JPH0728001B2 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0728001B2 JPH0728001B2 JP5103829A JP10382993A JPH0728001B2 JP H0728001 B2 JPH0728001 B2 JP H0728001B2 JP 5103829 A JP5103829 A JP 5103829A JP 10382993 A JP10382993 A JP 10382993A JP H0728001 B2 JPH0728001 B2 JP H0728001B2
- Authority
- JP
- Japan
- Prior art keywords
- bed frame
- resin
- pin
- sealing resin
- bulging portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 19
- 239000008188 pellet Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000035939 shock Effects 0.000 description 5
- 230000035882 stress Effects 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 230000009545 invasion Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フラットパッケージの
プラスチック品に使用した場合に好適な半導体装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device suitable for use in a flat package plastic product.
【０００２】[0002]
【従来の技術】この種の従来製品を図１、図２に示す。
図１（ａ）は、製品の全体を示す平面図で、ディアルピ
ンタイプのフラットパケージである。同図（ｂ）は同製
品の断面図、図２（ａ）ベッドフレーム付近の表面の概
略図、同図（ｂ）はベッドフレーム付近の裏面の概略図
である。これら図において１は半導体ペレット２をマウ
ントするベッドフレーム、３はこのベッドフレームを固
定するつりピン、４はベッドフレーム１の近傍に設けら
れるインナリード、５はペレット２およびその付近を封
止する封止樹脂である。また図２（ａ）においてハッチ
ングを施した部分は、銀もしくは金メッキを施した箇所
を示す。2. Description of the Related Art Conventional products of this type are shown in FIGS.
FIG. 1A is a plan view showing the entire product, which is a dual pin type flat package. 2B is a cross-sectional view of the product, FIG. 2A is a schematic view of the surface near the bed frame, and FIG. 2B is a schematic view of the back surface near the bed frame. In these figures, 1 is a bed frame for mounting a semiconductor pellet 2, 3 is a hanging pin for fixing the bed frame, 4 is an inner lead provided near the bed frame 1, and 5 is a seal for sealing the pellet 2 and its vicinity. It is a stop resin. Further, in FIG. 2 (a), the hatched portion indicates a portion plated with silver or gold.
【０００３】上記従来技術の問題点は次の事項である。
（１）フラットパケージ自身耐湿性が悪く、特にヒート
ショック（半田浴槽につける等）後、耐湿性がさらに著
しく悪くなる。（２）ヒートショック後に製品の形が変
化しやすい。The problems of the above prior art are as follows.
(1) The flat package itself has poor moisture resistance, and particularly after a heat shock (such as being placed in a solder bath), the moisture resistance further deteriorates significantly. (2) The shape of the product easily changes after heat shock.
【０００４】これらの不良は次のように考えられる。す
なわちヒートショック時の熱により、パッケージ内の各
材料の界面に熱応力が生じる。これは各材料の熱膨張係
数が違うために起きる。この応力は、樹脂５とペレット
２、樹脂５とリードフレーム４の間でとくに大きい。こ
のように生じた応力に対し、樹脂５の耐弾性が弱い場
合、外形変化が起きる。またこの外形変化と同時に、樹
脂とリードフレームの密着性が悪くなり、これらの間に
隙間が生じる。この隙間から、水分と一緒に不純物等が
侵入し、耐湿性を悪化させる。上記のような応力は、パ
ッケージ内に水分を含んでいた場合、増長する傾向にあ
り、その対策としては、パッケージ内に水分を侵入させ
にくくする方法、および樹脂とリードフレームの密着性
を良くさせる方法が考えられる。These defects are considered as follows. That is, the heat generated at the time of heat shock causes thermal stress at the interface of each material in the package. This occurs because the coefficient of thermal expansion of each material is different. This stress is particularly large between the resin 5 and the pellet 2 and between the resin 5 and the lead frame 4. If the resin 5 has a weak elasticity resistance to the stress thus generated, a change in outer shape occurs. At the same time with this change in outer shape, the adhesion between the resin and the lead frame deteriorates, and a gap is created between them. Impurities and the like enter along with water through the gaps, deteriorating the moisture resistance. The above stress tends to increase when moisture is contained in the package. As a countermeasure, a method of preventing moisture from entering the package and improving adhesion between the resin and the lead frame are provided. A method can be considered.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上記実情に鑑
みてなされたもので、従来技術で問題になっていたプラ
スチック製品の耐湿性向上が図れ、またヒートショック
後の製品の外形変化を押さえることができる半導体装置
を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to improve the moisture resistance of plastic products, which has been a problem in the prior art, and to suppress the change in outer shape of the product after heat shock. The present invention aims to provide a semiconductor device that can be manufactured.
