JP3189603B2 - Probe pin relocation method for in-circuit test - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for determining the arrangement of probe pins required for performing an in-circuit test, and more particularly to a method of changing the arrangement of probe pins which are initially provided as data and connecting the probe pins. The present invention relates to a probe pin rearrangement method for eliminating contact of the probe.

[0002]

2. Description of the Related Art An in-circuit test is a test for testing whether or not an operation of a circuit board is good from the viewpoint of electrical continuity. In this type of in-circuit test, a plurality of types of probe pins are selectively used, including the shape disclosed in Japanese Utility Model Laid-Open No. 3-68082, for example. Further, such probe pins are arranged on a movable plate called a pin board, and are brought into contact with a substrate to be tested, particularly a circuit wiring (land or the like) thereon.

[0003] Therefore, when performing an in-circuit test, it is important to determine what shape pins are to be placed in what positions. Conventionally, the selection of the pin shape and the determination of the pin arrangement have been performed based on the experience of the operator.

That is, an operator first extracts the same potential point on the board based on the drawing relating to the wiring pattern and the mounted components on the board. That is, a point where the same potential appears when the in-circuit test is executed is extracted for each of a plurality of types of potentials. Next, from among a plurality of potential points generally obtained for each potential, the position where the probe pin should be raised is determined based on the lead shape of the component to be mounted. This judgment requires experience accumulated in the workers or work groups. Next, a pin shape most suitable for the position determined and selected is selected. By repeatedly performing such an operation for each potential, a pattern of a position where the probe pin should be set, that is, a pin setting pattern can be obtained. Further, the obtained pin setting pattern is inspected to determine whether the interval between adjacent probe pins is small (hereinafter simply referred to as “contact”), and the pressure applied to the surface of the substrate when the probe pins are set and an in-circuit test is performed. Check if (surface pressure) varies. As a result of this check, if there is a defect in the probe pin interval or surface pressure, the process returns to the operation of determining the pin stand position, and the above operation is repeated until finally a good pin interval and surface pressure are obtained. Conventionally, such a work has provided a final pin arrangement used for an in-circuit test.

[0005]

However, it is difficult to perform such a pin placement determination operation in a short time. This is because the work of correcting the pin setting position performed when the pin spacing defect is detected must be repeatedly performed until the pin spacings of all the probe pins have cleared the regulation, and the pin setting performed when the surface pressure defect is detected. The work of correcting the position must be repeatedly performed until the surface pressure clears the regulation. Therefore, it is difficult to determine a pin setting pattern that satisfies the conditions of pin spacing and surface pressure distribution within a limited delivery date.

Further, since the conventional pin stand arrangement determination work is based on experience accumulated in a worker or a work group, the obtained pattern is not always the optimum pattern. That is, even if the provisions of the pin intervals are cleared for all the probe pins and the conditions of the surface pressure dispersion are satisfied, it is not known whether or not the pattern is an optimal pin setting pattern. In most cases, the rules are simply cleared.

[0007] In addition, the contents of the experience accumulated in the worker or the work group are different for different workers or work groups. Therefore, the quality of the completed (determined pattern) differs depending on which worker or work group is in charge, and quality variation also occurs.

[0008] As a method of solving these problems and making it possible to determine an optimum pattern more quickly than in the prior art,
There is a method proposed by the applicant of the present invention (Japanese Patent Application No. 5-
No. 211294). In this method, first, the same potential point existing on the substrate is extracted for each potential using artwork CAD data or the like. Next, in addition to the extracted same-potential-point information, a component priority is assigned to each of the same-potential points using a pin-priority priority storage database for each component name. The component name / pinning priority accumulation database referred to here is a database that associates component names (types of components), component priorities, and pin shapes. Further, based on the assigned component priorities and using the pin setting priority accumulation database and the pin shape database for each component name, a pin setting pattern is determined in consideration of the pin shape and its clearance. The pin shape database referred to here is a database that associates the pin shape with the clearance. Then, a pinning pattern is selected based on the surface pressure dispersion, and the result is output as an optimal pattern.

However, this method also has some problems. First, in the method proposed by the applicant of the present invention, when determining a pinning pattern in consideration of the pin shape and its clearance, first, a set of the same potential points of each potential (same potential group) is first used. A point having a high component priority is listed as a pinning position candidate, and a pinning pattern candidate is created by a combination of points listed as candidates in each of the same potential groups. If the pin spacing is not satisfied by any of these candidates and one of the pins is in contact with another pin, the pin setting position is set to the next highest component priority point in each same potential group. A similar procedure is executed after including it in the candidate (relaxation of the pin setting position selection criterion). By repeating such processing, contact between pins is eliminated at a certain point. However, this may require a great deal of computation time. As an example, each equipotential group has two highest component priority points,
Considering the case where there are 100 equal potential groups, the number of pinning pattern candidates created first is 2 ¹⁰⁰ = 1.3.
× 10 ³⁰ bulges and the number of patterns that must be finally considered is further increased by relaxing the standard. Therefore, even if it is calculated using a workstation, the best pin setting pattern without pin contact can be obtained. The decision requires a long time, such as one to two days.

Next, in the previously proposed method, pin position candidates are determined based on the component priorities. Although this concept is effective in automating the determination of the probe pin arrangement, it does not allow more flexible measures that would otherwise have been possible with humans. For example, let us consider a case where the pin contact can be eliminated only by changing the shape of the probe pin to a suboptimal shape even if the pin stand pattern has a pin contact. In this case, if a worker or a work group who has accumulated sufficient experience performs a manual operation, the shape of the probe pin will be changed to a suboptimal shape. For example, even in the case of a pin stand pattern in which pin contact occurs, the contact of the probe pins is changed only by changing the surface on which the probe component is mounted from the component surface on which the lead component is mounted to the solder surface on which the chip component is mounted. Consider a case in which can be resolved. In this case, if a worker or a work group who has accumulated sufficient experience executes the manual work, the problem will be solved by changing the probe pin arrangement surface to a solder surface. However, in the previously proposed method, the probe pin shape and the probe pin arrangement surface at the same point are fixed and cannot be changed. Inspection of the next pinning pattern candidate is executed despite being able to be cleared, and a situation that takes a long time may occur.

Furthermore, in the previously proposed method, when defining the pin standing pattern, although the definition of the pin interval and the conditions of the surface pressure distribution are taken into consideration, for example, it is necessary to set the probe pins on the solder surface as much as possible. It is difficult to respond to requests from circuit test and inspection systems.

