JPH07336049A - Manufacture of multilayer printed circuit board - Google Patents

Abstract

PURPOSE:To easily manufacture a thin multilayer printed circuit board with a non-penetrated hole by conducting series of steps of punching a viahole while repeating winding and rewinding of a rolled copper foil, and laminating the foil. CONSTITUTION:A method for manufacturing a multilayer printed circuit board comprises the steps of providing an insulating adhesive layer 2 on a copper foil 1 while rewinding the rolled copper foil 1, then punching a through hole 3 to become a viahole while rewinding the wound roll, thereafter laminating the foil 4 while rewinding the wound roll, winding it on the roll while curing the layer 2, forming the hole 3 to a non-penetrated hole, then forming an etching resist 5 for forming a wiring pattern on the surface of the foil 4 in which the hole 3 of the board is not opened, removing the foil, thereafter superposing it via insulating adhesive 6 between the inner layer board formed with the wiring and other board 7, pressuring it, heating it, integrating the layer, and then printing conductive paste 8 to conduct a connecting hole between the layers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board.

[0002]

2. Description of the Related Art With the development of electronic equipment, printed wiring boards are required to have high performance. For example, regarding the wiring density, so-called surface mount components have been developed that connect electronic components only on the surface of the wiring board, and if the spacing between the connection terminals of the electronic components is small, those with 0.15 mm or less are also used. It has begun, and it is required to form a circuit conductor according to this density.

As a method of manufacturing such a printed wiring board, a copper-clad laminate obtained by laminating a copper foil on an insulating substrate is used as a starting material, and a portion of the copper foil which does not serve as a circuit conductor is removed by etching to form a circuit. Subtractive method, additive method of electroless plating to form the circuit on the surface of the insulating substrate to form a circuit, partial additive to electrolessly plate a part of the circuit conductor such as the inner wall of the through hole The law etc. are generally known.

Among them, the subtractive method has been used for a long time, and in order to improve the wiring density, it is usual to reduce the thickness of the copper foil of the copper-clad laminate. The reason for this is that when an etching resist is formed in the required circuit shape on the surface of the copper foil and the unnecessary copper foil exposed from the etching resist is removed with an etching solution, copper is corroded from the side surface of the necessary circuit part. This is because a phenomenon called so-called side etching occurs, and the thicker the copper foil, the more copper on the side surface is removed by the side etching, which makes it difficult to form a fine circuit.

Even such a wiring board cannot accommodate wiring in one layer, and may have a plurality of circuit layers. In such a multilayer wiring board, after all wiring layers are created and laminated, a method of forming through holes for connection of each layer, an inner layer circuit is formed, and a prepreg and a copper foil are stacked and laminated. Various methods have been developed and put into practical use, such as a method of forming a through hole, electroless plating, and then forming an outer layer circuit.

[0006]

However, in the above method, it is not possible to form the wiring at the place where the through hole for connection is provided, and it is possible to increase the density of the wiring,
It hampered the freedom of design. Therefore, as shown in FIG. 1 (a), a single-sided copper foil-clad laminate with an adhesive layer in which a semi-cured insulating adhesive layer is provided on the insulating layer surface of the single-sided copper-clad laminate, or a copper foil As shown in FIG. 1 (b), a through hole to be a via hole is formed in a copper foil with an adhesive layer having a semi-cured insulating adhesive layer on one surface, and then, as shown in FIG. 1 (c).
As shown in Fig. 1, a copper foil is laid on the surface of the adhesive, laminated under pressure and heating to be integrated, an etching resist is formed, and the copper foil exposed from the etching resist is removed by etching as shown in Fig. 1 (d). By doing, the inner layer wiring pattern on the surface of the copper foil on the side without holes, and the outer layer wiring pattern on the surface of the copper foil on the side with holes, if necessary.
As shown in FIG. 1 (e), a double-sided copper foil-clad board with a non-through hole having wiring formed thereon and another board, for example, a metal board, are superposed with an adhesive insulating resin interposed therebetween, As shown in FIG. 1 (f), plating is performed on at least the inside of the through hole that will be a via hole and the copper foil portion exposed in the through hole that will be a via hole of the substrate obtained by pressurizing and heating to laminate and integrate. A method for producing a multilayer printed wiring board in which the interlayer connection holes are made conductive by carrying out or printing a conductive paste has been proposed by the present inventors, for example, in Japanese Patent Application No. 5-252990. There is.