【０００６】[0006]
【課題を解決するための手段と作用】本発明は、半導体
ペレットをマウントするベッドフレームと、このベッド
フレームを固定するつりピンと、前記ベッドフレームの
近傍に設けられるインナリードと、前記半導体ペレット
及びその付近のベッドフレーム、つりピン、インナリー
ドを封止する封止樹脂とを具備し、前記つりピン及びイ
ンナリードには、前記樹脂内で終始する膨出部が設けら
れ、該膨出部にはそれぞれ孔が設けられ、前記つりピン
には、前記膨出部と前記ベッドフレームとの間に蛇行部
が設けられていることを特徴とする半導体装置である。According to the present invention, there is provided a bed frame for mounting a semiconductor pellet, a suspension pin for fixing the bed frame, an inner lead provided in the vicinity of the bed frame, the semiconductor pellet and the same. A bed frame, a hanging pin, and a sealing resin for sealing the inner leads in the vicinity are provided, and the hanging pin and the inner leads are provided with a bulging portion that starts and ends in the resin, and the bulging portion includes The semiconductor device is characterized in that each of them is provided with a hole, and the hanging pin is provided with a meandering portion between the bulging portion and the bed frame.
【０００７】すなわち本発明は、耐湿性の向上に対して
は、パッケージに水分と一緒に不純物が入ると不良の原
因となるため、パケージに水分が入らないようにした。
特に、樹脂とリードフレームの界面から侵入する系に対
し、封止樹脂内で終始する箇所のつりピン、インナリー
ドに膨出部を設け、この膨出部に孔を設け、封止樹脂と
つりピン、インナリードの密着性を高めると共に、つり
ピンを蛇行させ、水分が入らないようにした。また一般
に、ピン状体を介する水分侵入は、ピン状体の封止樹脂
からの出口側で生じやすいので、水分侵入防止の決め手
となる膨出部は、封止樹脂の出口付近に置くようにし
た。That is, according to the present invention, in order to improve the moisture resistance, the inclusion of impurities together with moisture in the package causes a defect, so that moisture is prevented from entering the package.
In particular, for the system that enters from the interface between the resin and the lead frame, a swelling part is provided on the hanging pin and the inner lead at the part that starts and ends in the sealing resin, and a hole is provided in this swelling part and In addition to improving the adhesion of the pins and inner leads, the hanging pins were made to meander to prevent water from entering. In general, moisture intrusion through the pin-shaped body is likely to occur on the outlet side of the pin-shaped body from the sealing resin.Therefore, the bulging part, which is the decisive factor for preventing moisture intrusion, should be placed near the outlet of the sealing resin. did.
【０００８】[0008]
【実施例】以下図面を参照して本発明の実施例を説明す
る。図３は同実施例を示すが、これは前記従来例と対応
させた場合の例であるから、対応箇所には同一符号を付
して説明を省略し、特徴とする箇所の説明を行う。Embodiments of the present invention will be described below with reference to the drawings. FIG. 3 shows the same embodiment, but since this is an example corresponding to the above-mentioned conventional example, the corresponding portions are designated by the same reference numerals and the description thereof will be omitted, and the characteristic portions will be described.
