JP3596512B2 - Manufacturing method of electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method of manufacturing an electronic component and an electronic component mounting table, and is applied to, for example, an electrode of a liquid crystal driving IC connected to a liquid crystal display panel.
[0002]
[Prior art]
Conventionally, connection of electronic components such as semiconductor components, for example, connection between a liquid crystal display panel and a liquid crystal driving IC, is generally performed by face-down soldering, and a liquid crystal driving IC having solder projections formed on electrode terminals is used for liquid crystal display. It was positioned on the panel and heated on a hot plate for soldering. For this reason, it is necessary to heat the solder until the temperature exceeds the melting point, and this heating has a problem that the liquid crystal display panel is deteriorated. Therefore, a method of mounting a liquid crystal driving IC on a liquid crystal display panel without using a soldering method is desired. Such a method has been disclosed in the document "IMC'90 (International Microelectronics Conference)". As shown in “CHIP-ON-GLASS TECHNOLOGY USING CONDUCTIVE PARTICLES AND LIGHT-SETTING ADHESIVES”, a connection structure using conductive particles is used. I was FIG. 17 is a manufacturing process diagram showing a method of mounting conductive particles on the electrode terminals of the conventional liquid crystal driving IC in order of process. In the drawing, 1 is a liquid crystal driving IC, 2 is an electrode terminal of the liquid crystal driving IC 1, 3a is an uncured ultraviolet curing resin, 3b is a previously cured ultraviolet curing resin, and 4 is a pattern of two electrode terminals of the liquid crystal driving IC. The formed photomask, 5 is an exposure apparatus, 6 is conductive particles, for example, a metal ball such as gold is plated on the surface of a resin ball. Specifically, for example, Micropearl (registered trademark, Sekisui Fine Chemical Co., Ltd.) Made). In this figure, for the sake of clarity, the cross section is not hatched except for a part thereof, and this is the same in other drawings.
[0003]
Next, a method of mounting the conductive particles 6 on the electrode terminals 2 of the conventional liquid crystal driving IC 1 will be described.
First, as shown in FIG. 17A, an ultraviolet curable resin 3a is applied to the surface of the liquid crystal driving IC 1 by spin coating. Next, as shown in FIG. 17B, the liquid crystal driving IC 1 and the photomask 4 are aligned, and the ultraviolet curing resin 3a applied to the liquid crystal driving IC 1 is exposed by the exposure device 5. As a result, as shown in FIG. 17C, the ultraviolet curable resin 3a on the electrode terminals 2 of the liquid crystal driving IC is not cured, and the ultraviolet curable resin 3b other than the hatched electrode terminals 2 is in a cured state. It becomes. Next, as shown in FIG. 17D, the conductive particles 6 are mounted only on the electrode terminals 2 of the liquid crystal driving IC by utilizing the adhesive force of the uncured ultraviolet curing resin 3a on the electrode terminals 2. I was
[0004]
[Problems to be solved by the invention]
However, in the conventional electronic component and the method of manufacturing the electronic component as described above, since the conductive particles 6 are mounted using the adhesive force of the uncured ultraviolet-curable resin 3a on the electrode terminals, the uncured ultraviolet-curable resin is used. It was difficult to control the surface condition of the conductive particles 3a, and the fixing of the conductive particles 6 was unstable due to the aging of the ultraviolet curable resin 3a and the attachment of foreign substances.
[0005]
The present invention has been made to solve the above-described problem, and has as its object to provide a method for manufacturing an electronic component and an electronic component mounting table capable of reliably mounting conductive particles on an electrode terminal. .
[0006]
[Means for Solving the Problems]
The method for manufacturing an electronic component according to the first aspect of the present invention is a method for manufacturing an electronic component. only including volatility After the above solvent is applied to the transfer substrate, the solvent is evaporated.
[0007]
According to a second aspect of the invention, there is provided a method of manufacturing an electronic component, wherein a silicon substrate is used as the transfer substrate according to the first aspect.
[0008]
According to a third aspect of the present invention, there is provided a method for manufacturing an electronic component, wherein the transfer substrate according to the first or second aspect is provided with concave portions formed at predetermined intervals.
[0009]
According to a fourth aspect of the present invention, there is provided an electronic component mounting table configured to support an electronic component having a protruding electrode or an electrode terminal at a portion other than the protruding electrode or the electrode terminal.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, a method for manufacturing an electronic component and an electronic component mounting table according to the present invention will be described with reference to the drawings. In the following embodiments, a liquid crystal driving IC will be described as an example of an electronic component, but the present invention is not limited to this. For example, a contact image sensor, a thermal head driving IC, a chip resistor, a chip capacitor, and the like can be used. The present invention can be similarly applied to connection wiring such as an electronic component, a flexible substrate, and TAB (Tape Automated Bonding).
[0011]
Embodiment 1 FIG.
