JPH0728158B2 - Electronic component mounting device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to an electronic component mounting apparatus including an automatic replacement mechanism of nozzles of a transfer head.

(Prior Art) An electronic component mounting apparatus for automatically mounting electronic components on a substrate picks up electronic components (hereinafter referred to as “chips”) of a parts unit by vacuum suction with a nozzle of a transfer head moving up and down. After that, the transfer head moves above the substrate, and the nozzle again moves up and down there to mount the chip on the substrate.

Since there are various types of chips and their sizes and shapes are also various, this type of electronic component mounting apparatus is designed to replace nozzles according to the types of chips. Japanese Patent Laid-Open No. 59-6999 discloses a tool exchange device for an electronic component device.
The one described in Japanese Patent No. 2 is known. This relates to a tool replacement device for applying an adhesive to a predetermined portion of a printed circuit board, and it is conceivable to use this replacement device as a replacement device for an electronic component suction nozzle.

(Problems to be Solved by the Invention) However, in the conventional device described above, as shown in FIG. 2 (reference numeral is incorporated by reference), the sleeve 11, the sliding pin 12, and the spring 13 are provided inside the holder 10. , 14, steel balls 15, flanges 23, and many other parts must be assembled, and the deep recesses 16 and the shallow recesses 17 must be bored, resulting in a very complicated structure.

Therefore, an object of the present invention is to provide an electronic component mounting device that allows easy nozzle replacement.

(Means for Solving the Problems) To this end, the present invention comprises a transfer head that includes a nozzle shaft and a nozzle that is detachably attached to the lower end of the nozzle shaft. An engaged portion is formed on the outer wall surface of the nozzle, and a holding portion is provided on the nozzle shaft side for elastically contacting the engaged portion from the outside by the spring force of a spring material to detachably hold the nozzle. . In addition, a nozzle housing portion provided on a side portion of the substrate carrying means is provided for a nozzle holder in which the nozzle lands and is housed, an engaging member which engages with the landed nozzle, and an engaging member which disengages from the nozzle. And a driving means for moving the engaging member forward and backward with respect to the nozzle.

(Operation) In the above configuration, when the nozzles held by the transfer head are collected in the nozzle holder, the transfer head is moved above the nozzle holder, and then the transfer head is lowered to land the nozzle on the nozzle holder. At the same time, after driving the driving means to engage the engaging member with the nozzle and then raising the transfer head, the nozzle is disengaged from the transfer head and collected in the nozzle holder.

Also, when mounting the nozzle provided in the nozzle hilder on the transfer head, move the transfer head above this nozzle and lower the transfer head there, so that the gripping part engages with the outer wall surface of the nozzle. When the transfer head is lifted after elastically contacting the portion and holding the nozzle and driving the driving means to remove the engaging member from the nozzle, the nozzle is lifted together with the transfer head.

Therefore, the nozzles that are no longer needed are collected in the nozzle holder and new nozzles are mounted on the transfer head for normal vertical movement of the transfer head, that is, the transfer head picks up the chip of the parts unit or This can be automatically performed by the same vertical movement as when mounting the chip on the substrate.

(Example) Next, the Example of this invention is described, referring drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus. Carrier 3
The substrate 5 is positioned between a and 3b. The transfer means 3a, 3b transfer the substrate 5 in the direction of arrow D. A part unit 4 provided with a chip is provided on one side of the transfer means 3a, 3b, and a nozzle housing 2 for housing a nozzle 6 is provided on the other side. The transfer head moves horizontally in the direction of arrow A to pick up the chips of the parts unit 4 by vacuum suction onto the nozzles 6, and then the substrate 5
, And moves up and down in the direction of arrow B to mount the chip on the substrate 5.

2A and 2B show a holding structure for the nozzle 6. In FIG. 2, the nozzle 6 is detachably attached to the lower end of the nozzle shaft 12 of the transfer head 1. The nozzle 6 has an enlarged portion 6a and a suction portion 6b protruding from the lower end of the enlarged portion 6a. The enlarged portion 6a has a pair of left and right landing portions 19 protruding outward in a brim shape.
A pair of left and right engaged portions 16 are provided on the outer wall surface orthogonal to 19 so as to be recessed. A block 14 is fixed to the lower portion of the nozzle shaft 12 by a bolt 14a, and a leaf spring 18 extending downward is fixed to the block 14 by a bolt 13. As shown in FIG. 2B, there are two leaf springs 18 on the left and right, and a holding portion 18a formed by bending at the lower end of the leaf spring 18 elastically contacts the engaged portion 16 by the spring force of the leaf spring 18. The nozzle 6 is detachably held by being fitted.

FIG. 3 shows a cross section of the nozzle housing portion 2. The nozzle accommodating portion 2 includes a nozzle holder 10 having a box-shaped cross section, a hook-shaped engaging member 8 rotatably attached to a block 22 by a pin 23, and pins 20 and 21 that are engaged with each other. The spring member 7 for urging the member 8 in the clockwise direction is provided. The engaging member 8 is provided along the side surface of the nozzle holder 10,
At its upper end, a claw portion 8a that engages with the landing portion 19 of the nozzle 6 is provided.

