JPH0763819A - Probe pin array determining apparatus for in-circuit test - Google Patents

Abstract

PURPOSE:To achieve automatic selection of the optimum pin erecting position by a method wherein points of the same potential are extracted for the specified number of potentials in an in-circuit test and a pin erecting preference order is imparted to the points of the same potential according to parts carried to select the pin erecting position of a probe pin from any of the points of the same potential at each potential. CONSTITUTION:Data such as the name of parts, part number, pin number and land dimensions are inputted at an input section 12 to generate information on points of the same potential from the input data with a processing section 10 and a pin erecting preference order is imparted considering the type of the part carried corresponding to the information. Subsequently, the processing section 10 selects a pin erecting pattern based on the interval and the shape of pins. The pin erecting position is selected based on the preference order from any of the points of the same potential at each potential. Moreover, when a probe pin is erected. a pattern in which a pressure working on a substrate distributes most evenly is selected. The pin erecting pattern obtained is stored into a memory section 16 to be shown on a display section 14 and outputted at an output section 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for determining the arrangement of probe pins required for conducting an in-circuit test,
In other words, the present invention relates to a probe pin arrangement determining device for an in-circuit test.

[0002]

2. Description of the Related Art The in-circuit test is a test for testing the quality of operation of a circuit mounting board in terms of electrical continuity. In this type of in-circuit test, a plurality of types of probe pins are selectively used, including the shape disclosed in Japanese Utility Model Laid-Open No. 3-68082. Further, such a probe pin is arranged on a movable plate called a pin board, and is brought into contact with a substrate to be tested, particularly a circuit wiring (land or the like) on the substrate.

Therefore, when carrying out the in-circuit test, it is important to arrange the pin having what shape and at what position. Conventionally, selection of the pin shape and determination of the pin arrangement have been performed based on the experience of the operator.

That is, the worker first extracts the same potential point on the circuit wiring on the basis of the wiring pattern on the board and the drawings concerning the mounted components. That is, when executing the in-circuit test, points at which the same potential appears are extracted for a plurality of types of potentials. Next, the position where the probe pin is to be raised is determined based on the lead shape of the component to be mounted, etc. from among the same potential points that are generally obtained for each potential. This judgment requires experience accumulated in workers or work groups. Next, the pin shape most suitable for the selected position is selected. By repeatedly performing such an operation for each potential, a pattern at a position where the probe pin should be raised, that is, a pin raising pattern is obtained. In addition, inspect the obtained pin stand pattern to see if the space between adjacent probe pins is narrow, and if the probe pins are set up and the in-circuit test is performed, the pressure (contact pressure) applied to the surface of the board does not vary. I will check. If the result of this check is that there is a defect in the probe pin spacing or surface pressure, the process returns to the pin stand position determination operation, and the above operations are repeated until finally good pin spacing and surface pressure are obtained. By such an operation, the final pin arrangement used in the in-circuit test has been obtained conventionally.

[0005]

However, it is difficult to perform such pin stand arrangement determination work in a short time because it is based on the experience accumulated in the worker or the work group. That is, the work of correcting the pin stand position, which is executed when the pin spacing defect is detected, must be repeated until the pin spacing clears the regulation for all probe pins, and the same applies to the surface pressure dispersion condition. . Therefore, it is difficult to determine a pin stand pattern that satisfies the pin spacing and surface pressure dispersion conditions within a limited delivery time.

Further, the pin stand pattern obtained by such work is not always the optimum pattern. That is, even if the specification of the pin interval is cleared for all the probe pins and the condition of the surface pressure dispersion is satisfied, such a pattern is not always the optimum pin stand pattern, and the specification is barely cleared. In many cases, it is just a matter of time.

The present invention has been made to solve the above-mentioned problems, and the pin stand pattern is determined without depending largely on the experience of the operator to speed it up. It is an object of the present invention to make the resulting pin stand pattern an almost optimum pin stand pattern. It is another object of the present invention to eliminate the difference in quality due to the difference (know-how, knowledge, etc.) between workers or work groups by achieving the above object, and to make the quality of the in-circuit test uniform and improved. .