FIG. 1 is a diagram showing an electronic component manufacturing process according to an embodiment of an electronic component and a method of manufacturing the electronic component according to the first to fourth aspects of the present invention. In the figure, reference numeral 7 denotes a protruding electrode made of Au, Cu or the like formed on an electrode terminal of the liquid crystal driving IC 1, reference numeral 8 denotes a transfer substrate on which conductive particles 6 are dispersed, and reference numeral 9 denotes heating of the liquid crystal driving IC 1 onto the transfer substrate 8. It is a head that pressurizes.
[0012]
First, as shown in FIG. 1A, a transfer substrate 8 on which conductive particles 6 are dispersedly arranged and a liquid crystal driving IC 1 are heated and pressed by a head 9. At this time, since the pressure is concentrated on the contact portion between the conductive particles 6 and the protruding electrode 7, the protruding electrode 7 is easily deformed, and a concave portion is formed. The recess is formed in the form of the conductive particles 6, and the conductive particles 6 are pressed into the protruding electrodes 7. In this case, the contact portion between the conductive particles 6 and the protruding electrode 7 is shaved, although the surface layer is slightly removed, along with the deformation of the protruding electrode 7, so that the natural oxide film and the like are removed at the same time. Prevention and good ohmic contact can be obtained. When the conductive particles 6 are press-fitted into the protruding electrodes 7, the contact area increases, and the adhesive force between the transfer substrate 8 and the conductive particles 6 is weakened by heating. Is reliably transferred. As a result, as shown in FIG. 1B, the conductive particles 6 are pressed into the protruding electrodes 7, and the conductive particles 6 are mounted on the protruding electrodes 7.
[0013]
In this electrode structure, since there is no adhesive layer such as the ultraviolet curable resin 3 between the protruding electrode 7 and the conductive particles 6, the protruding electrode 7 and the conductive particles 6 are surely in contact with each other, and no open failure occurs. . Further, a photolithography step is not required, and productivity is improved. Further, a material such as the photomask 4 and a manufacturing apparatus such as the exposure apparatus 5 are not required, and the cost can be reduced. Further, in this manufacturing method, the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9 when the conductive particles 6 are press-fitted into the protruding electrodes 7. Therefore, even if the protruding electrodes 7 vary in height, The protruding electrodes 7 and the conductive particles 6 are deformed, and the height of the protruding electrodes including the conductive particles 6 becomes uniform. Therefore, when connecting to the liquid crystal display panel, the liquid crystal display panel and the electrode terminals of the liquid crystal drive IC can be electrically connected only by slightly applying pressure to the liquid crystal drive IC 1. Further, by pressing the liquid crystal driving IC 1 against the liquid crystal display panel, a lighting test of the liquid crystal display panel can be performed. Further, in this manufacturing method, the press-fitting is easy because the press-fitting of the conductive particles 6 into the protruding electrodes 7 is performed while heating.
[0014]
In the first embodiment, the liquid crystal driving IC 1 is heated and pressed on the transfer substrate 8 by the head 9. However, the liquid crystal driving IC 1 is pressed on the transfer substrate 8 by the head 9 by heating the transfer substrate 8. Have the same effect.
[0015]
Embodiment 2 FIG.
As another embodiment related to the first to fourth aspects of the present invention, in an electronic component having low heat resistance, the conductive particles 6 can be mounted on the protruding electrode 7 only by applying pressure.
[0016]
Embodiment 3 FIG.
Further, an embodiment related to the inventions described in claims 1 to 4 will be described. By forming a metal layer on the surface of the projecting electrode 7 and the conductive particles 6 of the liquid crystal driving IC 1 by a combination that easily forms an alloy layer at a low temperature, when the liquid crystal driving IC 1 is heated and pressed by the head 9, the conductive particles 6 An alloy layer is formed by the and the protruding electrode 7, and the connection is reliably performed, so that the connection reliability can be further improved. Examples of combinations of metal layers include Au and Sn, solder and solder, solder and Au, solder and Ag, and solder and Cu.
[0017]
Embodiment 4 FIG.
One embodiment related to the inventions described in claims 1 to 4 will be described. In the first to third embodiments, the liquid crystal driving IC 1 is heated and pressurized on the transfer substrate 8, but applying ultrasonic waves through the head 9 at this time is also very effective. Due to the ultrasonic waves, the protruding electrode 7 is deformed even by a slight pressure, and has an effect of removing an oxide film on the surface. Further, ultrasonic waves may be applied from the transfer substrate 8 side. Further, it is needless to say that applying the ultrasonic wave from both sides of the head 9 and the transfer substrate 8 is more effective.
[0018]
Embodiment 5 FIG.
FIG. 2 shows an embodiment relating to the inventions according to the first to fourth aspects. In the figure, reference numeral 10 denotes an air nozzle. In the step of transferring the conductive particles 6, the conductive particles 6 may enter between the adjacent protruding electrodes 7, and the electrode terminals may be electrically connected to each other. Then, after press-fitting the conductive particles 6 into the protruding electrodes 7, air is blown around the protruding electrodes 7 from the air nozzle 10 to blow off excess conductive particles existing between the protruding electrodes 7. Thus, the conductive particles 6 between the protruding electrodes 7 are efficiently and reliably removed. As a result, no short circuit occurs between the electrode terminals of the liquid crystal driving IC 1 due to the conductive particles 3, and the reliability and the yield are improved.
