JPH077778B2 - Wire bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention relates to an apparatus for wire-bonding a wide variety of semiconductor element chips with a small-capacity storage device, and a central control having a small-capacity storage device and means for creating wiring data by product type. For the purpose of providing a wire bonding device capable of surely removing unnecessary wiring by using the device, a wire bonder for bonding a wire connecting a semiconductor element chip and a lead of the package, and a wire bonder In a wire bonding device configured with a controlling central control device, a storage device for storing wire bonding data is connected to the central control device, and the central control device receives data from the storage device in accordance with a wire bonder operation type name signal. Of the semiconductor element chip and the output of the reading means. It is configured by including means for creating type-specific wiring data and means for notifying the wire bonder of the data created by the creating means.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for wire-bonding a wide variety of semiconductor element chips with a small-capacity storage device.

Since the conventional wire bonding apparatus is composed of a storage device that manages all data for each type of semiconductor element chip, a simple control device, and a wire bonder, the amount of data becomes enormous, and data management in storage and The work result of the wire bonder must be manually checked. Therefore, it has been desired to develop a device for reducing the capacity of the memory device and performing accurate bonding to the semiconductor element chip.

[Prior Art] When a chip of a semiconductor element is mounted on a package, and a wire bonder is used to connect between an external connection lead and a pad of the chip, recently, there are many kinds of chips that have the same package but different chips. It is often produced in small quantities. This is a package that mounts a gate array type integrated circuit chip, and the number of pins for pulling out its leads is 80.
However, depending on the product type, the connection between the pad and the lead may not be necessary in terms of electrical function, and the position and number of the product may vary depending on the product type. FIG. 7 shows that a certain chip has a large number of pads arranged around it, and the numeral is the order number of the pads. At this time 2
The numbered pad marked with ■ means that the pad and the package do not need to be connected. FIG. 8 shows pads for other chips mounted in the same package as FIG. 7, and in this case, the pad connection of No. 3 is unnecessary. As described above, the number of unnecessary connections is several to ten or more when a chip is mounted on a package of 80 to 200 pins. Currently, when performing a wiring work with a wire bonder, the wire bonder is provided with information about a place where necessary wiring should be performed after removing unnecessary wiring. Therefore, the storage device stores all necessary information for each product type. Further, when the information is given to the wire bonder, the operator gives the data read from the storage device for each wire.

[Problems to be Solved by the Invention] Since data to be wired required for each type of chip is stored in a storage device, a huge amount of common data to be wired should be stored every time the number of types increases. Since it is to be stored, the capacity of the storage device becomes enormous, which is a waste.
In addition, the wiring procedure is also called teaching, and it is troublesome for the operator to perform. Since mistakes are apt to occur during the work, the worker had to inspect the wire bonder after processing. In other words, the drawing in which the wiring was officially drawn was compared with the field of view of the wiring package under a microscope, and the misalignment of the bonding position and the presence / absence of a wire drop were checked. Moreover, with the multi-pin type, the check had to be repeated many times. Therefore, the pads and leads on the chip are all wired regardless of whether or not they are electrically used, and there is a drawback in that a wiring material such as a thin gold wire is wasted.

An object of the present invention is to improve the above-mentioned drawbacks, and to provide a bonding apparatus capable of surely removing unnecessary wiring and performing a wiring work by using a central controller having a small-capacity storage device and means for creating wiring data for each product type. To provide.

[Means for Solving Problems] FIG. 1 is a diagram showing a principle configuration of the present invention. In FIG. 1, 1 is a central control device, 2 is a storage device, 3 is a wire bonder, 4 is a semiconductor element chip, 5 is a package, 6 is a lead, 7 is a wire, 11 is a data reading means, and 12 is a wiring data creating means. , 13 are notification means.

A wire bonder 3 for bonding a wire 7 for connecting the semiconductor element chip 4 and the lead 6 of the package 5 thereof,
The present invention has the following configuration in the wire bonding apparatus configured with the central controller 1 that controls the wire bonder 3. That is, the central control unit 1 is connected with a storage unit 3 for storing wire bonding data, and the central control unit 1 is provided with a means 11 for reading data from the storage unit 2 in accordance with an operation type name signal from the wire bonder 3, The output of the reading means 11 is provided with a means 12 for creating type-specific wiring data of the semiconductor element chip 4 and a means 13 for notifying the wire bonder 3 of the data created by the creating means 12.

[Operation] The storage device 2 is connected to the central control device 1 and stores necessary basic data in order to create type-specific wiring data necessary for the operation of the wire bonder 3. Wire bonder 3
After designating a product type name for a predetermined semiconductor element chip 4 using a keyboard or the like, the wire bonder 3 sends a data request signal corresponding to the product type to the central control unit 1. In the central controller 1, the data read means 11 for the storage device 2 is operated by the data request signal designating the product type name.
Command. The reading means 11 reads predetermined data from the storage device 2 and applies it to the wiring data creating means 12. The wiring data creating means 12 creates wiring data for each product type based on the read data, and then notifies the wire bonder 3 by the notifying means 13. The wire bonder 3 performs a bonding process according to the wiring data.