According to this method, since holes are preliminarily punched in the semi-cured insulating adhesive film and then laminated with the inner layer plate, the inner layer wiring is not required to be processed without laser processing or drilling without through holes. There is an advantage that the connection hole can be easily formed. On the other hand, in recent years, multilayer printed wiring boards have been required to be thin in order to reduce the weight of electronic devices, and the thickness of the one-sided copper foil-clad laminate with an adhesive layer or the copper foil with an adhesive layer used is 0. The number of thin products with a thickness of 0.15 mm or less is increasing. When handling such a thin product, there is a problem that twisting or warping may occur or the product may break, which makes the handling difficult.

It is an object of the present invention to improve the proposal of Japanese Patent Application No. 5-252990 and the like, and to provide a method for producing a multilayer wiring board having high productivity.

[0009]

The method for manufacturing a multilayer printed wiring board according to the present invention is characterized by including the following steps. (A) While unwinding the rolled single-sided copper foil-clad laminate or the rolled copper foil, a semi-cured insulating adhesive layer is formed on the surface of the insulating material side of the single-sided copper-clad laminate or the copper foil. Step of providing and winding on a roll (b) Step of punching a through hole to be a via hole from the side of the copper foil surface with a punching machine while intermittently rewinding the wound roll, and winding on another roll (c) While rewinding the wound roll, copper foil is continuously laminated on the surface of the adhesive layer of the substrate on which the through holes that will be via holes are formed, and the adhesive layer is cured, and then on another roll. Step of winding (d) Step of laminating the photosensitive dry film on both sides of the wound roll while rewinding it, and cutting it into a predetermined size. (E) On the surface of the cut copper foil having no holes. Shape the inner layer wiring pattern A step of forming an etching resist for forming the same, and also forming an etching resist on the opposite surface thereof as necessary, and removing the copper foil exposed from the etching resist by etching (f) the substrate on which the wiring is formed in the above step A step of stacking with another substrate through a prepreg or an adhesive resin layer, and heating and pressurizing to laminate-integrate (g) at least the inside of the through-hole and the via-hole of the laminate-integrated substrate to be via holes Step of plating or printing conductive paste on the copper foil part exposed in the through hole

Among the above steps, (c) to (e) can be the following steps. (C1) While rewinding the wound roll, a copper foil is continuously laminated on the surface of the adhesive layer of the substrate in which the through holes to be the via holes are formed, the adhesive layer is cured, and then the predetermined Step of cutting to size (d1) On the surface of the cut copper foil with no holes,
A step of forming an etching resist for forming the inner layer wiring pattern and, if necessary, forming an etching resist also on the opposite surface thereof (e1) a step of etching away the copper foil exposed from the etching resist

Also, among the first steps, (d) and (e)
Can be the following steps. (D2) While rewinding the wound roll intermittently,
Step of forming an etching resist for forming the inner layer wiring pattern and, if necessary, forming an etching resist also on the opposite surface (e2) After cutting to a predetermined size, etching the copper foil exposed from the etching resist Removal process

Furthermore, in the first step (d)-
(F) can also be the following steps. (D3) While rewinding the wound roll, an etching resist for forming an inner layer wiring pattern is formed on the surface of the copper foil having no holes, and if necessary, an etching resist is formed on the opposite surface. Step of forming and winding on another roll (e3) After rewinding the wound roll, after etching away the copper foil exposed from the etching resist,
Step of peeling off the etching resist and winding it on another roll (f3) While rewinding the wound roll, it is laminated with another substrate through a prepreg or an adhesive resin layer and heated under pressure to be laminated and integrated. After cutting, cutting into a predetermined size

Furthermore, after the lamination and integration, a through hole to be a through hole is formed at a desired position, and plating or a conductive paste is printed together with the through hole to be a via hole provided in the previous step. You can also

The one-sided copper foil-clad laminate used in the present invention is an insulating material such as a glass cloth-bonded with copper foil on one side.
A single-sided copper foil-clad laminate using an epoxy resin, a single-sided copper foil-clad flexible sheet using a flexible polyimide film, or the like can be used. The insulating material may be an organic material obtained by impregnating a reinforcing fiber such as paper, non-woven fabric or glass cloth with a resin, a resin product that is not reinforced, a flexible film, or a composite material of such a material and ceramics. Can be used. As the resin, phenol resin, epoxy resin, polyimide resin, polyester resin, fluorine-containing resin or the like can be used. Further, it is also possible to use a material in which a catalyst for electroless plating is dispersed in these insulating materials. The thickness of this single-sided copper foil-clad laminate is such that it can be wound into a roll.