[0019]
Embodiment 6 FIG.
Further, as another embodiment related to the first to fourth aspects of the present invention, since most of the conductive particles 6 other than the protruding electrode 7 are attached by static electricity, the protruding electrode 7 is sprayed by blowing ionized air. The conductive particles 6 between them can be more effectively removed. Furthermore, the destruction of the liquid crystal driving IC 1 due to the application of static electricity can be prevented.
[0020]
Embodiment 7 FIG.
Furthermore, as one embodiment related to the inventions described in claims 1 to 4, after transferring the conductive particles 6 to the protruding electrode 7, vibration, for example, an ultrasonic wave or a shock wave is applied to the protruding electrode 7, that is, the liquid crystal driving IC1. Thereby, similarly to Embodiments 5 and 6, the conductive particles 6 other than the protruding electrode 7 can be removed. At this time, the vibration may be given, for example, by applying an ultrasonic wave via the heating / pressing head 9, or the liquid crystal driving IC 1 may be vibrated while heating the liquid crystal driving IC 1 without cooling the heating of the heating / pressing head 9. Moreover, you may hit it lightly with a hammer or the like.
[0021]
Embodiment 8 FIG.
FIG. 3 shows an embodiment relating to the inventions of claims 1 to 4. In the figure, 11 is a liquid crystal display panel, 12 is an output wiring pattern formed on the liquid crystal display panel 11, 13 is a flexible substrate for supplying an input signal to the liquid crystal driving IC 1, and a flexible substrate is mounted on the mounting portion of the liquid crystal display panel 11. 13 are arranged. Reference numeral 14 denotes an input wiring pattern formed on the flexible substrate 13. Reference numeral 15 denotes a protrusion formed on the transfer substrate 8, and the height of the protrusion, that is, the step in the press-fitting direction is equal to a value obtained by subtracting the thickness of the output wiring pattern 12 from the sum of the thicknesses of the flexible substrate 13 and the input wiring pattern 14. .
As shown in FIG. 3A, when an input signal is supplied to the liquid crystal driving IC 1 by the flexible substrate 13, the input wiring pattern 14 is located higher than the output wiring pattern 12 by the thickness of the flexible substrate 13. Therefore, the output wiring pattern 12 and the electrode terminal 2 of the liquid crystal driving IC 1 are hardly in contact with each other, and an open failure may occur. Therefore, as shown in FIG. 3B, conductive particles are mounted on the transfer substrate 8 on which the projections 15 are formed, and the input projection electrodes of the liquid crystal driving IC are arranged on the projections 15 to form the head 9. Then, the liquid crystal driving IC 1 is pressurized, and the conductive particles 6 are pressed into the protruding electrodes 7. Then, as shown in FIG. 3 (c), the depth of press-fitting of the conductive particles 6 into the input projection electrode of the liquid crystal driving IC 1 is increased so that the height of the flexible substrate 13 and the input wiring pattern 14 is reduced. It is lowered by a value obtained by subtracting the thickness of the output wiring pattern 12 from the sum. As a result, the liquid crystal display panel and the electrode terminals of the liquid crystal driving IC are electrically connected only by slightly applying pressure to the liquid crystal driving IC 1, and no open failure occurs.
[0022]
Embodiment 9 FIG.
By providing the transfer mechanism such as the heating / pressing head 9 and the transfer substrate 8 as described in the first to eighth embodiments in the bonder for connecting the liquid crystal display panel 11 and the liquid crystal driving IC 1, the press-fitting of the conductive particles 6 is performed. In addition, since the connection between the liquid crystal driving IC 1 and the liquid crystal display panel 11 can be consistently performed by one device, the productivity is further improved.
[0023]
Embodiment 10 FIG.
FIG. 4 is a sectional view showing an embodiment of the present invention. In the figure, reference numeral 16 denotes an IC mounting table on which electronic components such as the liquid crystal driving IC 1 are mounted, and reference numeral 17a denotes a concave portion formed in the IC mounting table 16.
When connecting the liquid crystal driving IC 1 onto which the conductive particles 6 are transferred and the liquid crystal display panel, the conductive particles 6 on the protruding electrodes 7 may come into contact with the IC mounting table 16 and the conductive particles 6 may come off from the protruding electrodes 7. is there. Therefore, by providing a concave portion 17a in the protruding electrode 7 portion of the IC mounting table 16 and supporting the liquid crystal driving IC 1 at a portion other than the protruding electrode 7, the protruding electrode 7 comes into contact with the IC mounting table 16 and becomes conductive particles. 6, connection reliability and yield are improved.
[0024]
Embodiment 11 FIG.
