JPH07211721A - Electronic part and its manufacture as well as electronic part mounting table - Google Patents

Abstract

PURPOSE:To provide an electronic part and manufacturing method as well as electronic part mounting table capable of mounting conductive particles on a bump electrodes or electrode terminals without fail. CONSTITUTION:The conductive particles 6 are forcibly inserted into bump electrodes 7 or electrode terminals. Otherwise, the conductive particles are forcibly inserted into a plastic previously set insulating resin layer formed on the bump electrodes 7 or electrode terminals. As for the manufacturing method, the conductive particles dispersed to a transfer substrate 8 are forcibly inserted into electrodes, electrode terminals or plastic previously set insulating resin layer formed on these electrodes. Besides, in order to disperse the conductive particles 6 onto the transfer substrate 8, the transfer substrate 8 is coated with volatile solvent containing the conductive particles 6 to be evaporated later. Furthermore, any electronic parts are composed so as be supported by the parts excluding the bump electrodes 7 or electrode terminals.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode structure of an electronic component, a method of manufacturing the same, and a table on which the electronic component is mounted. For example, electrodes of a liquid crystal driving IC connected to a liquid crystal display panel and the like. Applied to.

[0002]

2. Description of the Related Art Conventionally, connection of electronic parts such as semiconductor parts,
For example, the liquid crystal display panel and the liquid crystal drive IC are generally connected by face-down soldering. The liquid crystal drive IC with solder protrusions formed on the electrode terminals is aligned with the liquid crystal display panel and heated with a hot plate. I was soldering. Therefore, since it is necessary to heat the solder until the temperature exceeds the melting point, there is a problem that the heating deteriorates the liquid crystal display panel. Therefore, the liquid crystal drive panel I
A method of mounting C is desired, and as such a method, there is a document "IMC'90 (International Microelectron
ics Conference) "CHIP-ON-GLASS TECHN
OLOGY USING CONDUCTIVE PARTICLES AND LIGHT-SETTING
As shown in "ADHESIVES", a connection structure using conductive particles is used, and conductive particles are mounted on the electrode terminals of the liquid crystal driving IC. FIG. 17 is a manufacturing process diagram showing a method of mounting conductive particles on the electrode terminals of the conventional liquid crystal driving IC in the order of processes. In the figure,
Reference numeral 1 is a liquid crystal driving IC, 2 is an electrode terminal of the liquid crystal driving IC 1, 3a is an uncured ultraviolet curing resin, 3b is an already cured ultraviolet curing resin, and 4 is a liquid crystal driving IC electrode terminal. Photomask, 5 is an exposure device, 6 is a conductive particle, for example, a resin sphere whose surface is plated with a metal such as gold. Specifically, for example, Micropearl (registered trademark, manufactured by Sekisui Fine Chemical Co., Ltd.) is there. It should be noted that in this figure, for the sake of clarity, the cross-sectional portion is shown without hatching except for a part, and this is the same in other drawings.

Next, a method of mounting the conductive particles 6 on the electrode terminals 2 of the conventional liquid crystal driving IC 1 will be described. First, as shown in FIG. 17A, the ultraviolet curable resin 3a is applied to the surface of the liquid crystal driving IC 1 by spin coating. Next, as shown in FIG. 17B, the liquid crystal driving IC 1 and the photomask 4 are aligned with each other, and the ultraviolet curing resin 3a applied to the liquid crystal driving IC 1 is exposed by the exposure device 5. As a result, as shown in FIG. 17C, the ultraviolet curable resin 3a on the electrode terminals 2 of the liquid crystal drive IC is uncured, and the ultraviolet curable resin 3b other than the electrode terminals 2 shown by hatching is in a cured state. Becomes next,
As shown in FIG. 17 (d), the adhesive force of the uncured ultraviolet curable resin 3 a on the electrode terminal 2 is utilized to drive the liquid crystal drive I.
The conductive particles 6 were mounted only on the C electrode terminal 2.

[0004]

However, in the conventional electronic parts and the method for manufacturing the electronic parts as described above, the conductive particles 6 are mounted by utilizing the adhesive force of the uncured ultraviolet curable resin 3a on the electrode terminals. Therefore, it is difficult to control the surface state of the uncured ultraviolet curable resin 3a, and the conductive particles 6 may be changed due to the change with time of the ultraviolet curable resin 3a or the adhesion of foreign matter.
The fixation of was unstable.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic component in which conductive particles can be reliably mounted on an electrode terminal and a method for manufacturing the same.

[0006]

An electronic component according to a first aspect of the present invention has protruding electrodes or electrode terminals, and conductive particles are pressed into these protruding electrodes or electrode terminals.

An electronic component according to a second aspect of the present invention is the electronic component according to the first aspect, which has at least two projecting electrodes or electrode terminals, and the conductive particles have a press-fitting depth at each of the projecting electrodes or electrode terminals. Are different.

According to a third aspect of the present invention, in the electronic component according to the first or second aspect, the protruding electrode or the electrode terminal and the conductive particles are formed of a material in which at least the surface thereof is likely to be an alloy. It is what

An electronic component according to a fourth aspect of the present invention is the electronic component according to the third aspect, wherein an alloy layer is formed on the contact surface between the protruding electrode or electrode terminal and the conductive particle.

An electronic component according to a fifth aspect of the present invention is the electronic component according to any one of the first to fourth aspects, in which the protruding electrode or electrode terminal is formed on a chip component or an IC wafer.

According to a sixth aspect of the present invention, there is provided an electronic component having a protruding electrode or an electrode terminal, and at least a cured uncured insulating resin layer having plasticity is formed on the protruding electrode or the electrode terminal. is there.

According to a seventh aspect of the present invention, in the electronic component according to the sixth aspect, conductive particles are pressed into an insulating resin layer formed on the protruding electrode or the electrode terminal.

According to an eighth aspect of the present invention, there is provided an electronic component in which the insulating resin layer according to the sixth or seventh aspect is a photosensitive resist,
It is made of silicon resin, acrylic resin, epoxy resin, or polyimide resin.

An electronic component according to a ninth aspect of the present invention is the electronic component according to any of the sixth to eighth aspects, in which the protruding electrode or the electrode terminal is formed on the chip component or the IC wafer.

According to a tenth aspect of the present invention, there is provided a method of manufacturing an electronic component, wherein conductive particles dispersed on a transfer substrate are formed on a protruding electrode, an electrode terminal, or an uncured plastic resin formed on these electrodes. It is press-fitted into the insulating resin layer.

According to an eleventh aspect of the present invention, there is provided a method of manufacturing an electronic component, wherein the pressurization according to the tenth aspect is performed while heating at least one of the protruding electrode or the electrode terminal and the conductive particles.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing an electronic component, wherein the pressurization according to the tenth aspect is performed while applying an ultrasonic wave to at least one of the protruding electrode or the electrode terminal and the conductive particles.

