JP3330445B2 - Flexible printed circuit board holding structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for holding a flexible printed circuit board, and more particularly, to bending a flexible printed circuit board without lifting electronic components such as a flat package IC mounted on the flexible printed circuit board. It is bent near the part.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable progress in high functionality and high density in electrical products such as computers and precision machine products such as cameras. Above all, I used in these products
As for electronic components such as C, as a result of pursuing improvement in processing performance and miniaturization, the degree of integration of the number of transistor circuits is increasing and the surface mounting density is increasing. In order to further increase the mounting density, a laminated substrate in which several thin substrates are laminated to form a three-dimensional structure, a flexible printed circuit in which a copper foil pattern is provided on a soft plastic film, and the like are used.

As shown in FIGS. 25 to 31, a flat package IC 4a having lead terminals 5a extending in four directions and a lead terminal 5b extending in two directions on a flexible printed circuit board 2 mounted on the fixing member 1. Electronic components such as the extended flat package IC 4b and the LSI chip 6 are mounted.

For example, as shown in FIG. 25, when the flexible printed circuit board 2 is bent in the mountain-folding direction near the flat package IC 4a mounted on the flexible printed circuit board 2, the lead terminals 5a of the flat package IC 4a become A force may be applied to the flexible printed circuit board 2 in a direction in which the flexible printed circuit board 2 is lifted, and the lead terminals 5a of the flat package IC 4a may float from the pattern 2a provided on the flexible printed circuit board 2. For this reason, when bending the flexible printed circuit board 2, the bending position of the flexible printed circuit board 2 is adjusted by soldering the lead terminal 5 of the flat package IC 4 a and the pattern 2 a in order to prevent the lead terminals 5 a from floating from the pattern 2 a. Was bent at least at a distance of about 2.5 mm or more from the connecting portion 3a connected to the connecting portion 3a.

A lead terminal 5b as shown in FIG.
When the flexible printed circuit board 2 is bent in the mountain fold direction, the flexible package IC 4b extending in two directions is mounted on the flexible printed circuit board 2 in order to prevent the lead terminals 5b from floating from the pattern 2a. The bending position of the printed circuit board 2 is such that the lead terminal 5b of the flat package IC 4b and the pattern 2a are separated from the connection portion 3a electrically connected by soldering at least about 2.5 mm or more.

On the other hand, as shown in FIG.
Is mounted on the flexible printed board 2, the aluminum pad 7 provided on the LSI chip 6 and the pattern 2
a, a metal bump 8 and a bump 9 made of a low melting point metal such as an In alloy are provided and connected by mechanically plastically deforming the connection. 6
The whole is covered with resin 12. Even when the flexible printed circuit board 2 on which the LSI chip 6 is mounted is bent in the mountain-folding direction, the flexible printed circuit board 2
In order to prevent the LSI chip 6 mounted on the LSI chip 6 from floating from the pattern 2a, the resin 1 covering the LSI chip 6
2 was bent at least about 2.5 mm away from the tip.

Further, as shown in FIG. 28, a connection portion 3b between the LSI chip 6 and the pattern 13a of the hard substrate 13 is formed by the bumps or the conductive particles 14 as described above, and the hard substrate 13 on which the LSI chip 6 is mounted is formed. Even when the flexible printed circuit board 2 is connected via the anisotropic conductive film 15,
When bending the flexible printed board 2 in the mountain-folding direction, the rigid board 1 is used to prevent the connection portion 15a between the hard board 13 and the flexible printed board 2 from peeling off.
The flexible printed circuit board 2 is bent at least at a distance of about 2.5 mm or more from the connecting portion 15a.

In this figure, the conductive particles 14 are mixed with an adhesive to form a paste, the paste is provided on the aluminum pad 7 printed on the substrate, and the LSI chip 6 is placed on the pattern 13a of the hard substrate 13 and added. By pressing, the conductive particles 14 break the oxide film on the surface of the aluminum pad 7 and are electrically connected. The connecting portion 3b is adhered to the hard substrate 13 with an epoxy adhesive 16 also serving as a seal, and the entire LSI chip 6 is covered with a resin 12.

Note that the bending direction of the flexible printed circuit board 2 is not limited to the mountain fold as described above, but may be bent in the valley fold direction.

