JPH0737920A - Mounting structure for flexible circuit board - Google Patents
Mounting structure for flexible circuit boardInfo
- Publication number
- JPH0737920A JPH0737920A JP20258893A JP20258893A JPH0737920A JP H0737920 A JPH0737920 A JP H0737920A JP 20258893 A JP20258893 A JP 20258893A JP 20258893 A JP20258893 A JP 20258893A JP H0737920 A JPH0737920 A JP H0737920A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip component
- printed circuit
- flexible circuit
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ又はＬＳＩ等のチ
ップ部品の為の一部のボンディングパッドを硬質プリン
ト回路基板側に設けることにより、チップ部品及びワイ
ヤ−ボンディングを介して硬質プリント回路基板と可撓
性回路基板との間の電気的接続を行えるようにした可撓
性回路基板の実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a rigid printed circuit board through chip components and wire bonding by providing some bonding pads for chip components such as IC or LSI on the rigid printed circuit board side. The present invention relates to a mounting structure of a flexible circuit board that enables electrical connection between the flexible circuit board and the flexible circuit board.
【０００２】[0002]
【従来技術とその問題点】ＩＣ又はＬＳＩ等のチップ部
品、所謂ベアチップを可撓性回路基板に実装する一方法
として、ワイヤ−ボンディングが実用化されている。こ
の場合、可撓性回路基板上でワイヤ−ボンディングを実
現する為に、ワイヤ−ボンディング領域に金属板やガラ
スエポキシ基材等の補強材で裏打ちする構造が一般であ
る。2. Description of the Related Art Wire bonding has been put into practical use as a method of mounting chip parts such as ICs or LSIs, so-called bare chips, on a flexible circuit board. In this case, in order to realize wire bonding on the flexible circuit board, the wire bonding region is generally backed with a reinforcing material such as a metal plate or a glass epoxy base material.
【０００３】また、可撓性回路基板のパタ−ン高密度化
要求に対して、これらの裏打ち部材を上記の如き単なる
補強材を用いるのではなく、硬質プリント回路基板を適
用するものも知られている。Further, in response to the demand for high-density patterning of flexible circuit boards, it is also known to apply a rigid printed circuit board to these backing members instead of using the above-mentioned simple reinforcing materials. ing.
【０００４】このような構造で可撓性回路基板と硬質プ
リント回路基板とを電気的に接続する場合に於いて、回
路パタ−ンの微細化に伴って信頼性のある接続方法を図
ることが回路基板の設計上困難となっている。特に微細
パタ−ンの接続部に於ける耐電圧に対する環境信頼性な
どが問題となり易く、この点を解消する構造が要望され
ている。In the case of electrically connecting the flexible circuit board and the rigid printed circuit board with such a structure, it is possible to achieve a reliable connection method with the miniaturization of the circuit pattern. It is difficult to design the circuit board. In particular, environmental reliability with respect to withstand voltage at the connection portion of a fine pattern is likely to cause a problem, and a structure for solving this point is demanded.
【０００５】即ち、図３の如く硬質プリント回路基板１
０にチップ部品１１を実装し、このチップ部品１１の為
のボンディングパッド１３を全て硬質プリント回路基板
１０に形成してワイヤ−ボンディング１２でその間を接
続し、一方、硬質プリント回路基板１０と可撓性回路基
板１４との間を異方性導電膜１５により電気的に接続す
るような従来法では、硬質プリント回路基板１０と可撓
性回路基板１４とに於ける電極のずれを極力抑える必要
があるが、電極が微細ピッチの場合には対応が困難であ
る。That is, as shown in FIG. 3, a rigid printed circuit board 1
0, the chip component 11 is mounted, and the bonding pads 13 for this chip component 11 are all formed on the rigid printed circuit board 10 and the space between them is connected by wire bonding 12. In the conventional method in which the anisotropic conductive film 15 is electrically connected to the flexible circuit board 14, it is necessary to suppress the displacement of the electrodes in the rigid printed circuit board 10 and the flexible circuit board 14 as much as possible. However, it is difficult to cope with the case where the electrodes have a fine pitch.
【０００６】また、このような異方性導電膜１５は一般
に絶縁破壊電圧が低いので、耐電圧を常に考慮する必要
があるなどの問題がある。Further, since such an anisotropic conductive film 15 generally has a low dielectric breakdown voltage, there is a problem that it is necessary to always consider the withstand voltage.
