this, as the order determination progresses, the number of paste patterns subject to the order determination decreases, so that the order determination is performed in a shorter time.

The determination of the first coating pattern will be described later in detail with reference to FIG.

Returning to FIG. 9, next, the end point of the pattern applied immediately before is calculated (step 303). Since this process is a preparation for determining the paste pattern to be applied next, the paste pattern applied immediately before is seen from the viewpoint of the next application pattern. For the second coating pattern, the end point of the first coating pattern will be obtained.

The above "calculate" is based on the setting method of each paste pattern. If the paste pattern is set by all the coating position data of the paste pattern, a huge amount of data will be stored in the R of the microcomputer 14a.
It must be stored in the AM and requires a large capacity RAM. Therefore, for example, if the paste pattern is set by sequentially designating the traveling direction and the traveling change position for each paste pattern in FIG. 5, the RAM storage data amount is greatly reduced. it can. In such a case, the position data
This means that the data cannot be retrieved immediately and will be calculated and obtained.

Next, this starting point of the coating pattern whose starting point is closest to the ending point of the paste pattern applied immediately before obtained in step 303 is the starting point of the remaining coating patterns read in step 301. Search from (Step 3
04).

Here, the paste pattern in which the starting point is retrieved
Is stored as a second coating pattern in association with the column of coating order 2 in the coating order data file DF2 shown in FIG. 6 (step 305). In FIG. 6, FIG.
The paste pattern pp2 shown in (1) is determined as the second coating pattern. This determination process (step 3
04) will be described later in detail with reference to FIG.

Next, it is judged whether or not the coating order has been determined (finished) for all patterns pp1 to pp6 (step 306). If not finished, the process returns to step 303 to continue the above determination processing. All patterns pp1 to pp
When the coating order for No. 6 is determined, this coating order determination process (step 300) ends.

Here, referring to FIG. 10, the first in FIG.
Of coating pattern determination and order storage (step 30)
2) will be described.

First, as shown in FIG. 4, data indicating from which direction the substrate 7 is carried in is input (step 302-1). Next, based on this input data, it is determined whether or not it is carried in from the left side (step 302-
2). If the substrate 7 is loaded from the left side, the substrate 7
Of the paste patterns applied in the first quadrant or the fourth quadrant with the center of the origin as the origin, the application pattern having the closest starting point to the nozzle 1 is selected as the first application pattern. (Determine) (step 302-3).

Next, it is judged whether or not this selection is completed (step 302-4).
If not completed, proceed to -6 and select the paste pattern closest to the nozzle 1 among the paste patterns applied in the second quadrant or the third quadrant (step 302-5).

As described above, when the substrate 7 is loaded from the left side, the first coating pattern is surely selected by the processing of either step 302-3 or step 302-5.

If the substrate 7 is not loaded from the left side, it is determined whether it is loaded from the right side (step 302-
6) In case of loading from the right side, step 302-
Similar processing is performed according to Nos. 7 to 302-9, and the first coating pattern is selected.

If the substrate 7 is not loaded from the right side,
It is determined whether or not it is loaded from the rear side (step 302
-10), the first coating pattern is selected in steps 302-11 to 302-13, and similarly, when the first coating pattern is carried in from the front side (step 302-14), step 3
The first coating pattern is selected by 02-14 to 302-17.

Steps 302-2, 302-6, 302
If the selection is completed by either -10 or 302-14,
The one selected as the first coating pattern is stored in the coating order data file DF2 in FIG. 6 (step 302-18). In the example shown in FIG. 6, since the paste pattern pp1 is selected as the one closest to the nozzle 1, the substrate 7 is loaded from the right side.

Next, the process (step 304) of searching the coating start point of the coating pattern closest to the end point in FIG. 9 will be described with reference to FIG.

First, all the starting point data of the coating patterns for which the coating order has not been determined are read (step 304-1). Taking as an example the determination of the second coating pattern in FIG.
Undetermined coating patterns are paste patterns pp2 to pp
6 is applicable.

Next, using the coordinate (position) data of the starting points s2 to s6 of the undetermined patterns pp2 to pp6, the paste pattern pp1 selected as the first coating pattern.
The straight line distance from the end point e1 of the (step 304-
2). Since this distance is a stroke in which the nozzle 1 interrupts the paste discharge and simply moves relative to the next starting point, the second coating pattern is a linear distance so as to move in the shortest time. Is for selecting.

[Delta] in step 304-2 in FIG.
X and .DELTA.Y are position deviations on the X axis and the Y axis between the end point e1 of the paste pattern pp1 and the start points s2 to s6 of the undetermined patterns pp2 to pp6, respectively.