The previously proposed method cannot cope with a case where a special pin arrangement is required as in the case of four-terminal measurement. 4
Terminal measurement is a well-known measurement method applied to components that require precise impedance measurement, for example, low resistance of 10Ω or less. If the target component is a four-terminal component, two terminals are used for each terminal. It is necessary to set up a total of four probe pins. In other words, in order to execute the four-terminal measurement, it is necessary to set two potentials per target component and two potentials
It is necessary to erect a book pin. Further, in order to perform accurate four-terminal measurement, it is preferable to set a probe pin on a terminal of a target component. A pinning pattern determination procedure that enables such a measurement method is not disclosed in the prior proposal. Assuming that four-terminal measurement is performed using the previously proposed pin stand pattern determination procedure, first, normal probe pins (probe pins other than the four-terminal measurement probe pins) are arranged according to the previously proposed method, and thereafter, In addition, a two-step procedure of manually arranging the four-terminal measurement probe pins so as not to make contact with the already arranged normal probe pins is required. When the arrangement of the probe pins for four-terminal measurement is performed in such a procedure,
The first problem is that the four-terminal measurement probe pins are not necessarily arranged at the terminals of the component to be measured, and four-terminal measurement with good accuracy is not guaranteed. The second problem is that if the normal probe pin is moved in consideration of giving priority to the accuracy of the four-terminal measurement when the already arranged normal probe pin comes into contact with the four-terminal measurement probe pin, The pin arrangement is not always the optimum arrangement. The third problem is that the four-terminal measurement probe pins are usually arranged in the pin setting candidates remaining after the arrangement of the probe pins, so that it is difficult to arrange the four-terminal measurement probe pins, and it is performed manually. In addition to that, it generates a long study time.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has been made by further improving the method proposed by the applicant of the present invention and relaxing the pin setting position selection criterion. An object of the present invention is to make it possible to quickly determine a pin setting pattern that satisfies the requirements related to the pin shape and its clearance by eliminating the trouble of creating and examining pin setting pattern candidates one by one. The present invention achieves the above object by a procedure of rearranging the probe pins once arranged, and at this time, even in a case where a new pin contact occurs at the probe pin rearrangement destination, in a short time. An object of the present invention is to make it possible to eliminate pin contact. The present invention expands the priority information for determining the pinning position candidates, thereby enabling more flexible measures that could have been performed manually, while maintaining the advantages of automation. An object of the present invention is to make it possible to cope with a request from an in-circuit test / inspection machine system, such as setting up a probe pin on a solder surface side, and to determine a more optimal probe pin arrangement in a limited time. The present invention relates to a probe pin for a four-terminal measurement, in which a contact is made between a special probe pin which should be fixedly arranged and a normal probe pin. It is another object of the present invention to make it possible to perform the rearrangement in a short time so that the arrangement of the normal probe pins and the arrangement of the fixed probe pins are optimal.

[0014]

In order to achieve the above object, the present applicant proposes the following probe pin rearrangement method. That is, the present invention relocates at least one of the probe pins that are in contact with each other to any other point that has the same potential as the point where it was previously placed, and where a sub-optimal test environment is expected. And a test environment standard so that at least a part of the contact between the probe pins occurring in the probe pin arrangement initially given as data is eliminated.
Repeatedly executing the above-mentioned rearrangement step while sequentially relaxing the data, and determining the data indicating the arrangement of the probe pins used in the in-circuit test while eliminating the contact between the probe pins. And

[0015] In the present invention, the probe pin arrangement initially given may be a normal probe pin arrangement in which the rearrangement of the probe pins is permitted, and a probe pin rearrangement in accordance with the arrangement is basically prohibited. A probe according to the normal probe pin arrangement, wherein the probe pin rearrangement method includes a fixed probe pin arrangement and a probe pin according to the normal probe pin arrangement. Determining whether the pin can be relocated to any of the other points that have the same potential as the point where it was previously placed and for which a suboptimal test environment is expected; and determine that the pin can be relocated. In the case of performing, the step of performing a rearrangement step for the probe pins related to the normal probe pin arrangement, and if it is determined that the rearrangement is not possible, Performing a rearrangement step relates the probe pin according to the serial fixed probe pinout, and having a.

According to the present invention, in the rearranging step, among the probe pins in contact with each other, the probe pins other than the probe pin which has been rearranged immediately before are relocated to other points having the same potential as the previously arranged probe pin. A contact rearrangement step of repeatedly executing a process of arranging a predetermined search level as a limit; and a contact destination in a case where contact between the probe pins is not resolved despite execution of the contact rearrangement step. After returning to the probe pin arrangement immediately before performing the rearrangement step, the probe pins that have been immediately rearranged among the probe pins that are in contact with each other are changed to other points having the same potential as the point where they were arranged so far. And a contact source rearrangement step of executing a rearrangement process.

According to the present invention, with respect to a point where a probe pin may be arranged, the type of a component connected to the point, the type of a probe pin to be arranged at the point, and the probe pin to be arranged at the point Setting a candidate level indicating the placement priority of the probe pins based on the placement plane, and the rearrangement step includes selecting a candidate level from among other points having the same potential as the point where the probe pin has been placed. And selecting another point related to the rearrangement based on The invention can be used for the same point
When there are multiple types of probe pins and
If it can be arranged on several surfaces, each probe pin type or each surface
A feature is that a candidate level is set for each.

[0018]

In executing the probe pin rearrangement method of the present invention, the probe pin arrangement is initially given as data. The probe pin arrangement initially given may be a pinning pattern candidate obtained based on the result of the same potential point extraction, for example, or a pinning pattern finally obtained by a previously proposed method or a conventional manual method. It may be a pattern. Once the probe pin placement is initially provided, in the present invention, the relocation step is repeatedly performed. In each relocation step, at least one of the probe pins in contact with each other has the same potential as the point where it was previously placed and a suboptimal test environment (eg, a relatively large land). Relocated to one of the other possible points. For example, as shown in FIG. 1, it is assumed that probe pins are arranged at a point A ₀ belonging to a certain potential group and a point B ₀ belonging to another same potential group, and both probe pins are in contact with each other. . In this case, by performing the relocation step,
For example the probe pin in the point B ₀ is other points are within the same Everyone potential group is suboptimal test environment is expected, is rearranged for example B _1. A point B ₁ belonging to another same potential group
If already arranged probe pin in C ₀ point proximate the pin contact is eliminated one place by the rearrangement. Therefore, by repeatedly executing such a rearrangement step, the contact between the probe pins generated in the initially provided probe pin arrangement can be at least partially eliminated. For example, all contacts can be eliminated, or only contacts that can be eliminated within a predetermined number of repetitions or repetition times can be eliminated. As described above, in the present invention, since it is not necessary to create and examine all pinning pattern candidates one by one while relaxing the pinning position selection criterion, pinning that satisfies the requirements related to the pin shape and its clearance is not required. The pattern is determined quickly.