Further, as shown in FIG. 5 as another embodiment of the invention according to claim 4, even if a projection 17b is provided on a part of the IC mounting table 16 so that the projection electrode 7 does not contact, There is a similar effect.
[0025]
Embodiment 12 FIG.
One embodiment related to the inventions described in claims 1 to 4 will be described. In the electronic components described in the first to eleventh embodiments, the protruding electrodes or electrode terminals may be formed on a chip component such as an IC chip, a chip resistor or a chip capacitor, or may be formed on an IC chip before cutting out the IC chip. It may be formed on a wafer. That is, processing may be performed one chip at a time, or all steps may be performed in a wafer state. Furthermore, there is no problem even if the wafer is divided into ２ ，, な ど, and the like. By performing the press-fitting of the conductive particles 6 on the wafer, the productivity can be improved. As described above, when the transfer processing is performed in a wafer state, it is necessary to dice the wafer into individual IC chips after the transfer step. On the other hand, in the case of chip components, the conductive particles 6 can be mounted only on non-defective products.
[0026]
Embodiment 13 FIG.
FIG. 6 is a manufacturing process diagram showing one embodiment of the first and second aspects of the present invention. In the figure, reference numeral 18 denotes a volatile solvent containing the conductive particles 6, that is, ethanol. In the manufacturing method, first, as shown in FIG. 6A, ethanol 18 in which the conductive particles 6 are dispersed is applied to the transfer substrate 8 by a spin coating method, a spraying method, or the like. Next, the transfer substrate 8 is left at room temperature. As shown in FIG. 6B, since the ethanol 18 evaporates, the conductive particles 6 are uniformly and loosely fixed to the transfer substrate 8 without an adhesive layer.
Incidentally, the volatile property of dispersing the conductive particles 6 Solvent By properly selecting the type and drying conditions, the conductive particles 6 can be loosely fixed on the transfer substrate 8 although no adhesive layer is formed. It does not fall off the substrate 8. Further, since the conductive particles 6 are not firmly fixed to the transfer substrate 8 by an adhesive, the conductive particles 6 are easily peeled off from the transfer substrate 8. Therefore, the conductive particles 6 can be reliably and easily pressed into the protruding electrodes 7 of the liquid crystal driving IC 1 by heating and pressing, and the yield can be improved.
Note that, for example, a silicon substrate is used as the transfer substrate 8, but it is difficult to fix the conductive particles 6 on a mirror surface because the surface roughness of the substrate seems to be related to the ease with which the conductive particles 6 are fixed.
[0027]
Embodiment 14 FIG.
Another embodiment of the present invention will be described. In the thirteenth embodiment, ethanol is used as a volatile solvent for dispersing the conductive particles 6, but a liquid that does not contain dust and impurities and hardly remains after evaporation, for example, acetone, IPA (isopropyl alcohol), pure Water or the like may be used. In addition, drying after application is performed at room temperature, depending on the solvent to be used, the temperature and heating method may be selected. For example, when using pure water, a method of heating with a hot plate at about 80 ° C. Is valid.
Further, the number of the conductive particles 6 mounted on the transfer substrate 8 can be easily adjusted by the content of the conductive particles 6 dispersed in the solvent 14 and the number of spin rotations, thereby improving the transfer reliability of the conductive particles 6. Can be.
[0028]
Embodiment 15 FIG.
Another embodiment of the present invention will be described. Since the conductive particles 6 remaining on the transfer substrate 8 that have not been pressed into the protruding electrodes 7 and the like can be easily removed with a solvent such as acetone or ethanol, the remaining conductive particles 6 are collected and reapplied to the transfer substrate 8. As a result, manufacturing costs can be reduced. At this time, it goes without saying that the transfer substrate 8 can also be reused.
Further, the transfer substrate 8 is formed in a box shape with its peripheral edge raised as shown in FIG. 7, so that the conductive particles 6 washed away with the solvent accumulate on the transfer substrate 8. By spinning the transfer substrate 8 in this state, the conductive particles 6 can be easily and uniformly re-applied, and the productivity is further improved.
[0029]
Embodiment 16 FIG.
An embodiment of the invention described in claim 3 will be described. If a transfer substrate 8 having concave portions formed at predetermined intervals on the surface is used, the conductive particles 6 are held in the concave portions and dispersed at predetermined intervals when a solvent containing the conductive particles 6 is applied to the transfer substrate. Therefore, by controlling the interval between the concave portions, the conductive particles 6 can be dispersed on the transfer substrate 8 at a desired interval.
[0030]
Embodiment 17 FIG.