【０００７】[0007]
【課題を解決するための手段】本発明は、硬質プリント
回路基板と可撓性回路基板との間の微細パタ−ン相互の
接続手段及び線間絶縁抵抗の問題を好適に解決する為
に、上記のような高価な異方性導電膜を使用することな
く、チップ部品の為の一部のボンディングパッドを硬質
プリント回路基板側に形成し、このチップ部品及びその
ワイヤ−ボンディングにより硬質プリント回路基板と可
撓性回路基板との間の電気的相互接続を行えるようにし
た可撓性回路基板の実装構造を提供するものである。SUMMARY OF THE INVENTION In order to preferably solve the problems of means for connecting fine patterns to each other between a rigid printed circuit board and a flexible circuit board, and insulation resistance between lines, Without using the above-mentioned expensive anisotropic conductive film, some bonding pads for chip components are formed on the rigid printed circuit board side, and the rigid printed circuit board is formed by this chip component and its wire bonding. The present invention provides a mounting structure for a flexible circuit board, which enables electrical interconnection between the flexible circuit board and the flexible circuit board.
【０００８】その為に本発明では、硬質プリント回路基
板に可撓性回路基板の端部を接着剤を介して接合し、上
記硬質プリント回路基板に実装したＩＣ又はＬＳＩ等の
チップ部品の為のボンディングパッドを上記可撓性回路
基板の端部に設けると共に、上記チップ部品の為の一部
のボンディングパッドを上記硬質プリント回路基板に設
けるように構成し、上記チップ部品及びワイヤ−ボンデ
ィングを介して上記硬質プリント回路基板と上記可撓性
回路基板との電気的接続を行うように構成したものであ
る。Therefore, according to the present invention, an end portion of a flexible printed circuit board is bonded to a rigid printed circuit board via an adhesive, and a chip component such as an IC or LSI mounted on the rigid printed circuit board is provided. Bonding pads are provided on the ends of the flexible circuit board, and a part of the bonding pads for the chip component is provided on the rigid printed circuit board, and the chip component and wire-bonding are used. The hard printed circuit board and the flexible circuit board are electrically connected to each other.
【０００９】[0009]
【実施例】図１及び図２は本発明の一実施例による可撓
性回路基板の実装構造を示す概念的な断面構成図及び平
面構成図であり、図の如く硬質プリント回路基板１に対
して可撓性回路基板５の端部は一般の接着剤６で相互に
接合され、ＩＣ又はＬＳＩ等のベアチップ部品３は硬質
プリント回路基板１側に実装される。1 and 2 are a schematic sectional view and a plan view showing a mounting structure of a flexible circuit board according to an embodiment of the present invention. As shown in FIG. Thus, the ends of the flexible circuit board 5 are bonded to each other with a general adhesive 6, and the bare chip component 3 such as an IC or LSI is mounted on the hard printed circuit board 1 side.
【００１０】そして、このチップ部品３の為の大半のボ
ンディングパッド４はチップ部品３を配置する領域を切
欠した可撓性回路基板５の端部に配列形成し、また、硬
質プリント回路基板１側にはその一部のボンディングパ
ッド２を形成し、それらのボンディングパッド２，４と
チップ部品３との間はワイヤ−ボンディング７で接続す
るように構成してある。Most of the bonding pads 4 for the chip component 3 are arranged and formed on the end of the flexible circuit board 5 which is cut out in the region where the chip component 3 is arranged, and the hard printed circuit board 1 side. A part of the bonding pads 2 is formed on the semiconductor chip, and the bonding pads 2, 4 and the chip component 3 are connected by wire bonding 7.
【００１１】このような接続実装後に、チップ部品３及
びそのワイヤ−ボンディング領域は図１の如く適当なポ
ッティング剤８で被覆される。After such connection and mounting, the chip component 3 and its wire-bonding region are covered with a suitable potting agent 8 as shown in FIG.
【００１２】上記の如き可撓性回路基板の実装構造の場
合、硬質プリント回路基板１と可撓性回路基板５との電
気的相互接続はチップ部品３及びワイヤ−ボンディング
７によって達成されるので、両回路基板１，５間の接合
には通常の接着剤６の使用で十分である。In the case of the flexible circuit board mounting structure as described above, the electrical interconnection between the rigid printed circuit board 1 and the flexible circuit board 5 is achieved by the chip component 3 and the wire bonding 7. The ordinary adhesive 6 is sufficient for joining the two circuit boards 1 and 5.