According to a thirteenth aspect of the present invention, there is provided a method of producing an electronic component according to any one of the tenth to twelfth aspects, wherein air is blown around the protruding electrodes or the electrode terminals after the conductive particles are pressed. Excessive conductive particles are removed.

According to a fourteenth aspect of the present invention, there is provided an electronic component manufacturing method according to any one of the tenth to thirteenth aspects, wherein after the conductive particles are press-fitted, the protruding electrode or the electrode terminal is vibrated to generate an excess. The conductive particles are removed.

A method for manufacturing an electronic component according to a fifteenth aspect of the present invention is the method for manufacturing an electronic component according to any one of the tenth to fourteenth aspects, wherein the substrate on which the conductive particles are dispersed has a gap in the press-fitting direction. It is used.

According to a sixteenth aspect of the present invention, there is provided a method of manufacturing an electronic component, which comprises applying a volatile solvent containing conductive particles to a transfer substrate and then evaporating the solvent.

According to a seventeenth aspect of the present invention, there is provided a method of manufacturing an electronic component, wherein a silicon substrate is used as the transfer substrate according to the sixteenth aspect.

According to the eighteenth aspect of the present invention, there is provided a method of manufacturing an electronic component, wherein the transfer substrate according to the sixteenth aspect or the seventeenth aspect uses concave portions formed at predetermined intervals.

An electronic component mounting table according to a nineteenth aspect of the present invention is configured such that an electronic component having a protruding electrode or an electrode terminal is supported by a portion other than the protruding electrode or the electrode terminal.

[0025]

In the invention of claim 1, since the conductive particles are press-fitted into the protruding electrode or the electrode terminal, there is no adhesive layer of the ultraviolet curable resin on the electrode portion as in the conventional example, so that the conductive particles are surely secured. Contact with electrodes improves connection reliability. Further, when the conductive particles are pressed into the electrode, the surfaces of the conductive particles and the electrode are slightly shaved, so that the oxide film and the like are removed, and good contact can be obtained.

According to the second aspect of the present invention, at least two projecting electrodes or electrode terminals are provided, and the press-fitting depth of the conductive particles is different in each projecting electrode or electrode terminal. Even if the heights are different or the heights of the electrodes to be connected are different, the connection can be surely made.

In the third aspect of the present invention, since the protruding electrodes or electrode terminals and the conductive particles are formed of a material in which at least the surfaces thereof are likely to be alloyed, the protruding electrodes or electrodes are pressed when the conductive particles are press-fitted. An alloy layer is easily formed on the contact surface between the terminal and the conductive particles.

According to the fourth aspect of the present invention, since the alloy layer is formed on the contact surface between the projection electrode or the electrode terminal and the conductive particle, the reliability of connection is further improved.

In the fifth aspect of the present invention, since the protruding electrode or the electrode terminal is formed on the chip component or the IC wafer, in the case of the chip component, the conductive particles can be mounted only on the non-defective product. The property is improved.

According to the sixth aspect of the present invention, since the uncured insulating resin layer having plasticity is formed on at least the protruding electrode or the electrode terminal, it is possible to prevent the destruction of the electronic component due to the application of static electricity.

In the seventh aspect of the present invention, the conductive particles are press-fitted into the insulating resin layer formed on the protruding electrode or the electrode terminal. Since press-fitting is performed, it is easy to control the press-fitting amount of the conductive particles and the connection reliability is improved. In addition, since the insulating resin layer that is likely to be plastically deformed by pressure is formed on the protruding electrode or the electrode terminal, the conductive particles are easily press-fitted, and are reliably transferred from the transfer substrate onto the protruding electrode, so that connection reliability and connection reliability are improved. Yield improves. Furthermore, since the insulating resin is in a cured state and does not change with time or has dust attached, the conductive particles can be surely pressed.

In the eighth aspect of the invention, the insulating resin layer is formed of a photosensitive resist, a silicone resin, an acrylic resin,
If it is formed of an epoxy resin or a polyimide resin, an uncured insulating resin layer having plasticity can be obtained.

In the invention of claim 9, since the protruding electrode or the electrode terminal is formed on the chip component or the IC wafer, in the case of the chip component, the conductive particles can be mounted only on the non-defective product, and in the case of the IC wafer, the production is possible. The property is improved.

In the tenth aspect of the invention, the conductive particles dispersed on the transfer substrate are pressed against the protruding electrodes, the electrode terminals, or the uncured insulating resin layer having plasticity formed on these electrodes. By press-fitting, the height of the protruding electrodes or electrode terminals containing conductive particles becomes uniform. Therefore, when connecting this electronic component to another electronic component or the like, the connecting portion of both electronic components can be electrically connected by only applying a slight pressure.

In the eleventh aspect of the present invention, since the pressure is applied while heating at least one of the protruding electrode or the electrode terminal and the conductive particles, the conductive particles can be more surely pressed into the electrode.

In the twelfth aspect of the present invention, since the pressure is applied while applying the ultrasonic wave to at least one of the protruding electrode or the electrode terminal and the conductive particles, the conductive particles can be more surely pressed into the electrode.

In the thirteenth aspect of the present invention, after the conductive particles are press-fitted, air is blown around the protruding electrodes or electrode terminals to remove excess conductive particles, so that a short circuit due to the conductive particles occurs between the protruding electrodes or electrode terminals. Reliability and yield are improved.

In the fourteenth aspect of the present invention, after the conductive particles are press-fitted, the protruding electrodes or electrode terminals are vibrated to remove excess conductive particles, so that a short circuit due to the conductive particles occurs between the protruding electrodes or electrode terminals. Reliability and yield are improved.

According to the fifteenth aspect of the present invention, since the substrate in which the conductive particles are dispersed has a gap in the press-fitting direction, the conductive particles are press-fitted into the electrodes of the same height at different press-fitting amounts. The conductive particles can be press-fitted into the electrodes of different heights with the same press-fitting amount.

In the sixteenth aspect of the present invention, since the volatile solvent containing the conductive particles is applied to the transfer substrate and then the solvent is evaporated, the conductive particles are dispersed and held in the transfer substrate in a loosely fixed state. .

In the seventeenth aspect of the present invention, since the silicon substrate is used as the transfer substrate, it is convenient for the conductive particles to be dispersed and held in a state of being loosely fixed to the transfer substrate.

In the eighteenth aspect of the present invention, since the transfer substrate has the recesses formed at the predetermined intervals, the conductive particles are held in the recesses and dispersed at the predetermined intervals.

In the nineteenth aspect of the present invention, since the electronic component is configured to be supported by the portion other than the protruding electrode or the electrode terminal, for example, the conductive particles mounted on the protruding electrode or the electrode terminal are placed on the electronic component mounting table. It does not come out of contact and improves connection reliability and yield.