[0008]

In order to achieve such an object, the applicant of the present application proposes a device having the following configuration, that is, a device for determining the arrangement of probe pins in an in-circuit test. That is, the device of the present invention is based on the information about the circuit wiring on the board and the mounted parts, and the same potential point extracting means for extracting the same potential point at which the same potential is generated during the in-circuit test for a predetermined number of potentials. Depending on the type of mounted component corresponding to each equipotential point, the pin-placing priority assigning means for assigning the pin-placing priority to the equipotential point and the pin-placing position at which the probe pin should be erected And a pin stand position deciding means for selectively deciding from any one of the same potential points for each potential based on the above, and the pin stand position is automatically decided.

Further, in the apparatus of the present invention, the pin stand position determining means selects any one of the same potential points as a pin stand position candidate for each potential using the selection criterion determined based on the pin stand priority. , A first step of creating a pin stand pattern by selecting and combining one of the selected pin stand position candidates for each potential, and setting a probe pin in the pin stand position candidate for the created pin stand pattern. In the second step of determining whether or not a predetermined condition regarding the probe pin interval is satisfied, the above condition is satisfied for any of the created pin stand patterns while relaxing the selection criterion for any potential. Repeat until the condition is satisfied, and if the above conditions are satisfied, select one of the pin stand patterns related to the condition and select the selected pin stand pattern. Pins stand position candidate constituting the over emissions, and determines as a pin stand position.

Further, in the apparatus of the present invention, the pin stand position determining means determines that the number of places where the probe pin interval is a predetermined value or less is less than a predetermined number in the created pin stand pattern and / or the pin stand pattern. It is characterized in that the repetition of the first and second steps is terminated when the time required for the process up to the creation exceeds a predetermined time.

Further, in the apparatus of the present invention, the pin stand position determining means selects one of the same potential points for each potential as a pin stand position candidate, and one is selected for each potential among the selected pin stand position candidates. A pin stand pattern is created by selecting and combining individual pieces, and a pin stand pattern satisfying a predetermined condition among the created pin stand patterns is added to one side or both sides of the substrate when the probe pins are set up according to the pin stand pattern. Detecting the pressure, selecting the pin stand pattern that is said to have the detected pressure most uniformly distributed, and determining the pin stand position candidates that make up the selected pin stand pattern as the pin stand position candidates. Is characterized by.

[0012]

In the device of the present invention, first, the same potential point at which the same potential is generated during the in-circuit test is extracted based on the information on the circuit wiring on the board and the mounted components (data obtained by CAD, for example). This equipotential point extraction is performed with a predetermined number of potentials (eg, power supply potential, ground potential, etc.)
Executed about. Further, according to the type of the mounted component corresponding to each extracted equipotential point, the pin-placing priority order is given to each equipotential point. The pin-placing priority is information indicating which of the equipotential points that generally exist for each potential, the probing pin should be preferentially set up. For example, mounted parts with a wide land. To a relatively high pin-up priority, and a narrow mounting component to a low pin-up priority. Then, the pin raising position at which the probe pin should be raised is selected and determined from any of the same potential points for each potential. This pin stand position is determined based on the pin stand priority given to each equipotential point. For example, an equipotential point having a relatively high pin-placing priority is selected as the pin-placing position. In the present invention, since the pin stand position is determined by executing such a process, it becomes possible to automatically determine the placement of the probe pin in the in-circuit test, which shortens the time required for the placement determination, It is possible to obtain the effects of preventing a difference in quality due to a difference in, and optimizing the pin stand position.

Furthermore, the determination of the pin stand position described above
It can be performed by evaluating the distance between the probe pins and the surface pressure. It is also possible to combine both.