The minimum value pattern is selected from the movement distances S between the patterns (step 304-3). Since it is expected that there are a plurality of undecided patterns having the minimum value, it is judged whether the number of undecided patterns having the minimum value is 1 (step 304-4). Two
If the number is equal to or larger than the number, an undetermined pattern having a starting point with the shortest X-axis direction distance is selected (step 304-5).

Then, it is judged whether or not the selection is effective (step 304-6), and if the selection in the X-axis direction cannot be made, that is, if the pattern to be applied in the X-axis direction does not exist. , An undetermined pattern having a starting point with the shortest Y-axis direction distance is selected, and this is set as the second coating pattern, and the processing is terminated (step 304-7).

When determining the third coating pattern,
Based on the selected second coating pattern, it is similarly determined according to the above-described processing of FIG. In the case of the example shown in FIG. 5, the application sequence data file DF2 is created in the form shown in FIG.

In FIG. 11, step 304-
5 and step 304-7 may be interchanged. Figure 11
In the case of the processing shown in (1), the coating and drawing generally gives priority to the shift in the horizontal direction, and steps 304-5 and 304 are performed.
In the case of the processing in which -7 is replaced, the coating drawing shift in the vertical direction is performed.

As described above, in this embodiment, even an inexperienced operator can be skilled only by inputting the data such as the position and length of each paste pattern to be applied and drawn on the substrate 7. The drawing order of these paste patterns is automatically determined without the operator's intuition or experience, and it is possible to immediately move to the coating drawing process without the need for review and re-entry of data. It becomes easy to replace and the utilization rate of the paste coating machine is greatly improved.

Further, as described above, in the type in which the substrate 7 can be carried in from four sides of the paste coating machine, if the carrying-in direction of the substrate is set, the drawing order is automatically determined thereafter, and the immature Even a poor worker can immediately start up the device.

In this way, when the application sequence determination process (step 300) of the paste applicator in FIG. 7 is completed,
The process proceeds to the next substrate mounting process (step 400) in FIG.
In this process, the substrate 7 is placed on the suction table 13 (FIG. 1), and then the substrate 7 is positioned (step 500).

Preliminary positioning of the substrate 7 will be described with reference to FIG.

In the figure, it is provided on the substrate 7 and
The positioning mark in the camera field of view is read (that is, photographed) by the image recognition camera 11a (FIG. 1) (step 501), and the barycentric position of the positioning mark in the camera field of view is measured (step 502). .

The center of gravity position measurement is performed based on a known image recognition technique, and a description thereof will be omitted.

Next, the amount of deviation between the center of the camera field of view and the center of gravity of the positioning mark is calculated (step 503), and the amount of movement (operation) of each table 6, 8 in FIG. 1 is calculated based on this calculated amount of deviation. It is calculated (step 504), the operation amount is set in the motor controller 14b shown in FIG. 3 (step 505), and the tables 6 and 8 are moved appropriately (step 506).

The center of the camera field of view should coincide with the center of gravity of the positioning mark by such movement, but as a precaution, the position of the center of gravity of the positioning mark in the camera field of view is measured again (step 507). The amount of deviation between the center and the center of gravity of the positioning mark is calculated (step 5
08), it is confirmed whether or not the deviation amount is within the allowable range of positioning (step 509). If it is out of the range, the process returns to step 504 to repeat the above processing, and if it is within the range. The substrate positioning process (step 500) is completed, and the process proceeds to paste film formation (step 600) in FIG.

The paste film forming process (step 600) will be described below with reference to FIG.

In the figure, first, the substrate 7 is moved to the coating start position (step 601). As described above, the paste pattern pp1 shown in FIG. 5 is the first coating pattern. However, when the substrate 7 is positioned, the paste pattern pp1 is located immediately below the nozzle 1. Since there is no starting point S1 of pp1, the starting point S1 of the paste pattern pp1 is located immediately below the nozzle 1. Since the positioning of the substrate 7 only moves the substrate 7 slightly from the carry-in position, it can be considered that the substrate 7 is generally moved from the carry-in place to the coating start position. Therefore, this means that the substrates 7 are moved in the shortest time, which leads to an improvement in the number of processed substrates (throughput).

Next, the nozzle height is set (step 60).
2) The paste ejection from the nozzle 1 and the pattern operation are started (step 603). This paste ejection is shown in FIG.
In (1), the paste of the syringe 2 is pressurized with a discharge pressure by means not shown. In the pattern operation, the nozzles 1 and the substrate 7 are relatively moved by the tables 6 and 8 in accordance with the shape of the paste pattern pp1 shown in FIG.