[0044]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electronic component, a method of manufacturing the same, and an electronic component placement table of the present invention will be described with reference to the drawings. In the following embodiments, a liquid crystal drive IC will be described as an example of the electronic component, but the electronic component is not limited to this, and a contact type image sensor, a thermal head drive IC, a chip resistor, a chip capacitor, etc. Electronic parts, flexible substrates, TAB (Tape Automat
The present invention can be similarly applied to connection wiring such as ed bonding).

Example 1. FIG. 1 is a diagram showing a manufacturing process of an electronic component according to an embodiment of an electronic component and a method of manufacturing the same according to the first, tenth and eleventh aspects of the invention. In the figure, 7 is a protruding electrode such as Au or Cu formed on an electrode terminal of the liquid crystal driving IC 1, 8 is a transfer substrate on which conductive particles 6 are dispersed, and 9 is a liquid crystal driving IC 1 heated on the transfer substrate 8. It is a head that pressurizes.

First, as shown in FIG. 1A, the transfer substrate 8 on which the conductive particles 6 are dispersed and the liquid crystal driving IC 1 are arranged.
And are heated and pressed by the head 9. At this time, the pressure is concentrated on the contact portion between the conductive particles 6 and the protruding electrode 7, so that the protruding electrode 7 is easily deformed to form a recess. This recess is formed in the shape of the conductive particle 6, and the conductive particle 6 is pressed into the protruding electrode 7. In this case, the contact portion between the conductive particles 6 and the protruding electrode 7 is
Since the surface layer is slightly shaved, the natural oxide film and the like are removed at the same time, so that a poor connection between the two can be prevented and a good ohmic contact can be obtained.
Since the conductive particles 6 are press-fitted into the protruding electrodes 7, the contact area is increased, and the adhesive force between the transfer substrate 8 and the conductive particles 6 is weakened by heating. Is reliably transferred. by this,
As shown in FIG. 1B, the conductive particles 6 are the protruding electrodes 7
The conductive particles 6 are mounted on the protruding electrodes 7 by being pressed into.

In this electrode structure, since there is no adhesive layer such as the ultraviolet curable resin 3 between the protruding electrode 7 and the conductive particles 6, the protruding electrode 7 and the conductive particles 6 are surely brought into contact with each other and an open defect occurs. There is no such thing. In addition, the photolithography process is unnecessary, and the productivity is improved. Further, the material such as the photomask 4 and the manufacturing apparatus such as the exposure apparatus 5 are not required, and the cost can be reduced. Further, in this manufacturing method, since the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9 when the conductive particles 6 are pressed into the protruding electrodes 7, even if the protruding electrodes 7 have variations in height, The protruding electrode 7 and the conductive particles 6 are deformed, and the height of the protruding electrode including the conductive particles 6 becomes uniform. Therefore, when connecting to the liquid crystal display panel, the liquid crystal display IC and the liquid crystal driving I
The electrode terminal of C can be electrically connected. Also,
By pressing the liquid crystal driving IC 1 against the liquid crystal display panel, it is possible to perform a lighting inspection of the liquid crystal display panel. Furthermore, in this manufacturing method, since the conductive particles 6 are press-fitted into the protruding electrodes 7 while heating, the press-fitting is easy.

Further, in the first embodiment, the liquid crystal driving IC 1 is heated and pressed onto the transfer substrate 8 by the head 9, but the transfer substrate 8 is heated and the liquid crystal driving IC 1 is pressed onto the transfer substrate 8 by the head 9. However, it has the same effect.

Example 2. As another embodiment of the invention described in claim 10, in an electronic component having low heat resistance, the conductive particles 6 can be mounted on the protruding electrodes 7 only by applying pressure.

Example 3. Further, an embodiment of the invention described in claims 3 and 4 will be described. Liquid crystal driving IC1
When the liquid crystal driving IC 1 is heated and pressed by the head 9 by forming a metal layer on the surfaces of the protruding electrodes 7 and the conductive particles 6 by a combination that easily forms an alloy layer at a low temperature, the conductive particles 6 and the protruding electrodes 7 are formed. The alloy layer is formed by and, the connection is surely made, and the connection reliability can be further improved. As an example of the combination of the metal layers, Au and S
n, solder to solder, solder to Au, solder to Ag, solder to Cu, etc.

Example 4. An embodiment of the invention described in claim 12 will be described. In Examples 1 to 3, the liquid crystal driving I
C1 was heated and pressed onto the transfer substrate 8, and at this time, the head 9
It is also very effective to apply ultrasonic waves through. Due to the ultrasonic waves, the protruding electrode 7 is deformed even with a slight pressure,
It also has the effect of removing the oxide film on the surface. Alternatively, ultrasonic waves may be applied from the transfer substrate 8 side. Further, needless to say, it is more effective to apply ultrasonic waves from both sides of the head 9 and the transfer substrate 8.

Example 5. FIG. 2 shows an embodiment of the invention described in claim 13. In the figure, 10 is an air nozzle. In the transfer step of the conductive particles 6, the conductive particles 6 may enter between the adjacent protruding electrodes 7 and may be electrically connected to each other. Therefore, after the conductive particles 6 are press-fitted into the protruding electrodes 7, air is blown around the protruding electrodes 7 from the air nozzle 10 to blow off the excess conductive particles existing between the protruding electrodes 7. As a result, the conductive particles 6 between the protruding electrodes 7 are efficiently and surely removed. As a result, a short circuit due to the conductive particles 3 does not occur between the electrode terminals of the liquid crystal driving IC 1, and reliability and yield are improved.

Example 6. Further, as another embodiment of the invention described in claim 13, since most of the conductive particles 6 other than the protruding electrode 7 part are attached by static electricity, the conductive particles 6 between the protruding electrodes 7 can be blown by blowing ionized air. Can be removed more effectively. Further, it is possible to prevent the liquid crystal driving IC 1 from being broken due to the application of static electricity.

Example 7. Furthermore, as one embodiment of the invention described in claim 14, after transferring the conductive particles 6 to the protruding electrode 7, by applying vibration, for example, ultrasonic waves or shock waves to the protruding electrode 7, that is, the liquid crystal driving IC 1, Similar to 5 and 6, the conductive particles 6 other than the protruding electrode 7 can be removed. At this time, for example, ultrasonic waves may be applied as the vibration through the heating / pressurizing head 9, or the liquid crystal driving IC 1 may be vibrated while heating the heating / pressurizing head 9 without purposely cooling it. It may also be tapped with a hammer or the like.