As the insulating adhesive, an epoxy resin adhesive, an acrylic modified resin adhesive, a polyimide resin adhesive or the like can be used. Inorganic fillers such as calcium carbonate, calcium magnesium carbonate, calcium silicate, and silicate glass powder can be added to these adhesives. The insulative adhesive layer can be formed by direct coating or by laminating a film of the adhesive. An example of such an adhesive film is an epoxy adhesive film AS-3000 (trade name, manufactured by Hitachi Chemical Co., Ltd.), and an example of an adhesive-attached copper foil is an epoxy adhesive film MCF-3000E (Hitachi Chemical Co., Ltd.). Made by corporation, product name). These adhesive films and adhesive layers need to be in a semi-cured state. The semi-cured state referred to in the present invention means a semi-cured state which does not have tackiness at 40 ° C. or lower and which can give an adhesive strength of 0.8 kgf / cm or more by the subsequent multilayer adhesion. Such a semi-cured state is carried out by heating at a temperature and a time at which the resin does not completely cure like ordinary resins. Such conditions are obtained by experimentally obtaining in advance.

[0016]

【Example】

Example 1 As shown in FIG. 2 (a), AS-3000 (Hitachi Chemical Co., Ltd.), which is an insulating adhesive in a semi-cured state, was continuously rolled while rolling a copper foil 9 having a thickness of 35 μm. Product name, manufactured by Co., Ltd. is laminated and wound on a roll 10.
The structure at this time is, as shown in FIG. 1A, composed of a copper foil 1 and an insulating adhesive layer 2. Next, as shown in FIG. 2 (b), while the roll 10 obtained in the step (a) is being unwound intermittently, a through hole serving as a via hole is opened using the press punch 20, and the roll 11 is formed. Roll up. The structure at this time is, as shown in FIG. 1B, a through hole 3 to be a via hole is formed in a laminated material composed of the copper foil 1 and the insulating adhesive layer 2. Next, as shown in FIG. 2C, while unwinding the roll obtained in the step (b), the copper foil 4 is continuously laminated, and the insulating adhesive layer 2 is cured by the curing furnace 12. While winding up on roll 13,
As shown in FIG. 1C, the through holes that will be the via holes are non-through holes. Next, as shown in FIG.
While rewinding the roll 13 obtained in the step (c), SR-3000 (manufactured by Hitachi Chemical Co., Ltd., trade name), which is a photosensitive dry film 14, is laminated on both sides and cut into a predetermined size. , Substrate 15. Next, as shown in FIG. 1D, an etching resist 5 for forming an inner layer wiring pattern is formed on the surface of the cut copper foil 4 of the substrate, and also on the opposite surface. The etching resist 5 is formed, and the copper foil exposed from the etching resist 5 is removed by etching. Next, FIG. 1 (e)
As shown in FIG. 2, the semi-cured insulating adhesive 6 is provided between the inner layer substrate on which the wiring is formed in this manner and the other substrate 7.
Through AS-3000 (manufactured by Hitachi Chemical Co., Ltd., trade name). Next, as shown in FIG. 1 (f), by printing the conductive paste 8 on the inside of the through hole to be the via hole and the copper foil portion exposed in the through hole to be the via hole,
A multilayer printed wiring board is formed by making the interlayer connection holes conductive.

