JPH07312405A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce mounting area, and improve mounting efficiency in board mounting, by protruding a part of an inner lead from the bottom surface or the upper surface of a sealing resin part. CONSTITUTION:An inner lead part 1 is electrically connected with a semiconductor chip 3 via a bump 2 formed on the inner lead part 1. An outer lead part 5 protruding from a resin molded part 4 is surface-mounted on a board or the like. By protruding a part of the inner lead from the bottom surface or the upper surface of the sealing resin part of a semiconductor device, the outer leads are provided in the area occupied by the sealing resin part of the semiconductor device, so that the mounting area is reduced and the mounting efficiency in the board mounting of a semiconductor device is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique effectively applied to a semiconductor device.

[0002]

2. Description of the Related Art Generally, conventional semiconductor devices include those in which internal leads and semiconductor chips are connected by wires and those in which bumps are connected, and both of these external leads protrude from the side surface of a sealing resin portion of the semiconductor device. It has a structure.

[0003]

DISCLOSURE OF THE INVENTION The present inventors have found the following problems as a result of examining the above prior art.

With the recent downsizing of system equipment and the like using semiconductor devices, it has become necessary to reduce the size of the substrate on which the semiconductor devices are mounted. Therefore, the size of the semiconductor device has been reduced and the mounting efficiency of the substrate has been increased to reduce the size of the substrate.

This reduction in the size of the semiconductor device is mainly done by reducing the size of the semiconductor chip, and the external lead has not been the target of the reduction.

For this reason, there is currently no countermeasure for reducing the area occupied by the external leads of the semiconductor device on the substrate.

Therefore, since the external leads in the conventional semiconductor device generally have a structure protruding from the side surface of the sealing resin portion of the semiconductor device, only the external leads protruding from the side surface of the sealing resin portion are formed. There is a problem in that the mounting area is taken up and the mounting efficiency in board mounting is poor.

An object of the present invention is to provide a technique capable of improving the mounting efficiency in mounting a semiconductor device on a substrate.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

In a semiconductor device in which a semiconductor chip and an internal lead electrically connected to the semiconductor chip are sealed with a resin, a part of the internal lead is projected from a bottom surface or an upper surface of a sealing resin portion of the semiconductor device.

[0012]

According to the above-mentioned means, the semiconductor device is a semiconductor device in which the semiconductor chip and the internal leads electrically connected to the semiconductor chip are encapsulated with resin, and the internal leads are provided from the bottom surface or the top surface of the encapsulating resin portion of the semiconductor device. By projecting a part of the external leads, the external leads can be accommodated within the area occupied by the sealing resin portion of the semiconductor device, and the mounting area taken up by the protrusion of the conventional external leads can be reduced. It is possible to improve the mounting efficiency in mounting.

The structure of the present invention will be described below together with embodiments.

In all the drawings for explaining the embodiments, those having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0015]

1 is a view for explaining the structure of a semiconductor device according to an embodiment of the present invention.

The semiconductor device of this embodiment shown in FIG. 1 is of a rectangular type, and FIG. 2 is a side view seen from the shorter side of the rectangle, FIG. 3 is a side view seen from the longer side, and FIG. 4 is seen from the bottom side. Each top view is shown.

1 to 4, 1 is an internal lead portion, 2 is a bump, 3 is a chip, 4 is a resin sealing portion, and 5 is an external lead portion.

As shown in FIG. 1, the semiconductor device of this embodiment is provided with a step on the lead, and comprises an inner lead portion 1 functioning as an inner lead and an outer lead portion 5 functioning as an outer lead.

The step of the lead can be obtained by half-etching the inner lead portion 1 of the lead or by cutting two leads which are attached in different steps.

In the resin encapsulation portion 4, bumps 2 made of, for example, solder are provided on the internal lead portions 1 and are electrically connected to the semiconductor chip 3 via the bumps 2. The internal lead portion 1 at this time
As a means for electrically connecting the semiconductor chip 3 and the semiconductor chip 3, a bump provided in advance on the semiconductor chip 3 side may be used. Alternatively, a wire or the like may be used.

Then, the resin sealing portion 4 shown in FIGS.
The external lead portion 5 projecting from is mounted on a substrate or the like by imposition.

As a result, the mounting space can be cut down or allocated for mounting other components by the amount of the external leads that have conventionally protruded from the side surface of the resin sealing portion 4.

Next, the lead frame of the semiconductor device of this embodiment will be described with reference to FIG.

In FIG. 5, 3A is a large semiconductor chip, 3B is a small semiconductor chip, 2A is a bump for joining a large semiconductor chip to an internal lead portion, and 2B is a bump for joining a large semiconductor chip to an internal lead portion. Are shown respectively.

As shown in FIG. 5, in the shape of the lead frame of the semiconductor device of this embodiment, the inner leads radiate from the vicinity of the center of the frame.