By simultaneously advancing the paste discharge and the pattern operation, the paste pattern pp1 is applied and drawn on the substrate 7. In addition, the undulation of the substrate surface is measured from the distance between the nozzle 1 and the substrate surface by the optical distance meter 3 while the paste ejection and the pattern operation are in progress at the same time, that is, during coating and drawing (step 604), and the distance is a constant value. (=
If it is less than or equal to the set height of the nozzle-the height of the paste pattern), it means that the optical rangefinder 3 is measuring the distance on the paste pattern which has been applied and drawn (step 60).
5). At this time, the nozzle 1 is maintained at the height at the time of measurement, and the process proceeds to step 608 described later.

If the measured distance is not less than the fixed value, it means that the distance is not measured on the paste film. Therefore, Z-axis correction data is calculated according to the waviness of the substrate 7 (step 606) and the Z-axis table is calculated. 8 is operated to correct the nozzle 1 so that it has the set height (step 60).
7). Then, it is determined whether or not the paste ejection has ended, that is, whether or not the end point e1 (FIG. 5) of the paste pattern pp1 has been reached (step 608). If the ejection has ended, paste ejection end processing is performed (step 609). If the discharge is not completed, the paste discharge is continued and step 60
Returning to step 4, the above processing is repeated.

When the discharge of the paste is completed, the nozzle 1 is then raised (step 610). This allows
Although the drawing of one paste pattern pp1 is completed,
Next, it is confirmed whether or not all the paste patterns pp have been drawn (step 611). When it is determined that the drawing has not been completed, the process returns to step 601 and the remaining paste patterns pp are drawn.

In this case, the application sequence data file DF2 in FIG. 6 is viewed, and the paste pattern p to be applied next.
The starting point data of p is automatically given, and based on this starting point data, step 60 is performed without bothering the operator.
The processes after 1 are automatically executed.

When the drawing of all the paste patterns pp to be applied to one substrate 7 is completed, the substrate 7 is discharged (the substrate is carried out from the paste applying machine) in FIG. Check if the coating work on the substrate 7 is completed (step 800),
If it is a condition to be carried in, the process returns to step 400 to continue the coating work on a new substrate. If there is no substrate to be loaded, the paste applicator is stopped and the work is completed.

Although one embodiment of the present invention has been described above, the present invention may have the following aspects.

(1) As shown in FIG. 14, in the coating order determining step (step 300), step 302 and step 303 may be replaced with each other.

(2) In the past coater of the type in which the image recognition camera 11a is fixed to the Z-axis support portion 10 or the beam member and cannot be moved, at the time when the substrate is carried in in determining the first coating pattern. In the substrate prepositioning step (step 500) shown in FIG. 7, the pattern closest to the nozzle is set as the first coating pattern without setting the pattern closest to the nozzle as the first coating pattern. It is preferable that the substrate movement is the shortest.

(3) When the substrate is large and the number of patterns to be applied is large, the substrate is appropriately numbered, and a plurality of paste patterns are applied and drawn in each address.
The coating order is determined for each of the substrates, and for the adjacent addresses, the one to be applied first and the one to be applied last are sequenced to determine the application order of the paste pattern on the entire substrate.

(4) The nozzle 1 is arranged in order from the pattern located farthest from the substrate carry-out position.
The one closest to the image recognition camera 11a or the one that is closest to the image recognition camera 11a is determined, and the coating is performed in order from the closest one.

(5) The order is determined by searching for the end portions of the respective patterns which are at the shortest distance, without paying attention to the start end and the end of each paste pattern.

(6) At step 300 in FIG.
In order to reduce the amount of data stored in RAM, the shape of each pattern is set by relative coordinates on the board.
The end point is calculated at 03. When the number of patterns to be drawn is small, if the pattern data is input in the absolute coordinates of the substrate, the end position can be obtained by searching in step 303, and the order determination can be performed in a shorter time. It

(7) While the paste is being applied, the external storage device 1
9, the pattern data of another type of substrate to be applied next is input, that is, the process of step 202 in FIG. 8 is performed, and in the case of setup change, the data previously input from the external storage device 19 is input. -In order to speed up the start-up by reading the data, or to interrupt the paste application, the data being executed stored in the RAM is transferred to the external storage device 19, Speed up the next startup.

(8) Regarding the determination of the coating order, the input of the substrate carrying-in direction is omitted, and a skilled worker manually makes the first coating pattern from the keyboard 17 based on the experience. Inputting and setting may be performed, and subsequent coating order determination may be automatically determined according to the present invention.