[0010] As shown in FIG.
a or a flat package IC extending the lead terminals 5b in two directions.
When the flexible printed circuit board 2 on which the flexible printed circuit board 4b is mounted is to be bent in the valley folding direction, a force is applied in a direction in which the flexible printed circuit board 2 is separated from the lead terminals 5a and 5b of the flat package ICs 4a and 4b. The lead terminals 5a, 5b of the flexible printed circuit board 2 may be lifted from the pattern 2a provided on the flexible printed circuit board 2.
In order to prevent the floating of the flexible printed circuit board 2 from the pattern 2a, the bending positions of the flexible printed circuit board 2 and the lead terminals 5a and 5b of the flat package ICs 4a and 4b and the pattern 2
a is bent at least at a distance of about 2.5 mm or more from the connection portion 3a electrically connected by solder.

Similarly, when the flexible printed circuit board 2 on which the LSI chip 6 is mounted as shown in FIG. 30 is bent in the valley folding direction, the resin 12 covering the LSI chip 6 in order to prevent the LSI 6 from floating from the board. Was bent at least at a distance of about 2.5 mm or more from the tip.

Also, when the LSI chip 6 as shown in FIG. 31 is mounted on the hard board 13 and the flexible printed board 2 connected to the hard board 13 is bent in the valley folding direction, the hard board 13 and the flexible printed board 2 In order to prevent the connection portion 15a between the hard substrate 13 and the flexible printed circuit board 2 from peeling off, the connection portion 15a is bent at least at a distance of about 2.5 mm or more from the connection portion 15a between the hard substrate 13 and the flexible printed circuit board 2.

[0013]

However, when a flexible printed circuit board on which electronic components are mounted or a flexible printed circuit board connected to a hard substrate on which electronic components are mounted is bent, the mounted electronic components and the hard substrate are not flexibly connected. If a predetermined interval (about 2.5 mm or more) is provided from the connection portion that connects the printed circuit board and the printed circuit board is bent, the mounting area becomes large.

The present invention has been made in view of the above circumstances, and provides a flexible printed circuit board holding structure that can be folded with a small mounting area.

[0015]

According to the present invention, there is provided a flexible printed circuit board holding structure in which electronic components are provided in a predetermined manner.
The flexible printed circuit board electrically connected at the connecting portion, and the flexible printed circuit board near the connecting portion.
A fixed member to be placed bent beside, the fixed part
Holding the flexible printed circuit board
And it comprises a pressing member for pressing the fixed member, the upper
The pressing member is formed by bending the flexible printed circuit board.
The electronic component side of the
By pressing the vicinity of the part, the electronic component is
It is characterized in that it is prevented from floating from the connecting part . The holding structure of the flexible printed circuit board according to the present invention, electrostatic
Flexible pre-packaged with child components mounted at specified connection points
Printed circuit board and the flexible printed circuit board
The through hole and the flexible printed circuit board
A fixing member that is bent by placing in parts near the solid
The flexible printed circuit board on the fixed member is placed
That is inserted into the through hole.
And the flexure held by the holding member.
Of printed circuit boards on which electronic components are mounted
A pressing member for pressing the vicinity, and the pressing portion
The material, the flexible printed board is bent
Closer to the electronic component than the position and near the connection portion
By pressing, the electronic component is moved from the connection portion.
It is characterized in that it is prevented from floating.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a first embodiment of the present invention.

As shown in the figure, a flat package IC 21 extending lead terminals 21a in four directions is mounted on a flexible printed board 20. The flexible printed circuit board 20 is provided with two through holes 22. The two through holes 22 provided in the flexible printed circuit board 20 correspond to the flexible printed circuit board 2.
When the mounting member 0 is mounted on the fixing member 80, the mounting member 81 is mounted by inserting the holding member 81 protruding from the fixing member 80, and is inserted into the key-shaped concave portion 82 of the holding member 81. Terminal member 2 of the flat package IC 21 by sandwiching a prismatic pressing member 83 formed of a conductive ceramic, rubber member, plastic resin, or the like.
1 a and the pattern 20 a formed on the flexible printed circuit board 20 press the connecting portion 23 connected by soldering or the like to the fixing member 80 side.