【００１３】[0013]
【発明の効果】本発明によれば、硬質プリント回路基板
と可撓性回路基板との電気的相互接続はチップ部品及び
ワイヤ−ボンディングにより行われるので、高価な異方
性導電膜を使用することなく、微細ピッチのパタ−ンに
対しても好適に対応することができる。According to the present invention, since the electrical interconnection between the rigid printed circuit board and the flexible circuit board is made by chip parts and wire-bonding, an expensive anisotropic conductive film is used. In addition, it is possible to suitably cope with a fine pitch pattern.
【００１４】従って、硬質プリント回路基板と可撓性回
路基板との間の微細パタ−ン相互の接続手段及び線間絶
縁抵抗の問題を好適に解決できる。Therefore, it is possible to preferably solve the problems of the means for connecting the fine patterns to each other and the insulation resistance between lines between the rigid printed circuit board and the flexible circuit board.
【図１】 本発明の一実施例による可撓性回路基板の実
装構造の概念的断面構成図。FIG. 1 is a conceptual cross-sectional configuration diagram of a mounting structure of a flexible circuit board according to an embodiment of the present invention.
【図２】 図１の概念的平面構成図。FIG. 2 is a conceptual plan configuration diagram of FIG.
【図３】 従来の可撓性回路基板の実装構造の概念的断
面構成図。FIG. 3 is a conceptual sectional configuration diagram of a conventional flexible circuit board mounting structure.
【符号の説明】 １ 硬質プリント回路基板 ２ ボンディングパッド ３ チップ部品 ４ ボンディングパッド ５ 可撓性回路基板 ６ 接着剤 ７ ワイヤ−ボンディング ８ ポッティング剤[Explanation of reference numerals] 1 hard printed circuit board 2 bonding pad 3 chip component 4 bonding pad 5 flexible circuit board 6 adhesive 7 wire-bonding 8 potting agent
Claims (1)
の端部を接着剤を介して接合し、上記硬質プリント回路
基板に実装したＩＣ又はＬＳＩ等のチップ部品の為のボ
ンディングパッドを上記可撓性回路基板の端部に設ける
と共に、上記チップ部品の為の一部のボンディングパッ
ドを上記硬質プリント回路基板に設けるように構成し、
上記チップ部品及びワイヤ−ボンディングを介して上記
硬質プリント回路基板と上記可撓性回路基板との電気的
接続を行うように構成したことを特徴とする可撓性回路
基板の実装構造。1. A bonding pad for a chip component such as an IC or LSI mounted on the rigid printed circuit board by bonding an end of the flexible printed circuit board to the rigid printed circuit board with an adhesive. Along with being provided at the end of the flexible circuit board, a part of the bonding pads for the chip component is provided on the rigid printed circuit board.
A mounting structure of a flexible circuit board, characterized in that the rigid printed circuit board and the flexible circuit board are electrically connected to each other through the chip component and the wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20258893A JPH0737920A (en) | 1993-07-24 | 1993-07-24 | Mounting structure for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20258893A JPH0737920A (en) | 1993-07-24 | 1993-07-24 | Mounting structure for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0737920A true JPH0737920A (en) | 1995-02-07 |
Family
ID=16459975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20258893A Pending JPH0737920A (en) | 1993-07-24 | 1993-07-24 | Mounting structure for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737920A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000347591A (en) * | 1999-06-07 | 2000-12-15 | Citizen Watch Co Ltd | Display device with external connection |
| JP2020178059A (en) * | 2019-04-19 | 2020-10-29 | ハイソル株式会社 | Wire bonding method and semiconductor chip wiring structure |
| CN119095255A (en) * | 2024-11-06 | 2024-12-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
-
1993
- 1993-07-24 JP JP20258893A patent/JPH0737920A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000347591A (en) * | 1999-06-07 | 2000-12-15 | Citizen Watch Co Ltd | Display device with external connection |
| JP2020178059A (en) * | 2019-04-19 | 2020-10-29 | ハイソル株式会社 | Wire bonding method and semiconductor chip wiring structure |
| CN119095255A (en) * | 2024-11-06 | 2024-12-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
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