Regarding another embodiment related to the first to fourth aspects of the present invention, a method of connecting a liquid crystal driving IC in which the bump electrode 7 is not formed will be described with reference to FIG. In the figure, reference numeral 15 denotes a projection corresponding to the electrode terminal 2 of the liquid crystal driving IC 1, which is formed by an etching method or the like. As shown in FIG. 8A, the conductive particles 6 are mounted on the surface of the transfer substrate 8 having a step in the press-fitting direction by the protrusion 15. The mounting of the conductive particles 6 is performed, for example, according to the method of the fourteenth embodiment. Next, as shown in FIG. 8B, the electrode terminals 2 of the liquid crystal driving IC 1 and the projections 15 of the transfer substrate are positioned so as to face each other, and heated and pressed by the head 9. As a result, as shown in FIG. 8C, the conductive particles 6 are pressed into the electrode terminals 2 of the liquid crystal driving IC 1. In addition, the pressing force pressing the liquid crystal driving IC 1 slightly deforms the conductive particles 6 and the surface of the electrode terminal 2, and also removes the natural oxide film on the surface, thereby obtaining a reliable connection.
[0031]
Embodiment 18 FIG.
FIG. 9 is a manufacturing process diagram showing one embodiment relating to the inventions of claims 1 to 4. In the figure, reference numeral 19 denotes an insulating resin layer, for example, a negative photosensitive resist.
Next, a manufacturing method will be described. First, as shown in FIG. 9A, a negative photosensitive resist 19 is applied to the surface of the liquid crystal driving IC 1 by spin coating or printing. Next, the liquid crystal driving IC 1 is heated at about 90 ° C. to pre-bake the negative photosensitive resist 19. Then, as shown in FIG. 9B, the liquid crystal driving IC 1 and the photomask 4 on which the electrode terminal 2 pattern of the liquid crystal section driving IC is formed are aligned, and the exposure device 5 causes the negative photosensitive resist 19 to be aligned. Is exposed. By performing post-exposure development, as shown in FIG. 9C, the negative photosensitive resist 19 selectively remains on the protruding electrodes 7, and is a cured uncured insulating resin having plasticity on the protruding electrodes 7. Nineteen layers can be formed.
As described above, since the negative photosensitive resist 19 layer can be selectively formed on the bump electrodes 7 of the liquid crystal driving IC 1 by applying the photolithography method, the fine pitch and the number of terminals tend to be increased. This has an effect that the pitch of the electrode terminals of the liquid crystal driving IC 1 can be easily adjusted to two pitches. Further, since the electrode terminals 2 are covered with the negative photosensitive resist 19 layer, it is possible to prevent the liquid crystal driving IC 1 from being destroyed by applying static electricity.
Although the case of a negative photosensitive resist has been described, it goes without saying that a positive photosensitive resist has the same effect.
[0032]
Embodiment 19 FIG.
Further, the insulating resin layer 19 may be a resin having a property that plastic deformation is easily caused by a pressing force, and is not limited to the above-described photosensitive resist, and may be, for example, a silicone resin, an acrylic resin, an epoxy resin, a polyimide resin, or the like. Good.
[0033]
Embodiment 20 FIG.
As a method for forming the insulating resin layer 19 on the electrode terminals 2, for example, a printing method includes a screen printing method, a pad printing method, and a transfer printing method.
The pad printing method will be briefly described with reference to FIG. In the figure, 20 is an elastic rubber pad, 21 is a metal blade having a concave portion 21a formed corresponding to the electrode terminal 2 pattern of the liquid crystal driving IC, and 22 is a squeegee for rubbing the insulating resin 19 against the metal blade 21. is there. First, as shown in FIG. 10A, an insulating resin 19 is applied to a metal blade 21. Next, as shown in FIG. 10B, the insulating resin 19 is packed in the concave portion 21 a of the metal blade 21 by the squeegee 22. Then, the insulating resin 19 in the recess 21 a of the metal blade 21 is transferred to the rubber pad 20 by pressing the rubber pad 20 against the metal blade 21. Next, as shown in FIG. 10C, the rubber pad 20 is pressed against the liquid crystal driving IC 1, and the insulating resin 19 layer is transferred to the bump electrode 7. Finally, the insulating resin 19 is cured to form a plastic cured uncured insulating resin 19 layer on the protruding electrodes 7.
[0034]
The transfer printing method will be briefly described with reference to FIG. In the figure, reference numeral 23 denotes a resin-coated substrate on which an insulating resin 19 is applied. First, as shown in FIG. 11A, an insulating resin 19 is applied to a uniform thickness on a resin application substrate 23 by a screen printing method or the like. Next, as shown in FIG. 11B, the liquid crystal driving IC 1 on which the protruding electrodes 7 are formed is pressed against the resin coating substrate 23, and the insulating resin 19 is attached to the protruding electrodes 7 of the liquid crystal driving IC 1. Then, as shown in FIG. 11 (c), the insulating resin is cured, and a 19 cured plastic resin layer is formed on the bump electrodes 7.
Such a printing method is excellent in mass productivity, and since the insulating resin 19 layer can be formed only by a printing machine, improvement in productivity and reduction in cost can be realized.
[0035]
Embodiment 21 FIG.