Example 2 As shown in FIG. 3 (a), while rolling back a roll-shaped copper foil 9 having a thickness of 35 μm, a continuous semi-cured insulating adhesive AS-3000 ( Hitachi Chemical Co., Ltd., trade name) is laminated and wound on a roll 10.
The structure at this time is, as shown in FIG. 1A, composed of a copper foil 1 and an insulating adhesive layer 2. Next, as shown in FIG. 3 (b), while the roll 10 obtained in the step (a) is being unwound intermittently, a through hole serving as a via hole is formed using the press punch 20 to form the roll 11 in the roll 11. Roll up. The structure at this time is, as shown in FIG. 1B, a through hole 3 to be a via hole is formed in a laminated material composed of the copper foil 1 and the insulating adhesive layer 2. Next, as shown in FIG. 3C, while unwinding the roll obtained in the step (b), the copper foil 4 is continuously laminated, and the insulating adhesive layer 2 is cured by the curing furnace 12. While cutting into a predetermined size,
The substrate 15 is used. At this time, as shown in FIG. 1C, the structure is such that the through holes to be via holes are non-through holes. Next, on the substrate 15 obtained in the step (c), SR-3000 (manufactured by Hitachi Chemical Co., Ltd., trade name), which is a photosensitive dry film 14, is laminated on both sides, and FIG.
As shown in (d), an etching resist 5 for forming an inner layer wiring pattern is formed on the surface of the cut copper foil 4 of the substrate, and an etching resist 5 is also formed on the opposite surface. Then, the copper foil exposed from the etching resist 5 is removed by etching. Next, as shown in FIG. 1E, a semi-cured insulating adhesive 6 is provided between the inner layer substrate having the wiring thus formed and the other substrate 7.
Through AS-3000 (manufactured by Hitachi Chemical Co., Ltd., trade name). Next, as shown in FIG. 1 (f), by printing the conductive paste 8 on the inside of the through hole to be the via hole and the copper foil portion exposed in the through hole to be the via hole,
A multilayer printed wiring board is formed by making the interlayer connection holes conductive.

Example 3 As shown in FIG. 4 (a), while rolling back a roll-shaped copper foil 9 having a thickness of 35 .mu.m, AS-3000 (insulating adhesive AS-3000 ( Hitachi Chemical Co., Ltd., trade name) is laminated and wound on a roll 10.
The structure at this time is, as shown in FIG. 1A, composed of a copper foil 1 and an insulating adhesive layer 2. Next, as shown in FIG. 4 (b), while the roll 10 obtained in the step (a) is being unwound intermittently, a press punch 20 is used to form a through hole to be a via hole, and the roll 11 is formed. Roll up. The structure at this time is, as shown in FIG. 1B, a through hole 3 to be a via hole is formed in a laminated material composed of the copper foil 1 and the insulating adhesive layer 2. Next, as shown in FIG. 4C, while unwinding the roll obtained in the step of FIG. 4B, the copper foil 4 is continuously laminated, and the insulating adhesive layer 2 is cured by the curing furnace 12. While winding up on roll 13,
As shown in FIG. 1C, the through holes that will be the via holes are non-through holes. Next, as shown in FIG.
While rewinding the roll 13 obtained in the step (c), a resist printing machine was used to
The etching resist 5 for forming the inner layer wiring pattern is formed, and the etching resist 5 is formed on the opposite surface.
After forming, the substrate 15 is cut into a predetermined size to form the substrate 15. Next, as shown in FIG. 1D, the copper foil exposed from the etching resist 5 is removed by etching. Next, as shown in FIG. 1E, the semi-cured insulating adhesive AS-3000 (Hitachi) is provided between the inner layer substrate on which the wiring is formed in this manner and the other substrate 7. The product is manufactured by Kasei Kogyo Co., Ltd., and the product is laminated and laminated under pressure and heating. Next, as shown in FIG. 1F, the conductive paste 8 is printed on the inside of the through hole to be the via hole and the copper foil portion exposed in the through hole to be the via hole to form the interlayer connection hole. By making them conductive, a multilayer printed wiring board is formed.