For this reason, when the flexible printed circuit board 20 is to be bent near the pressing member 83, since the connecting portion 23 between the lead terminal 21a and the pattern 20a is pressed by the pressing member 83, the lead terminal 21a is connected to the pattern 20a. It can be easily folded without floating from it.

As described above, the holding member protruding from the fixing member is inserted into the through-hole provided in the flexible printed circuit board, and the pressing member is sandwiched between the key-shaped concave end portions of the holding member, and the lead terminal of the flat package is connected to By pressing and holding the connection with the pattern toward the fixing member, the connection between the lead terminal and the pattern does not float when bending the flexible printed circuit board, so that the opposite side of the flat package across the pressing member Can be bent near the connection portion.

The height of the holding member and the height of the flat package are substantially the same.

FIG. 2 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a second embodiment of the present invention.

As shown in the drawing, in this embodiment, instead of providing the pressing member 83 of the first embodiment on the connecting portion 23 between the lead terminal 21a of the flat package IC 21 and the pattern 20a, a position distant from the connecting portion 23 is provided. Pattern 2
A pressing member 83 is provided so as to press on 0a. At this time, since the pressing member 83 having the full width of the distal end recess 82 is sandwiched between the key-shaped distal end recesses 82 of the holding member 81, when the flexible printed board 20 is bent,
The flexible printed circuit board 20 can be bent at the end surface of the pressing member 83 opposite to the flat package with the pressing member 83 interposed therebetween. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 3 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a modification of the first embodiment of the present invention.

As shown in the drawing, in the present embodiment, a cylindrical pressing member 83a is sandwiched between the key-shaped concave recesses 82 of the holding member 81 instead of the prismatic pressing member 83 of the first embodiment. ing. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 4 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a modification of the second embodiment of the present invention.

As shown in the drawing, in this embodiment, a cylindrical pressing member 83a is sandwiched between the key-shaped concave recesses 82 of the holding member 81 instead of the prismatic pressing member 83 of the second embodiment. ing. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 5 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to another modification of the first embodiment of the present invention.

As shown in the figure, in this embodiment, the lead terminals 25a extend in two directions instead of mounting the flat package IC 21 extending the lead terminals 21a in four directions on the flexible printed circuit board 20 in the first embodiment. The flat package IC 25 is mounted on the flexible printed circuit board 20. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 6 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to another modification of the second embodiment of the present invention.

As shown in the drawing, in this embodiment, the lead terminals 25a extend in two directions instead of mounting the flat package IC 21 extending the lead terminals 21a in four directions on the flexible printed circuit board 20 in the second embodiment. The flat package IC 25 is mounted on the flexible printed circuit board 20. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 7 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to another modification of the first embodiment of the present invention.

As shown in the drawing, in this embodiment, a cylindrical pressing member 83a is replaced with a key-shaped concave portion 82 of the holding member 81 in place of the prismatic pressing member 83 of another modification of the first embodiment. To be clamped. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 8 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to another modification of the second embodiment of the present invention.

As shown in the drawing, in this embodiment, a cylindrical pressing member 83a is replaced by a key-shaped concave portion 82 of the holding member 81 in place of the prismatic pressing member 83 of another modification of the second embodiment. To be clamped. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 9 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a third embodiment of the present invention.

As shown in the drawing, in this embodiment, an LSI chip 26 is mounted on the flexible printed board 20 instead of mounting the flat package ICs 21 and 25 on the flexible printed board 20 in the first embodiment.

The method of mounting the LSI chip 26 on the flexible printed circuit board 20 is such that a gold bump 28 and a low melting point metal such as an In alloy are provided between the aluminum pad 27 provided on the LSI chip 26 and the pattern 20a. The bumps 29 are provided and mechanically plastically deformed for connection. The connection portion 30 is sealed with a sealing resin 31 and the entire LSI chip 26 is covered with a resin 32.

At this time, the holding member 81 is arranged near the joint 33 between the resin 32 covering the entire LSI chip 26 and the flexible printed board 20. Then, the resin 32 and the flexible printed circuit board 2 are sandwiched between the key-shaped concave recesses 82 by pressing a prismatic pressing member 83 formed of, for example, a non-conductive plastic resin.
0 is pressed to the fixing member 80 side.