In the probe pin rearrangement method of the present invention, the rearrangement of the fixed probe pin arrangement (for example, the arrangement of the probe pins for four-terminal measurement), which is prohibited in principle, is also performed under predetermined conditions. Be executed. First, the probe pin arrangement initially provided in the present invention includes a normal probe pin arrangement in which relocation of probe pins is permitted and a fixed probe pin arrangement in which relocation is basically prohibited. When the probe pins related to the fixed probe pin arrangement and the probe pins related to the normal probe pin arrangement are in contact with each other, first, it is determined whether the probe pin related to the normal probe pin arrangement can be rearranged. As a result, when it is determined that the probe pin can be relocated to another same potential point where a next-best test environment is expected, the probe pin related to the normal probe pin arrangement is relocated, and it is determined that the rearrangement is not possible. , The probe pins related to the fixed probe pin arrangement are rearranged. When contact with another probe pin related to the fixed probe pin arrangement occurs at the rearrangement destination, it is determined whether or not the rearranged probe pin can be rearranged again. When contact with another probe pin related to the normal probe pin arrangement occurs at the relocation destination, one of the relocated probe pin and the relocation destination probe pin is relocated. Therefore, in the present invention, the contact between the probe pin, which should be fixedly arranged, and the normal probe pin is preferably eliminated. Also,
Since the probe pins that should originally be fixedly arranged are not rearranged in principle, it is possible to maintain the accuracy of measurement using the probe pins. Furthermore, when the probe pins related to the normal probe pin arrangement cannot be rearranged (or when the rearrangement is inappropriate), the probe pins related to the fixed probe pin arrangement are exceptionally rearranged. Therefore, reallocation can be performed in a short time.

In the present invention, the contact destination rearrangement and the contact source rearrangement are executed under management by a search level. First, to eliminate the contact that occurred at a certain point,
Suppose that a certain probe pin is relocated to another same potential point.
For example, since the probe pins are arranged on the probe pin and the point B ₀ which are arranged in a point A ₀ in FIG. 1 has been in contact, the same potential point probe pins of the other which are located in the points B ₀ B ₁ And relocated to Further, since the probe pin is also arranged at the point C ₀ which is close to the point B ₁ and belongs to another same potential group, the probe pin which is arranged at the point B ₁ as a result of the rearrangement is arranged at the point C ₀ . It is assumed that the probe pin has been newly contacted. in this case,
In the present invention, first, the contact rearrangement, that is, the point C ₀
Is relocated.
For example, the probe pins are arranged point C ₀ is relocated to another of the same potential point C _1. Even if this rearrangement is performed, the point C
If no new pin contact occurs in step ₁ , the process ends as relocation succeeds. Conversely, if the result points C ₁ subjected to the relocation a new pin contact occurs, relates the probe pins (not shown) in contact with the probe pins are arranged in point C _1, relocation is executed You. Such repetitive contact destination rearrangement processing is executed with a predetermined search level as a limit. If the contact between the probe pins has not been eliminated despite the repetition up to the search level, the probe pin arrangement immediately before executing the contact destination rearranging step, that is, the points A ₀ and B
Returns to the state of arranging the probe pins ₁ and point C _0. On top of that, the probe pins were relocated immediately before of the probe pin in contact with each other, that is, the probe pins are arranged in point B _1, are rearranged other same potential point, for example, B _2. When a new contact occurs due to this rearrangement, the contact destination rearrangement is executed in the same procedure as the procedure described above. Therefore, in the present invention, not only the probe pins related to the contact are rearranged within the same potential group, but also the pin contact is eliminated while expanding the rearrangement target by the contact destination rearrangement. Even if a new pin contact occurs at the relocation destination, this pin contact is eliminated in a short time. Furthermore, since the expansion range of the relocation target is limited by using the search level, the contact source relocation is executed when the early resolving of the pin contact cannot be expected due to the relocation of the contact destination. Pin contact elimination is realized.

According to the present invention, regarding the points where the probe pins may be arranged, the types of parts connected to the points, the types of the probe pins to be arranged at the points, and the probes to be arranged at the points Based on the pin placement surface,
A candidate level indicating the probe pin arrangement priority is set. In the rearrangement, a rearrangement destination is selected from the same potential points based on the candidate level. Therefore, in the present invention, since the priority information is extended not only to the type of the component but also to the type and arrangement of the probe pins, while maintaining the advantages of automation, a more flexible measure that could be performed manually. Becomes executable. The candidate level is
You can also set the type and each side. Further, it becomes possible to cope with a request from the in-circuit test / inspection machine system which wants to set the probe pin on the solder surface as much as possible.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 shows the configuration of an apparatus according to an embodiment of the present invention. The device shown in FIG. 1 is, for example, a device that can be configured as a workstation, and includes a processing unit 10, an input unit 12, a display unit 14, a storage unit 16, and a print output unit 18.

FIG. 3 shows a flow of the operation of this embodiment. In this embodiment, the arrangement of the probe pins in the in-circuit test is automatically executed using the apparatus configuration shown in FIG.

In this embodiment, first, the same potential point is extracted using artwork CAD data (10).
0). That is, data including a part name, a part number, a pin number, land dimensions X and Y, or data from which these can be derived are input from the input unit 12 to the processing unit 10 by the user. The processing unit 10 performs, based on the input data,
The same potential point information as shown in the left half of FIG. 4 is created.

The same potential point information is grouped for each potential. That is, the same potential point information is grouped like the same potential group,.
Each equipotential group is generally composed of a plurality of equipotential points, and each equipotential point has a component name, a component N
o, pin No., and land dimensions X and Y correspond to each other. The component name indicates the name of the component mounted on the board corresponding to the same potential point, and the component number indicates the number assigned to the component. Pin No. indicates the pin number of the component corresponding to the same potential point, and land dimensions X and Y indicate the dimensions of the same potential point (generally, a land).

Next, the processing section 10 executes the pin priority setting (102). At that time, the processing unit 10 refers to the pin name priority priority accumulation database 200 and the pin shape database 202 for each component name. These databases 200 and 202 are constructed on the storage unit 16, for example.