Example 4 As shown in FIG. 5 (a), while rolling a roll-shaped copper foil 9 having a thickness of 35 μm, the semi-cured insulating adhesive AS-3000 (was continuously formed. Hitachi Chemical Co., Ltd., trade name) is laminated and wound on a roll 10.
The structure at this time is, as shown in FIG. 1A, composed of a copper foil 1 and an insulating adhesive layer 2. Next, as shown in FIG. 5B, while the roll 10 obtained in the step (a) is being unwound intermittently, a through hole serving as a via hole is opened using the press punch 20 to form the roll 11 in the roll 11. Roll up. The structure at this time is, as shown in FIG. 1B, a through hole 3 to be a via hole is formed in a laminated material composed of the copper foil 1 and the insulating adhesive layer 2. Next, as shown in FIG. 5C, while unwinding the roll obtained in the step (b), the copper foil 4 is continuously laminated, and the insulating adhesive layer 2 is cured by the curing furnace 12. While winding up on roll 13,
As shown in FIG. 1C, the through holes that will be the via holes are non-through holes. Next, as shown in FIG.
While rewinding the roll 13 obtained in the step (c), a resist printing machine was used to
The etching resist 5 for forming the inner layer wiring pattern is formed, and the etching resist 5 is formed on the opposite surface.
And then roll it up into a roll. Next, as shown in FIG. 5E, the copper foil exposed from the etching resist 5 is removed by etching with the etching device 17, and the copper foil shown in FIG.
Then, the etching resist is removed by a resist stripping device and wound on a roll. next,
As shown in FIG. 5 (f), the inner layer substrate having the wiring thus formed is rewound on a roll that has been wound up, and then the insulating adhesive 6 in a semi-cured state is formed between the inner substrate and another substrate 7. AS-3000 (manufactured by Hitachi Chemical Co., Ltd., trade name) is stacked, heated under pressure, laminated and integrated, and cut into a predetermined size. At this time, the configuration is as shown in FIG. Next, as shown in FIG. 1 (f), by printing the conductive paste 8 on the copper foil portion exposed inside the through hole which becomes the via hole and in the through hole which becomes the via hole, the interlayer connection hole is formed. By making them conductive, a multilayer printed wiring board is formed.

Example 5 In Example 4, except that in the first step, a flexible film with a polyimide-based copper foil was used in place of the copper foil and a glass cloth epoxy resin insulating plate was used for the other substrate 7, A substrate 15 was created in the same manner as in Example 4, and a hole to be a through hole was further opened. The through hole was to be a through hole, the inside of a through hole to be a via hole, and the copper foil portion exposed in the through hole to be a via hole. By printing the conductive paste 8 to make the interlayer connection holes conductive,
Form a multilayer printed wiring board.

[0021]

As described above, according to the present invention, it is possible to provide a method for manufacturing a thin multilayer printed wiring board with a non-through hole which can be easily handled during the manufacturing process.

[Brief description of drawings]

1A to 1F are cross-sectional views in each step of an embodiment of the present invention.

2A to 2D are side views for explaining each step of one embodiment of the present invention.

3 (a) to 3 (c) are side views for explaining respective steps of another embodiment of the present invention.

4 (a) to 4 (d) are side views for explaining respective steps of still another embodiment of the present invention.

5 (a) to 5 (f) are side views for explaining each step of still another embodiment of the present invention.

[Explanation of symbols]

1. Copper foil 2. Insulating adhesive layer in semi-cured state 3. Through hole 4. Copper foil 5. Wiring pattern 6. Adhesive insulating resin 7. Substrate 8. Conductive paste 9. Copper foil 10. Roll 11. Roll 12. Curing furnace 13. Roll 14. Photosensitive dry film 15. Cut substrate 16. Resist printing machine 17. Etching device 18. Resist stripping device 19. roll

Claims (6)