【０００９】図３（ａ）は、表面に半導体ペレットがマ
ウントされるベッドフレーム１付近の表面の概略図、同
図（ｂ）は、ベッドフレーム付近の裏面の概略図であ
る。すなわち本実施例の特徴は、封止樹脂５内で終始す
る箇所のつりピン３、インナリード４にそれぞれ膨出部
３ａ、４ａを設け、この膨出部３ａ、４ａにそれぞれパ
ンチ孔３1 、４1 を設ける。つりピン３には、膨出部３
ａとベッドフレーム１との間に蛇行部３2 を設ける。つ
まり膨出部３ａは、封止樹脂５内の出口付近に設けられ
る。インナリード４の膨出部４ａの配置についても、つ
りピン側と同様である。FIG. 3A is a schematic view of the surface near the bed frame 1 on which the semiconductor pellets are mounted, and FIG. 3B is a schematic view of the back surface near the bed frame. That is, the feature of this embodiment is that the swelling portions 3a and 4a are respectively provided on the hanging pin 3 and the inner lead 4 at the locations that start and end in the sealing resin 5, and the punching holes 3 1 and 3 are provided on the swelling portions 3a and 4a, respectively. 4 1 is provided. The bulge 3 is attached to the fishing pin 3.
A meandering portion 3 2 is provided between a and the bed frame 1. That is, the bulging portion 3 a is provided near the outlet in the sealing resin 5. The arrangement of the bulging portion 4a of the inner lead 4 is similar to that on the fishing pin side.
【００１０】ベッドフレーム１には、図３（ａ）に示す
ごとくパンチ孔１1 を多数設けるか、または図３（ｂ）
に示すごとく、ベッドフレーム１の裏面にわたって多数
の凹部１2 を設ける。また樹脂５は、膨出部３ａ、４ａ
を含みその孔３1 、４1 、蛇行部３2 、ベッドフレーム
１を含みその孔１1 または凹部１2 を覆うように封止を
行った。[0010] The bed frame 1, either providing a large number of punch holes 1 1 as shown in FIG. 3 (a) or FIG. 3, (b)
As shown in FIG. 3 , a large number of recesses 12 are provided over the back surface of the bed frame 1. In addition, the resin 5 has bulges 3a and 4a.
Part hole 3 1 includes, 4 1, meander 3 2 were sealed so as to cover the holes 1 1 or recess 1 2 comprises a bed frame 1.
【００１１】上記本発明の構成は、ベッドフレーム１に
直接つながるつりピン３からの水分などの侵入時間を長
くするため、蛇行部３2 を設けた。またつりピン３、イ
ンナリード４の膨出部３ａ、４ａにパンチ孔３1 、４1
を開け、リードフレーム１と樹脂５間の密着性を上げ、
これらの間に隙間を生じにくくした。ここで、膨出部３
ａ、４ａを設けかつこれらにパンチ孔３1 、４1 を設け
たため、これらの孔の径を大きくできるし、膨出部３
ａ、４ａが存在すること自体で、リードの引っ張り力、
捩れなどの機械的応力に対し、強度が増す利点は大き
い。In the above-described structure of the present invention, the meandering portion 3 2 is provided in order to prolong the intrusion time of moisture or the like from the hanging pin 3 directly connected to the bed frame 1. In addition, the punching holes 3 1 , 4 1
Open to improve the adhesion between the lead frame 1 and the resin 5,
A gap was not easily formed between them. Here, the bulge 3
Since a and 4a are provided and punch holes 3 1 and 4 1 are provided therein, the diameter of these holes can be increased and the bulging portion 3
the presence of a and 4a itself, lead pulling force,
There is a great advantage that the strength is increased against mechanical stress such as twisting.