The component name-by-pinning priority storage database 200 stores, for example, data having a configuration as shown in FIG. This data is
This is data relating the component priority, the pin shape code, and the pin arrangement surface. The component priority is information indicating which component name should be selected when deciding the probe pin arrangement. Are assigned the lowest priority. For example, a high priority “1” is assigned to a component that easily contacts the probe pin such as a connector (CONNECT), and a low priority “99” is assigned to a chip component (CHIP _- MM) that does not easily contact the probe pin. Is given. The pin shape code is information indicating what shape a probe pin suitable for the component has, and is associated with at least one component name. When there are two or more types of probe pins suitable for the component, a plurality of pin shape codes are associated with each other as represented by (first), (second)... In the drawing. The pin arrangement surface is information indicating on which surface of the board the component corresponding to the component name is to be arranged. The “solder surface” is on the solder surface of the substrate, the “component surface” is on the component surface of the substrate, "Double-sided" indicates that the probe pins should be placed on either the solder side or the component side.

The pin shape database 202 stores data having a configuration as shown in FIG. 6, for example. This data is data that associates the pin shape code, clearance, and probe pin priority.
Each pin shape code is a code for specifying a pin shape having an appearance as shown at the left end of the figure. The clearance indicates a clearance to be secured when the pin shape is used. For example, when a probe pin having a pin shape code a is used, a clearance of 2.5 mm must be secured. The probe pin priority is information indicating which pin shape should be preferentially selected when the same component name is associated with a plurality of pin shape codes on the component name-by-component pin setting priority accumulation database 200. Yes, high priority is given to items that should be selected with priority, and lowest priority is given to items that should not be selected most. For example, if the probe pin represented by the pin shape code d is thinner than the probe pin represented by the pin shape code a, and therefore, a should be used in preference to d, the component shape code a is assigned a high priority “0”, and the pin shape code d is assigned a low priority “20”.

The processing unit 10 includes databases 200 and 2
By referring to FIG. 02, as shown in FIG. 4, a component priority order, a probe pin priority order, and a surface priority order are assigned to each same potential point, and a candidate level is determined based on these. For example, for the same potential point belonging to the same potential group and having a component number of IC1, the database 200
The component priority order “3” associated with the component name IC is given above. In addition, since the pin shape code associated with this component name IC is only b in the component name pin setting priority accumulation database 200, the probe associated with the pin shape code b in the pin shape database 202 is used. The pin priority “0” is assigned to the component IC1. Further, since the “solder surface” is associated with the component name IC in the component name pinning priority accumulation database 200 as the component placement surface, the component IC 1 has the surface priority “0” corresponding to the “solder surface”. "Is given. Since the candidate level is determined by adding the component priority order, the probe pin priority order, and the surface priority order, 3 + 0 + 0 = 3 is given as the candidate level to the same potential point related to the component IC1.
The component C10 having the component name of CHIP _- MM is given a component priority order “99” based on information on the database 200 and a probe pin priority order “0” based on information on the databases 200 and 202. You. In addition, the CHI
Since the pin arrangement surface corresponding to the P _- MM is the “component surface”, the surface priority order “20” corresponding to the “component surface” is assigned to the component C10. Therefore, the candidate level given to the component C10 is 99 + 0 + 20 = 119. Assigning such priorities, and thus determining candidate levels,
This is performed for all the same potential points. In addition, the same potential point according to a component name having a plurality of pin shape codes associated with it, such as the component names RD and POWER, and the same potential point according to a component name whose pin arrangement surface is set to “both sides” Are set in a plurality of ways in accordance with these. If the same potential point information created in step 100 includes a component name that has not been stored in the database 200, the processing unit 10
Registers in the database 200 the component name, the component priority order to be associated with the component name, the pin shape code, and the pin arrangement surface.

The processing unit 10 determines the pinning pattern based on the candidate level (104), and corrects the pinning pattern based on the surface pressure distribution (106). That is, in the present embodiment, the determination of the pinning pattern is preferentially performed based on the candidate level, and the result is corrected based on the surface pressure distribution. The correction based on the surface pressure distribution is performed, for example, on each part of the substrate in the following procedure. First, a point having a relatively high candidate level that does not come into contact with another probe pin even if a probe pin is arranged at that point is selected from the vicinity of the part where the surface pressure is recognized to be insufficient. Then, the probe pins are moved from the same potential point belonging to the same potential group as this point (relocation). At this time, a probe pin for four-terminal measurement described later is not moved. By repeating this process until the optimum surface pressure (or surface pressure distribution) is obtained, not only the type of mounted components, the probe pins to be used and the probe pin arrangement surface, but also the surface pressure or surface pressure distribution An optimal pin pattern can be obtained. Further, since the correction based on the surface pressure distribution is performed according to the rearrangement procedure described later, the calculation time required to execute step 106 can be relatively short. The pinning pattern thus obtained is stored on the recording unit 16 by the processing unit 10, displayed on the display unit 14, or output from the output unit 18 (108).

FIGS. 7 to 9 show the details of step 104, that is, the process of determining the pinning pattern in this embodiment.

First, as shown in FIG.
In executing step 04, first, probe pin initial arrangement based on the candidate level is executed (300). That is, based on the candidate level determined in step 102, a candidate for a point where a probe pin is set is selected for each same potential group. For example, in the example shown in FIG. 4, since the components CN1 and CN2 have the highest candidate levels among the same potential points belonging to the same potential group, the probe pins are initially arranged in CN1 or CN2 for the same potential group. . Regarding the same potential group, TR when the probe pin represented by the pin shape code b is used
1 and D3 when the probe pin represented by the pin shape code b is used are the same potential points having the highest candidate level. Accordingly, for the same potential group, the probe pin represented by the pin shape code b is initially arranged in TR1 or the probe pin represented by the pin shape code b is initially arranged in D3. As for the same potential group, the probe pin represented by the pin shape code b has the highest candidate level when the probe pin represented by the pin shape code b is arranged at D2, so the probe pin represented by the pin shape code b is initially arranged at D2.