Therefore, when the flexible printed circuit board 20 is bent near the pressing member 83, the resin 3
Since the joining portion 33 between the second substrate 2 and the flexible printed circuit board 20 is pressed by the pressing member 83, the LSI chip 26 can be easily bent without floating from the pattern 20a.

As described above, the holding member is inserted through the through-hole provided in the flexible printed circuit board, and the pressing member is sandwiched between the key-shaped concave portions of the holding member so that the joint between the resin and the flexible printed circuit board is fixed. When bending a flexible printed circuit board by pressing and holding
The LSI chip can be bent in the vicinity of the connection portion on the opposite side of the LSI chip with the pressing member interposed therebetween without lifting the LSI chip from the pattern. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

Further, as shown in FIG. 10, the same effect can be obtained by replacing the prismatic pressing member 83 with a cylindrical pressing member 83a.

FIG. 11 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a fourth embodiment of the present invention.

As shown in the drawing, in this embodiment, instead of the flexible printed circuit board 20 on which the LSI chip 26 is mounted in the third embodiment, a rigid substrate 34 on which the LSI chip 26 is mounted and the flexible printed circuit board 20 are anisotropic. The connection is made via a connection portion 36a formed of the conductive film 36.

The LSI chip 26 and the hard substrate 3
The connection with the pattern 34a of No. 4 is performed by bonding using the bumps 28 and 29 as in the third embodiment, or by mixing the conductive particles 35 with an adhesive as shown in FIG. The LSI chip 26 is provided on the aluminum pad 27 printed thereon, and the LSI chip 26 is
The conductive particles 35 are placed on the top and pressed to break the oxide film on the surface of the aluminum pad 27 to be electrically connected. Then, the connection portion 30 a is bonded to the hard substrate 34 with an epoxy adhesive 37 also serving as a seal, and the entire LSI chip 26 is covered with a resin 32.

At this time, the holding member 81 is located near the connecting portion 36a between the hard board 34 and the flexible printed board 20.
The flexible printed circuit board 20 is pressed toward the fixing member 80 by sandwiching a prismatic pressing member 83 formed of, for example, a non-conductive plastic resin in the tip concave portion 82 formed in a key shape. .

Therefore, when the flexible printed circuit board 20 is to be bent near the pressing member 83, since the flexible printed circuit board 20 is pressed by the pressing member 83, the connecting portion 36 a between the hard substrate 34 and the flexible printed circuit board 20 is bent. Can be easily folded without peeling.

As described above, by holding the pressing member in the key-shaped concave portion of the key of the holding member and pressing and holding the flexible printed circuit board toward the pressing member, the flexible printed circuit board can be flexibly bent when the flexible printed circuit board is bent. It is possible to bend the vicinity of the connection portion on the opposite side of the LSI chip with the pressing member therebetween without peeling off the connection portion with the printed board. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

As shown in FIG. 12, the same effect can be obtained by replacing the prismatic pressing member 83 with a cylindrical pressing member 83a.

FIG. 13 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a fifth embodiment of the present invention.

As shown in the drawing, in this embodiment, FIG. 1C of the above-described first embodiment and FIG. 5 showing another modification of the first embodiment.
As shown in (c), a non-conductive rectangular column-shaped pressing member 83 is sandwiched in a key-shaped concave portion 82 of the holding member 81 to press and hold the connection portion 23, and the flexible printed board 20 is piled up. In contrast to bending in the folding direction, the flexible printed circuit board 20 is bent in the valley folding direction near the holding member 81 and the pressing member 83. For this reason,
As shown in the figure, up to the upper surface direction of the flat package ICs 21 and 25, ie, the flexible printed circuit board 20.
Can be easily bent in the valley folding direction of 90 degrees or 180 degrees. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 14 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a sixth embodiment of the present invention.

As shown in the drawing, in this embodiment, as shown in FIG. 3C of the modification of the first embodiment and another modification of the first embodiment, as shown in FIG. A non-conductive cylindrical pressing member 8 is formed in a key-shaped concave portion 82 of the key 81.
3a, the connecting portion 23 is pressed and held, and the flexible printed board 20 is bent in the mountain fold direction. On the other hand, the flexible printed board 20 is bent in the valley fold direction near the holding member 81 and the pressing member 83a. I have.
Therefore, as shown in FIG.
The flexible printed circuit board 20 can be easily bent in the valley folding direction of 90 degrees or 180 degrees up to the upper surface direction of 1, 25. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 15 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a seventh embodiment of the present invention.