As a result, the pad positions of the respective semiconductor chips 3A and 3B are set inside regardless of whether the large semiconductor chip 3A, which is a semiconductor chip of a different size indicated by the broken line, or the small semiconductor chip 3B is mounted. Change to a connectable position on the lead 1 and bump 2 at that position
By providing A and 2B, the semiconductor chips 3A and 3B can be connected to the internal lead portion 1. The electrical connection between the internal lead and the semiconductor chip by applying the bump is a useful means that cannot be obtained by wire connection.

That is, various semiconductor chips can be applied with one lead frame of this embodiment.

Next, another embodiment of the present invention is shown in FIGS.

The example of the semiconductor device shown in FIG. 6 is the same as that shown in FIG.
The semiconductor device shown in FIG. 1 eliminates the step between the inner lead portion 1 and the outer lead portion, and is provided with a lead that shares the inner lead and the outer lead. That is, according to the present embodiment, approximately 2/3 of the plate thickness of the lead is embedded by the resin, and the embedded one main surface (upper surface) of the lead forms an electrical connection portion with the semiconductor chip, while the lead is formed. Approximately one-third of the board thickness is exposed from the resin, and the exposed other main surface becomes a connection terminal to the mounting board, that is, an external lead.

As a result, the area of the contact portion between the substrate and the external lead during mounting can be secured, and a thin package can be obtained. There is no need to make a step on the lead frame.

An example of the semiconductor device shown in FIG. 7 is the same as that shown in FIG.
The heat radiation fins 6 are provided on the semiconductor chip 3 of the semiconductor device shown in FIG. 2 to release the heat generated from the semiconductor chip.

In this embodiment, the rectangular semiconductor devices are mentioned, but the same applies to the square semiconductor devices.

Further, the COL (CHIP ON) of this embodiment is
For the semiconductor device having the LEAD structure, an example in which the external lead is projected from the bottom surface is given.
In a semiconductor device having a NCHIP) structure or the like, external leads are projected from the upper surface.

Therefore, in a semiconductor device in which a semiconductor chip and internal leads electrically connected to the semiconductor chip are sealed with resin, the bottom surface of the sealing resin portion of the semiconductor device or
By projecting a part of the internal leads from the upper surface, the external leads can be contained within the area occupied by the sealing resin portion of the semiconductor device, and the mounting area that has been taken up by the protrusion of the conventional external leads can be reduced. It is possible to improve the mounting efficiency in mounting the device on the substrate.

The inventions made by the present inventors are as follows.
Although the specific description has been given based on the above-described embodiments, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0036]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

A semiconductor device in which a semiconductor chip and an internal lead electrically connected to the semiconductor chip are sealed with a resin, and a part of the internal lead is projected from a bottom surface or an upper surface of a sealing resin portion of the semiconductor device. This allows the external leads to fit within the area occupied by the encapsulation resin portion of the semiconductor device, and reduces the mounting area that was left over by the protrusion of the conventional external leads, thus improving the mounting efficiency of the semiconductor device on a substrate. Is possible.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a structure of a semiconductor device that is an embodiment of the present invention.

FIG. 2 is a side view of the semiconductor device of this embodiment.

FIG. 3 is a side view of the semiconductor device of this embodiment.

FIG. 4 is a plan view of the semiconductor device according to the present embodiment as seen from the bottom surface.

FIG. 5 is a diagram for explaining the structure of a lead frame in the semiconductor device of this embodiment.

FIG. 6 is a diagram for explaining the structure of a semiconductor device according to another embodiment of the present invention.

FIG. 7 is a diagram for explaining the structure of a semiconductor device that is another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Internal lead part, 2 ... Bump, 3 ... Chip, 4 ... Resin sealing part, 5 ... External lead part, 6 ... Heat dissipation fin.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 23/28 Z 8617-4M (72) Inventor Akio Sumiya 5-20-1 Kamimizumotocho, Kodaira-shi, Tokyo Hitachi, Ltd. Semiconductor Division

Claims (3)

[Claims] 1. A semiconductor device in which a semiconductor chip and an internal lead electrically connected to the semiconductor chip are sealed with a resin, and a part of the internal lead is projected from a bottom surface or an upper surface of a sealing resin portion of the semiconductor device. A semiconductor device characterized by the above. 2. The semiconductor device according to claim 1, wherein the semiconductor chip and the internal lead are electrically connected via a bump. 3. A semiconductor device in which a semiconductor chip and a plurality of leads electrically connected to the semiconductor chip are encapsulated with a resin, wherein a principal surface portion of the resin encapsulant has a plate thickness of each lead. Part is embedded with resin, the main surface of the embedded lead forms an electrical connection with the semiconductor chip, the other part of the lead is exposed from the resin, and the exposed other main surface forms an external lead. A semiconductor device characterized by the above.