Example 8. Further, FIG. 3 shows an embodiment of the invention described in claim 15. In the figure, 11 is a liquid crystal display panel, 12 is an output wiring pattern formed on the liquid crystal display panel 11, 13 is a flexible substrate that supplies an input signal to the liquid crystal driving IC 1, and a flexible substrate is mounted on the mounting portion of the liquid crystal display panel 11. 13 are arranged. Reference numeral 14 is an input wiring pattern formed on the flexible substrate 13. Reference numeral 15 denotes a protrusion formed on the transfer substrate 8. The height of the protrusion, that is, the step difference in the press-fitting direction is equal to the sum of the thicknesses of the flexible substrate 13 and the input wiring pattern 14 minus the thickness of the output wiring pattern 12. . As shown in FIG. 3A, when the flexible substrate 13 supplies an input signal to the liquid crystal driving IC 1, the input wiring pattern 14 is located higher than the output wiring pattern 12 by the thickness of the flexible substrate 13. Therefore, the output wiring pattern 12 and the electrode terminal 2 of the liquid crystal driving IC 1 are less likely to come into contact with each other, and an open defect may occur. Therefore, as shown in FIG. 3B, conductive particles are mounted on the transfer substrate 8 on which the projection 15 is formed, and the projection electrode for input of the liquid crystal driving IC is formed on the projection 15.
It is arranged on the upper side, and the liquid crystal driving IC 1 is pressed by the head 9,
The conductive particles 6 are pressed into the protruding electrodes 7. And FIG.
As shown in (c), the press-fitting depth of the conductive particles 6 is deepened to the input protruding electrode of the liquid crystal driving IC 1 and the height thereof is calculated from the sum of the thicknesses of the flexible substrate 13 and the input wiring pattern 14 to the output wiring. The pattern 12 is reduced by a value obtained by subtracting the thickness thereof. As a result, the liquid crystal display panel and the electrode terminals of the liquid crystal drive IC are electrically connected to each other by only slightly pressing the liquid crystal drive IC 1, and the open defect does not occur.

Example 9. The bonder connecting the liquid crystal display panel 11 and the liquid crystal driving IC 1 is provided with the transfer mechanism such as the heating and pressing head 9 and the transfer substrate 8 as described in the first to eighth embodiments, so that the conductive particles 6 are press-fitted. Further, since the liquid crystal driving IC 1 and the liquid crystal display panel 11 can be consistently connected by one device, the productivity is further improved.

Example 10. FIG. 4 is a sectional configuration diagram showing an embodiment of the invention described in claim 19. In the figure, 16
Is an IC mounting table on which an electronic component such as a liquid crystal driving IC 1 is mounted, and 17a is a recess formed in the IC mounting table 16. Liquid crystal driving IC 1 on which conductive particles 6 are transferred
When the liquid crystal display panel and the liquid crystal display panel are connected, the conductive particles 6 on the protruding electrode 7 come into contact with the IC mounting table 16,
May come off the protruding electrode 7. Therefore, by providing the recess 17a in the protruding electrode 7 portion of the IC mounting table 16 to support the liquid crystal driving IC 1 by a portion other than the protruding electrode 7, the protruding electrode 7 comes into contact with the IC mounting table 16 and the conductive particles are formed. 6 does not come off, and the connection reliability and the yield are improved.

Example 11. Furthermore, as shown in FIG. 5 as another embodiment of the invention according to claim 19, even if a projection 17b is provided in a part of the IC mounting table 16 so that the projection electrode 7 does not contact, the same is true. Has the effect of.

Example 12 An embodiment of the invention described in claim 5 will be described. In the electronic component as described in Examples 1 to 11, the protruding electrode or the electrode terminal may be formed on a chip component such as an IC chip, a chip resistor, or a chip capacitor, or the IC before the IC chip is cut out.
It may be formed on a wafer. That is, the processing may be performed chip by chip, or all the processes may be performed in a wafer state. Furthermore, there is no problem even if the wafer is divided into ½, ¼, etc. By press-fitting the conductive particles 6 on the wafer, the productivity can be improved. Thus, when the transfer process is performed in the wafer state, it is necessary to dice the wafer into individual IC chips after the transfer process is completed. On the other hand, in the case of a chip component, the conductive particles 6 can be mounted only on a good product.

Example 13. FIG. 6 shows claims 16 and 17.
It is a manufacturing-process figure which shows one Example of the described invention. In the figure, 18 is a volatile solvent containing the conductive particles 6, that is, ethanol. In the manufacturing method, first, as shown in FIG. 6A, the transfer substrate 8 is coated with ethanol 18 in which the conductive particles 6 are dispersed by a spin coating method or a spraying method. Next, this transfer substrate 8 is left at room temperature. Figure 6
As shown in (b), since ethanol 18 evaporates,
The conductive particles 6 are uniformly and loosely fixed to the transfer substrate 8 without an adhesive layer. By appropriately selecting the volatile type for dispersing the conductive particles 6 and the drying conditions, the conductive particles 6 can be loosely fixed on the transfer substrate 8 although the adhesive layer is not formed. The conductive particles 6 will not fall off the transfer substrate 8 due to subsequent handling or the like.
Furthermore, since the conductive particles 6 are not firmly fixed to the transfer substrate 8 with an adhesive, they can be easily peeled off from the transfer substrate 8. Therefore, the conductive particles 6 can be surely and easily pressed into the protruding electrodes 7 of the liquid crystal driving IC 1 by heating and pressing, and the yield can be improved. As the transfer substrate 8, for example, a silicon substrate is used, but the surface roughness of the substrate seems to be related to the ease with which the conductive particles 6 are fixed, and it seems difficult to use a mirror surface.

Example 14 Another embodiment of the invention according to claim 16 will be described. In Example 13, the conductive particles 6
Although ethanol is used as a volatile solvent for dispersing the above, a liquid that does not contain dust or impurities and hardly remains after evaporation, for example, acetone, IPA (isopropyl alcohol), pure water, or the like may be used. Further, although the drying after coating is performed at room temperature, the temperature and the heating method may be selected according to the solvent to be used. For example, when pure water is used, it is heated on a hot plate at about 80 ° C. Is effective. Further, the number of the conductive particles 6 mounted on the transfer substrate 8 can be easily adjusted by the content ratio of the conductive particles 6 dispersed in the solvent 14 and the spin rotation speed, and the transfer reliability of the conductive particles 6 can be improved. You can

Example 15. Still another embodiment of the invention according to claim 16 will be described. The conductive particles 6 remaining on the transfer substrate 8 without being pressed into the protruding electrodes 7 and the like can be easily removed with a solvent such as acetone or ethanol. Therefore, the remaining conductive particles 6 are collected and re-coated on the transfer substrate 8. As a result, the manufacturing cost can be reduced. At this time, it goes without saying that the transfer substrate 8 can also be reused. Further, by forming the transfer substrate 8 into a box shape with its peripheral portion lifted as shown in FIG. 7, the conductive particles 6 washed away with the solvent are accumulated on the transfer substrate 8. In this state, the transfer substrate 8 can be spun together with the conductive particles 6 to be recoated easily and uniformly, further improving the productivity.