Further, regarding another embodiment related to the first to fourth aspects of the present invention, a method for forming a 19-layer insulating resin by transfer printing on the liquid crystal driving IC 1 on which the protruding electrodes 7 are not formed will be described. 12 will be described. In the figure, reference numeral 24 denotes a protrusion of the resin-coated substrate 23 formed corresponding to the electrode terminal 2 of the liquid crystal driving IC 1. First, as shown in FIG. 12A, an insulating resin 19 is applied to the surface of the resin application substrate 23 including the protrusion 24. Next, as shown in FIG. 12B, the liquid crystal driving IC 1 and the protrusion 24 of the resin-coated substrate are opposed to each other and aligned and pressed. Then, as shown in FIG. 12 (c), an insulating resin 19 is attached to the electrode terminals 2 of the liquid crystal driving IC 1, and then the insulating resin 19 is cured. A resin 19 layer is formed.
[0036]
As described above, in the screen printing method, the pad printing method, and the photolithography method, the protruding electrode 7 may or may not be provided, and can be applied to all IC chips. Further, there is no particular limitation on the material of the protruding electrode 7, and a normal material structure such as Au or Cu can be used. Furthermore, no special electrode material is required for the electrode terminal 2 where the protruding electrode 7 is not formed, and a normal electrode metallization such as Al may be used.
[0037]
Embodiment 22 FIG.
FIG. 13 is a sectional view showing another embodiment related to the inventions of claims 1 to 4. In this example, as shown in FIG. 13, a 19-layer cured and insulative resin having plasticity is formed on the entire surface of the liquid crystal driving IC 1. In the manufacturing method, an insulating resin, for example, a polyimide resin 19 is applied to a wiring pattern surface of the liquid crystal driving IC 1 to a thickness of about several μm by spin coating, screen printing, pad printing, transfer printing, or the like. Next, the liquid crystal driving IC 1 is heated and cured by curing the polyimide resin 19, thereby forming a polyimide resin 19 layer on the entire surface of the liquid crystal driving IC 1.
As described above, since the polyimide resin 19 is applied to the entire surface of the liquid crystal driving IC 1, the liquid crystal driving IC 1 having a fine pitch and a large number of terminals can be easily handled without being affected by the pitch of the electrode terminals 2 or the number of electrode terminals. Further, since the electrode terminals 2 are covered with the polyimide resin 19 layer, it is possible to prevent the destruction of the liquid crystal driving IC 1 by applying static electricity.
[0038]
Also, the case of a polyimide resin has been described as the insulating resin. However, the present invention is not limited to this. Any resin may be used as long as it has a property of easily causing plastic deformation by a pressing force. Silicon resin, acrylic resin, epoxy resin, It may be a photosensitive resist or the like. Further, in the case of an electronic component having low heat resistance, it is not necessary to heat the electronic component if a room-temperature-curable insulating resin, for example, a moisture-curable silicone resin is used.
[0039]
Furthermore, the projection electrode 7 of the liquid crystal driving IC may or may not be provided. Further, the material structures of the electrode terminals 2 and the protruding electrodes 7 are not particularly limited, and for example, a metallization of ordinary Al, Au, Cu or the like is used.
[0040]
Embodiment 23 FIG.
One embodiment related to the inventions described in claims 1 to 4 will be described. In the electronic components as described in Embodiments 18 to 22, the protruding electrodes or electrode terminals may be formed on chip components such as IC chips, chip resistors, chip capacitors, or the like before the IC chips are cut out. It may be formed on a wafer. That is, processing may be performed one chip at a time, or all steps may be performed in a wafer state. Furthermore, there is no problem even if the wafer is divided into ２ ，, な ど, and the like. The productivity can be further improved by forming the insulating resin 19 layer on the wafer. As described above, when the insulating resin 19 layer is formed in a wafer state, the wafer needs to be diced into individual IC chips after the insulating resin 19 layer is formed. On the other hand, in the case of chip components, the insulating resin layer 19 can be formed only on non-defective products.
[0041]
Embodiment 24 FIG.
FIG. 14 is a manufacturing process diagram showing one embodiment relating to the inventions of claims 1 to 4. As described in detail in Examples 18 to 23, the present invention relates to an electrode terminal structure in which conductive particles 6 are press-fitted into a 19-layer plasticized cured insulating resin formed on the protruding electrode 7 or the electrode terminal 2 and a method of manufacturing the same. Things.
In the manufacturing method, first, as shown in FIG. 14A, the liquid crystal driving IC 1 in which the insulating resin 19 layer is formed at the tip of the protruding electrode 7 is pressed against the transfer substrate 8 on which the conductive particles 6 are mounted. . Here, the conductive particles 6 can be easily mounted on the transfer substrate 8 by the method according to claim 16 described in detail in Examples 13 to 16. Next, as shown in FIG. 14B, the conductive particles 6 are pressed into the insulating resin 19 layer, and the conductive particles 6 come into contact with the protruding electrodes 7, and the conductive particles 6 can be fixed to the protruding electrodes 7. Even after the conductive particles 6 and the protruding electrodes 7 come into contact with each other, the protruding electrodes 7 are deformed by applying pressure, the insulating resin 19 interposed therebetween is removed, and the protruding electrodes 7 are formed by frictional force at that time. In addition, the surface oxide layer of the conductive particles 6 is broken, and a good contact is obtained.
