JPH0739616Y2 - Transfer film heating board of simultaneous molding transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a heating plate for use in an injection molding simultaneous painting apparatus that simultaneously paints the surface of a resin product when the resin product is injection molded.

(Prior Art) Conventionally, as a device for simultaneously performing injection molding of a resin product and painting by transferring a pattern onto the surface of the resin product, for example, in Japanese Patent Publication No. 61-137716, an arbitrary pattern is drawn at regular intervals. The belt-shaped transfer film is adsorbed on the heating platen, the part to be adsorbed on the transfer film is carried to the position facing the front of the molding die, and then the transfer film is attached to the molding surface of the die by vacuum pressure molding. After that, a simultaneous molding transfer technique is disclosed in which a male mold is joined to the female mold and a molten resin is injected into the cavities of both molds.

Further, in such a simultaneous molding and transferring apparatus, as shown in FIG. 6, a large number of small-diameter vent holes C are opened and arranged on the surface B of the heating plate A, and a heater is built in, so that a vacuum pump is provided. It is also practiced to heat the sucked portion of the transfer film D by sucking air through the ventilation hole C during the carrying-in step of the sucked portion of the transfer film D to the female mold front facing position. . According to this, the transfer film D is appropriately softened by heating, so that the transfer film D is appropriately adhered to the female molding surface during the vacuum pressure molding while extending along the molding surface shape.

(Problems to be solved by the invention) By the way, in the above heating platen A, in order to promote good adsorption of the transfer film D6, the heating platen surface B is made smooth, and the ventilation holes C are arranged at constant pitch intervals. In that case, the transfer film D is provided through the ventilation hole C.
Since the suction force of the vacuum pump that works on the above-mentioned works strongly around the vent holes C, the transfer film D tends to be adsorbed in advance at the vent holes C, and therefore the heating plate surface B and the transfer film D are likely to be adsorbed. The suction of air between the
As shown in the figure, it is conceivable that an air pool E is formed between the vent holes C, C. And in such cases,
The transfer film D floats in the air pocket E and does not adhere to the heating platen surface B. Therefore, the heating of the film part in which the float is generated is weaker than that in the film part in which the float is not generated, resulting in uneven heating. Due to the uneven heating, the softening degree of the transfer film D also varies, and the film D adheres to the female mold without uniform elongation during vacuum pressure molding. That is, when molding is performed using a mold having a deep cavity, the transfer film D is brought into close contact with the female molding surface while being expanded by vacuum pressure aerodynamic force by utilizing the softened state by heating in the above vacuum pressure molding. In that case, the elongation of the transfer film becomes non-uniform due to the above heating unevenness or softening unevenness. Therefore, even if the pattern is transferred during resin molding, the pattern transferred to the product may be distorted and the quality of the product may be deteriorated.

Therefore, the present invention is capable of adhering the transfer film with good adhesion without trapping air between the transfer film and the surface of the heating plate when the transfer film is adsorbed and carried into the position facing the front surface of the female mold, and therefore the transfer film An object of the present invention is to provide a heating plate of a simultaneous molding transfer device capable of eliminating uneven heating.

(Means for Solving the Problems) The present invention is characterized in that it is configured as follows in order to address the above problems.

That is, the transfer film heating plate of the simultaneous molding transfer device according to the present invention adsorbs a band-shaped transfer film on which arbitrary patterns are drawn at regular intervals and separates the attracted portions of the film from each other. In a transfer film heating plate in a simultaneous molding transfer device that heats an adsorbed portion while it is carried in between resin molding dies, a large number of vent holes are formed in the film adsorbing surface and the adsorbing surface is heated. A heating means is provided, and the adsorption surface is a rough surface formed by fine irregularities provided so that the recesses communicate with the ventilation holes.

(Operation) According to the above configuration, when the suction force of the vacuum pump is exerted on the transfer film through the ventilation hole of the heating plate and the film is adsorbed to the film adsorption surface, the transfer film precedes at the ventilation hole portion. Even if there is a tendency to be adsorbed by the film, the suction force extends over the entire surface of the film adsorption surface through the concave and convex portions formed on the film adsorption surface, so that air is trapped between the transfer film and the adsorption surface. The transfer film is prevented from being lifted, and the film does not float, and incomplete adsorption of the transfer film can be eliminated. Therefore, since the adsorbed portion of the transfer film is uniformly heated and there is no variation in the softening of the transfer film, the transfer film exhibits uniform elongation when attached to the female molding surface.