Example 16 An embodiment of the invention described in claim 18 will be described. When the transfer substrate 8 having recesses formed at predetermined intervals is used, the conductive particles 6 are held in the recesses and dispersed at predetermined intervals when a solvent containing the conductive particles 6 is applied to the transfer substrate. Therefore, it is possible to disperse the conductive particles 6 on the transfer substrate 8 at desired intervals by controlling the intervals of the recesses.

Example 17 With respect to another embodiment of the invention as set forth in claim 15, a method of connecting a liquid crystal driving IC in which the protruding electrodes 7 are not formed will be described with reference to FIG. In the figure, reference numeral 15 is a protrusion corresponding to the electrode terminal 2 of the liquid crystal driving IC 1, which is formed by an etching method or the like.
As shown in FIG. 8A, the conductive particles 6 are mounted on the surface of the transfer substrate 8 having a step in the press-fitting direction by the protrusion 15.
The conductive particles 6 are mounted by the method of Example 14, for example. Next, as shown in FIG. 8B, the electrode terminals 2 of the liquid crystal driving IC 1 and the projections 15 of the transfer substrate are aligned so as to face each other, and heated and pressed by the head 9. As a result, as shown in FIG. 8C, the electrode terminals 2 of the liquid crystal driving IC 1 are
The conductive particles 6 are pressed into. Further, due to the pressure applied to the liquid crystal driving IC 1, the conductive particles 6 and the surface of the electrode terminal 2 are slightly deformed, the natural oxide film on the surface is also removed, and a reliable connection is obtained.

Example 18. FIG. 9 is a manufacturing process diagram showing an embodiment of the invention described in claim 6. In the figure, 19 is an insulating resin layer, for example, a negative photosensitive resist. Next, the manufacturing method will be described. First, as shown in FIG. 9A, the negative photosensitive resist 19 is applied to the surface of the liquid crystal driving IC 1 by a spin coating method or a printing method. Next, the liquid crystal driving IC 1 is heated at about 90 ° C. to prebak the negative photosensitive resist 19. And FIG.
As shown in (b), the liquid crystal driving IC 1 and the photomask 4 on which the electrode terminal 2 pattern of the liquid crystal driving IC is formed are aligned, and the negative photosensitive resist 19 is exposed by the exposure device 5. . By performing post-exposure development, the negative photosensitive resist 19 selectively remains on the protruding electrodes 7 as shown in FIG.
A 19-layer uncured insulating resin layer having plasticity can be formed thereon. As described above, by applying the photolithography method, the 19 layers of the negative photosensitive resist can be selectively formed on the protruding electrodes 7 of the liquid crystal driving IC 1, so that there is a tendency that the fine pitch and the number of terminals are increased. This has an effect that the pitch of the electrode terminals 2 of the liquid crystal driving IC 1 can be easily accommodated. Further, since the electrode terminals 2 are covered with the negative photosensitive resist 19 layer, it is possible to prevent the liquid crystal driving IC 1 from being damaged by the application of static electricity. Although the case of the negative type photosensitive resist is described,
It goes without saying that the positive type photosensitive resist also has the same effect.

Example 19 Further, as the insulating resin layer 19, any resin may be used as long as it has a characteristic that plastic deformation is easily caused by the applied pressure, and it is not limited to the above-mentioned photosensitive resist and may be, for example, a silicone resin, an acrylic resin, an epoxy resin, a polyimide resin or the like. Good.

Example 20. As a method of forming the insulating resin layer 19 on the electrode terminal 2, for example, in the printing method,
There are screen printing method, pad printing method, transfer printing method and the like. The pad printing method will be briefly described with reference to FIG. In the figure, 20 is a rubber pad having elasticity, and 21 is a recess 21a corresponding to the pattern of the electrode terminals 2 of the liquid crystal driving IC.
Reference numeral 22 denotes a squeegee on which the insulating resin 19 is rubbed against the metal blade 21. First, as shown in FIG. 10A, the insulating resin 19 is applied to the metal blade 21. Next, as shown in FIG. 10B, the insulating resin 19 is filled in the recess 21 a of the metal blade 21 with the squeegee 22. Then, by pressing the rubber pad 20 against the metal blade 21, the insulating resin 19 in the recess 21 a of the metal blade 21 is removed from the rubber pad 2.
Transfer to 0. Next, as shown in FIG. 10C, the rubber pad 20 is pressed against the liquid crystal driving IC 1 to transfer the insulating resin 19 layer onto the protruding electrode 7. Finally, insulating resin 1
9 is cured to form a cured uncured insulating resin 19 layer on the protruding electrodes 7.

The transfer printing method will be briefly described with reference to FIG. In the figure, reference numeral 23 is a resin coated substrate coated with an insulating resin 19. First, as shown in FIG. 11A, the insulating resin 19 is applied on the resin-coated substrate 23 by a screen printing method or the like to have a uniform thickness. Next, as shown in FIG. 11B, the liquid crystal driving IC 1 on which the protruding electrodes 7 are formed is pressed against the resin coating substrate 23 to attach the insulating resin 19 to the protruding electrodes 7 of the liquid crystal driving IC 1.
Then, as shown in FIG. 11 (c), the insulating resin is cured, and the cured insulating resin 1 having plasticity for the protruding electrodes 7 is formed.
Form 9 layers. Such a printing method has excellent mass productivity, and since the 19 layers of the insulating resin can be formed only by the printing machine, the productivity can be improved and the cost can be reduced.

Example 21. Further, regarding another embodiment of the invention described in claim 6, a method of forming the insulating resin 19 layer on the liquid crystal driving IC 1 on which the protruding electrodes 7 are not formed by the transfer printing method will be described with reference to FIG. To do. In the figure, reference numeral 24 is a protrusion of the resin-coated substrate 23 formed corresponding to the electrode terminal 2 of the liquid crystal driving IC 1. First, FIG.
As shown in (a), the resin coated substrate 23 including the protrusion 24.
The insulating resin 19 is applied to the surface of the. Next, FIG.
As shown in (b), the liquid crystal driving IC 1 and the protrusion 24 of the resin coated substrate are opposed to each other, aligned, and pressed.
Then, as shown in FIG. 12C, the insulating resin 19 is attached to the electrode terminals 2 of the liquid crystal driving IC 1, the insulating resin 19 is then cured, and the electrode terminals 2 are plasticized and have already been cured. 19 layers of resin are formed.

As described above, in the screen printing method, the pad printing method and the photolithography method, the protruding electrode 7 may or may not be provided, and it can be applied to all IC chips. Further, the material of the bump electrode 7 is not particularly limited, and a normal material structure such as Au or Cu can be used.
Furthermore, the electrode terminal 2 without the protruding electrode 7 is formed.
Also in this case, a special electrode material is not necessary, and a normal electrode metallization such as Al may be used.