[0091]

As described above, according to the present invention,
Just by inputting the position data of multiple paste patterns, the drawing order of each paste pattern is automatically determined, and the preparation work for coating drawing can be greatly shortened and the productivity is greatly increased. Improve to.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a paste applicator according to the present invention.

FIG. 2 is a perspective view showing a positional relationship between a syringe and an optical distance meter in FIG.

FIG. 3 is a configuration diagram showing a specific example of a control device in the embodiment shown in FIG.

FIG. 4 is a diagram showing a loading direction of a substrate into the paste applicator shown in FIG. 1 and a position of a nozzle at the time of loading.

5 is a diagram showing an example of a paste pattern on a substrate which is applied and drawn by the embodiment shown in FIG.

6 is a diagram showing a configuration example of a data file in a RAM of the microcomputer shown in FIG.

FIG. 7 is a flowchart showing the overall operation of the embodiment shown in FIG.

8 is a flowchart showing the contents of a coating machine initial setting step in FIG.

9 is a flowchart showing the contents of a coating order determination process in FIG.

FIG. 10 is a flowchart showing the contents of the steps of first coating pattern determination and order storage in FIG.

FIG. 11 is a flow chart showing the contents of the process of starting inspection measures for the coating pattern closest to the end point in FIG.

FIG. 12 is a flowchart showing the contents of a substrate preliminary positioning step in FIG.

13 is a flowchart showing the contents of the paste film forming step in FIG.

14 is a flowchart showing the contents of another specific example of the coating order determining step in FIG.

[Explanation of Codes] 1 Nozzle 2 Paste Storage Cylinder (Syringe) 3 Optical Distance Meter 4 Z-axis Table 5 X-axis Table 6 Y-axis Table 7 Substrate 8 θ-axis Table 9 Stand 10 Z-axis Table Support 11a Image Recognition camera 11b Image recognition camera barrel 12 Nozzle support 13 Substrate suction unit 14 Control device 14a Microcomputer 14b Motor controller 14ca-14cd driver 14d Image processing device 14e External interface 15a-15d server -Voltage 16 Monitor 17 Keyboard 18 A / D converter 19 External storage device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Haruo Miki, 5-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. (72) Inventor Yukihiro Kawasumi 5-2 Koyodai, Ryugasaki-shi, Ibaraki Ban Hitachi Techno Engineering Co., Ltd.

Claims (7)

[Claims] 1. A substrate is placed on a table so as to face a paste discharge port of a nozzle, and the nozzle and the substrate are separated from each other while discharging the paste filled in the paste container from the discharge port onto the substrate. In a paste applicator for changing and forming a relative positional relationship to draw and form a paste pattern of a desired shape on the substrate, a first means for inputting position data of the paste pattern and a plurality of input means from the first means. Second means for storing the position data of the paste pattern, third means for determining the drawing order of each paste pattern from the position data stored in the second means, and the third means. And a fourth means for drawing the plurality of paste patterns according to the order described above. 2. The paste pattern according to claim 1, wherein the third means first includes a paste pattern having an end portion at a position closest to a position immediately below the nozzle when the substrate is loaded. A paste applicator which is characterized in that it determines the paste pattern to be drawn. 3. The paste pattern according to claim 1, wherein the third means draws a paste pattern having an end at a position closest to the drawing end point of the drawing pattern for which the drawing order has been determined. A paste applicator characterized in that it is determined to be a paste pattern. 4. The third means according to claim 1, wherein when there are a plurality of paste patterns having an end portion at a position closest to a drawing end point of the drawing sequence determined paste pattern. , The X- and Y-axis directions, the paste pattern having an end portion at the closest position is preferentially selected as the next paste pattern to be drawn next. . 5. The paste applicator according to claim 1, wherein the third means has means for removing a drawing pattern whose drawing order has been determined from a drawing target. 6. The method according to claim 1, wherein the third means arbitrarily divides all paste patterns drawn on the substrate based on a positional relationship on the substrate, and a plurality of members belonging to each division are included. Of the past pattern, the past pattern having the end closest to the drawing end point of the drawing pattern for which the drawing order has been determined is the past pattern to be drawn next. The page
Strike coating machine. 7. The method according to claim 6, wherein the third means is the last paste pattern in a section.
When the drawing of the final paste pattern is completed, the paste pattern is drawn first in a section other than the section to which the final paste pattern belongs and which has an end portion closest to the drawing end point of the final paste pattern. A paste applicator characterized in that it is a paste pattern.