(Example) Next, the Example of this invention is described.

FIG. 3 is a simultaneous molding transfer apparatus equipped with the heating plate 1 according to the present invention shown in FIGS. 1 and 2, in which the male mold 2 faces the female mold 3 and the injection molding machine. Is fixedly mounted on the stationary platen 4 of the same, and the male mold 2 is provided with an injection nozzle 6 in communication with the injection passage 5, while the female mold 3 is provided with a movable plate 7.
It is connected to the ram 8 via the ram 8 and is driven in a direction in which the ram 8 moves toward and away from the male mold 2 by the forward and backward movement of the ram 8. Further, the female mold 3 is provided with a vent hole 9 for discharging the air inside the female mold to the outside by using a vacuum pump (not shown) at the time of vacuum forming the film.

The transfer film 10 is a belt-shaped film made of a synthetic resin on which an arbitrary pattern is printed at a constant pitch. In the case of this embodiment, the transfer film 10 is located from directly above the female mold 3 to the female mold 3. Of the transfer film 10 is rotatably supported at the upper position of the female die 3 and is also provided at the lower position of the female die 3. A winding roll 12 for winding the used transfer film 10 is axially supported, and the transfer film 10 is bridged between both rolls 11 and 12, and
The guide 10 is guided downward by the upper and lower guide rollers 13 and 14. In this case, the feeding roll 11 and the winding roll
The reference numeral 12 is configured to be moved in the same direction integrally with the female die 3 which is moved forward and backward by the ram 8. Although not shown, a film supply means for feeding the transfer film 10 from the pay-out roll 11 to the take-up roll 12 side is provided, and this means is similarly driven integrally with the female mold 3.

It should be noted that the transfer film 10 is printed with an arbitrary pattern as described above, but if it is for reverse printing or transfer,
The printing surface is set so as to face the side opposite to the female die 3, and is sent, and conversely, in the case of front printing, the printing surface is set so as to face the female die 3 and sent.

A movable block 15 which is driven up and down is located directly above the male die 2 and the female die 3 with the transfer film 10 interposed therebetween.
It is deployed in the opposite position. That is, the movable block 15 includes a support frame 16 and a suction head 17 attached to the support frame 16 by a structure described later, and a fluid pressure cylinder 18 having an upper end connected to a fixed portion (not shown) on the support frame 16. Piston rod 19 of is connected,
The movable block is moved by the expansion and contraction operation of the fluid pressure cylinder 18.
15 is moved up and down between a rising standby position (in other words, a transfer film suction position) of the solid line in FIG. 3 and a female mold front surface facing position (in other words, a film vacuum pressure forming position) shown in the chain line of FIG.

The suction head 17 is positioned so as to face the transfer film 10 fed downward in parallel.
Is a transfer film that is supported by the rod 20 protruding from the back of the support frame 20 penetrating the support frame 16.
10 and the female die 3 are allowed to move in a perspective manner while maintaining a parallel facing relationship, so that the support frame 16 has the above-mentioned rod 20.
It is equipped with a solenoid 21 ... 21 that slides 20 ... 21, and a spring member 22 is generated by exciting the solenoid 21 ... 21.
.. 20 and the suction head 17 are moved in the direction of approaching the transfer film 10 or the female mold 3 against the.

Further, the suction head 17 has an integrated structure in which the heating plate 1, the air flow path forming plate 23, the heater plate 24, and the insulating plate 25 according to the present invention are combined and laminated in this order from the side facing the transfer film 10. The suction head has a structure based on these
The transfer film 10 is adapted to adsorb the transfer film 10, heat the transfer film 10, and separate the transfer film 10 during vacuum pressure forming.

That is, the heating plate 1 is made of a metal plate such as brass having excellent thermal conductivity, and as shown in FIGS. 1 and 2, a large number of small-diameter vent holes ( As an example, 0.4 ¢) 26 ... 26 are arranged at a constant equal pitch interval such as a 15 mm interval, and
The entire surface of the heating plate 1a is formed by etching or other processing on a rough surface with fine unevenness such as a satin pattern or a skin grain pattern, whereby the respective recesses are communicated with each other, and these recesses form the vent holes. 26 …… 26 is communicated. Further, a Teflon (registered trademark) coating is applied to the heating platen surface 1a in order to ensure mold releasability during vacuum pressure forming of the film. Note that, in FIG. 2, in order to clarify the existence of the unevenness, the unevenness is exaggerated in the drawing.