A cylinder 9 as a driving means is provided below the engaging member 8, and a rod 9a thereof is in contact with the lower surface of the engaging member 8. Therefore, when the rod 9a is descending, the engaging member 8 is urged in the clockwise direction by the spring force of the spring member 7, the pawl portion 8a engages with the landing portion 19 of the nozzle 6, and the nozzle 6 Fix in holder 10. When the rod 9a rises, the engaging member 8 resists the spring force of the spring member 7
Rotating counterclockwise around 23, the claw portion 8a comes off the landing portion 19 (see the chain line in the figure). The present apparatus has the above-mentioned structure. Next, a method for replacing the nozzle 6 will be described with reference to FIGS. 4 and 5.

When the unnecessary nozzle 6 is collected in the nozzle holder 10, the transfer head 1 moves above the nozzle holder 10 as shown in FIG. At this time, as shown in the figure, the rod 9a projects upward and the engaging member 8 is open outward. Then, the transfer head 1 descends, and the landing portion 19 of the nozzle 6 lands on the upper surface of the nozzle holder 10 (see the chain line in the figure). Next, as shown in (b) of FIG. 4, the rod 9a is pulled downward, the engaging member 8 is rotated clockwise by the spring force of the spring member 7, and the claw portion 8a is engaged with the landing portion 19, The nozzle 6 is fixed to the nozzle holder 10. Next, the transfer head 1 moves up as shown by the chain line in the figure. Then, the holding portion 18 of the leaf spring 18
a is disengaged from the engaged portion 16, and the nozzle shaft 12 is disengaged from the nozzle 6 so that only the nozzle 6 has the landing portion 19 with the claw portion.
It is locked by 8a and collected by the nozzle holder 10.

When the nozzle 6 provided in the nozzle holder 10 is mounted on the transfer head 1 having no nozzle 6, the transfer head 1 moves above the nozzle 6 and then descends as shown in FIG. . Then, the lower end portion of the nozzle shaft 12 is inserted into the nozzle 6, and the holding portion 18a of the leaf spring 18 elastically fits into the engaged portion 16 of the nozzle 6, so that the nozzle 6 holds the holding portion.
It is held by 18a (see the chain line in the figure). Then, the rod 9a projects upward to rotate the engaging member 8 counterclockwise, whereby the claw portion 8a is disengaged from the landing portion 19 and the locked state is released. Next, if the transfer head 1 is raised, the nozzle 6
Moves up integrally with the transfer head 1 and the nozzle replacement is completed (see FIG. 5B). The rod 9a of the cylinder 9 may be projected to release the locked state before the transfer head 1 is lowered.

As described above, according to the apparatus of this embodiment, the nozzle 6 can be easily replaced. In particular, this transfer head 1
Picks up the chip of the parts unit 4,
The pick-up chip is moved up and down in order to be mounted on the substrate 5. This device uses the normal up-and-down operation function of this type of transfer head as it is for nozzle replacement operation. Therefore, the nozzle can be easily replaced.

(Effects of the Invention) As described above, according to the present invention, by the vertical movement of the transfer head, the nozzles held by the transfer head are recovered to the nozzle holder and the nozzles stored in the nozzle holder are transferred. Both can be easily mounted on the mounting head. That is, the normal vertical movement of the transfer head, that is, the vertical movement similar to the vertical movement when the transfer head picks up a chip of a parts unit or mounts the picked-up chip on the substrate, is used as it is. Automatic exchange can be performed easily.

[Brief description of drawings]

1 is a perspective view of the electronic component mounting apparatus, FIG. 2A is a side view of the transfer head, FIG. 2B is a sectional view of the transfer head, and FIG. Sectional view (a) in Fig. 4
And (b) are cross-sectional views of the nozzle being collected, (a) in FIG.
And (b) are cross-sectional views of the nozzle being mounted. 1 ... Transfer head, 2 ... Nozzle housing, 3a ... Conveying means, 3b ... Conveying means, 4 ... Parts unit, 5 ... Substrate, 6 ... Nozzle, 9 ... Cylinder (driving means) ,Ten…
... Nozzle holder, 12 ... Nozzle shaft, 16 ... Engagement part, 18 ... Leaf spring (spring material), 18a ... Holding part, 19 ...
… Landing area

Claims (1)

[Claims] 1. An electronic component provided in a substrate carrying means, a nozzle housing portion provided at a side portion of the carrying means, and a part unit provided at a side portion of the carrying means is vacuum-sucked to a nozzle. And a transfer head for transferring and mounting the transfer head onto the substrate. The transfer head has a nozzle shaft and a nozzle detachably mounted on a lower end portion of the nozzle shaft, and the transfer head is mounted on an outer wall surface of the nozzle. An engaging portion is provided, and a holding portion for elastically contacting the engaged portion from the outside by the spring force of a spring material by the spring force of a spring material to detachably hold the nozzle is provided on the nozzle shaft side. A nozzle holder in which the nozzle lands and is stored, an engagement member that engages with the landed nozzle, and a drive that moves the engagement member forward and backward with respect to the nozzle in order to engage and disengage the nozzle. And means An electronic component mounting apparatus characterized and.