[Claims] 1. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (A) While unwinding the rolled single-sided copper foil-clad laminate or the rolled copper foil, a semi-cured insulating adhesive layer is formed on the surface of the insulating material side of the single-sided copper-clad laminate or the copper foil. Step of providing and winding on a roll (b) Step of punching a through hole to be a via hole from the side of the copper foil surface with a punching machine while intermittently rewinding the wound roll, and winding on another roll (c) While rewinding the wound roll, copper foil is continuously laminated on the surface of the adhesive layer of the substrate on which the through holes that will be via holes are formed, and the adhesive layer is cured, and then rolled onto another roll. Step of winding (d) Step of laminating the photosensitive dry film on both sides of the wound roll while rewinding it, and cutting it into a predetermined size. (E) On the surface of the cut copper foil having no holes. , Inner layer wiring pattern A step of forming an etching resist for forming the same, and also forming an etching resist on the opposite surface thereof as necessary, and removing the copper foil exposed from the etching resist by etching (f) the substrate on which the wiring is formed in the above step A step of stacking with another substrate through a prepreg or an adhesive resin layer, and heating and pressurizing to laminate-integrate (g) at least the inside of the through-hole and the via-hole of the laminate-integrated substrate to be via holes Step of plating or printing conductive paste on the copper foil part exposed in the through hole 2. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (A) While unwinding the rolled single-sided copper foil-clad laminate or the rolled copper foil, a semi-cured insulating adhesive layer is formed on the surface of the insulating material side of the single-sided copper-clad laminate or the copper foil. Step of providing and winding on a roll (b) Step of punching a through hole to be a via hole from the side of the copper foil surface with a punching machine while intermittently rewinding the wound roll, and winding on another roll (c1) While rewinding the wound roll, copper foil is continuously laminated on the surface of the adhesive layer of the substrate that has through holes that will be via holes, and the adhesive layer is cured and then cut to a predetermined size. Step (d1) on the surface of the copper foil which is not cut,
A step of forming an etching resist for forming an inner layer wiring pattern and, if necessary, an etching resist also on the opposite surface thereof (e1) a step of etching away the copper foil exposed from the etching resist (f) the above step The step of stacking the wiring-formed board with another board through a prepreg or an adhesive resin layer and pressurizing and heating to stack-integrate (g) at least a via hole of the board A step of plating or printing a conductive paste on the copper foil portion exposed inside the through hole and the through hole to be a via hole. 3. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (A) While unwinding the rolled single-sided copper foil-clad laminate or the rolled copper foil, a semi-cured insulating adhesive layer is formed on the surface of the insulating material side of the single-sided copper-clad laminate or the copper foil. Step of providing and winding on a roll (b) Step of punching a through hole to be a via hole from the side of the copper foil surface with a punching machine while intermittently rewinding the wound roll, and winding on another roll (c) While rewinding the wound roll, copper foil is continuously laminated on the surface of the adhesive layer of the substrate on which the through holes that will be via holes are formed, and the adhesive layer is cured, and then rolled onto another roll. Winding step (d2) While rewinding the wound roll intermittently,
Step of forming an etching resist for forming the inner layer wiring pattern and, if necessary, forming an etching resist also on the opposite surface (e2) After cutting to a predetermined size, etching the copper foil exposed from the etching resist Step of removing (f) Step of stacking the substrate on which the wiring is formed in the above step with another substrate through a prepreg or an adhesive resin layer and heating and pressing to laminate and integrate (g) A step of plating or printing a conductive paste on at least the inside of the through hole to be the via hole and the copper foil portion exposed in the through hole to be the via hole of the substrate 4. A method of manufacturing a multilayer printed wiring board, which comprises the following steps. (A) While unwinding the rolled single-sided copper foil-clad laminate or the rolled copper foil, a semi-cured insulating adhesive layer is formed on the surface of the insulating material side of the single-sided copper-clad laminate or the copper foil. Step of providing and winding on a roll (b) Step of punching a through hole to be a via hole from the side of the copper foil surface with a punching machine while intermittently rewinding the wound roll, and winding on another roll (c) While rewinding the wound roll, copper foil is continuously laminated on the surface of the adhesive layer of the substrate on which the through holes that will be via holes are formed, and the adhesive layer is cured, and then rolled onto another roll. Winding step (d3) While rewinding the wound roll, an etching resist for forming an inner layer wiring pattern is formed on the surface of the copper foil having no holes, and on the opposite surface, if necessary. Etching resist Step of forming and winding on another roll (e3) After rewinding the wound roll, after etching away the copper foil exposed from the etching resist,
Step of peeling off the etching resist and winding it on another roll (f3) While rewinding the wound roll, it is laminated with another substrate through a prepreg or an adhesive resin layer and heated under pressure to be laminated and integrated. And then cutting into a predetermined size. (G) At least the inside of the through hole to be the via hole and the copper foil portion exposed in the through hole to be the via hole of the cut substrate are plated or electrically conductive. Of printing a conductive paste 5. After the lamination and integration, a through hole to be a through hole is opened at a desired position, and plating or printing of a conductive paste is performed together with the through hole to be a via hole provided in the previous step. The method for manufacturing a multilayer printed wiring board according to any one of claims 1 to 4, which is characterized in that. 6. A one-sided copper foil-clad laminate or a copper foil having a semi-cured insulating adhesive layer on one surface is 0.1
It has a thickness of 5 mm or less.
A method for manufacturing a multilayer printed wiring board according to any one of 1.