Example 22. FIG. 13 is a sectional view showing another embodiment of the invention according to claim 6. In this example, as shown in FIG. 13, a uncured insulating resin layer 19 having plasticity is formed on the entire surface of the liquid crystal driving IC 1. As a manufacturing method, an insulating resin, for example, a polyimide resin 19 is applied to the wiring pattern surface of the liquid crystal driving IC 1 by a spin coating method, a screen printing method, a pad printing method, a transfer printing method or the like to a film thickness of about several μm. Next, this liquid crystal driving IC
1 is heated to cure the polyimide resin 19 to cure it, and a polyimide resin 19 layer is formed on the entire surface of the liquid crystal driving IC 1. Since the polyimide resin 19 is applied to the entire surface of the liquid crystal driving IC 1 as described above, the liquid crystal driving IC 1 having a fine pitch and multiple terminals can be easily accommodated without being affected by the pitch of the electrode terminals 2 and the number of electrode terminals. Further, since the electrode terminal 2 is covered with the 19 layers of the polyimide resin, it is possible to prevent the liquid crystal driving IC 1 from being broken by the application of static electricity.

Further, the case where the insulating resin is the polyimide resin has been described, but the insulating resin is not limited to this, and any resin having a characteristic that easily plastically deforms due to the applied pressure may be used, such as a silicone resin, an acrylic resin, It may be an epoxy resin or a photosensitive resist. Further, in the case of an electronic component having low heat resistance, if a room temperature curable insulating resin such as a moisture curable silicone resin is applied, it is not necessary to heat the electronic component.

Furthermore, the protruding electrode 7 of the liquid crystal driving IC
It may or may not be present. Furthermore, there are no particular restrictions on the material structure of the electrode terminal 2 and the protruding electrode 7, and for example, the usual A
Metallization of 1, Au, Cu or the like is used.

Example 23. An embodiment of the invention described in claim 9 will be described. In the electronic component as described in Examples 18 to 22, the protruding electrode or the electrode terminal may be formed on the chip component such as the IC chip, the chip resistor or the chip capacitor, or I before cutting out the IC chip.
It may be formed on a C wafer. That is, the processing may be performed chip by chip, or all the processes may be performed in a wafer state. Furthermore, there is no problem even if the wafer is divided into ½, ¼, etc. By forming the 19 layers of the insulating resin on the wafer, the productivity can be further improved. In this way, when 19 layers of insulating resin are formed in a wafer state, it is necessary to dice the wafer into individual IC chips after forming 19 layers of insulating resin. On the other hand, in the case of a chip component, the insulating resin layer 19 can be formed only on a good product.

Example 24. FIG. 14 shows claims 7 and 10.
It is a manufacturing-process figure which shows one Example of the described invention. The present invention claims 6 as described in detail in Examples 18-23.
The present invention relates to an electrode terminal structure in which conductive particles 6 are press-fitted into a uncured insulating resin 19 layer having plasticity formed on the protruding electrode 7 or the electrode terminal 2 according to 1. In the manufacturing method, first, as shown in FIG. 14A, the liquid crystal driving IC 1 in which the insulating resin 19 layer is formed at the tip of the protruding electrode 7 is pressed against the transfer substrate 8 on which the conductive particles 6 are mounted. . Here, the conductive particles 6 are used in Examples 13 to.
According to the method of claim 16 detailed in 16,
It can be easily mounted on the transfer substrate 8. Next, FIG.
As shown in (b), the conductive particles 6 are press-fitted into the insulating resin 19 layer, the conductive particles 6 contact the protruding electrodes 7, and the conductive particles 6 can be fixed to the protruding electrodes 7. By applying pressure even after the conductive particles 6 and the protruding electrodes 7 are in contact with each other,
The protruding electrode 7 is deformed, the intervening insulating resin 19 is eliminated, and the surface oxidation layer of the protruding electrode 7 and the conductive particles 6 is destroyed by the frictional force at that time, and a good contact is obtained. Thus, since the conductive particles 6 are pressed into the already cured insulating resin 19 layer,
At least a part of the spherical surface of the conductive particles 6 is exposed from the insulating resin 19 layer, and the connection between the IC chip and another wiring board is achieved in this part. By pressing the liquid crystal driving IC1 against the liquid crystal display panel,
It is also possible to perform a lighting inspection of the liquid crystal display panel. Moreover, since the conductive particles 6 are fixed only on the protruding electrodes 7,
A short circuit failure does not occur between the adjacent protruding electrodes 7, and the connection reliability is improved. In addition, since the insulating resin 19 layer having plasticity that is likely to be plastically deformed by pressure is formed on the protruding electrode 7, the conductive particles 6 are easily pressed and the transfer substrate 8 is reliably transferred onto the protruding electrode 7. , Connection reliability and yield are improved. Furthermore, insulating resin 1
The reference numeral 9 indicates a pre-cured state, which does not change with time or has dust attached thereto, so that the conductive particles 6 can be reliably press-fitted.
Further, since the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9 when the conductive particles 6 are transferred, the protruding electrodes 7 and the conductive particles 6 are deformed even if the height of the protruding electrodes 7 varies. The height of the protruding electrode including the conductive particles 6 becomes uniform. Therefore, when connecting to the liquid crystal display panel 11, it is possible to electrically connect the liquid crystal display panel and the electrode terminals of the liquid crystal drive IC by only slightly pressing the liquid crystal drive IC 1.

Example 25. FIG. 15 shows another embodiment of the invention described in claims 7 and 15 and is a manufacturing process diagram showing a method of press-fitting the conductive particles 6 into the liquid crystal driving IC 1 whose entire surface is coated with the insulating resin 19. First, as shown in FIG. 15A, the conductive particles 6 are mounted on the surface of the transfer substrate 8 on which the projections 15 are formed so as to correspond to the projection electrodes 7 of the liquid crystal driving IC. The conductive particles 6 can be mounted on the transfer substrate 8 by the method described in claim 16. Next, as shown in FIG. 15B, the protruding electrode 7 of the liquid crystal driving IC
And the protrusion 15 of the transfer substrate are opposed to each other and aligned,
Press with the head 9. As a result, as shown in FIG. 15 (c), the conductive particles 6 are formed on the insulating resin 19 on the protruding electrodes 7.
Press in and fix. According to this method, since the conductive particles 6 are mounted only on the protruding electrodes 7, a short circuit failure does not occur between the protruding electrodes 7, and the connection reliability and the yield are improved.

Example 26. Another embodiment of the invention described in claims 7 and 10 will be described. In the above-mentioned Examples 24 and 25, the case where the protruding electrode 7 is formed on the liquid crystal driving IC 1 has been described, but the conductive particles 6 are formed by the same process in the liquid crystal driving IC 1 on which the protruding electrode 7 is not formed. It goes without saying that it can be installed. When the liquid crystal driving IC does not have the protruding electrode 7, the conductive particles 6 are mounted on the electrode terminal 2 and further pressure is applied, so that the conductive particles 6 and the surface portion of the electrode terminal 2 are slightly deformed. At this time, the intervening resin is removed, and the natural oxide film on the surface is also removed by the frictional force, so that a reliable connection can be obtained.