As shown in the drawing, in this embodiment, FIG. 2C of the above-described second embodiment and FIG. 6 of another modification of the second embodiment are shown.
As shown in (c), the non-conductive rectangular column-shaped pressing member 83 is sandwiched in the key-shaped concave portion 82 of the holding member 81 to press and hold the flexible printed circuit board 20, and the flexible printed circuit board 20 is held. Instead of bending in the mountain fold direction, the flexible printed circuit board 20 is bent in the valley fold direction near the holding member 81 and the pressing member 83. Therefore, as shown in the figure, the flexible printed circuit board 20 can be easily bent to the upper surface direction of the flat package ICs 21 and 25, that is, the valley folding direction of 90 degrees or 180 degrees. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 16 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to an eighth embodiment of the present invention.

As shown in the drawing, in this embodiment, a modified example (c) of the above-described second embodiment and another modified example (c) of the second embodiment.
As shown in the figure, the non-conductive cylindrical pressing member 83a is sandwiched in the key-shaped concave portion 82 of the holding member 81 to press and hold the flexible printed board 20, and the flexible printed board 20 is folded in the mountain-folding direction. However, the flexible printed circuit board 20 is bent in the valley folding direction near the holding member 81 and the pressing member 83a. Therefore, as shown in FIG.
The flexible printed circuit board 20 can be easily bent to the upper surface direction of C21, 25, that is, the valley folding direction of 90 degrees or 180 degrees. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 17 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a ninth embodiment of the present invention.

As shown in the drawing, in the present embodiment, as shown in FIG.
Instead of bending 0 in the mountain fold direction, the flexible printed circuit board 20 is bent in the valley fold direction near the holding member 81 and the pressing member 83. For this reason, as shown in the figure, the flexible printed circuit board 20 can be folded in the vicinity of the holding member 81 and the pressing member 83 by 90-degree valley fold toward the LSI chip 26 side or by 180-degree valley fold in the direction of the LSI chip 26 side. . Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 18 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a tenth embodiment of the present invention.

As shown in the drawing, in this embodiment, instead of bending the flexible printed circuit board 20 in the mountain-folding direction as shown in FIG. And it is bent in the valley folding direction near the pressing member 83a. For this reason,
As shown in the drawing, the flexible printed circuit board 20 is placed on the LSI chip 26 side near the holding member 81 and the pressing member 83.
It can be bent at 0 degree valley fold or 180 degree valley fold toward the LSI chip 26 side. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 19 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to an eleventh embodiment of the present invention.

As shown in the drawing, in this embodiment, instead of bending the flexible printed circuit board 20 in the mountain fold direction as shown in FIG. 11 of the fourth embodiment, the flexible printed circuit board 20 is held by the holding member 81 and the pressing member. It is bent in the valley folding direction near 83. For this reason, as shown in the figure, the flexible printed circuit board 20 can be folded in the vicinity of the holding member 81 and the pressing member 83 by 90-degree valley fold toward the LSI chip 26 side or by 180-degree valley fold in the direction of the LSI chip 26 side. . Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

FIG. 20 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a twelfth embodiment of the present invention.

As shown in the drawing, in this embodiment, instead of bending the flexible printed circuit board 20 in the mountain-folding direction as shown in FIG. And it is bent in the valley folding direction near the pressing member 83a. For this reason,
As shown in the drawing, the flexible printed circuit board 20 is placed on the LSI chip 26 side near the holding member 81 and the pressing member 83.
It can be bent at 0 degree valley fold or 180 degree valley fold toward the LSI chip 26 side. Other configurations, operations and effects are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

The holding member 8 described in the above-described embodiment is used.
FIG. 21 (a) shows the shape of the tip concave portion 82 formed in the shape of a key.
, A tapered surface 82b that expands from the near side to the far side as shown in FIG. By forming the R-shaped concave surface 82c as shown, the pressing members 83, 83a can be reliably held without falling off from the holding member 81.