As described above, since the conductive particles 6 are pressed into the already cured insulating resin 19 layer, at least a part of the spherical surface of the conductive particles 6 is exposed from the insulating resin 19 layer. The connection between the chip and another wiring board is achieved. By pressing the liquid crystal driving IC 1 against the liquid crystal display panel, a lighting test of the liquid crystal display panel can be performed. In addition, since the conductive particles 6 are fixed only on the protruding electrodes 7, short-circuit failure does not occur between adjacent protruding electrodes 7, and connection reliability is improved. In addition, since the insulating resin layer 19 having plasticity, which is liable to undergo plastic deformation by pressure, is formed on the protruding electrode 7, the conductive particles 6 are easily pressed into the protruding electrode 7, and are reliably transferred from the transfer substrate 8 onto the protruding electrode 7. The connection reliability and the yield are improved. Furthermore, since the insulating resin 19 is in a cured state and there is no change with time or adhesion of dust, the conductive particles 6 can be securely pressed.
Further, when transferring the conductive particles 6, the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9, so that even if the height of the protrusion electrodes 7 varies, the protrusion electrodes 7 and the conductive particles 6 are deformed. In addition, the height of the protruding electrodes including the conductive particles 6 becomes uniform. Therefore, when connecting to the liquid crystal display panel 11, the liquid crystal display panel and the electrode terminals of the liquid crystal drive IC can be electrically connected by only slightly applying pressure to the liquid crystal drive IC1.
[0042]
Embodiment 25 FIG.
FIG. 15 shows another embodiment related to the first to fourth aspects of the present invention, and is a manufacturing process diagram showing a method of press-fitting conductive particles 6 into a liquid crystal driving IC 1 having an insulating resin 19 applied to the entire surface. It is. First, as shown in FIG. 15A, the conductive particles 6 are mounted on the surface of the transfer substrate 8 on which the protrusions 15 are formed so as to correspond to the protrusion electrodes 7 of the liquid crystal driving IC. The conductive particles 6 can be mounted on the transfer substrate 8 by the method described in claim 1. Next, as shown in FIG. 15B, the protruding electrode 7 of the liquid crystal driving IC and the protruding portion 15 of the transfer substrate are positioned so as to face each other, and are pressed by the head 9. Thus, as shown in FIG. 15C, the conductive particles 6 are pressed into the insulating resin 19 on the protruding electrodes 7 and fixed.
According to this method, since the conductive particles 6 are mounted only on the protruding electrodes 7, short-circuit failure does not occur between the protruding electrodes 7, and connection reliability and yield are improved.
[0043]
Embodiment 26 FIG.
Another embodiment related to the first to fourth aspects of the present invention will be described. In the embodiments 24 and 25, the case where the protruding electrode 7 is formed on the liquid crystal driving IC 1 has been described. However, in the liquid crystal driving IC 1 on which the protruding electrode 7 is not formed, the conductive particles 6 are formed by the same process. Needless to say, it can be installed. In the case where the liquid crystal driving IC does not have the protruding electrode 7, the conductive particles 6 are mounted on the electrode terminals 2 and then further pressure is applied to slightly deform the conductive particles 6 and the surface of the electrode terminals 2. At this time, the intervening resin is removed, and the natural oxide film on the surface is also removed by the frictional force, so that reliable connection is obtained.
[0044]
Embodiment 27 FIG.
Further, as another embodiment related to the invention as set forth in claims 1 to 4, a protrusion formed on the transfer substrate 8 as shown in FIGS. 8 and 15 of the seventeenth and twenty-fifth embodiments. The area 15 is formed smaller than the size of the electrode terminals 2 of the liquid crystal driving IC. Thus, since the conductive particles 6 are mounted at the center of the electrode terminal 2, a short-circuit failure does not easily occur between the adjacent electrode terminals 2, and connection reliability is improved.
[0045]
Embodiment 28 FIG.
Further, as another embodiment related to the first to fourth aspects of the present invention, when the conductive particles 6 are pressed into the insulating resin layer 19, as shown in FIG. 2 may be stopped at a stage where the conductive particles 6 do not come into contact. In this case, when the liquid crystal driving IC 1 is press-connected to the liquid crystal display panel 11, the conductive particles 6 are further pressed into the insulating resin layer 19, and the electrode terminals of the liquid crystal display panel 11 and the liquid crystal driving IC 1 are connected to the conductive particles. 6 are electrically connected.
[0046]
Embodiment 29 FIG.
Further, as another embodiment related to the first to fourth aspects of the present invention, when the head 9 presses the liquid crystal driving IC 1 against the transfer substrate 8, not only pressurization but also heating and pressurization are performed simultaneously. Is also good. Furthermore, by applying the ultrasonic wave, the insulating resin 19 is deformed even by a slight pressure, so that the conductive particles 6 can be reliably press-fitted. Further, there is also an effect of removing an oxide film on the surfaces of the conductive particles 6 and the electrode terminals 2. Needless to say, the ultrasonic wave may be applied from the transfer substrate 8 side or from both sides of the head 9 and the transfer substrate 8.
