JPH0734446B2 - Film carrier tape - Google Patents

Description

TECHNICAL FIELD The present invention relates to a film carrier tape. More specifically, the present invention relates to a film carrier tape using a film or sheet having excellent heat resistance, dimensional stability and punching processability.

[Prior art]

Film carrier tape is coated with adhesive, sprocket hole / device hole punching, copper foil bonding, etching, plating, IC
Since the base film or sheet is processed through processes such as bonding and board mounting, the film or sheet used as the base is used for IC bonding, conductive heat when mounting the board, and copper foil adhesion (when adhesive is cured). Heat resistance to heat, chemical resistance to organic solvents such as resist solvents and degreasing solvents, acids such as plating solutions and etching solutions, dimensional stability against heat treatment such as temperature and humidity, copper foil adhesion, sprocket holes and device holes Punching workability, flexibility, mechanical strength, etc. at the time of punching are required.

Conventional film carrier tape is polyimide film,
Although glass epoxy is used, polyimide has excellent heat resistance, chemical resistance, punching workability, flexibility, and mechanical strength, but has considerable hygroscopicity, resulting in poor dimensional stability and high price. On the other hand, glass epoxy is excellent in heat resistance, chemical resistance, and dimensional stability and is cheaper than polyimide, but since it contains glass fibers, gas is generated at the time of punching and cutting also causes cracks.

Various applications have also been investigated for thermoplastic resin films, but unsatisfactory results have been obtained mainly in terms of heat resistance and dimensional stability.

For example, among the thermoplastic resin films, even the polyetherimide film, which seems to be most suitable for this application because of its heat resistance and other physical properties, has a large linear expansion coefficient, so that the dimensional stability is not sufficient, and copper after bonding with copper foil is not possible. Warpage also occurs due to the difference in linear expansion coefficient from the foil. In the case of a polyetherketone film, when a biaxially stretched polyetherketone film is used, the heat resistance and the linear expansion coefficient reach a satisfactory range, but the heat shrinkage rate is large and the dimensional stability becomes insufficient.

[Object of the Invention]

The present invention, as a result of diligent studies to apply a film or sheet having excellent heat resistance, dimensional stability, punching processability, chemical resistance, flexibility and mechanical strength to a film carrier tape, results in polyetherimide A film or sheet made of a composition of 75 to 20% by weight of resin, 10 to 40% by weight of polyetherketone resin, and 15 to 40% by weight of inorganic filler and having a plate-like shape of the inorganic filler has chemical resistance and flexibility. Of heat resistance, dimensional stability, and punching workability in addition to heat resistance and mechanical strength, we applied adhesive to this film or sheet, punched sprocket holes and device holes, bonded copper foil, etched, etc. The circuit can be formed well through the process of
It has been found that bonding and board mounting can be carried out smoothly.

[Structure of Invention]

The present invention is a film or sheet which, after applying an adhesive on one surface, punches sprocket holes and device holes, removes the sprocket holes, and laminate-bonds copper foil on the adhesive-coated surface to form a wiring circuit by etching. The present invention relates to a film carrier tape, wherein the film or sheet has a composition of 75 to 20% by weight of a polyetherimide resin, 10 to 40% by weight of a polyetherketone resin, and 15 to 40% by weight of an inorganic filler.

The polyetherimide resin used in the present invention is defined as a thermoplastic polymer having an aromatic nucleus bond, an ether bond, and an imide bond in its structural unit, and a resin having the following structural formula is a typical example.

On the other hand, the polyetherketone resin is defined as a thermoplastic polymer having an aromatic nucleus bond, an ether bond, and a ketone bond in its structural unit, and a resin having the following structural formula is a typical example.

Further, the inorganic filler is preferably plate-shaped, generally plate-shaped, disc-shaped, and flakes, and examples thereof include talc, mica, clay and calcined clay.
These 1 type, or 2 or more types are appropriately selected and used.