First, the pin stand position is determined by evaluating the probe pin interval, for example, as follows.
That is, first, using the selection criterion determined based on the pin-placing priority order, one of the same potential points is selected as the pin-placing position candidate for each potential. Such a selection criterion is initially a criterion of selecting the same potential point having the highest pin-placing priority, for example. When a plurality of pin-positioning position candidates are generally selected for each potential using such selection criteria, one selected pin-positioning position candidate is extracted for each potential, and the extracted pin-positioning position candidates are extracted. A pin stand pattern is created by the combination of. As described above, there are generally a plurality of pin stand position candidates for each potential, and therefore there are generally a plurality of pin stand patterns obtained by this creation. Next, with respect to the created pin stand pattern, a determination is made regarding a predetermined condition regarding the probe pin interval when the probe pins are set up at the pin stand position candidates, for example, a condition regarding whether or not it is a predetermined value or less. As a result of this determination, when it is determined that the condition is not satisfied, the selection criterion described above, that is, the selection criterion used when selecting the candidate of the pin stand position is relaxed, and the candidate of the pin stand position is selected. The creation of the pin stand pattern is repeated until the above determination condition is satisfied. The relaxation of the selection criterion here is, for example, a process of expanding the pin-placing priority order of the same potential point that can be selected as the pin-placing position candidate to the highest pin-placing priority order and the next pin-placing priority order. is there. As a result of such repetition,
If a certain condition regarding the probe pin interval is satisfied at a certain point in time, one of the pin stand patterns that satisfy this condition is selected, and the pin stand position candidates that make up the selected pin stand pattern are in-circuit tested. Is determined as the pin stand position used in.

Next, the pin stand position can be determined based on the surface pressure as follows. That is, first, for each potential, one of the same potential points is selected as a pin stand position candidate. From the selected pin-positioning position candidates, one is taken out for each potential, and the same potential points are combined to form a pin-positioning pattern. In general, the number of pin stand position candidates is plural for each potential, and therefore the pin stand pattern obtained by the combination is also generally plural. Furthermore, regarding the pin stand pattern that satisfies a predetermined condition (for example, the pin stand pattern that satisfies the above-mentioned pin spacing condition) among the created pin stand patterns, when probe pins are set according to the pin stand pattern, one side or both sides of the substrate The pressure applied to is detected. As a result, the pin stand pattern in which the pressure is considered to be most uniformly distributed is selected, and the pin stand position candidates that form the selected pin stand pattern are determined as the pin stand positions in the in-circuit test.

As described above, when the pin stand pattern creating process is repeatedly executed depending on whether or not a predetermined condition regarding the probe pin interval is satisfied, an optimum pin stand pattern or a pattern close thereto can be obtained. Further, when the pin stand position is determined based on the surface pressure, the distribution of the surface pressure applied to the substrate is optimized.

The pin stand position determining process based on the pin interval is preferably terminated when a predetermined condition is satisfied. That is, when the number of locations where the probe pin interval is less than or equal to a predetermined value (defective location of the probe pin spacing) is less than a predetermined number, or when the time required for the process up to the creation of the pin stand pattern exceeds a predetermined time By stopping the above-mentioned repetition, it is possible to shorten the processing time and to feed back the fact that the circuit wiring is inappropriate to the board design process.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows the structure of an apparatus according to an embodiment of the present invention. The device shown in this figure is a device that can be configured as a workstation, for example, and is composed of a processing unit 10, an input unit 12, a display unit 14, a storage unit 16, and a print output unit 18.

FIG. 2 shows the operation flow of this embodiment. As shown in this figure, the feature of the present embodiment is that the arrangement of probe pins in the in-circuit test can be automatically executed by using the apparatus configuration shown in FIG.

In this embodiment, first, the same potential point extraction is executed using so-called artwork CAD data (100). That is, part name, part number, pin N
Data including o, land dimensions X and Y, or data from which these can be derived is input from the input unit 12 to the processing unit 10 by the user. The processing unit 10 creates the same potential point information as shown in the left half of FIG. 3 based on the input data.