[Embodiment] FIG. 2 shows an example of stored data in the storage device 2 of FIG. 1 as an embodiment of the present invention. In FIG. 2, A
3A to 3E are data tables, where A stores the coordinates of the package lead for each package type, B stores the coordinates of the chip pad for each chip type, and C the number of A above. The table of the basic wiring that makes the numbers B and B correspond to each other is stored for each product series.

Further, D shows a table of unnecessary wiring, and E shows a correspondence table of data by product type.

The coordinate values in FIGS. 2A and 2B are the package leads obtained by measuring the distance from the origin O in microns as the origin O is the center position of the upper surface of the chip and the package as shown in FIG. X, Y coordinate value of the chip, that is,
The position of the bonding point of the wire bonder is shown. 2C shows the presence or absence of the corresponding basic wiring (lead) for the same number in FIGS. 2A and 2B. Since it is normally present, the arrows point in both directions. Next, FIG. 2D
In the figure, those having no wiring (lead) with the chip pad as a reference are shown for each product serial number. That is, when the series name of the product type is the same and the serial numbers are different, such as 001 and 002, pads without wiring are displayed as N pads. For example
In MB123001, it can be seen that the pads are No. 2, 8, 14, and 20 and the leads are not connected, and are N pads. Further, FIG. 2E shows a correspondence table of data by product type.

The central control unit 1 may be a personal computer or the like, and is provided with the data reading unit 11, the data creating unit 12, and the data notifying unit 13 described above. The operation flowchart is shown in FIG. First, after the operation is started, in step, it is judged whether or not it is necessary to create a new database in the storage device, and when it is created, it is created in step. Next in step,
Specify the product type name required for wire bonding. After the step, it operates as shown. Therefore, in response to the data transfer request from the wire bonder 3, the central controller 1 searches the table of FIG. 2D for the corresponding product name based on the specified product name data, and the product-specific wiring data as shown in FIG. Create a new. In FIG. 5, the mark ■ indicates an N pad. After that, the data is sent to the wire bonder 3. Therefore, the storage device does not store all the wiring data for each product type, but the central control device creates the data necessary for wire bonding from the basic data.

FIG. 6 shows a block mechanism diagram when a plurality of wire bonders are used. The wire bonders 3-1 to 3-5 are connected to the central control unit 1 via the network controller 8-1, and similarly the wire bonders 3-6 to 3-10 are connected to the controller 8-2.
Is connected via. At this time, the controllers 8-1 and 8-2 are connected as shown by the interfaces RS232C and RS422. The type of wire bonder to be operated is specified as described above. Of course, it is possible to specify and operate the same type, and all wire bonders may operate for different types.

As described above, according to the present invention, the storage device stores only basic data and does not need to store all individual unnecessary wiring data or wiring data. It can be small. Further, by initially checking the data stored in the storage device, it is not necessary to check again after the wire bonder operates. Therefore, unlike the conventional apparatus, the teaching time is not required and the check time is short, so that the number of steps is reduced and high-quality wire bonding can be performed in a short time.

[Brief description of drawings]

FIG. 1 is a diagram showing the principle configuration of the present invention, FIG. 2 is a diagram showing an example of data stored in the storage device of FIG. 1, and FIG. 3 is a diagram explaining obtaining coordinate values. FIG. 4 is a flow chart of processing operation of the central control device, FIG. 5 is a diagram showing an example of wiring data by product type created in the central control device, FIG. 6 is a block diagram when a plurality of wire bonders are used, FIG. FIG. 8 is a view mainly showing unnecessary pads of the semiconductor element chip. DESCRIPTION OF SYMBOLS 1 ... Central control device, 2 ... Storage device 3 ... Wire bonder, 4 ... Semiconductor element chip 5 ... Package, 6 ... Lead 7 ... Wire 11 ... Data reading means 12 ... Wiring data creation means 13 ... Notification means

Claims (1)

[Claims] 1. A wire bonder (3) for bonding a wire (7) connecting a semiconductor element chip (4) and a lead (6) of its package (5), and a central controller for controlling the wire bonder (3). In the wire bonding apparatus including (1), a storage device (2) for storing wire bonding data is connected to the central control device (1), and a wire bonder (3) is connected to the central control device (1). ) Means for reading data from the storage device (2) in accordance with the operation type name signal of (4), and means (12) for creating type-specific wiring data of the semiconductor element chip (4) for the output of the reading means (11). ) And a means (13) for notifying the wire bonder (3) of the data created by the creating means (12).