FIG. 22 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a thirteenth embodiment of the present invention.

As shown in the drawing, in the present embodiment, instead of holding the pressing members 83, 83a in the concave end portion 82 of the holding member 81 protruding from the fixing member 80 in the first embodiment, two through holes 84a, Pressing member 84 having 84a
The holding members 81a formed in a columnar shape are fitted into the respective through holes, and the lead terminals 2 of the flat package IC 21 are inserted.
1 a and the pattern 20 a formed on the flexible printed circuit board 20 press the connecting portion 23 connected by soldering or the like to the fixing member 80 side. Other configurations, operations, and effects are the same as those of the first embodiment, and the same members are denoted by wave symbols and description thereof is omitted.

FIG. 23 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a fourteenth embodiment of the present invention.

In this embodiment, instead of using only one pressing member 83 as in the first embodiment, the pressing members 84 can be provided on all sides to be bent near the flat package IC 21. Has become.

As shown in the drawing, pressing members 84 are provided on two sides. That is, the through holes 84a, 84a of the pressing member 84
A plurality of holding members 8 provided so as to protrude from the fixing member 80
1a, the lead terminals 21a on each side are fixed. At this time, the pressing member 84 is fitted into the holding member 81a so that the pressing member 84 rides on the lead terminal 21a of the flat package IC 21. Other configurations, operations, and effects are the same as those of the first embodiment, and the same members are denoted by wave symbols and description thereof is omitted.

Incidentally, the pressing position of the pressing member 84 against the lead terminal 21a is not limited to the place as shown in this drawing, but as shown in FIG.
The pressing member 83 may be arranged at a position slightly further away. Further, a holding member may be provided outside the flexible printed circuit board as shown in FIG.
In the figure, only one holding member is located outside the flexible printed circuit board, but by arranging all the holding members outside the flexible printed circuit board, it is not necessary to provide a through hole in the flexible printed circuit board. Further, the flat package may extend the lead terminals in four directions, or may extend the lead terminals in two directions. Further, the pressing member may have a columnar shape, and the holding member may have a concave portion at the tip.

FIG. 24 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a fifteenth embodiment of the present invention.

As shown in the drawing, in this embodiment, the pressing member 85
A substrate 86 including a switch pattern 86a is provided thereon. The chip component 8 is provided below the pressing member 85.
6b is provided. Reference numeral 86c is a through hole provided in the substrate.

As described above, by providing a switch pattern or the like on the pressing member, the mounting space can be more effectively used. Other configurations, operations and effects are the same as those of the above-described fourteenth embodiment and the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

In the above-described embodiment, when there is no risk of contact with a terminal such as an IC on a substrate or the like using an LSI chip, not only a non-conductive material but also a conductive material such as iron or Aluminum or the like may be used.

Further, in the above-described embodiment, the holding member is described as an integral member protruding from the fixing member. However, the holding member may be a separate member from the fixing member.

[Supplementary Notes] (1) A flexible printed board on which chip components such as a flat package IC and an LSI chip are mounted, and a fixing member on which the flexible printed board is mounted,
And a pressing member that presses the vicinity of the chip component against the fixing member in the flexible printed board, and folds the flexible printed board on a side opposite to the chip component with the pressing member interposed therebetween. Flexible printed circuit board holding structure.

(2) Flat package IC or L
A flexible printed circuit board on which electronic components such as an SI chip are mounted, a fixing member on which the flexible printed circuit board is mounted, and a holding member projecting from a surface of the fixing member on which the flexible printed circuit board is mounted. A pressing member which is held by the holding member and presses the vicinity of a portion of the flexible printed circuit board on which the flat package IC or the LSI chip is mounted. A flexible printed circuit board holding structure that is bent on the side opposite to the electronic component with the electronic component interposed therebetween.

(3) The holding member has a key-shaped tip and at least two protruding portions from the fixing member.
The holding structure for a flexible printed circuit board according to claim 2, wherein the pressing member is held at the key-shaped portion.

(4) The structure for holding a flexible printed circuit board as described in appendix (1) or (2), wherein the pressing member is formed of a non-conductive material.

(5) The holding structure of the flexible printed circuit board according to (3), wherein a surface of the key-shaped portion of the holding member facing the fixing member is formed in a concave shape.

