JPH0796454A - Wire tool with diamond electrodeposited on it and its manufacture - Google Patents

Abstract

PURPOSE:To manufacture a tool which is provided with a chip pocket, large in breaking and twisting angle and long in shape, in a wire tool having diamond electrodeposited on it and used for cutting hard and brittle materials and the manufacture of the tool. CONSTITUTION:Two spiral parts consisting of a conductive spiral part 13 and an insulating spiral part 15 are formed on a first plated layer 1 of a strand of a wire tool, and a second plated layer 11 and diamond abrasive grains 12 are electrodeposited on the conductive spiral part 13. This tool is obrained by electrodepositing the first plated layer 1 on the wire 2, coating the surface of this plated layer 1 with synthetic resin, grinding the coating layer spirally, and electrodepositing of the second plated layer 11 and the diamond abrasive grains 12 on the exposed first plated layer 1. It is appropriate to use a piano wire 2 as the strand, to use nickel as the plating metal, and to use the fluororesin as the coating resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond electrodeposition wire tool used for cutting hard brittle materials and a method for manufacturing the same.

[0002]

2. Description of the Related Art A diamond electrodeposition wire tool is one in which diamond abrasive grains are electrodeposited on the surface of an element wire such as a piano wire. Some have been electrodeposited. 7 and 8 shows the latter wire tool, in which the second nickel plating layer 11 is formed on the surface of the piano wire 2 thinly provided with the first nickel plating layer 1 by an abrasive grain electrodeposition device described later. Along with this, diamond abrasive grains 12 are spirally electrodeposited. FIG. 9 is a perspective view showing a main part of the abrasive grain electrodeposition apparatus. This device
Cylindrical abrasive grain electrodeposition tank 2 containing diamond abrasive grains 12
1, a spiral shield plate 22 that is coaxially arranged on the outer periphery of the shield plate 1, and nickel plates 23 that are arranged on both sides of the shield plate.
And these members are placed in a nickel plating solution tank (not shown).

In order to manufacture a wire tool using this apparatus, a piano wire 2 having a thin first nickel plating layer is inserted through the axis of an abrasive grain electrodeposition tank 21 and the piano wire 2 is used as a cathode. Using the plate 23 as an anode, the second nickel plating layer 11 is electrodeposited on the entire surface of the piano wire by applying a constant feed speed to the piano wire and synchronizing the feed speed with the rotation speed of the shielding plate. At this time, the diamond wire 12 is electrodeposited together with the second nickel plating layer 11 on the piano wire at the position corresponding to the void portion of the shield plate, and the wire tool in which the diamond abrasive particle is electrodeposited spirally is manufactured. .

The wire tool manufactured in this manner is shown in FIG.
As shown in, the second nickel plating layer 11 on which the diamond abrasive grains 12 are electrodeposited becomes thicker than other portions to form spiral ridges, and the spiral diamond abrasive grains 12 are A groove between them (hereinafter referred to as "chip pocket")
24 is formed. The chip pocket 24 has a function of entraining a working liquid at the time of cutting a hard brittle material and supplying the working liquid to the working portion, and facilitating discharge of chips.
It has the functions of suppressing the reduction of machining efficiency due to continuous use of the wire tool and extending the life of the wire tool.

[0005]

However, in the conventional wire tool, since the second nickel plating layer is also electrodeposited on the piano wire in the area shielded by the shield plate, the nickel plating layer becomes thick, There is a drawback that the breaking torsion angle of the wire becomes small (see (3) in FIG. 5). Further, in the conventional manufacturing method using the spiral shielding plate, the abrasive grain electrodeposition tank 21
Has to be made into a cylindrical shape, and even if the diamond abrasive grains 12 are reduced during the electrodeposition work, they cannot be replenished and there is a drawback that a long wire tool cannot be manufactured. Further, in the conventional manufacturing method, the spiral pitch p of the shielding plate is
And the diamond pitch of the diamond abrasive grains are the same,
There is a problem that the diamond abrasive grains wrap around and it is difficult to electrodeposit a small pitch.

The present invention provides a diamond electrodeposition wire tool having a tip pocket and a large breaking twist angle, and a spiral wire pitch of diamond abrasive grains can be freely set and a long wire. It is an object to provide a method by which a tool can be manufactured.