If a part to be subjected to four-terminal measurement is used during the in-circuit test, step 30
0, in principle, regardless of candidate level,
Initially, a four-terminal measurement probe pin is arranged at the same potential point of a component to be measured for four terminals. When arranging the four-terminal measurement probe pins, be sure to satisfy the following rules. First, when a four-terminal measurement target component exists in the same potential group, two four-terminal measurement probe pins are always arranged in the same potential group. However, when the same potential group is composed of only a single same potential point, that is, when only the same potential point of the four-terminal measurement target component exists in the same potential group, the same potential The number of probe pins arranged in the group is one ordinary probe pin. Second, 4
The probe pins for terminal measurement are arranged at the same potential point on the four-terminal measurement target component with priority over any normal probe pins. Also, when two or more four-terminal measurement target components exist in the same potential group, two terminals for four-terminal measurement are used.
All of the four probe pins are arranged at the same potential point of the four-unit measurement target component. However, when the four-terminal measurement target component is a surface-mount (SMD) component, the measurement accuracy deteriorates if the four-terminal measurement probe pin is arranged at the same potential point of the component. The probe pins for terminal measurement are avoided and the normal probe pins are arranged at other same potential points belonging to the same potential group according to the candidate level. Therefore, when a component to be mounted on the board includes a four-terminal measurement target component, the type and number of probe pins to be arranged in the same potential group for the four-terminal measurement target component are shown in Table 1. The breakdown is as follows.

[0035]

[Table 1] Therefore, as shown in FIG. 10, A and B exist as the same potential group relating to the four-terminal measurement target component.
Also considering the case where the potential group A is composed of four the same potential point A ₁ to A _4, if the 4 terminals measurement target component is typically a low resistance component, firstly the 4-terminal measurement target component one of the probe pin 4 terminal measurements are initially arranged at the same potential point a ₁ according to the remainder of the same potential point a ₂ to a ₄
Among them, the same potential point related to the other four-terminal measurement target components or the same potential point with the highest candidate level (A ₃ in the example in the figure)
The remaining one of the terminal measurement probe pins is initially placed. Also, 4 if terminal measurement target component is a SMD resistor 4 probe pin 4 terminal measurement to the same potential point A ₁ is of the terminal measurement target component without placing the rest of the same potential point A ₂
~A Other 4-terminal measurement same potential points according to subject part or candidate level higher two equipotential points of the _four Select (A ₂ and A ₃ in the example in the _figure), two four-terminal Initially place the measurement probe pins. In order to enable such an initial arrangement, it is possible to detect whether or not the same potential point (for example, A ₁ ) relating to the four-terminal measurement target component is the same potential point where the four-terminal measurement probe pin can be arranged. There must be. Therefore, in this embodiment, in step 300,
A comparison between the candidate level, the cancellation ranking value and the candidate level is performed. That is, when the four-terminal measurement target component is a component such as an SMD resistor, the above-described component priority and the like are set low, and the candidate level thereof is also set to a low value such as 20, for example. By comparing the cancellation order value set to a value of about 10 with the candidate level of the same potential point of the four-terminal measurement target component, the four-terminal measurement probe pin is connected to the same potential point of the four-terminal measurement target component. It is possible to know whether or not to arrange.

After the initial arrangement of the probe pins as described above, the processing section 10 sets the maximum search level and the maximum candidate level (302). After that, the processing unit 10
After setting the forced end time (304), the normal probe pins are rearranged (306). Maximum search level,
The maximum candidate level and the forced end time will be described later. When executing step 306, the four-terminal measurement probe pins are not moved at all. Processing unit 10
Executes the rearrangement of the four-terminal measurement probe pins after setting the forced end time (308) (310). At that time, if the normal probe pin comes into contact with the normal probe pin as a result of rearranging the four-terminal measurement probe pin, the normal probe pin must be rearranged, and that the normal probe pin comes into contact with another normal probe pin. If this happens, the other normal probe pin or the rearranged normal probe pin is rearranged. When the contact between the probe pins cannot be eliminated by the rearrangement of the normal probe pins, for example, the four-terminal measurement probe pin related to the contact is changed to the normal probe pin (312), and the forced termination time is set. (314), the normal probe pin rearrangement is executed again (316).

The rearrangement procedure realized by the steps 306, 310, 312 and 316 is, for example, as follows. Here, as shown in FIG. 11, it is assumed that A and B exist as the same potential group relating to the four-terminal target component. Further, the potential group A is composed of the same potential point A ₁ to A _4, the same potential group B are to contain the same potential point B _1. Furthermore, 4 close to the point A ₁ of the terminal measurement target component, and C ₁ points belonging to other same potential group C is present, the same potential group C are three same potential point C ₁ -C ₃ is assumed. In addition, in close proximity to the point C _2, and the point D ₁ belonging to other same potential group D is present, E ₁ belonging to other same potential group E in close proximity to the point A ₃ is present And It is assumed that the candidate levels of these points A _{1 to} A ₄ , B ₁ , C _{1 to} C ₃ , D ₁ and E ₁ are values as shown in the figure, and the above-mentioned cancellation order value is set to 20. .

In this case, for example, the points A ₁ , A ₂ and B ₁
Assuming that the four-terminal measuring probe pins are initially arranged at the points C and the normal probe pins are initially arranged at the points C ₁ and E ₁ (300), even if contact occurs at step 306, even if the contact occurs, since the probe terminal measuring pin is to reposition only the normal probe pins without moving, the normal probe pins of C ₁ that is in contact with the four-terminal measurement probe pins arranged in a point a ₁ is the same potential group C then the candidate level is relocated to higher same potential point C ₂ on the inner.
Thereby, the contact between the four-terminal measurement probe pin and the normal probe pin is eliminated.

Further, when the probe pin further to point D ₁ during initial placement is placed, when relocating the normal probe pins of the point C ₁ to the point C ₂ in step 306, the point C
Contact between the probe pin which is initially disposed on a common probe pin and the point D ₁ arranged in _two newly occurs. In this case, the probe pins are initially located at point D ₁ is repositioned normal probe pins are arranged in point D ₁ as described below would normally probe pin runs, the pin contacted by the relocation When it is canceled, the process related to the contact ends. However, it is not possible to move the probe pin in step 306 when the probe pins are arranged in point D ₁ is a probe pin 4-terminal measurement, also the probe pin normal probes placed at point D ₁ in such case the candidate level was also the relocation destination a pin or that can not be relocated in a given search level in time is lower than the revocation rank value, the probe pins are arranged in point C _2, the same It is rearranged to another same potential point belonging to the same potential group C. However, in this example, the next candidate high-level same potential point existing within the same potential group C is C ₃ candidate level = 15 cancel rank value = 10
This relocation is not successful. in this case,
Usually the probe pin according to the potential group C are arranged in point _{C 1} (306). In this state, the contact between the common probe pin disposed in a four-terminal measurement probe pin and the point C ₁ disposed at the point A ₁ have not yet been solved. Therefore, in step 310, rearrangement of 4-terminal measuring probe pins are arranged in point A ₁ is executed. At this time, four equal potential points A ₁ to A 4 belonging to the same potential group A
Only A ₁ to A ₃ of A ₄ is at the same potential point of the 4-terminal measurement target component, A ₄ is When the same potential point of the normal measurement target component, are arranged point A ₁ in step 310 and 4 can be a terminal relocated measuring probe pins are is only the still 4 points terminal measuring probe pins are not arranged a _3. At this time, point A ₃
If the probe pin E ₁ to proximity is disposed, the contact pins are eliminated. But already probe pin to the point E ₁ is arranged, when it is not possible to reposition the probe pin, even if rearranged in A ₃ a probe pin 4 terminal measured from the point A _1, the pin contact Cannot be eliminated. Therefore, step 312
In the four-terminal measurement probe pin failed relocation to the point A _3, after having changed to the normal probe pins, repositioning the point A ₄ according to the normal measurement component in step 316.