Example 27. Further, as another embodiment of the invention according to claim 15, FIG.
The area of the protrusion 15 formed on the transfer substrate 8 as shown in FIG. 15 and FIG. 15 is made smaller than the size of the electrode terminal 2 of the liquid crystal driving IC. As a result, the conductive particles 6 are mounted in the central portion of the electrode terminal 2, so that a short circuit failure is unlikely to occur between the adjacent electrode terminals 2 and the connection reliability is improved.

Example 28. Furthermore, as another embodiment of the invention as set forth in claim 10, when the conductive particles 6 are press-fitted into the insulating resin layer 19, as shown in FIG. 16, the conductive particles 6 are applied to the electrode terminals 2 of the liquid crystal driving IC 1. It may be stopped at the stage where they do not contact. In this case, when the liquid crystal driving IC 1 is pressure-connected to the liquid crystal display panel 11, the conductive particles 6 are further pressed into the insulating resin layer 19, so that the electrode terminals of the liquid crystal display panel 11 and the liquid crystal driving IC 1 become conductive particles. It is electrically connected via 6.

Example 29. Further, claims 11 and 1
As another embodiment of the invention described in 2, when the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9, not only pressurization but also heating and pressurization may be performed simultaneously. Furthermore, by applying ultrasonic waves, the insulating resin 19 is deformed even with a slight pressure, and the conductive particles 6 can be reliably pressed. It also has an effect of removing the oxide film on the surfaces of the conductive particles 6 and the electrode terminals 2. Needless to say, ultrasonic waves may be applied from the transfer substrate 8 side, or may be applied from both sides of the head 9 and the transfer substrate 8 to further enhance the effect. Further, similarly to the eighth embodiment of the invention described in claim 15 shown in FIG. 3, by forming the projection 15 on the transfer substrate 8, I
It is possible to deal with the case where the mounting portion of the circuit board to which the C chip is connected has irregularities. Therefore, the connection reliability between the IC chip and the circuit board is improved.

Example 30. Furthermore, as another embodiment of the invention according to claim 9, in the electronic parts as described in the embodiments 24 to 29, the protruding electrodes or the electrode terminals are formed on the chip parts such as IC chips, chip resistors and chip capacitors. May be used, or I before cutting out the IC chip
It may be formed on the C wafer as described in the twelfth and twenty-third embodiments.

[0082]

As described above, according to the first aspect of the present invention, since the conductive particles are press-fitted into the protruding electrode or the electrode terminal, there is no uncured adhesive layer such as an ultraviolet curable resin in the electrode portion. Therefore, the conductive particles surely come into contact with the electrodes, and the connection reliability is improved. Further, when the conductive particles are pressed into the electrode, the surfaces of the conductive particles and the electrode are slightly shaved, so that the oxide film and the like are removed, and good contact can be obtained.

According to the second aspect of the present invention, each projection electrode or electrode terminal has at least two projection electrodes or electrode terminals, and the press-fitting depth of the conductive particles is different in each projection electrode or electrode terminal. Even when the heights of the electrodes are different or the heights of the electrodes to be connected are different, the connection can be surely performed.

According to the third aspect of the present invention, since the protruding electrode or electrode terminal and the conductive particles are each formed of a material in which at least the surface thereof is likely to become an alloy, the protruding electrode or An alloy layer is easily formed on the contact surface between the electrode terminal and the conductive particle.

According to the fourth aspect of the invention, since the alloy layer is formed on the contact surface between the protruding electrode or the electrode terminal and the conductive particle, the reliability of the connection is further improved.

According to the invention of claim 5, since the protruding electrode or the electrode terminal is formed on the chip component or the IC wafer, the conductive particles can be mounted only on the non-defective product in the case of the chip component, and in the case of the IC wafer. Productivity is improved.

According to the sixth aspect of the invention, since the uncured insulating resin layer having plasticity is formed on at least the protruding electrodes or the electrode terminals, it is possible to prevent the destruction of the electronic component due to the application of static electricity.

According to the invention of claim 7, the conductive particles are press-fitted into the insulating resin layer formed on the protruding electrode or the electrode terminal. Since press-fitting is performed, it is easy to control the press-fitting amount of the conductive particles and the connection reliability is improved. In addition, since the insulating resin layer that is likely to be plastically deformed by pressure is formed on the protruding electrode or the electrode terminal, the conductive particles are easily pressed in, and the connection reliability and the yield are improved.
Furthermore, since the insulating resin is in a cured state and does not change with time or has dust attached, the conductive particles can be surely pressed.

According to the invention of claim 8, if the insulating resin layer is formed of a photosensitive resist, a silicone resin, an acrylic resin, an epoxy resin, or a polyimide resin,
An uncured insulating resin layer having plasticity is obtained.

According to the invention of claim 9, since the protruding electrode or the electrode terminal is formed on the chip component or the IC wafer, the conductive particles can be mounted only on the non-defective product in the case of the chip component, and in the case of the IC wafer. Productivity is improved.

According to the tenth aspect of the present invention, the conductive particles dispersed on the transfer substrate are added to the protruding electrodes, the electrode terminals, or the uncured insulating resin layer having plasticity formed on these electrodes. Since they are pressed in by pressure, the height of the protruding electrodes or electrode terminals containing conductive particles becomes uniform. Therefore, when connecting this electronic component to another electronic component or the like, the connecting portion of both electronic components can be electrically connected by only applying a slight pressure.

According to the eleventh aspect of the present invention, since the pressure is applied while heating at least one of the protruding electrode or the electrode terminal and the conductive particles, the conductive particles can be more surely pressed into the electrode.

According to the twelfth aspect of the present invention, since the pressure is applied while applying the ultrasonic wave to at least one of the protruding electrode or the electrode terminal and the conductive particles, the conductive particles can be more surely pressed into the electrode.

According to the thirteenth aspect of the invention, after the conductive particles are press-fitted, air is blown around the protruding electrodes or electrode terminals to remove excess conductive particles, so that a short circuit due to the conductive particles occurs between the protruding electrodes or electrode terminals. Reliability and yield are improved.

According to the fourteenth aspect of the present invention, after the conductive particles are pressed in, vibration is applied to the protruding electrodes or the electrode terminals to remove excess conductive particles, so that a short circuit due to the conductive particles occurs between the protruding electrodes or the electrode terminals. Reliability, and the yield is improved.

According to the fifteenth aspect of the invention, since the substrate in which the conductive particles are dispersed has a gap in the press-fitting direction, the conductive particles are press-fitted into the electrodes of the same height with different press-fitting amounts. , The conductive particles can be press-fitted into the electrodes of different heights with the same press-fitting amount.

