JPH07212077A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To absorb noise and to prevent interference with a second circuit block by providing a conductive path near a second circuit between a first circuit to become a noise generation source and the second circuit to become a noise receiving side, and electrically connecting a plurality of loops of metal wire to the path. CONSTITUTION:A block of a first circuit 17 is formed at the left side of a conductive path 16 as a boundary, an electric circuit element for generating noise is assembled, and noise is emitted externally from the element, the path. A block of a second circuit 18 is formed at a right side to easily cause a circuit error operation upon receiving of the noise and to originally need its shield. Metal wire 19 bonded on the path 16 formed between the circuits 17 and 18 are formed in a circular arc smaller than 1/2 of a wavelength of the noise arriving thereat and a circle having a diameter smaller than the 1/2, thereby absorbing the noise larger than the wavelength.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a structure for shielding unnecessary radiation in the hybrid integrated circuit device by a simple method.

[0002]

2. Description of the Related Art Generally, a structure for shielding unnecessary radiation is
It is described in detail in the revised and revised "Practical Noise Reduction Techniques" (published by Jatec Publishing Co.). As an application example of these technical ideas, for example, although it is not an application example of a hybrid integrated circuit device, there is Japanese Utility Model Laid-Open No. 52-154111, and in an FM tuner of a stereo component, especially a local oscillation circuit is shielded by a shield plate. It is a thing.

FIG. 7 shows an application of this shield plate to a hybrid integrated circuit device. The case (2) fitted with the substrate (1) is made of a metal material, and the case (2) is divided into a plurality of spaces. The shield plate (3) was provided so as to be separated to achieve the shield.

[0004]

When the metal case (2) as described above is applied to the hybrid integrated circuit device, there is a possibility that the cost may be increased unlike the conventional resin mold which is simple and mass-producible. Further, it is necessary to provide the metallic shield plate (3) on the substrate (1) on which the conductive pattern is arranged. In consideration of a short circuit between the shield plate (3) and the conductive pattern, a separate through hole or the like is provided. There was a problem that required measures.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and is provided between a first circuit which is a noise generation source and a second circuit which is a noise receiving side, and this second circuit. This is solved by providing a conductive path in the vicinity of the circuit and electrically connecting a plurality of thin metal wires having an arc for shielding the noise of the first circuit on the conductive path.

Further, a second conductive path and a third conductive path are provided along one side and the other side of the first conductive path which is a source of noise, and the second conductive path and the third conductive path are provided. The problem is solved by electrically connecting a plurality of thin metal wires, which draw a circular arc, to the conductive path.

[0007]

In general, radiation cannot pass through a metallic hole having a size of ½ of the wavelength or smaller than that, and the same can be said for a metallic mesh structure. Therefore, a plurality of metal thin wires with arcs are wire-bonded on a conductive path fixed to the ground voltage (or V _CC voltage), and the mesh diameter drawn by the metal thin wires (the mesh diameter drawn by one metal thin wire or the metal before and after If the mesh diameter of the three thin metal wires including the thin wire drawn as shown in FIG. 2) is set to 1/2 or less of the radiation wavelength in question,
This noise is absorbed through this thin metal wire. This will be referred to as a mesh shield structure hereinafter.

Further, this structure can be applied to a signal line which is a source of noise. In this case, one conductive path having a wire-bondable width is provided on both sides of the signal line, and a thin metal wire having an arc extending from one to the other is wire-bonded. This structure is equivalent to covering the periphery of the signal line with a metallic mesh, and by achieving the above mesh diameter, noise emitted from the signal line can be absorbed.

Further, as shown in FIG. 2, if the front and rear metal thin wires are arranged so as to intersect when viewed from the lateral direction, the position of the metal mesh that can be absorbed can be set high, and the shield effect can be further enhanced. Can be realized.

[0010]

EXAMPLES Examples of the present invention will be described below. 1 to 4 are for explaining the first embodiment, in which a plurality of thin metal wires are wire-bonded between a noise generating circuit and a circuit that receives noise to form a mesh shield. In addition, FIG. 6 shows that a mesh shield is configured by wire-bonding a plurality of thin metal wires around a signal line where noise is generated.

First, referring to FIG. 1, there is a substrate (10) which has been subjected to an insulation treatment, on which a conductive path (11) made of a metal material is provided, and on the conductive path (11), a bare or a resin is provided. Molded semiconductor chip (12),
Electrical circuit elements such as the print resistor (13), chip capacitor, chip resistor, chip coil, and transformer are electrically connected to achieve a desired electrical circuit.