Based on such a procedure, 4
The best probe pin arrangement can be quickly determined for both the terminal measurement probe pin and the normal probe pin. Also, in general, as the mounting density of the components increases or as the mounted components become more sophisticated, the number of four-terminal measurement target components mounted on the board increases, and the probe pin arrangement is usually very difficult. Becomes In this embodiment, even in such a case, the probe pin arrangement including the four-terminal measurement probe pins can be automatically determined with a relatively short delivery date. Further, in the case where a defect such as pin contact still exists in the finally determined probe pin arrangement, the information to that effect can be fed back to the board design process at an early stage. In addition, it is possible to eliminate the unavoidable empirical elements of the operator or the working group in the arrangement of the probe pins for the four-terminal measurement, thereby achieving a more uniform and improved quality for the four-terminal measurement. It is possible to realize determination of a pin stand pattern including a probe pin.

Next, steps 306, 310 and 316
Will be described in detail.

In this embodiment, the candidate level difference is first set to 0 as shown in FIG. 8 (400). Next, after setting the search level to 0 (402), the processing unit 10 executes contact pin sorting and counting (40).
4). That is, of the probe pins that are initially placed, all the probe pins to be relocated (step 30)
6 and 316, the total number of probe pins in contact with other probe pins and the number of probe pins present at each contact point are determined with respect to the normal probe pins in step 310 and the four-terminal measurement probe pins in step 310. Step 4 in order from the place where the number of probe pins
06. In step 406, rearrangement of the probe pins is performed according to the procedure shown in FIG. When the processing of step 406 is completed for all the contact pins detected in step 404 (4
08), the search level is incremented by one (41).
0), the procedure returns to step 404, and the same procedure is repeated. Thereafter, when the search level reaches the maximum search level set in Step 302 (412), the candidate level difference is incremented by 1 (414), and Step 4
The operation after 02 is repeated. This candidate level difference is
When the maximum candidate level set in step 302 is reached (416), the procedure shown in FIG. 8 ends.

The relocation procedure shown in step 406 is as follows.
As shown in FIG. 9, the process is started by determining whether or not the forced end time has elapsed (500). That is,
The forced ending time set immediately before (steps 304 and 30
8 and 312) have elapsed, step 4
The process proceeds to step 408 without executing the rearrangement according to 06. This eliminates the problem that the step 406 relating to the rearrangement is repeated endlessly and the operation time is extremely long.

Subsequently, the processing section 10 determines whether or not the pin contact currently being processed is a contact between probe pins that can be rearranged (502). That is,
When only the normal probe pins are to be rearranged as in steps 306 and 316, the contact between the probe pins detected in step 404 is the contact between the four-terminal measurement probe pins or the four-terminal measurement probe pin. Step 406 should not be performed when there is normal contact with the measurement probe pins. This is because when the four-terminal measurement probe pins are to be rearranged as in step 310, the contact of the probe pins detected in the immediately preceding step 404 is the contact between the four-terminal measurement probe pins and the four-terminal measurement probe pin. The same applies to the case where neither the probe pin nor the normal probe pin is in contact. Therefore, in these cases, it is determined in step 502 that the object is not a relocation target, and the processing described later is omitted, and the process immediately returns to step 408.

When the determination condition in step 502 is satisfied, the processing section 10 first clears the success flag (504), and sets the next candidate within the candidate level difference set / updated in step 400 or 414. It is determined whether or not there is (506). Thereafter, a point having a candidate level whose difference from the candidate level of the same potential point at which the probe pin to be relocated is currently arranged is higher (ie, smaller) than the given candidate level difference is
It is determined whether or not the same potential group exists. As a result, if it is determined that they do not exist,
Since it is considered that the next candidate cannot be found unless the candidate level difference is incremented, the processing described later is omitted and the process returns to step 408 immediately. If it is determined that there is a next candidate, it is determined whether the candidate has already been used to arrange another probe pin (508). If already used, the process returns to step 506 to search for the next candidate.

If there is a next candidate in the candidate level difference and the candidate is unused, the processing unit 10 sets the candidate, that is, the same potential point existing in the candidate level difference and unused,
The probe pins related to the rearrangement are moved (510). The processing unit 10 checks whether a new contact between the probe pins has occurred at the destination where the probe pins have been moved (51).
2). If no new contact has occurred, it can be considered that the rearrangement of the probe pin to be rearranged has been successful, so that the success flag is set (514), and step 40 is performed.
Return to 8. In step 408, the success flag is set, so that it is known that the rearrangement was successful.

If it is determined in step 512 that a new contact has occurred, the immediately preceding step 402
Alternatively, it is determined whether the search level set / updated at 410 is 0 or 1 or more (515).
If the search level is 0, the operation of the processing section 10 returns to step 506, and it is determined whether or not the next candidate exists within the candidate level difference within the same potential group. That is, when the search level is 0, it is examined whether or not the probe pins can be rearranged only in one certain potential group. If for example, a probe pin disposed in a probe pin and B ₀ which are arranged in point A ₀ as shown in FIG. 1 and is in contact, when the search level is 0, it is arranged point A ₀ another point in the probe pins are in the same Everyone potential group is for example only whether it relocated to the point B ₁ is being considered,
No consideration is given to the possibility of rearranging the probe pins in other same potential groups. Thus, the search level = 0
If, then step 514 will be executed if the probe pins can be relocated within a single equipotential group; otherwise, step 506 will return to step 408.