The same potential point information is grouped for each potential. That is, the same-potential point information is grouped as the same-potential group, .... Each equipotential group consists of multiple equipotential points,
A part name, a part number, a pin number, and land dimensions X and Y correspond to the same potential point, respectively. The component name indicates the name of the component mounted on the board corresponding to the same potential point, and the component No indicates the number given to the component. The pin No. indicates the pin number of the component corresponding to the same potential point, and the land dimensions X and Y indicate the dimensions of the same potential point (generally a land).

The processing unit 10 next executes the pin-placing priority ordering (102). At that time, the processing unit 10 refers to the pinning priority order accumulation database 200 for each component name. The database 200 is built on the storage unit 16, for example.

The pin name priority order accumulation database 200 for each part name stores data having a structure as shown in FIG. 4, for example. This data is data that associates the component name with the priority order, and further associates the component name with the pin shape. The priority is information that indicates which part name should be selected when deciding the probe pin arrangement, and the higher priority is given to the one that should be selected first, and the highest priority is given to the part that should not be selected. The lowest priority is given to each. For example, a high priority “1” is given to a component such as a connector that easily makes good contact with the probe pin, and a low priority “5” is given to a chip component that is difficult to make good contact with. Further, the pin shape is information indicating what kind of shape the probe pin suitable for the component has.

The processing unit 10 acquires such information by referring to the database 200, and assigns a priority to each equipotential point, as shown in FIG. For example,
For the equipotential point that belongs to the same potential group and the component number is IC1, the priority order “3” associated with the component name IC on the database 200 is given. Such prioritization is executed for all the same potential points. If the equipotential point information created in step 100 includes a component name that has not been stored in the database 200, the processing unit 10 should associate this component name with the component name. The priority order is registered in the database 200.

After performing the pin-placing priority order in this manner, the processing section 10 selects a pin-placing pattern based on the pin interval and the pin shape (104). that time,
The processing unit 10 refers to the information on the pin shape database 202 and the pin name priority accumulation database 200 for each part name. The pin shape database 202 is composed of information associating various pin shapes as shown in FIG. 5, for example, with clearances to be secured when the pin shapes are used. Further, as described above, the component name and the pin shape are associated with each other on the pin-pile priority accumulation database 200 for each component name. The information obtained by referring to such databases 202 and 200 is used for evaluation of the pin interval NG (described later) in step 104. The details will be described later.

The processing section 10 selects a pin stand pattern based on the pin interval and pin shape, and then selects a pin stand pattern based on the surface pressure distribution (106). That is, one side or both sides of the board to be subjected to the in-circuit test is divided into a plurality of areas, and the standard deviation of the load applied by the probe pin in each of the divided areas is calculated. The pin stand pattern having the smallest standard deviation is selected from the pin stand patterns selected in step 104. The processing unit 10 stores the pin stand pattern thus obtained in the storage unit 16, displays it on the display unit 14, or outputs it from the output unit 18 (108).

FIG. 6 and FIG. 7 show details of step 104 in the present embodiment, that is, the operation of selecting the pin stand pattern based on the pin interval and the pin shape.

As shown in this figure, step 300
In, first, the setting of the calculation termination condition is executed. That is, it is possible to prevent the selection process of the pin stand pattern based on the pin interval and the pin shape from continuing indefinitely, and to determine the number of pin intervals NG (NG remaining number) in the pin stand pattern obtained by the operation of the apparatus of this embodiment. In order to feed back to the circuit board design process, the conditions for the total calculation time and the NG remaining number are set in step 300. In step 302, which will be described later, it is determined whether or not the discontinuation condition set in step 300 is satisfied. If the discontinuation condition is satisfied, the process of the processing unit 10 is step 106.
Move to.