According to the sixteenth aspect of the present invention, since the volatile solvent containing conductive particles is applied to the transfer substrate and then the solvent is evaporated, the conductive particles are dispersed and held in a state of being loosely fixed to the transfer substrate. It

According to the seventeenth aspect of the invention, since the silicon substrate is used as the transfer substrate, it is convenient for the conductive particles to be dispersedly held in a state of being loosely fixed to the transfer substrate.

According to the eighteenth aspect of the present invention, since the transfer substrate has the recesses formed at the predetermined intervals, the conductive particles are held in the recesses and dispersed at the predetermined intervals.

According to the nineteenth aspect of the present invention, the electronic component is configured to be supported by a portion other than the protruding electrode or the electrode terminal. Therefore, for example, the conductive particles mounted on the protruding electrode or the electrode terminal are mounted on the electronic component mounting table. Since it does not come off by coming into contact with, the connection reliability and part retention are improved.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram illustrating an electronic component and a manufacturing method thereof according to a first embodiment.

FIG. 2 is a cross-sectional configuration diagram showing a method of manufacturing an electronic component according to a fifth embodiment.

FIG. 3 is a manufacturing process diagram illustrating an electronic component and a method for manufacturing the same according to an eighth embodiment.

FIG. 4 is a sectional configuration diagram showing an electronic component placement table according to a tenth embodiment.

FIG. 5 is a sectional configuration diagram showing an electronic component placement table according to an eleventh embodiment.

FIG. 6 is a manufacturing process diagram illustrating a method of manufacturing an electronic component according to a thirteenth embodiment.

FIG. 7 is a sectional configuration diagram illustrating a method for manufacturing an electronic component according to a fifteenth embodiment.

FIG. 8 is a manufacturing process diagram illustrating a method of manufacturing an electronic component according to a seventeenth embodiment.

FIG. 9 is a manufacturing process diagram showing an electronic component and a method for manufacturing the same according to an eighteenth embodiment.

FIG. 10 is a manufacturing process diagram illustrating a method of manufacturing an electronic component according to a twentieth embodiment.

FIG. 11 is a manufacturing process diagram illustrating a method of manufacturing an electronic component according to a twentieth embodiment.

FIG. 12 is a manufacturing process diagram illustrating a method of manufacturing an electronic component according to a twenty-first embodiment.

FIG. 13 is a sectional configuration diagram showing an electronic component according to a twenty-second embodiment.

FIG. 14 is a manufacturing process diagram illustrating a method of manufacturing an electronic component according to a twenty-fourth embodiment.

FIG. 15 is a manufacturing process diagram illustrating an electronic component and a method for manufacturing the same according to a twenty-fifth embodiment.

FIG. 16 is a sectional configuration diagram showing an electronic component according to a twenty-eighth embodiment.

FIG. 17 is a manufacturing process diagram showing an example of a conventional electronic component and a manufacturing method thereof.

[Explanation of symbols]

 1 Liquid Crystal Driving IC 2 Electrode Terminal 3a Uncured UV Curing Resin 3b Cured UV Curing Resin 4 Photomask 5 Exposure Device 6 Conductive Particles 7 Projection Electrodes 8 Transfer Substrate 9 Head 10 Air Nozzle 11 Liquid Crystal Display Panel 12 Output Wiring Pattern 13 Flexible Board 14 Input Wiring Pattern 15 Projection Formed on Transfer Board 16 IC Mounting Table 17a Recess 17b Convex 18 Volatile Solvent 19 Insulating Resin 20 Rubber Pad 21 Metal Blade 22 Squeegee 23 Resin Coating Substrate 24 Resin Coating Projection formed on the substrate

Front page continuation (72) Inventor Mitsuyuki Takada 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation Material Devices Research Center (72) Inventor Tomio Kawato 8-1-1 Tsukaguchihonmachi, Amagasaki Mitsubishi Electric Corporation Stock Company Materials Device Laboratory

Claims (19)

[Claims] 1. An electronic component comprising a protruding electrode or an electrode terminal, and conductive particles being press-fitted into the protruding electrode or the electrode terminal. 2. The electronic component according to claim 1, further comprising at least two protruding electrodes or electrode terminals, wherein the protruding depths of the conductive particles are different in each of the protruding electrodes or electrode terminals. 3. The electronic component according to claim 1, wherein the protruding electrode or electrode terminal and the conductive particle are each formed of a material in which at least the surface thereof easily forms an alloy. 4. The electronic component according to claim 3, wherein an alloy layer is formed on a contact surface between the projection electrode or the electrode terminal and the conductive particle. 5. The electronic component according to claim 1, wherein the bump electrode or the electrode terminal is formed on a chip component or an IC wafer. 6. An electronic component comprising a protruding electrode or an electrode terminal, and at least a cured uncured insulating resin layer having plasticity is formed on the protruding electrode or the electrode terminal. 7. The electronic component according to claim 6, wherein conductive particles are pressed into an insulating resin layer formed on the protruding electrode or the electrode terminal. 8. The insulating resin layer is formed of a photosensitive resist, a silicone resin, an acrylic resin, an epoxy resin, or a polyimide resin.
Or the electronic component described in 7. 9. The electronic component according to claim 6, wherein the protruding electrode or the electrode terminal is formed on a chip component or an IC wafer. 10. A conductive particle dispersed on a transfer substrate,
A method for manufacturing an electronic component, comprising press-fitting into a protruding electrode, an electrode terminal, or an uncured insulating resin layer having plasticity formed on these electrodes by pressure. 11. The method of manufacturing an electronic component according to claim 10, wherein the pressing is performed while heating at least one of the protruding electrode or the electrode terminal and the conductive particles. 12. The method of manufacturing an electronic component according to claim 10, wherein the pressure is applied while applying ultrasonic waves to at least one of the protruding electrode or the electrode terminal and the conductive particles. 13. The method for manufacturing an electronic component according to claim 10, wherein excess conductive particles are removed by blowing air around the protruding electrodes or the electrode terminals after the conductive particles are pressed in. . 14. The method of manufacturing an electronic component according to claim 10, wherein after the conductive particles are pressed in, the protruding electrodes or the electrode terminals are vibrated to remove excess conductive particles. 15. A substrate having a gap in a press-fitting direction is used as a substrate in which the conductive particles are dispersed.
The method for manufacturing an electronic component according to any one of 0 to 14. 16. A method of manufacturing an electronic component, comprising applying a volatile solvent containing conductive particles to a transfer substrate and then evaporating the solvent. 17. The method of manufacturing an electronic component according to claim 16, wherein a silicon substrate is used as the transfer substrate. 18. The transfer substrate having recesses formed at predetermined intervals is used as the transfer substrate.
A method for manufacturing the described electronic component. 19. An electronic component mounting table, wherein an electronic component having a protruding electrode or an electrode terminal is configured to be supported by a portion other than the protruding electrode or the electrode terminal.