Polyetherimide resin in the film or sheet used in the present invention, polyetherketone resin, the content of the inorganic filler is polyetherimide resin 75 to 20 wt%
(Preferably 65 to 35% by weight), polyetherketone resin is 10 to 40% by weight (preferably 15 to 30% by weight), and inorganic filler is 15 to 40% by weight (preferably 20 to 35% by weight) . If the amount of polyetherimide resin exceeds 75% by weight, the dimensional stability (coefficient of linear expansion) and punching processability cannot be satisfied at the same time, and if it is less than 20% by weight, the excellent heat shrinkage resistance of polyetherimide resin cannot be maintained. Stability is significantly reduced. On the other hand, if the polyetherketone resin is less than 10% by weight, flexibility and punching workability are rapidly lowered, and if it exceeds 40% by weight, the heat shrinkage rate is increased and the dimensional stability is lowered. Further, if the inorganic filler is less than 15% by weight, the linear expansion coefficient increases, which leads to a decrease in dimensional stability, and it causes warpage due to the difference in the linear expansion coefficient with the copper foil. If it exceeds 40% by weight, it is flexible and punched. Sex decreases rapidly. The film or sheet used in the present invention is a lubricant, a heat resistance stabilizer, a weather resistance stabilizer, depending on the purpose.
Additives such as pigments and dyes, flame retardants, and fluidity improvers including other thermoplastic resins may be included.

The method for producing the film or sheet used in the present invention is a polyetherimide resin, a polyetherketone resin, a dry blending method of an inorganic filler, a Banbury mixer, after mixing by a usual method such as a method using a mixing machine such as an extruder, a calendar A method of forming a film into a film or sheet by a usual processing method such as processing or extrusion film forming method is used.

〔The invention's effect〕

Since the film carrier tape obtained by the present invention uses a film or sheet consisting of three components of polyetherimide resin, polyetherketone resin and inorganic filler, the linear expansion coefficient which is a drawback of the polyetherimide film is By using a filler that is as low as copper, and by using a plate-shaped material, the difference between the MD and TD directions is minimized and the effect is achieved with a small filling amount. Properties and punching processability are improved by introducing polyetherketone resin, which has excellent heat resistance and flexibility and is compatible with the polyetherimide resin, and by limiting the composition (content), polyetherketone The reduction of heat shrinkage, which is impaired by the introduction of resin, is minimized, and the overall physical properties are balanced. It becomes a film or sheet with excellent processability, and it is possible to satisfactorily carry out from circuit formation to IC bonding and substrate mounting, and the conventional processing method and equipment can be used without any problems, which is industrially advantageous.

〔Example〕

Polyetherimide resin (ULTEM1000 manufactured by GE), polyetherketone resin (PEEK380P manufactured by ICI), and talc as an inorganic filler are 50% by weight, 20% by weight, and 30% by weight, respectively.
After the mixture was mixed and melt-kneaded and granulated at a ratio of 125 .mu.m, a film having a thickness of 125 .mu.m was extrusion formed and slit into a width of 35 mm.

After degreasing this film with trichlorethylene, apply thermosetting adhesive on one side to punch out sprocket holes and device holes, and remove the sprocket holes on the adhesive application surface to a thickness of 35μ.
A copper foil of m was adhered by heating and pressing, cured at 160 ° C. for 3 hours, and further a circuit was formed on the film by etching. Next, Sn plating and IC bonding were carried out, and after cutting, soldering was used to mount and mount on the substrate.

The dimensional change during this process was extremely small, and there was no warp or twist after the copper foil was bonded. In addition, the film was not deformed or destroyed until it was mounted on the substrate, even after the heat treatment, and no scraps or cracks were generated during punching or cutting.

When a 125 μm-thick polyimide film, glass epoxy, and polyetherimide film were processed by the same method, the polyimide film had a large dimensional change during processing, and the dimensional stability was poor, but when glass epoxy was punched, Many dusts and cracks were generated at the time of cutting, and the polyetherimide film was largely warped after the copper foil was bonded.

Claims (2)

[Claims] 1. A sprocket hole after application of adhesive on one side
A film or sheet for punching a device hole to form a wiring circuit by laminating and adhering a copper foil on an adhesive coated surface except for a sprocket hole, wherein the film or sheet is a polyetherimide resin 75 to 20% by weight, Ether ketone resin 10-40% by weight, inorganic filler 15-40% by weight
A film carrier tape characterized by comprising the following composition. 2. The film carrier tape according to claim 1, wherein the inorganic filler has a plate shape.