After executing step 300, the processing section 10 executes step 304. In step 304,
The candidate lowering KD is set to 0. In the following step 306, the highest priority Y is extracted for each equipotential group. For example, in the example shown in FIG. 3, since the same potential point corresponding to the part name CONNECT in the same potential group is given priority "1", the highest priority Y [] of this same potential group is set to 1. It Similarly, the highest priority Y [] of the same potential group is "1".
The highest priority Y [] of the same potential group 03 is set to "2". In this way, when the highest priority Y is extracted for each equipotential group, after that, the processing unit 1
0 executes step 308. In step 308, first, the highest value Ymax of the highest priority Y, the same potential group having the highest priority Ymax, and the number Gnum thereof are extracted. For example, the same potential group shown in FIG.
Considering only the above, the highest value Ymax of the highest priority Y is “1”, and the equipotential group having the highest priority Ymax (the highest highest priority equipotential group) is. Therefore, the number Gnum is 2.

Next, the processing unit 10 calculates the highest priority lowering value YD for the highest highest priority equipotential group based on the equation YD ← Y + KD (310). Then, the processing unit 10
Executes the operation of Gnum ← Gnum−1, that is, the decrement of the number Gnum of the highest and highest priority equipotential groups (312).

After such processing, the processing section 10 executes extraction of pin-position position candidates (314). That is,
From each of the same potential groups, the same potential point to which the highest priority Y is given is extracted as a pinning position candidate. For example, in the case of the equipotential group shown in FIG. 3, it is the components CN1 and CN2 to which the priority order “1” is assigned that is extracted as the pinning position candidates when the step 314 is first executed. In case of, the part TR1
And D3. For the same potential group, the part D2 to which the priority order “2” is given is extracted as the pin-position position candidate.

After that, the processing section 10 generally creates a plurality of pin stand patterns by combining the pin stand position candidates selected one by one from each of the pin stand position candidates of the same potential group (316). For example, in the same-potential group shown in FIG. 3, when the step 314 is first executed, two pin-positioning position candidates are extracted,
Further, two are extracted for the same potential group and one is extracted for the same potential group. Therefore, when selecting one from each of the pin raising position candidates of each of the same potential groups and combining them, 2 × 2 × 1 = 4 pin raising patterns can be obtained. The process in step 316 is a process related to such a combination calculation.

The processing unit 10 then proceeds to the database 202.
The clearance is read for each pin from (318). Next, the processing unit 10 determines, for each pin stand pattern created in step 316, based on the read clearance and the pin shape obtained by referring to the database 200.
The pin interval NG is calculated (320). The pin interval NG mentioned here refers to a situation where the interval between adjacent probe pins is equal to or less than a predetermined value when the probe pins are actually set up according to the pin setting pattern. The standard of the probe pin interval related to the calculation of the pin interval NG is determined based on the clearance read in step 318, and what standard is used for each pin stand position candidate is
The pin shape to be used at the same potential point is determined by reading from the database 200.

The processing unit 10 displays the result of the calculation in step 320, that is, the position and the number of pin intervals NG occurring for each pin stand pattern on the screen of the display unit 14 (322). Then, in step 302, it is determined whether or not the cutoff condition is satisfied. If the condition is not satisfied in step 302, the operation of the processing unit 10 proceeds through step 324 to step 3 above.
Return to 12. The determination condition in step 324 is a condition of whether or not the number Gnum of highest and highest priority equipotential groups is 0, and the operations in and after step 312 are repeated until this condition is satisfied.

When the condition of step 324 is satisfied at a certain point, the candidate lowering level KD is incremented (3
26). For example, when the condition of step 324 is satisfied for the first time after executing step 304, the candidate lowering level KD is updated from 0 to 1. The processing unit 10 returns to step 308 after executing step 326.

In step 308, the extraction of the maximum value Ymax of the highest priority Y, the information for specifying the highest and highest priority equipotential groups, and the number Gnum thereof is executed again. In step 310, the highest rank reduction value YD is calculated for the highest highest priority equipotential group based on the above equation. Therefore, when the highest value Ymax of the highest priority Y is "1", the previous step 3
Since the candidate lowering level KD is updated to "1" at 26, the highest priority lowering value YD becomes "2". Thereafter, the processing unit 10 goes through step 312 and then step 3
14 is executed.

