JPH0773407A - Production of magnetic head chip - Google Patents

Abstract

PURPOSE:To reduce the number of processes of heating by adhering substrates, on which soft magnetic thin films to constitute an operation gap are formed respectively, to each other in the process where these substrates are butted against each other and fused glass is charged into a groove for adhesion between them. CONSTITUTION:Nonmagnetic substrates 1a and 1b are provided with plural parallel V grooves and are provided with winding grooves orthogonal to these V grooves. Soft magnetic thin films 2a and 2b are formed in V grooves, and these substrates are butted against each other with a gap material between them, and a nonmagnetic pipe 17 is inserted to a winding window 16 formed with winding grooves by this butting. A glass bar 18 is fused and charged in grooves formed by forming the soft magnetic films in the V grooves, thus fixing the substrates to each other. These fixed substrates are sliced in the direction crossing the butting surface and the nonmagnetic pipe to obtain a magnetic head chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic head chip, and more particularly to a method of manufacturing a magnetic head chip that can simplify the manufacturing process and improve productivity.

[0002]

2. Description of the Related Art Conventionally, a video head shown in FIG. 3 is known. In FIG. 3, reference numerals 1a and 1b are non-magnetic substrates, 2a and 2b are soft magnetic thin films formed on the substrates, 3a and 3b are glass filled in grooves, 4 is an operating gap, and 5 is a winding window. , 6 show winding materials wound through the window. Since the soft magnetic thin film uses sendust or the like having a high saturation magnetic flux density, the characteristics of a high coercive force recording medium such as a metal tape can be sufficiently obtained.

Next, an example of a method of manufacturing a head chip in the above conventional video head will be described with reference to FIGS. A V-shaped groove 7 as shown in FIG. 4A is provided at a plurality of locations on a flat non-conductive and non-magnetic substrate, for example, a CaTiO ₃ ceramic substrate 1a. A soft magnetic thin film 2a made of sendust is formed to a predetermined thickness on the surface having the groove 7 as shown in FIG. By this film formation, the V-shaped groove 7 becomes a groove 8. Glass is placed on the groove 8 and heated. (C) shows the state after this heating, and 3a is glass. After that, the groove 9 for the winding window 5 is provided as shown in (d) and (e).

The groove 9 is substantially orthogonal to the grooves 7 and 8 and is provided on the same surface as the grooves 7 and 8. In addition, (e)
Shows the side surface of (d).

Thereafter, as shown in (f), the opposing surface is finished and lapped, and a gap material (not shown) is sputtered. As shown in FIG. 5, the block 10 shown in (f) and the block 11 having the same shape (the gap material need not be sputtered) are butt-joined and thermocompression bonded. Next, the sliding surface is R-processed and sliced at a predetermined azimuth angle as shown by a chain line. The chip thus completed is subjected to steps such as winding and tip processing to finally obtain a magnetic head as shown in FIG. The magnetic head of FIG. 3 has an azimuth direction opposite to that of the magnetic head manufactured in the steps of FIGS. 4 and 5.

[0006]

The magnetic head chip as described above requires at least two heating steps in its manufacture. That is, the first time is the step of filling the groove 8 with the molten glass, and the second time is the step of thermocompression bonding the blocks 10 and 11 to each other and adhering them to each other.
Thus, in the conventional magnetic head chip, at least 2
Since the number of heating steps is required, there is a drawback that the number of steps is increased. Further, if there are many heating steps, there is a drawback that when Sendust is used as the soft magnetic thin film, the magnetic characteristics are deteriorated and the recording / reproducing efficiency is lowered. It is an object of the present invention to provide a method of manufacturing a magnetic head chip which eliminates the above-mentioned drawbacks and can be manufactured by a relatively small number of heating steps.

[0007]

A method of manufacturing a magnetic head chip according to the present invention for solving the above problems is a method of manufacturing a magnetic head chip in which core halves are butted to form an operating gap. This magnetic head chip has a groove filled with glass for adhering the core halves to each other in the abutting state, and a winding window in a direction substantially orthogonal to the groove and communicating with the groove,
The core halves are pressed in the abutting direction, a non-magnetic pipe is inserted into the winding window, and in this state, the groove is filled with molten glass to bond the core halves to each other. Is. Further, instead of the non-magnetic pipe, a wire may be inserted into the winding window, and the wire may be withdrawn after the molten glass filled in the groove is solidified.

[0008]

In the method of manufacturing a magnetic head chip constructed as described above, since the non-magnetic pipe is inserted in the winding window, the grooves are filled with molten glass in a state where the substrates are butted. However, this molten glass never reaches the non-magnetic pipe in the winding window. The substrates are adhered to each other by filling the above-mentioned groove with molten glass. Therefore, the substrate is bonded at the same time as the heating step for filling the molten glass, and the magnetic head chip can be manufactured by a relatively small number of heating steps. By the way,
If the groove is filled with molten glass without inserting the non-magnetic pipe into the winding window, the molten glass reaches the winding window and the winding window is filled. When a wire is used instead of the non-magnetic pipe, the wire is pulled out after the molten glass is solidified, so that the winding window is secured without being buried in the glass.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the manufacturing method of the present invention will be described below with reference to FIG.
2 will be described. In FIG. 2A, 1a
Is a ceramic similar to that described with reference to FIG.
It is a non-magnetic substrate such as crystallized glass, and V-shaped grooves 7 are formed in parallel with each other at a plurality of locations at a predetermined pitch dimension, and on the same surface as these grooves 7 and A winding groove (not shown) is also engraved in a direction orthogonal to the groove 7. Next, as shown in (b), a soft magnetic thin film 2a of sendust, amorphous or the like is formed on the surface having the groove 7 by sputtering or vacuum vapor deposition to have a predetermined film thickness. Then, as shown in (c), the substrate 1a and the upper surface of the soft magnetic thin film are mirror-finished by lapping, and a gap material (not shown) such as SiO ₂ is sputtered on the finished surface. This (c)
Block 12a shown in Fig. 1 and block 1 having the same shape
2b (the gap material need not be sputtered)
Are paired as shown in (d), and are abutted so that the abutting positions of the soft magnetic thin films 2a coincide with each other.