[0007]

A diamond electrodeposition wire tool according to the present invention has a double-strand spiral portion composed of a conductive spiral portion 13 and an insulating spiral portion 15 on a first plating layer 1 of a wire 2. And the second plated layer 11 and diamond abrasive grains 12 are electrodeposited on the conductive spiral portion 13.

In the manufacturing method according to the present invention, the first plating layer 1 is electrodeposited on the wire 2, a synthetic resin is coated on the surface of the plating layer 1, and the formed coating layer is spirally ground. The second plating layer 11 and the diamond abrasive grains 12 are electrodeposited on the exposed first plating layer 1.

The piano wire 1 is used as the element wire, and the first wire
Of the nickel plating layer 1 is further electrodeposited, and the fluororesin is further coated, and the formed fluororesin layer is spirally ground to form the conductive spiral portion 13 with the exposed first nickel plating layer 1. It is preferable to form the insulating spiral portion 15 with the fluororesin layer remaining in a spiral shape.

[0010]

The angle of rupture of the wire 2 is inversely proportional to the thickness of the plating layer. In the diamond electrodeposition wire tool according to the present invention, the insulating spiral portion 15 is provided between the conductive spiral portions 13 of the wire 2.
Since the second plating layer 11 is not electrodeposited on the wire 2 in the electrodeposition step of diamond abrasive grains by providing the above, it is possible to leave a portion in which only the thin first plating layer 1 is electrodeposited in a spiral shape. The breaking torsion angle can be increased.

According to the manufacturing method of the present invention, since the thin first plating layer 1 is formed on the wire 2 prior to the coating firing step necessary for forming the insulating spiral portion, the applied synthetic resin solution is applied. It is possible to prevent a decrease in tensile strength in the firing step. Then, by using a conventionally known spiral grinding machine, the coating layer can be ground to easily and quickly manufacture the spiral groove, and the pitch of the spiral groove can be arbitrarily selected. Furthermore, diamond abrasive grain 1
Since the conventional abrasive grain electrodeposition device can be used for the electrodeposition process of No. 2 and the electrodeposition work can be performed while supplying the diamond abrasive grains 12, it is possible to manufacture a long wire tool. Becomes

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a process drawing of a method for manufacturing a wire tool according to the present invention. A piano wire having a diameter of 0.2 mm is passed through a known nickel plating device to form a 0.02 mm first wire on the surface of the wire.
Forming a nickel plating layer. Next, a fluororesin solution is applied and fired by a coating device described later to form a coating layer. Then, the coating layer is spirally removed by passing through a known spiral grinder to expose the first nickel plating layer in a spiral shape. As a result, the conductive spiral portion made of the first nickel plating layer and the insulating spiral portion made of the coating layer are formed on the surface of the piano wire. Finally, the second nickel plating layer and the diamond abrasive grains are electrodeposited on the surface of the conductive spiral portion by a known abrasive grain electrodeposition apparatus to manufacture the diamond electrodeposition wire tool according to the present invention.

FIG. 2 is a sectional view of a coating apparatus used for manufacturing the wire tool of the present invention. This apparatus 9 comprises a delivery drum 3 around which a piano wire 2 having a first nickel plated layer 1 is wound, a front tank 4 containing acetone for removing fat adhering to the piano wire, and a fluororesin solution. It has a main tank 5 in which it is placed, a firing device 6 for curing the applied fluororesin solution, and a winding drum 7 for winding the piano wire that has been coated. The temperature of the calciner is a temperature at which the fluororesin cures, that is, about 360 degrees Celsius. Other devices used for carrying out the above manufacturing method, that is, a nickel plating device, a spiral grinder, and an abrasive grain electrodeposition device may be those conventionally used.

3 and 4A are enlarged views of the wire before the electrodeposition treatment, and FIG. 3B is an enlarged view of the wire after the electrodeposition treatment. In the case of (a), a 0.2 mm piano wire 2 is used as a core wire, and a 0.02 mm first nickel plating layer 1 is electrodeposited on the surface thereof, and a spiral fluororesin layer 14 is formed thereon. Is applied. The fluororesin layer 14 becomes the insulating spiral portion 15, and the first nickel plating layer 1 becomes the conductive spiral portion 13. When this is passed through an abrasive grain electrodeposition apparatus, a spiral second nickel plating layer 11 and diamond abrasive grains 12 are electrodeposited on the conductive spiral portion 13 as shown in FIG. A wire tool can be obtained. The spiral pitch P of the diamond abrasive grains can be easily changed by changing the pitch of the spiral groove with a spiral grinder. Further, since the diamond abrasive grains can be continuously supplied using the conventional abrasive grain electrodeposition apparatus, a long wire tool can be easily manufactured.