As described above, in this embodiment, FIG.
Are repeatedly executed for all the contact pins detected in step 404 (408), and after the search level is incremented (410), the search level reaches the maximum search level (412) again. Steps 404 to 408 are repeatedly executed. Therefore, the value of the search level gradually increases every time the step 412 is performed. If it is detected in step 515 that the value of the search level is 1 or more, the processing unit 10
Extracts one of the probe pins arranged at a point belonging to another same potential group in relation to the new contact detected in step 512 (516). If the currently executed rearrangement procedure is not the procedure related to the normal probe pin rearrangement (518), or if the contact probe pin extracted in step 516 is not a four-terminal measurement probe pin (520), After decrementing the search level by one, the processing unit 10 rearranges the probe pins of the contact destination extracted in step 516 within the same potential (522). That is, the same procedure as steps 506 to 510 is executed. As a result, if the probe pin can be moved to a point where the candidate level is higher than the cancellation order value (524), the operation of the processing unit 10 proceeds to step 5
It moves to 12. That is, if a new contact has not occurred at the relocation destination, the process returns to step 408 via step 514. If a new contact has occurred, whether the search level decremented in step 522 is 1 or more or 0. Is determined. If it is determined in step 524 that such movement has not been successful,
If it is determined in steps 518 and 520 that the normal probe pins are being rearranged and the contact is for four-terminal measurement, the process returns to step 506 described above. That is, determination is made as to whether or not there is an equipotential point at which the probe pin can be rearranged in the same potential group in which the probe pin of the contact destination extracted in step 516 is arranged.

Therefore, when the search level is 1 or more, the processing relating to the rearrangement is executed not only within a single same potential group but also to other same potential groups. As shown in FIG. 1, the points A ₀ , B ₀ and C
Considering the situation where the probe pin is located at ₀ , the probe pin located at point B ₀ at the time when step 510 is first executed is moved to point B ₁ , for example.
New contact between the probe pins are arranged on the probe pin and the point B ₀ which are arranged point B ₁ is detected at step 512. In this case, if the search level is 1, (5
15), the point _{C 0} is taken out at step 516, the point C
Probe pin disposed to _zero are moved at step 522, for example, the point C _1. This move succeeds (52
4) If the new contact at and point C ₁ has not occurred (512), the procedure shown in FIG. 9 the pin contact is eliminated ends. However, when the candidate level of the point C ₁ is lower than the cancellation order value, the processing unit 10 belongs to the same potential group as the points C ₀ and C ₁ and the point B
_A search is made for an unused point that has a difference between the candidate level with ₀ and within the given candidate level difference (506 and 508). If no such point exists, the relocation will not succeed,
The procedure shown in FIG. 9 ends. If such a point exists, the processing unit 10 moves the probe pin to that point (510) and determines whether a new contact has occurred (512). If the contact has not occurred, a success flag indicating that the rearrangement was successful is set (514), and the procedure shown in FIG. 9 ends. Conversely, if a contact occurs (512), the search level is decremented by 1 in the previous step 522, so that it is determined to be 0 (515), and the steps 506 and 508 are performed again.
Is executed.

As described above, when the search level is 1, not only the same potential group where the contact occurs but also the
The possibility of relocating the probe pins is also examined for the same potential group in which contact with the probe pin newly occurs when the probe pin related to the contact is moved in the same potential group. When the search level is 2, the next same potential group is further included in the relocation possibility limit, and when the search level is 3, the further same potential group is further applied. Are incremented by the search level in step 410, so that the objects of the relocation possibility limit are sequentially expanded. In this way, by expanding the equipotential groups to be relocated under management using the search level, for example, compared to a case where the possibility of relocation is examined only within a single equipotential group,
Efficiently, pin contact can be reduced, and processing can be speeded up. Also, the increment of the search level is, as shown in steps 408 and 412,
The processing is stopped when the search level reaches the maximum search level or when the pin contact is completely eliminated, so that it is possible to prevent processing delay due to endless expansion of the relocation target.

Further, in this embodiment, the candidate level difference is sequentially incremented by the procedures of steps 414 and 416, and the procedure relating to the rearrangement is repeated until the candidate level difference reaches the maximum candidate level. That is, in searching for the next candidate in step 506, it is possible to prevent the candidate level from being lowered beyond the given candidate level difference. In other words, only those having the next best candidate level can be the relocation targets. This makes it possible to always optimize the probe pin arrangement. In this embodiment, the candidate level difference is used, but a similar function can be realized by using the absolute value of the candidate level.

In addition, as described above, the candidate levels used in the procedures shown in FIGS. 8 and 9 take into account not only the component priorities but also the probe pin priorities and the surface priorities. Priority. Therefore, in the present embodiment, such a change should be performed only when the type of the probe pin is simply changed or when the arrangement of the probe pins is changed so that a good probe pin arrangement can be realized. Can be. That is, unlike the conventional case in which the pin setting position candidates are determined using only the component priorities, priorities are assigned to the usable probe pins, and the priorities are also assigned to the probe pin arrangement surface. Since the candidate level is determined based on the sum of these and the component priority, the pinning pattern can be determined more flexibly than the previously proposed method. For example, FIG.
Consider the same potential group in the figure, and also consider a case where the probe pin related to the pin shape code b is initially arranged at the same potential point related to the component TR1. In this case, even if a probe pin initially placed in the same potential group is in contact with a probe pin initially placed in another same potential group, the probe pin placed in the same potential group is still By performing rearrangement (while executing the rearrangement first), pin contact can be eliminated at an early stage. Specifically, in the example of the same potential group, TR1
(Pin shape code P) → D3 (Pin shape code b) → Z
Rearrangement can be performed in the order of D2 → CD (pin shape code c) → CD (pin shape code e) →. That is, in the method of the prior proposal, if the pin position candidate is extended to the component CD having the lowest component priority in the same potential group, the pin position candidate cannot be further extended. In the example, further processing such as changing the probe pin from the probe pin represented by the pin shape code C to the probe pin represented by the pin shape code E becomes possible. A similar advantage arises in that the arrangement surface can be changed from the solder surface to the component surface for the component TH1 which is a through hole. As described above, according to the present embodiment, it is possible to determine the pin setting pattern more flexibly, since it is possible to deal with a change in the pin shape of the probe pin and the arrangement surface of the probe pin as compared with the related art.

[0053]

According to the present invention, the rearrangement step is repeatedly performed so that the contact between the probe pins generated in the initially provided probe pin arrangement is at least partially eliminated. Relocates at least one of the probe pins that are in contact with each other to one of the other potential points where the next best test environment is expected. The trouble of creating and examining the standing pattern candidates one by one becomes unnecessary, and a pin standing pattern that satisfies the requirements relating to the pin shape and its clearance can be quickly determined. As a result, the processing load on the apparatus can be reduced, the period for determining the probe pin arrangement can be shortened, and the cost can be reduced.