【００１２】ここで、下記（イ）、（ロ）の構成が奏す
る利点は大きい。 （イ）つりピンおよびインナリードには、封止樹脂内で
終始する、孔の開いた膨出部がある。 （ロ）つりピンには、孔の開いた膨出部が、蛇行部より
封止樹脂の出口側に存在するという位置関係がある。 すなわち上記（イ）の膨出部が封止樹脂内で終始してい
ることは、つりピンは樹脂の出口側で面積が小さいこと
を意味することにより、水分が侵入しにくくなる。また
膨出部が樹脂内で終始していることは、膨出部に設けら
れた孔部分の樹脂が、膨出部と樹脂とのずれを確実に抑
制した上で、膨出部自信にそのストッパ的役割を果たさ
せることにより、これら膨出部、樹脂間の密着性を良く
し、相乗的に水分の侵入を非常に困難にしている。本発
明のこの効果は、インナリードについても言えることで
ある。Here, the advantages of the following configurations (a) and (b) are great. (A) The fishing pin and the inner lead have a bulged portion with a hole that starts and ends in the sealing resin. (B) The fishing pin has a positional relationship in which the bulged portion having a hole is located closer to the outlet side of the sealing resin than the meandering portion. That is, the fact that the bulging portion in (a) above is maintained in the sealing resin means that the fishing pin has a small area on the resin outlet side, which makes it difficult for moisture to enter. Further, the fact that the bulging portion is entirely in the resin means that the resin in the hole portion provided in the bulging portion surely suppresses the deviation between the bulging portion and the resin, and By playing the role of a stopper, the adhesion between the bulging portion and the resin is improved, and synergistically making the intrusion of water extremely difficult. This effect of the present invention is also applicable to inner leads.
【００１３】また本発明の構成の上記（ロ）の特徴は、
「つりピンには、膨出部とベッドフレームとの間に蛇行
部が設けられている」旨の記載からも分かるごとく、孔
の開いた膨出部が、封止樹脂内において、つりピンの蛇
行部よりも封止樹脂の出口側に存在するという位置関係
を有していることである。The feature (b) of the configuration of the present invention is
As can be seen from the statement that "the fishing pin has a meandering portion between the bulging portion and the bed frame", the bulging portion with holes has a bulging portion in the sealing resin. It has a positional relationship such that it exists on the outlet side of the sealing resin rather than the meandering portion.
【００１４】すなわち一般に、本発明のごとき樹脂封止
型半導体装置では、ピン状体を介する水分侵入は、封止
樹脂の出口側で極めて生じやすく、このことから始まる
ので、この部分で食い止めるのがベターである。つまり
水分侵入防止効果は、ピン状体の封止樹脂の出口側の構
成に大きく依存するのである。しかるに本発明によれ
ば、つりピンの封止樹脂からの露出面積を小さくした上
で、上記（イ）の構成でもって、封止樹脂の出口側で、
水分の侵入を食い止めてしまうのである。そして、万一
水分の侵入があったなら、蛇行部で距離をかせぎ、これ
につながるベッドフレームへの水分の侵入を防止すると
いう優れた構成である。That is, in general, in the resin-encapsulated semiconductor device of the present invention, moisture intrusion through the pin-shaped body is very likely to occur on the outlet side of the encapsulating resin, and since it starts from this, it is necessary to stop it at this portion. Better. That is, the effect of preventing moisture intrusion largely depends on the configuration of the pin-shaped body on the outlet side of the sealing resin. However, according to the present invention, after making the exposed area of the fishing pin from the sealing resin small, with the configuration of (a) above, on the outlet side of the sealing resin,
It stops the invasion of water. And, in the case of invasion of water, it is an excellent configuration in which the meandering portion increases the distance to prevent the invasion of water into the bed frame connected thereto.
【００１５】[0015]
【発明の効果】以上説明したごとく本発明によれば、内
部に水分を侵入させにくくし、かつ樹脂とリードフレー
ム間の密着性（これら両者間の相対的動きを妨げる方向
の密着性）を良くしたため、耐湿性の向上、およびヒー
トショック後の外形変形を押さえることが可能となり、
したがって樹脂とリードフレーム間の固着性が増し、装
置自体の機械的強度が増大した半導体装置が提供できる
ものである。As described above, according to the present invention, it is possible to prevent water from penetrating inside and to improve the adhesion between the resin and the lead frame (adhesion in the direction in which the relative movement between them is prevented). Therefore, it is possible to improve moisture resistance and suppress external deformation after heat shock,
Therefore, it is possible to provide a semiconductor device in which the adhesiveness between the resin and the lead frame is increased and the mechanical strength of the device itself is increased.