The air flow path forming plate 23 located on the back surface of the heating platen 1 is also a metal plate having excellent thermal conductivity, and air is sucked into the ventilation holes 26 ... 26 on the surface portion facing the back surface of the heating platen. Vents 26 ... for exerting force and supplying compressed air
Corresponding to 26, vertical and horizontal grooves 27 (or all ventilation holes 26 ......
An air chamber having a size communicating with 26) is engraved, and an air passage 28 communicating with the groove 27 is penetrated through the center of the air flow path forming plate 23. The air passage 28 also penetrates through the central portions of the heater plate 24 and the insulating plate 25 and is opened to the back surface of the insulating plate 25, and an air hose 29 is connected to the air passage 28. The air hose 29 is switched and connected to the vacuum pump 31 and the compressor 32 by a three-way switching valve 30. The vacuum pump 31 applies an air suction force to the suction head 17 through the air hose 29, and the compressor 32 functions to supply compressed air to the suction head 17.

Further, the heater plate 24 has a large number of heaters 33 inside thereof.
Although not shown, these heaters 33 are equipped with 33 ...
The wiring for supplying power to 33 is provided. Further, the insulating plate 25 functions to effectively apply the heat generated by the heaters 33 ... 33 to the heating plate 1 in front of the adsorption head.

In such a structure, as shown in FIG. 3, in manufacturing the resin molded product, the movable block 15 stands by at the raised position, and the heaters 33 ... 33 are powered to heat the adsorption head 17. The process is performed from the state where the male die 2 and the female die 3 are separated from each other. First, a predetermined amount of the transfer film 10 is delivered from the delivery roll 11 to the front surface of the suction head 17, and the transfer film 10 is formed by printing or the like. The feeding is stopped when a sensor (not shown) detects the mark. In that case, if the transfer film 10 is excessively fed out and the position of the transfer film 10 is displaced in the left-right direction, the transfer film 10 is correctly positioned with respect to the suction head 17 by the correction by the control of the servo system.

Then, from the positioned state, the three-way switching valve 30 connects the vacuum pump 31 to the suction head 17 so that an air suction force acts on the suction head 17, whereby the vent hole 26 of the heating platen 1 is made.
The air is sucked through 26, and the transfer film film 10 existing at the front position is sucked onto the heating platen surface 1a by its suction force. At the time of sucking the film, the suction force of the vacuum pump 31 works most strongly at the vent holes 26..26, so that the transfer film 10 is likely to be sucked at these places prior to the other parts. However, in the heating platen 1 of this embodiment, the heating platen surface 1a is fine even if adsorption is preceded by the ventilation holes 26. The surface is rough due to unevenness, and these recesses are communicated with each other, and are also communicated with the ventilation holes 26 ... 26.
The suction force spreads over the entire surface of 1a, and the heating plate surface
All the air between 1a and the transfer film 10 is smoothly sucked. As a result, the air is not trapped and the transfer film 10 does not float so that the film 10 can be completely adhered.

After the transfer film 10 is adsorbed, the movable block 15 descends toward the position indicated by the chain line in FIG. 3 by the extension operation of the fluid pressure cylinder 18. During the lowering, the transfer film attracted portion is heated by the heat of the heaters 33 ... 33 transmitted to the heating plate 1, and the transfer film 10 is appropriately softened by this heating.
Are carried to a position facing the front surface of the female die 3. Next, in the movable block 15, the solenoids 21 ... 21 are excited so that the suction head 17 moves forward toward the female die 3 and comes into close contact with the female die 3 as shown in FIG. Air is sucked and discharged from the sealed internal space of the female mold 3, and the inside of the female mold 3 is evacuated. Then, in the adsorption head 17, the compressed air is compressed from the compressor 32 through the air hose 29 by the switching operation of the three-way switching valve 30 and the groove of the air flow path forming plate 23.
27, and the compressed air is supplied to the ventilation holes 26 in the heating plate 1 26..26
By being jetted from, the transfer film 10 is brought into close contact with the inner surface of the female die 3 by the air pressure and the vacuum force inside the female die.
That is, vacuum pressure forming of the film.