(6) The structure for holding a flexible printed circuit board according to (5), wherein the pressing member is formed in a rod shape.

(7) The structure for holding a flexible printed circuit board according to (5), wherein the pressing member is formed in a cylindrical or prismatic shape.

(8) The structure for holding a flexible printed circuit board according to (2), wherein a board including a switch pattern is fixed on the pressing member.

(9) A flexible printed circuit board on which a flat package IC or LSI chip is mounted, a fixing member on which the flexible printed circuit board is mounted, and the vicinity of the flat package IC or LSI chip on the flexible printed circuit board. And a pressing member for pressing against the fixing member, and the flexible printed circuit board is bent at the side opposite to the flat package IC or LSI chip with the pressing member interposed therebetween.

[0086]

As described above, according to the present invention, it is possible to provide a flexible printed circuit board holding structure that can be folded with a small mounting area.

[Brief description of the drawings]

FIG. 1 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a first embodiment of the present invention, wherein (a) a flexible printed circuit board on which a flat package IC extending lead terminals in four directions is mounted; Perspective view showing the positional relationship with the pressing member. (B) Top view of FIG. (A). (C) Side view of FIG.

FIG. 2 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a second embodiment of the present invention; (a) a flexible printed circuit board mounted with a flat package IC extending lead terminals in four directions; Perspective view showing the positional relationship with the pressing member. (B) Top view of FIG. (A). (C) Side view of FIG.

3A and 3B are diagrams showing a schematic configuration of a flexible printed circuit board holding structure according to a modification of the first embodiment of the present invention. (A) Flexible mounting a flat package IC that extends lead terminals in four directions. A perspective view showing the positional relationship between the printed circuit board and the pressing member. (B) Top view of FIG. (A). (C) Side view of FIG.

FIG. 4 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a modification of the second embodiment of the present invention. (A) Flexible mounting a flat package IC extending lead terminals in four directions. A perspective view showing the positional relationship between the printed circuit board and the pressing member. (B) Top view of FIG. (A). (C) Side view of FIG.

FIG. 5 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to another modified example of the first embodiment of the present invention; (a) mounting a flat package IC extending lead terminals in two directions; Perspective view showing the positional relationship between the flexible printed circuit board and the pressing member, shown in (b) Top view in FIG. (A), (c) Side view in FIG.

FIG. 6 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to another modified example of the second embodiment of the present invention, wherein (a) a flat package IC extending lead terminals in two directions is mounted; Perspective view showing the positional relationship between the flexible printed circuit board and the pressing member, shown in (b) Top view in FIG. (A), (c) Side view in FIG.

FIGS. 7A and 7B are diagrams showing a schematic configuration of a flexible printed circuit board holding structure according to another modification of the first embodiment of the present invention, in which: (a) a flat package IC extending lead terminals in two directions is mounted; Perspective view showing the positional relationship between the flexible printed circuit board and the pressing member, shown in (b) Top view in FIG. (A), (c) Side view in FIG.

FIG. 8 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to another modified example of the second embodiment of the present invention, in which (a) a flat package IC extending lead terminals in two directions is mounted; Perspective view showing the positional relationship between the flexible printed circuit board and the pressing member, shown in (b) Top view in FIG. (A), (c) Side view in FIG.

FIG. 9 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a third embodiment of the present invention.

FIG. 10 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a modification of the third embodiment of the present invention.

FIG. 11 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a fourth embodiment of the present invention.

FIG. 12 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a modification of the fourth embodiment of the present invention.

FIG. 13 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a fifth embodiment of the present invention.

FIG. 14 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a sixth embodiment of the present invention.

FIG. 15 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a seventh embodiment of the present invention.

FIG. 16 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to an eighth embodiment of the present invention.

FIG. 17 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a ninth embodiment of the present invention.

FIG. 18 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a tenth embodiment of the present invention.

FIG. 19 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to an eleventh embodiment of the present invention.

FIG. 20 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a twelfth embodiment of the present invention.