5 and 6 are graphs showing the results of the performance test of the wire tool having the above structure. In FIG. 5, the vertical axis on the left side is the tensile strength (white circle), and the vertical axis on the right side is 360 degrees (1
The twist angle (black circle) based on the rotation is taken as the reference, the horizontal axis is the piano wire (1), the diamond abrasive grains are electrodeposited on the entire surface (2), and the conventional spiral diamond abrasive grains are used. The electrodeposited one (3) and the spirally wound diamond abrasive grain according to the present invention (4) are taken. As is clear from the figure, the wire tool (4) of the present invention is comparable to the conventional tools (2) and (3), but the breaking twist angle is significantly improved.

FIG. 6 is a graph in which the horizontal axis represents the piano wire and the sample taken after each step in the manufacturing process and the vertical axis represents the twist angle with reference to 360 degrees (one rotation). Is a 0.2 mm piano wire, is a 0.2 mm piano wire electrodeposited with a 0.02 mm thick nickel plating layer, is a coating layer, is a spiral groove, and is diamond abrasive It was electrodeposited. When the first nickel plating layer is electrodeposited on the piano wire, the breaking torsion angle is reduced by about 7 × 360 deg (that is, 7 rotations), and about 4 × 360 deg during the electrodeposition process of diamond abrasive grains.
It can be seen that it has decreased (ie 4 rotations).

[0017]

As described above, since the wire tool according to the present invention has the chip pocket and the thin nickel plating layer is present in a spiral shape, the breaking twist angle is large and the tool life is extended. Further, according to the manufacturing method of the present invention, by changing the grinding pitch of the coating layer, it is possible to easily change the pitch of the conductive spiral portion,
The pitch of DIAMONT abrasive grains can be set freely. Further, since it is not necessary to use an abrasive grain electrodeposition device provided with a shielding plate, there is an effect that a long wire tool can be manufactured.

[Brief description of drawings]

FIG. 1 is a diagram showing a manufacturing process of the present invention.

FIG. 2 is a side view of the coating device.

FIG. 3 is an enlarged side view of a wire tool before and after electrodeposition processing.

4 is a sectional view of a portion A and a portion B of FIG.

FIG. 5 is a graph comparing the performance with other wire tools.

FIG. 6 is a graph comparing samples taken after the manufacturing process.

FIG. 7 is an enlarged side view of a conventional wire tool.

FIG. 8 is a sectional view of a portion C in FIG.

FIG. 9 is a perspective view of essential parts of an abrasive grain electrodeposition apparatus.

[Explanation of Codes] 1 First nickel plating layer 2 Piano wire 11 Second nickel plating layer 12 Diamond abrasive grains 13 Conductive spiral part 14 Fluororesin layer 15 Insulating spiral part

Claims (4)

[Claims] 1. The first plating layer (1) of the wire (2) is formed with two spiral parts consisting of a conductive spiral part (13) and an insulating spiral part (15), A diamond electrodeposition wire tool in which the second plating layer (11) and diamond abrasive grains (13) are electrodeposited on the conductive spiral portion (13). 2. The conductive spiral portion (13) is the first nickel plating layer (1), and the insulating spiral portion (15) is the fluororesin layer (14).
The diamond electrodeposition wire tool according to claim 1, which is 3. A first plating layer (1) is electrodeposited on the wire (2), a synthetic resin is coated on the surface of the plating layer (1), and the formed coating layer is ground in a spiral shape, A method for producing a diamond electrodeposition wire tool, which comprises electrodepositing a second plating layer (11) and diamond abrasive grains (12) on the exposed first plating layer (1). 4. The first nickel plating layer on the piano wire (2)
(1) is electrodeposited, fluorocarbon resin is further coated, and the formed coating layer is spirally ground to expose the exposed first layer.
The second nickel plating layer (11) on the nickel plating layer (1)
And a method for producing a diamond electrodeposition wire tool, which comprises electrodepositing diamond abrasive grains (12).