FIG. 1 (a) shows the side surfaces of the blocks 12a and 12b in the abutted state, and the side to be in contact with the magnetic recording medium, that is, the operation gap side is downward. And the notches 13a, 13b, 14a,
14b, 15a and 15b are provided at the stage where the V-shaped groove 7 is engraved. As a result of the abutting, as shown in FIG. 1A, a non-magnetic pipe 17 such as copper is inserted into the winding window 16 formed by the winding groove. Then, the glass rod 18 is placed in the groove formed by the notches 13a and 13b. In this state, the blocks 12a, 12b are heated by pressurizing them in the butting direction. The glass melted by this heating is filled in the groove formed by forming the soft magnetic film in the V-shaped groove 7, and the blocks 12a and 12b are bonded to each other.
At this time, the molten glass is blocked by the nonmagnetic pipe 17 and does not reach the inside of the pipe. In addition, the notch 14
The groove formed by a and 14b is for preventing the blocks 12a and 12b from being adhered to the jig by the molten glass.

Next, R processing is performed on the side of the blocks 12a and 12b bonded to each other as described above to be the surface that comes into contact with the magnetic recording medium, and the abutting surfaces of the blocks 12a and 12b are formed at a predetermined azimuth angle. And the non-magnetic pipe 1
Slice in the direction that intersects 7. As a result, Fig. 1 (b)
A magnetic head chip such as Incidentally, reference numeral 19
Reference numerals a and 19b denote glasses in which the glass rod 18 is melted and filled in the grooves. Winding is applied to the non-magnetic pipe 17 and the notches 15a and 15b of the chip thus completed to complete the magnetic head.

In the above embodiment, the non-magnetic pipe 17 was inserted into the winding window 16, but instead of this pipe, a wire was inserted, and after the glass melted in the groove was solidified, the wire was pulled out to wind it. The line window 16 may be prevented from being filled with glass. Incidentally, inserting the wire into the winding window to prevent the winding window from being filled with glass is described in detail in JP-A-5-166126, but the wire of the present invention is also disclosed in this publication. The same as the above can be used.

Although a non-magnetic substrate is used as the substrate in the above embodiment, a magnetic substrate may be used as the substrate. In this case, it is desirable to form the grooves of the substrates 20a and 20b as shown in FIG. 6 and fill the grooves with the glasses 21a and 21b. Further, in the above embodiment, the winding window 16
Although the winding groove for forming is provided on both the substrates 1a and 1b,
It may be provided on only one of the substrates. Further, in the present invention, a magnetic head may be used as the substrate, and the magnetic head chip may be configured without using the soft magnetic thin film. Figure 7
(A) shows the front of this magnetic head chip, 22a and 22b are substrates, 23a and 23b are glass filled in V-shaped grooves, and 24 is an operating gap. Such a magnetic head chip can be manufactured in substantially the same manner by omitting the film forming process of the soft magnetic thin films 2a and 2b in the manufacturing process described with reference to FIGS. The shape of the groove filled with the glasses 23a and 23b of the magnetic head chip described with reference to FIG. 7A may be as shown in FIG. 7B or 7C.

In the magnetic head chip described with reference to FIG. 7, one of the grooves filled with the glasses 23a and 23b may be omitted.

[0015]

According to the method of manufacturing a magnetic head chip of the present invention, since the non-magnetic pipe is inserted in the winding window, even if the groove is filled with the molten glass while the substrates are abutted, Molten glass does not reach the non-magnetic pipe of the winding groove. The substrates are adhered to each other by filling the above-mentioned groove with molten glass. Therefore, the substrates are adhered to each other at the same time as the heating process for filling the molten glass, and the magnetic head chip can be manufactured by the relatively few heating processes.

[Brief description of drawings]

1A is a view showing a manufacturing process of a magnetic head chip of the present invention, and FIG. 1B is a front view showing a magnetic head chip manufactured by this manufacturing process.

FIG. 2 is a diagram showing a manufacturing process of the magnetic head chip of the present invention.

FIG. 3 is a perspective view showing a conventional magnetic head.

FIG. 4 is a diagram showing a manufacturing process of a conventional magnetic head chip.

FIG. 5 is a diagram showing a manufacturing process of a conventional magnetic head chip.

FIG. 6 is a front view showing another magnetic head chip manufactured by the manufacturing process of the present invention.

FIG. 7 is a front view showing still another magnetic head chip manufactured by the manufacturing process of the present invention.

[Explanation of symbols]

 1a, 1b Substrate 2a, 2b Soft magnetic thin film 4 Working gap 7 V-shaped groove 12a, 12b Block 16 Winding window 17 Non-magnetic pipe 18 Glass rod 19a, 19b Glass

Claims (2)

[Claims] 1. A method for manufacturing a magnetic head chip in which core halves are butted to form an operating gap, the magnetic head chip being filled with glass for adhering the core halves to each other in the butted state. In a groove having a groove and a winding window in a direction substantially orthogonal to the groove and communicating with the groove, the core half is pressed in the butting direction and a non-magnetic pipe is inserted into the winding window. In this state, the groove is filled with molten glass and the core halves are adhered to each other. 2. A method for manufacturing a magnetic head chip, wherein a wire is inserted into the winding window instead of the non-magnetic pipe, and the wire is extracted after the molten glass filled in the groove is solidified. .