In step 314, the extraction of the pin stand position candidates described above is executed. At this time, for one of the highest and highest priority equipotential groups, instead of the highest priority Y, the highest priority reduction value YD is used as a basis for extraction. Further, which of the highest potential priority equipotential groups using the highest priority reduction value YD instead of the highest priority Y is to be changed depending on the number Gnum of the highest highest priority equipotential groups. . Based on the pin stand position candidates obtained as a result of such processing, step 316 is subsequently executed to create the pin stand pattern.

For example, as a result of the first execution of steps 314 and 316, pin stand patterns as shown by a to z in FIG. 3 are obtained, and these pin stand patterns a
If none of the discontinuing conditions of step 302 are satisfied for ~ z, then steps 314 and 31 are performed.
When 6 is executed, the pin stand pattern as shown by a ′ to z ′ is recreated. At this time, in step 314, the highest priority lowering value YD is used in place of the highest priority Y for one of the highest and highest priority equipotential groups (and the same potential group in the example of FIG. 3). To be executed. As a result, the same potential points (parts CN1 and CN2) that were treated as pin-positioning position candidates in the pin-up patterns a to z are not treated as pin-positioning position candidates in the pin-up patterns a ′ and b ′. The higher-priority equipotential point, that is, the component R3 to which the priority “2” is assigned is treated as the same-potential point. The highest and highest priority equipotential groups using the highest priority reduction value YD are changed according to the number Gnum of highest and highest priority equipotential groups. For example, step 3 which is first executed after step 326 is executed.
In FIG. 14, YD is used for the equipotential group, and when it is executed next, YD is used for the equipotential group.
D is used, and so on. By performing such an operation, a'-
z'will be obtained.

When the cutoff condition 302 is not satisfied for any of the new pin stand patterns a'to z'obtained by recreating the pin stand pattern as described above,
Further, in step 326, the candidate lowering level KD is updated from "1" to "2", and the processing from step 308 onward is repeated.

As described above, in this embodiment, the pinning pattern is created while treating the same potential point initially assigned the highest priority Y as a pinning position candidate.
The created pin stand pattern is evaluated by the pin interval. When the termination condition is not satisfied for this pin-up pattern, the same potential point with the next highest priority is selected as a pin-up position candidate, and the same evaluation is executed for pin-up patterns relating to different combinations. Therefore, according to the present embodiment, a pin stand pattern that is almost optimum with respect to the pin interval can be obtained, and since the pin stand pattern is selected based on the surface pressure distribution in step 106 described above, the contact pressure can be reduced. Also, a good pin stand pattern can be obtained.

Further, in this embodiment, step 3
In 02, the processing is aborted when the number of pin intervals NG becomes relatively small or when the processing time exceeds a predetermined value. Therefore, in this embodiment, it is possible to prevent the processing time from being extended indefinitely, and when the pin interval NG is remarkable, the information can be fed back to the circuit design / board design.

As described above, according to the present embodiment, the arrangement of the probe pins in the in-circuit test can be automatically determined, the quality can be homogenized and improved, and the pinning pattern relating to the arrangement of the probe pins can be achieved. Can be optimized and the surface pressure can be optimized.

Note that the evaluation of the surface pressure distribution in step 106 is performed together with the evaluation of whether or not the degree to which the positions of the probe pins on the respective surfaces match is high when the in-circuit test is simultaneously performed on both surfaces of the substrate. It is preferable to carry out.

[0045]

As described above, according to the device of the present invention, the equipotential point extraction is executed based on the information on the circuit wiring on the board and the mounted parts, and the pinning priority order is given to each equipotential point. However, since the pin stand position is determined based on the given pin stand priority, the pin stand position can be determined automatically, and the quality difference and the longer working time caused by work based on experience can be prolonged. Can be prevented.

Further, according to the apparatus of the present invention, when the pin stand position is determined based on the pin interval, the selection standard determined based on the pin stand priority is sequentially relaxed and the pin stand position candidate is selected. Since the pin stand pattern is selected as the pattern relating to the arrangement of the probe pins when the predetermined condition is satisfied with respect to the pin stand pattern composed of the selected pin stand position candidates, the pin stand pattern which is almost optimal with respect to the probe pin interval is selected. You can get the pattern.