Here, the substrate (10) is a ceramic substrate,
A printed circuit board, a glass substrate, and a metallic substrate are conceivable. Here, an Al metallic substrate is adopted in consideration of heat dissipation. Further, in the case of a metallic substrate, an insulating treatment is required, and both surfaces thereof are anodized to form an aluminum oxide layer (14). In addition, an insulating polymer such as an epoxy resin is applied to the upper surface of the substrate (10) in consideration of the adhesiveness of the conductive path (11), and C is applied by hot pressing.
The u foil is applied and the Cu foil is patterned to form the conductive paths (11).

Here, a block of the first circuit (17) is formed on the left side of the conductive path (16) extending obliquely to the right from the GND pad (15), and the second block is formed on the right side. The block of the circuit (18) is formed. Here, the block of the first circuit (17) incorporates an electric circuit element that generates noise (unnecessary radiation), and this noise is emitted to the outside from this circuit element and a conductive path electrically connected to the circuit element. Has been done. Further, the second circuit is assumed to be a circuit block that originally needs a shield, because it may malfunction in a circuit when receiving the noise. First
In the block of the circuit (17), only one semiconductor chip (12) such as Tr is shown, and in the block of the second circuit (18), only the printed resistor (13) is shown. Of course, it goes without saying that in reality, electric circuit elements are mounted on the blocks of both parties in order to achieve the circuit.

Here, the feature of the present invention resides in the structure of the fine metal wire (19) wire-bonded to the conductive path (16). Here, the conductive path (16) is fixed to GND, but it may be V _CC . This metal thin wire (19) draws an arc, if not a circle, when wire-bonded, though it depends on the wire diameter and the length of the thin wire from one end to the other end. Therefore, the arc-shaped metal wire (19) is, as described in the section of the action, 1 / the wavelength of the noise reaching it.
If the arc is smaller than 2 and a circle having a diameter smaller than 1/2, noise larger than this noise wavelength can be absorbed.

FIG. 2 is a horizontal view of the structure of the thin metal wire (19) shown in FIG. 1, and FIGS. 3 and 4 are plan views of the same. In FIG. 3, wire bonding is performed on one side (upper side with respect to the paper surface) and the other side (lower side with respect to the paper surface) of the conductive path (16) at regular intervals. From the position of 2/3 of 19A), the left end of the lower metal thin wire (19B) is bonded, and the left end of the second upper metal thin wire (19C) is bonded to the metal thin wire (19C).
Bonding is performed at a distance of L / 3 from the right end of A), and the bonding position starts from the thin metal wire (19B), a position of 2/3 from the left. The distance between the upper thin metal wire (19A) and the lower thin metal wire (19B) varies depending on the size of the bonding tool, but is preferably as narrow as possible so that the conductive path (16) does not become thick.

In FIG. 4, a thin metal wire (19) is obliquely bonded, and the right end of 19D and the left end of 19E, the right end of 19E and the left end of 19F, ... Have an interval of L / 3. . In FIG. 4, the width of the conductive path can be narrowed because the thin metal wire is inclined. The distance between the thin metal wires varies depending on the size of the tool, but is preferably narrow.

As can be seen from FIG. 2, thin metal wires are bonded at an interval of L / 3, but in order to enhance noise absorption, hold the intersection of the left and right thin metal wires at a high position. I need to go. In addition, since the size of X and Z is larger than the size of Y, which wavelength of noise can be absorbed is determined by the size of X and Z. However, since these sizes can be adjusted depending on the bonding position, it is possible to make the sizes of X, Y and Z substantially equal.

Next, a second embodiment will be described. Figure 5
6 and FIG. 6, which is the case where the signal line (20) is a source of noise, and in this case, this signal line (20)
A conductive path (21) and a conductive path (22) are provided on both sides of the both, and both of these conductive paths (21) and (22) are fixed to GND or V _CC like the conductive path (16) of FIG. Has been done. When viewed from the side as in FIG. 2, the present embodiment seems to intersect with the left and right thin metal wires, but in reality it is shown in FIG.
Do not cross like. Further, the positional relationship as shown in FIG. 2 can be obtained by adjusting the bonding position. Therefore, the noise of the signal line (20) can be absorbed in advance as in the previous embodiment.