Further, as in the case of the eighth embodiment shown in FIG. 3, by forming the projection 15 on the transfer substrate 8, it is possible to cope with a case where the mounting portion of the circuit board to which the IC chip is connected has irregularities. Therefore, the connection reliability between the IC chip and the circuit board is improved.
[0047]
Embodiment 30 FIG.
Further, as another embodiment related to the invention as set forth in claims 1 to 4, in an electronic component as described in the embodiments 24 to 29, the protruding electrode or the electrode terminal is an IC chip, a chip resistor or a chip capacitor. And the like, or may be formed on an IC wafer before cutting out IC chips, as in the twelfth and twenty-third embodiments.
[0048]
【The invention's effect】
According to the first aspect of the present invention, the conductive particles only including volatility After the solvent is applied to the transfer substrate, the solvent is evaporated, so that the conductive particles are dispersed and held in a state of being loosely fixed to the transfer substrate. In addition, the conductive particles can be reliably and easily pressed into the protruding electrodes of the electronic component, thereby improving the yield. .
[0049]
According to the second aspect of the present invention, since a silicon substrate is used as the transfer substrate, it is convenient that the conductive particles are dispersed and held in a state of being loosely fixed to the transfer substrate.
[0050]
According to the third aspect of the invention, since the transfer substrate having the concave portions formed at the predetermined intervals is used, the conductive particles are held in the concave portions and dispersed at the predetermined intervals.
[0051]
According to the fourth aspect of the invention, since the electronic component is configured to be supported by a portion other than the protruding electrode or the electrode terminal, for example, the conductive particles mounted on the protruding electrode or the electrode terminal come into contact with the electronic component mounting table. The connection reliability and the yield rate are improved.
[Brief description of the drawings]
FIG. 1 is a manufacturing process diagram showing an electronic component and a method for manufacturing the same according to a first embodiment.
FIG. 2 is a cross-sectional configuration diagram illustrating a method for manufacturing an electronic component according to a fifth embodiment.
FIG. 3 is a manufacturing step diagram showing an electronic component and a method for manufacturing the same according to an eighth embodiment.
FIG. 4 is a sectional configuration diagram showing an electronic component mounting table according to a tenth embodiment.
FIG. 5 is a sectional configuration diagram showing an electronic component mounting table according to an eleventh embodiment.
FIG. 6 is a manufacturing step diagram showing a method for manufacturing an electronic component according to a thirteenth embodiment.
FIG. 7 is a sectional view illustrating a method of manufacturing an electronic component according to a fifteenth embodiment.
FIG. 8 is a manufacturing step diagram showing a method for manufacturing an electronic component according to a seventeenth embodiment.
FIG. 9 is a manufacturing step diagram showing an electronic component and a method for manufacturing the same according to an eighteenth embodiment.
FIG. 10 is a manufacturing step diagram showing a method for manufacturing an electronic component according to a twentieth embodiment.
FIG. 11 is a manufacturing process diagram showing a method for manufacturing an electronic component according to a twentieth embodiment.
FIG. 12 is a manufacturing step diagram showing a method for manufacturing an electronic component according to a twenty-first embodiment.
FIG. 13 is a sectional view showing an electronic component according to a twenty-second embodiment.
FIG. 14 is a manufacturing step diagram showing a method for manufacturing an electronic component according to a twenty-fourth embodiment.
FIG. 15 is a manufacturing step diagram showing an electronic component and a method for manufacturing the same according to a twenty-fifth embodiment.
FIG. 16 is a sectional view showing an electronic component according to a twenty-eighth embodiment.
FIG. 17 is a manufacturing process diagram illustrating an example of a conventional electronic component and a method for manufacturing the same.
[Explanation of symbols]
1 LCD drive IC
2 electrode terminals
3a Uncured UV curable resin
3b Pre-cured UV curable resin
4 Photomask
5 Exposure equipment
6 conductive particles
7 Protruding electrode
8 Transfer substrate
9 heads
10 Air nozzle
11 LCD panel
12 Output wiring pattern
13 Flexible board
14 Input wiring pattern
15 Projection formed on transfer substrate
16 IC mounting table
17a recess
17b convex part
18 Volatile solvents
19 Insulating resin
20 rubber pad
21 Metal blade
22 Squeegee
23 Resin coated substrate
24 Projection formed on resin coated substrate

Claims (3)

A method for manufacturing an electronic component, comprising applying a volatile solvent containing only conductive particles to a transfer substrate and then evaporating the solvent. 2. The method according to claim 1, wherein a silicon substrate is used as the transfer substrate. 3. The method for manufacturing an electronic component according to claim 1, wherein the transfer substrate has concave portions formed at predetermined intervals.

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