Further, according to the apparatus of the present invention, the above-described repetition is terminated based on the number of defective probe pin intervals and the processing time for creating the pin stand pattern, so that the processing time may be extended indefinitely. Moreover, it is possible to feed back the processing result to the circuit design / board design process in an early stage.

According to the apparatus of the present invention, the pin stand pattern is selected based on the evaluation of the surface pressure distribution, so that an appropriate surface pressure distribution can be obtained.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a flow of operations of a processing unit in this embodiment.

FIG. 3 is a conceptual diagram for explaining an outline of an operation from extraction of the same potential point to determination of a pin interval among operations of this embodiment.

FIG. 4 is a diagram showing an example of pin name priority ranking accumulated data for each component name used in this embodiment.

FIG. 5 is a diagram showing an example of a pin shape.

FIG. 6 is a flow chart showing a flow of a pin stand pattern selecting operation based on a pin interval and a pin shape among the flow of the operation of the processing unit in this embodiment.

FIG. 7 is a flowchart showing a continuation of the operation shown in FIG.

[Explanation of symbols]

 10 Processing unit 12 Input unit 14 Display unit 16 Storage unit 18 Print output unit 200 Pin name priority database for each part name 202 Pin shape database Y Maximum priority Ymax Y maximum value Gnum Maximum maximum priority Same number of potential groups KD Candidate reduction level YD Highest priority reduction value

Claims (4)

[Claims] 1. An equipotential point extracting means for extracting, for a predetermined number of potentials, equipotential points at which the same potential is generated during an in-circuit test, based on information about circuit wiring on the board and mounted parts, and each of the extracted same potential points. Depending on the type of the mounted component corresponding to the potential point, the pin-placing priority assigning means for assigning the pin-placing priority order to the same potential point and the pin-placing position at which the probe pin should be erected are set according to the pin-placing priority order. A probe pin arrangement determination device comprising: a pin stand position determination means for selectively determining from any one of the same potential points for each potential, and automatically determining the pin stand position. 2. The arrangement determining device according to claim 1, wherein the pin-positioning means determines the same potential point for each potential by using a selection criterion defined based on the pin-setting priority. The first step of creating a pin stand pattern by selecting as a candidate and selecting and combining one for each potential among the selected pin stand position candidates, and the created pin stand pattern as a pin stand position candidate. The second step of determining whether or not a predetermined condition regarding the probe pin interval when the probe pin is raised is satisfied, by relaxing any of the above selection criteria with respect to any of the potentials, by using any of the created pin raising patterns. The above is repeated until the above condition is satisfied, and when the above condition is satisfied, one of the pin stand patterns related to the satisfaction is selected and selected. Been pins stand position candidates for configuring the pin stand pattern, arrangement determination unit of the probe pin, characterized by determining as a pin stand position. 3. The arrangement determining device according to claim 2, wherein the pin stand position deciding means has less than a predetermined number of locations where the probe pin interval is a predetermined value or less in the created pin stand pattern, and / or An arrangement determining device for probe pins, characterized in that the repetition of the first and second steps is terminated when the time required for processing until the creation of the pin stand pattern exceeds a predetermined time. 4. The arrangement determining device according to claim 1, wherein the pin stand position determining means selects one of the same potential points as a pin stand position candidate for each potential, and each of the selected pin stand position candidates. A pin stand pattern is created by selecting and combining one for each potential, and for the pin stand pattern that satisfies the specified condition among the created pin stand patterns, one side of the board when the probe pins are set up according to the pin stand pattern. Or, detect the pressure applied to both sides, select the pin stand pattern where the detected pressure is said to be most evenly distributed, and select the pin stand position that constitutes the selected pin stand pattern as the pin stand position. An arrangement determining device for probe pins, characterized in that the arrangement is determined.