FIGS. 21A and 21B relate to a shape of a concave portion at the distal end of the holding member; (a) a rectangular concave surface formed at the distal concave portion; What did

FIG. 22 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a thirteenth embodiment of the present invention. (A) A flexible printed circuit board mounted with a flat package IC extending lead terminals in four directions, a pressing member, (B) Top view of FIG. (A) (c) Side view of FIG. (A)

FIG. 23 is a view showing a schematic configuration of a flexible printed circuit board holding structure according to a fourteenth embodiment of the present invention. (A) A flexible printed circuit board mounted with a flat package IC extending lead terminals in four directions and a plurality of presses. Perspective view showing positional relationship with members (b) Top view of figure (a)

FIG. 24 is a diagram showing a schematic configuration of a flexible printed circuit board holding structure according to a fifteenth embodiment of the present invention. (A) Having a flexible printed circuit board mounted with a flat package IC extending lead terminals in four directions and a board Perspective view showing the positional relationship with the pressing member. (B) Top view of FIG.

FIG. 25 to FIG. 31 relate to a conventional example, and FIG.
Is a flat package I with lead terminals extending in four directions
It is a figure which shows the flexible printed circuit board which mounted C, (a) is a perspective view, (b) is a top view, (c) is a side view.

26A and 26B are diagrams showing a flexible printed circuit board on which a flat package IC having lead terminals extending in two directions is mounted, wherein FIG. 26A is a perspective view, FIG. 26B is a top view, and FIG.

FIG. 27 is a view showing a flexible printed circuit board on which an LSI chip is mounted.

FIG. 28 is a diagram in which a hard board on which an LSI chip is mounted and a flexible printed board are connected;

FIG. 29 is a view showing a valley-folded state of a flexible printed board on which a flat package IC is mounted.

FIG. 30 is a diagram showing a valley-folded state of a flexible printed board on which an LSI chip is mounted;

FIG. 31 is a view showing a valley-folded state of a flexible printed board connected to a hard board on which an LSI chip is mounted;

[Explanation of symbols]

 Reference Signs List 20 flexible printed circuit board 21 flat package IC (electronic component) 80 fixing member 81 holding member 83 pressing member

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-3-145074 (JP, A) JP-A-64-36096 (JP, A) JP-A-58-184778 (JP, A) 11225 (JP, U) Japanese Utility Model 2-31188 (JP, U) Japanese Utility Model 1-137584 (JP, U) Japanese Utility Model Utility Model 2-97753 (JP, U) Japanese Utility Model Utility Model 60-27487 (JP, U) (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 7/14

Claims (5)

(57) [Claims] An electronic component is electrically connected at a predetermined connection portion.
The continuous flexible printed circuit board and the flexible printed circuit board are folded near the connection portion.
A fixed member that is bent and placed; and the flexible print base that is held by the fixed member.
Plate is provided with a pressing member for pressing toward the fixing member, the pressing member, the flexible flop
The electronic component side above the position where the lint board is bent
And by pressing the vicinity of the connection portion,
A structure for holding a flexible printed circuit board, wherein the electronic component is prevented from floating from the connection portion . 2. The electronic component has a lead terminal.
Connected to the flexible printed circuit board with lead terminals
The pressing member is moved upward through this lead terminal.
Press the flexible printed circuit board toward the fixing member
Holding structure of a flexible printed circuit board according to claim 1, characterized in that pressure. 3. A switch pattern is provided on the pressing member.
Claim 1 or the substrate which is characterized in that it is provided
3. The flexible printed circuit board holding structure according to 2. 4. A pad provided on said electronic component and said pad
Between the pattern provided on the flexible printed circuit board
The electronic components are flexible with the bumps
2. The printed circuit board is connected to a printed circuit board.
3. The holding structure for a flexible printed circuit board according to claim 1 . 5. The electronic component is mounted at a predetermined connection part.
A flexible printed circuit board, a through hole formed in the flexible printed circuit board, and the flexible printed circuit board folded near the connection portion.
A fixed member that is bent and placed, and the flexible printed circuit board in the fixed member is
It is projected from the surface on which it is placed, and is inserted through the through hole.
Holding member, and the flexible pre-
Push the vicinity of the part on the printed circuit board where the electronic components are mounted.
And a pressing member for pressing the flexible member.
The electronic component side above the position where the lint board is bent
And by pressing the vicinity of the connection portion,
It is specially designed to prevent the electronic component from floating from the connection.
Flexible printed circuit board holding structure .