【図１】図１（ａ）は従来装置の全体的平面図、図１
（ｂ）は従来装置の断面図。1 (a) is an overall plan view of a conventional device, FIG.
(B) is sectional drawing of a conventional apparatus.
【図２】図２（ａ）は従来装置の一部を示す表面図、図
２（ｂ）は従来装置の一部を示す裏面図。FIG. 2A is a front view showing a part of a conventional device, and FIG. 2B is a rear view showing a part of the conventional device.
【図３】図３（ａ）は本発明の一実施例の要部を示す平
面図、図３（ｂ）は本発明の他の実施例の要部を示す裏
面図。FIG. 3 (a) is a plan view showing a main part of an embodiment of the present invention, and FIG. 3 (b) is a rear view showing a main part of another embodiment of the present invention.
１…ベッドフレーム、２…ペレット、３…つりピン、４
…インナリード、３ａ、４ａ…膨出部、１1 、３1 、４
1 …パンチ孔、１2 …凹部、３2 …蛇行部、５…封止樹
脂。1 ... Bed frame, 2 ... Pellet, 3 ... Fishing pin, 4
… Inner leads, 3a, 4a… Bulging parts, 1 1 , 3 1 , 4
1 ... punched holes, 1 2 ... recess, 3 2 ... meander, 5 ... sealing resin.
Claims (1)
ームと、このベッドフレームを固定するつりピンと、前
記ベッドフレームの近傍に設けられるインナリードと、
前記半導体ペレット及びその付近のベッドフレーム、つ
りピン、インナリードを封止する封止樹脂とを具備し、
前記つりピン及びインナリードには、前記樹脂内で終始
する膨出部が設けられ、該膨出部にはそれぞれ孔が設け
られ、前記つりピンには、前記膨出部と前記ベッドフレ
ームとの間に蛇行部が設けられていることを特徴とする
半導体装置。1. A bed frame for mounting a semiconductor pellet, a hanging pin for fixing the bed frame, an inner lead provided in the vicinity of the bed frame,
The semiconductor pellet and a bed frame in the vicinity thereof, a hanging pin, and a sealing resin for sealing the inner leads,
The fishing pin and the inner lead are provided with a bulging part that starts and ends in the resin, and the bulging part is provided with a hole respectively, and the fishing pin has a bulging part and the bed frame. A semiconductor device having a meandering portion provided therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5103829A JPH0728001B2 (en) | 1993-04-30 | 1993-04-30 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5103829A JPH0728001B2 (en) | 1993-04-30 | 1993-04-30 | Semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58230764A Division JPS60123046A (en) | 1983-12-07 | 1983-12-07 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0621308A JPH0621308A (en) | 1994-01-28 |
| JPH0728001B2 true JPH0728001B2 (en) | 1995-03-29 |
Family
ID=14364316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5103829A Expired - Lifetime JPH0728001B2 (en) | 1993-04-30 | 1993-04-30 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728001B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040751B2 (en) | 1997-04-18 | 2006-05-09 | Aspex Eyewear, Inc. | Frame construction for eyewear having removable auxiliary lenses |
| US7063420B2 (en) | 2004-05-14 | 2006-06-20 | Isl Technologies, Llc | Adjustable tensioning system for rimless eyewear |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302209A (en) * | 2008-06-11 | 2009-12-24 | Nec Electronics Corp | Lead frame, semiconductor device, manufacturing method of lead frame, and manufacturing method of semiconductor device |
| KR102071078B1 (en) * | 2012-12-06 | 2020-01-30 | 매그나칩 반도체 유한회사 | Multi chip package |
-
1993
- 1993-04-30 JP JP5103829A patent/JPH0728001B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040751B2 (en) | 1997-04-18 | 2006-05-09 | Aspex Eyewear, Inc. | Frame construction for eyewear having removable auxiliary lenses |
| US7063420B2 (en) | 2004-05-14 | 2006-06-20 | Isl Technologies, Llc | Adjustable tensioning system for rimless eyewear |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621308A (en) | 1994-01-28 |
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