When the electronic circuit element is the source, a conductive path is provided around the circuit element, for example, in a circle, and a plurality of fine metal wires are bonded so as to pass through the center of the circle and cover the element. By doing so, the generation of noise can be absorbed in advance. Further, in this embodiment, since the base substrate is a metal, if one surface of the substrate (10) is exposed and fixed to GND or V _CC with a thin metal wire or the like through this portion, the conductive path (16) is formed. , (21) and (22) need not be provided. That is, when exposing the surface of the substrate, the bonding portion of the metal thin wire forming the mesh shield is also exposed, and by bonding the metal thin wire to this exposed portion, the same effect as the above-described two embodiments can be obtained. At the same time, it is possible to eliminate the pad (15) in both embodiments.

[0020]

As is apparent from the above description, the first
By providing a conductive path between the second circuit block and the second circuit block and bonding a plurality of thin metal wires to the conductive path, the wavelength of noise that can be absorbed varies slightly depending on the size of the thin metal wire. Noise from the first circuit block can be absorbed, and interference with the second circuit block can be prevented.

Further, another conductive path is provided so as to surround a circuit element which is a source of noise, for example, a conductive path or a circuit element, and a plurality of thin metal wires surrounding the circuit element are bonded to the different conductive path. Since it is possible to absorb the noise from the source, noise radiation can be prevented. Furthermore, when a metal substrate is used as the substrate, the conductive path, which is the bonding destination of the thin metal wire, can be changed to the metal substrate, and the conductive path and the pad at the tip can be omitted.

[Brief description of drawings]

FIG. 1 is a perspective view of a hybrid integrated circuit device of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a plan view showing an example of FIG.

FIG. 4 is a plan view showing an example of FIG.

FIG. 5 is a perspective view of the hybrid integrated circuit device of the present invention.

FIG. 6 is a plan view of FIG.

FIG. 7 is a cross-sectional view of a conventional hybrid integrated circuit device.

[Explanation of symbols]

 10 Substrate 11 Conductive Path 12 Semiconductor Chip 13 Printing Resistor 14 Oxide Film 15 Ground Pad 16 Conductive Path 17 First Circuit Block 18 Second Circuit Block 19 Metal Fine Wire 20 Conductive Path 21 Where Noise Occurs 21 Conductive Path 22 Conductive Path

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Seiwa Ueno 2-5-5 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd.

Claims (4)

[Claims] 1. A substrate having an insulating property at least on its surface, a conductive path provided on the substrate, and a conductive path on the conductive path,
Alternatively, in the hybrid integrated circuit including a circuit element fixed between the conductive paths, the conductive path and the circuit element forming one element to form a predetermined circuit, the first circuit serving as a noise generation source on one side of the substrate. On the other hand, the other has a second circuit in which interference easily occurs due to the intrusion of noise, and a conductive path is provided between the first circuit and the second circuit, and on this conductive path, A hybrid integrated circuit device characterized in that a plurality of thin metal wires, each of which draws an arc for shielding noise of the first circuit, are electrically connected. 2. A substrate having at least a surface thereof having an insulating property, a conductive path provided on the substrate, and a conductive path on the conductive path,
Alternatively, in a hybrid integrated circuit including a circuit element fixed between conductive paths, the conductive path and the circuit element forming a predetermined circuit, the first conductive path serving as a noise source on the substrate. The second conductive path and the third conductive path are provided along one side and the other side of the first conductive path, and the second conductive path and the second conductive path shield noise from the first conductive path. 2. A hybrid integrated circuit device characterized in that a plurality of thin metal wires that draw an arc extending from the conductive path to the third conductive path are electrically connected. 3. A substrate having at least a surface thereof having an insulating property, a conductive path provided on the substrate, and a conductive path on the conductive path,
Alternatively, in a hybrid integrated circuit including a circuit element fixed between conductive paths, the conductive path and the circuit element forming one element to form a predetermined circuit, the circuit element serving as a noise source is provided on the substrate. ,
A hybrid integrated circuit device characterized in that a conductive path surrounding the circuit element is provided, and a plurality of arc-shaped metal thin wires are electrically connected to cover the circuit element. 4. The substrate is a metallic substrate whose surface is insulated, and a metal substrate having a partially exposed surface is used instead of a conductive path to which the thin metal wire is bonded. 2. The hybrid integrated circuit device according to 2 or 3.