At this time, the transfer film 10 makes use of the heat-softened state and adheres to the inner surface of the female mold while exhibiting an appropriate elongation, but when the transfer film 10 is adsorbed by the adsorption head 17, as described above, the film is formed. Since air is not trapped between the heating plate surface 1a and the heating plate surface 1a and is adsorbed so as to completely adhere to the entire surface of the heating plate surface 1a, heating of the transfer film 10 while the suction head is descending is performed on the film to be adsorbed. It is made uniform over the entire part and heating unevenness does not occur. Therefore, at the time of the film vacuum pressure forming, the transfer film 10 exhibits uniform elongation in any part of the film 10 because the entire part adsorbed by the adsorbing head 17 is uniformly heated and softened without variation. It will be in close contact with the inner surface of the female mold.

Then, after the solenoids 21 ... 21 are de-energized, the suction head 17 is returned to its original position, the movable block 15 is returned to the ascending position, and then the ram 8 is operated so that the female die 3 is moved forward of the male die 2. By moving and joining with the male mold 2, molten resin is injected from the injection nozzle 6 into the cavities of both molds 2 and 3, whereby resin molding is performed in the cavities and transferred to the resin molded product. The design of the film 10 is transferred and painting is performed. In this case, since the transfer film 10 that is in close contact with the inner surface of the female mold is uniformly stretched as described above, the transfer of the pattern to the resin molded product can be performed without causing the distortion of the pattern, and thus a good quality product can be obtained. Is obtained.
Then, the female die 3 is moved back by the completion of molding and painting, and is prepared for the next molding operation.

In this way, the surface 1a of the heating plate 1 in the suction head 17 is
By providing a rough surface with a fine uneven pattern applied to the entire surface, the transfer film 10 can be completely adhered and uniformly heated, and distortion of the pattern in the resin molded product can be prevented.

In addition, in the above-mentioned embodiment, the transfer film 10 was carried in from above to the female mold 3, but the present invention is not limited to this.
The transfer film 10 may be fed in from the lateral direction to the front surface of the female mold, or the female mold may be turned upward and the transfer film 10 may be fed by horizontal feeding.

Further, as a reference example of the etching processing on the heating plate surface 1a, for example, an etching pattern number, FG13, manufactured by Tanako Hachikosha Co., Ltd. can be mentioned.

(Effect of the Invention) As is clear from the above description, when the heating plate according to the present invention is used as the suction surface of the suction head in the simultaneous molding transfer device, the rough surface formed on the surface of the heating plate causes transfer film suction. It prevents the air from being trapped during heating, prevents uneven heating of the part to be adsorbed on the transfer film, and prevents uneven stretching of the film during vacuum pressure forming, which causes the distortion of the design. It is possible to manufacture high quality products that do not occur.

[Brief description of drawings]

The drawings show an embodiment of the present invention. Fig. 1 is a perspective view of a heating plate, Fig. 2 is an enlarged cross-sectional view of a main part of the heating plate, and Fig. 3 is a schematic configuration of a simultaneous molding transfer device using the heating plate. 4 and 5 are cross-sectional views of the suction head of the simultaneous molding transfer device, and FIG. 5 is a schematic configuration diagram in a vacuum pressure air molding state. FIG. 6 is a sectional view of a main part of a heating plate according to the prior art of the present invention. 1 ... Heating plate, 1a ... Film adsorption surface (heating plate surface),
2 ... male type, 3 ... female type, 9,32 ... film vacuum pressure forming means (9 is a vent hole, 32 is a compressor), 10 ... transfer film, 17 ... adsorption head, 26 ... vent hole , 33 …… Heating means (heater).

Claims (1)

[Scope of utility model registration request] 1. A belt-shaped transfer film on which arbitrary patterns are drawn at regular intervals is adsorbed, and the adsorbed portion of the film is carried in between a pair of resin molding dies in a separated state, and A transfer film heating plate in a simultaneous molding transfer device for heating an adsorbed portion, the film adsorbing surface having a large number of vent holes, and a heating means for heating the adsorbing surface, and the adsorbing surface. However, the transfer film heating plate of the simultaneous molding transfer device is characterized in that it has a rough surface with fine irregularities provided so that the respective recesses communicate with the air holes.