Further, according to the present invention, when the probe pins related to the fixed probe pin arrangement and the probe pins related to the normal probe pin arrangement are in contact with each other and the probe pins related to the normal probe pin arrangement cannot be rearranged, 4 The probe pins related to the fixed probe pin arrangement, which is basically prohibited to be relocated like the probe pin arrangement for terminal measurement, are relocated. The contact can be suitably eliminated. In addition, since the probe pins that should be fixedly arranged are not rearranged in principle, it is possible to maintain the accuracy of measurement using the probe pins. Furthermore, when the probe pins related to the normal probe pin arrangement cannot be rearranged (or when the rearrangement is inappropriate), the probe pins related to the fixed probe pin arrangement are exceptionally rearranged. Therefore, reallocation can be performed in a short time.

According to the present invention, further, when a new contact occurs as a result of the rearrangement, the process of rearranging the probe pins of the contact destination is repeatedly executed. Therefore, new pin contact at the relocation destination can be eliminated in a short time. In addition, since the relocation of contact destinations is aborted with a predetermined search level as the limit, contact source rearrangement is executed, and contact source rearrangement is executed when early pin contact cancellation cannot be expected due to contact destination rearrangement. As a result, quick pin contact cancellation can be realized in this aspect as well.

According to the present invention, with respect to points where probe pins may be arranged, the types of components connected to the points, the types of probe pins to be arranged at the points,
And setting a candidate level indicating a probe pin arrangement priority based on a probe pin arrangement surface when arranging the probe pin at the point, and selecting a rearrangement destination based on the candidate level in the rearrangement. Is extended not only to the types of components but also to the types and arrangement of probe pins, so that it is possible to execute more flexible measures that could be performed by hand, while maintaining the advantages of automation. Further, it becomes possible to cope with a request from the in-circuit test / inspection machine system which wants to set the probe pin on the solder surface as much as possible.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing the concept of probe pin rearrangement in the present invention.

FIG. 2 is a block diagram showing an apparatus configuration suitable for performing a probe pin rearrangement method according to one embodiment of the present invention.

FIG. 3 is a flowchart illustrating a flow of an operation of a processing unit in the embodiment.

FIG. 4 is a diagram for explaining from the extraction of the same potential point to the initial arrangement of probe pins in the operation of the processing unit in this embodiment.

FIG. 5 is a diagram illustrating an example of the contents of a pinning priority accumulation database for each component name used in this embodiment.

FIG. 6 is a diagram showing an example of the contents of a pin shape database used in this embodiment.

FIG. 7 is a flowchart illustrating an entire flow of a pinning pattern determination process executed by a processing unit in this embodiment.

FIG. 8 is a flowchart illustrating a relocation repetition procedure in a pinning pattern determination process executed by a processing unit in this embodiment.

FIG. 9 is a flowchart illustrating details of a rearrangement procedure in a pinning pattern determination process executed by a processing unit in this embodiment.

FIG. 10 is a conceptual diagram for describing an initial arrangement method of four-terminal measurement probe pins in this embodiment.

FIG. 11 is a conceptual diagram for explaining a method for rearranging four-terminal measurement probe pins in this embodiment.

[Explanation of symbols]

Reference Signs List 10 processing unit, 12 input unit, 14 display unit, 16 storage unit, 18 print output unit, 200 storage database of pin priority for each part name, 202 pin shape database, ae pin shape code, AE same potential group _{, A 0 ~A 4, B 0} ~B 2, C 0 ~C 3, D 1, E 1
Same potential point.

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/28 G01R 1/06-1/073 G01R 31/02

Claims (5)

(57) [Claims] At least one of the probe pins in contact with each other is relocated to any other point which has the same potential as the point at which it was previously placed, and where a sub-optimal test environment is expected. The relocation step and the criteria for the test environment are sequentially set so that at least a part of the contact between the probe pins occurring in the probe pin arrangement initially given as data is eliminated.
Repeatedly executing the above-mentioned rearrangement step while relaxing , and determining data indicating the arrangement of the probe pins used at the time of the in-circuit test while eliminating the contact between the probe pins. Probe pin relocation method. 2. The probe pin rearrangement method according to claim 1, wherein the initially provided probe pin arrangement is related to a normal probe pin arrangement in which the rearrangement of the probe pins related to the arrangement is permitted, and to the arrangement of the probe pins. When the probe pin relocation method includes the fixed probe pin arrangement and the probe pin related to the fixed probe pin arrangement and the probe pin related to the normal probe pin arrangement include the fixed probe pin arrangement where the relocation of the probe pin is prohibited in principle. The probe pins related to the normal probe pin arrangement,
A step of determining whether or not it is possible to relocate to any of the other points having the same potential as the point that has been placed up to that point and a second-best test environment expected; and if it is determined that relocation is possible. Performing a rearrangement step on the probe pins related to the normal probe pin arrangement, and performing a rearrangement step on the probe pins related to the fixed probe pin arrangement when it is determined that the rearrangement is not possible. A probe pin rearrangement method, comprising: 3. The probe pin rearrangement method according to claim 1, wherein the rearrangement step includes, among the probe pins in contact with each other, probe pins other than the probe pin that has been rearranged immediately before. Processing to relocate to another point having the same potential as the point
A contact destination rearranging step that is repeatedly executed with a predetermined search level as a limit; and a contact destination rearranging step is executed when contact between the probe pins is not resolved despite execution of the contact destination rearranging step. After returning to the probe pin arrangement immediately before, the process of relocating the probe pin that was immediately rearranged among the probe pins that are in contact with each other to another point having the same potential as the previously arranged point is performed. Performing a contact source rearrangement step to be performed. 4. The probe pin rearranging method according to claim 1, wherein, for a point where the probe pin may be disposed, a type of a component connected to the point and a probe pin to be disposed at the point. A step of setting a candidate level indicating a probe pin arrangement priority based on a type and a probe pin arrangement surface when arranging the probe pin at the point. A method of relocating a probe pin, comprising the step of selecting, from among other points having a potential, another point related to the relocation based on a candidate level. 5. The method according to claim 4, wherein the probe pins are relocated.
There are multiple types of probe pins that can be used for the same point
And if the probe pins can be arranged on multiple surfaces,
Set the candidate level for each probe pin type or each surface
A probe pin rearrangement method characterized by the above-mentioned.