JPH07207023A - Polyimide copolymer and its production - Google Patents
Polyimide copolymer and its productionInfo
- Publication number
- JPH07207023A JPH07207023A JP1319094A JP1319094A JPH07207023A JP H07207023 A JPH07207023 A JP H07207023A JP 1319094 A JP1319094 A JP 1319094A JP 1319094 A JP1319094 A JP 1319094A JP H07207023 A JPH07207023 A JP H07207023A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide copolymer
- repeating unit
- polyamic acid
- polyimide
- dianhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 34
- 239000004642 Polyimide Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 17
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims abstract description 9
- DMSLHMXRJPWJBV-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)-2-hydroxybenzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1O DMSLHMXRJPWJBV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 5
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 3
- 150000004984 aromatic diamines Chemical class 0.000 claims description 10
- 239000000470 constituent Substances 0.000 claims description 5
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 abstract description 2
- 229930195733 hydrocarbon Natural products 0.000 abstract description 2
- 150000002430 hydrocarbons Chemical group 0.000 abstract description 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 238000006210 cyclodehydration reaction Methods 0.000 abstract 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- -1 tetracarboxylic acid dianhydride Chemical class 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 3
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000006798 ring closing metathesis reaction Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- DOPJTDJKZNWLRB-UHFFFAOYSA-N 2-Amino-5-nitrophenol Chemical compound NC1=CC=C([N+]([O-])=O)C=C1O DOPJTDJKZNWLRB-UHFFFAOYSA-N 0.000 description 1
- FJYCAYKHNVQCJW-UHFFFAOYSA-N 2-[4-[4-(2-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C(=CC=CC=3)N)=CC=2)C=C1 FJYCAYKHNVQCJW-UHFFFAOYSA-N 0.000 description 1
- IIQLVLWFQUUZII-UHFFFAOYSA-N 2-amino-5-(4-amino-3-carboxyphenyl)benzoic acid Chemical group C1=C(C(O)=O)C(N)=CC=C1C1=CC=C(N)C(C(O)=O)=C1 IIQLVLWFQUUZII-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- ZDRNVPNSQJRIRN-UHFFFAOYSA-N 2-amino-5-[2-(4-amino-3-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C(O)=C1 ZDRNVPNSQJRIRN-UHFFFAOYSA-N 0.000 description 1
- JDFAWEKPFLGRAK-UHFFFAOYSA-N 2-amino-5-[2-(4-amino-3-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(N)C(O)=CC=1C(C)(C)C1=CC=C(N)C(O)=C1 JDFAWEKPFLGRAK-UHFFFAOYSA-N 0.000 description 1
- SZSZELGAXPUXGX-UHFFFAOYSA-N 2-hydroxy-4-nitro-n-(4-nitrophenyl)benzamide Chemical compound OC1=CC([N+]([O-])=O)=CC=C1C(=O)NC1=CC=C([N+]([O-])=O)C=C1 SZSZELGAXPUXGX-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical group C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical compound C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- UDKYPBUWOIPGDY-UHFFFAOYSA-N 3-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=CC(N)=C1 UDKYPBUWOIPGDY-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- FWOLORXQTIGHFX-UHFFFAOYSA-N 4-(4-amino-2,3,5,6-tetrafluorophenyl)-2,3,5,6-tetrafluoroaniline Chemical group FC1=C(F)C(N)=C(F)C(F)=C1C1=C(F)C(F)=C(N)C(F)=C1F FWOLORXQTIGHFX-UHFFFAOYSA-N 0.000 description 1
- IJJNNSUCZDJDLP-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 IJJNNSUCZDJDLP-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- QBSMHWVGUPQNJJ-UHFFFAOYSA-N 4-[4-(4-aminophenyl)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(C=2C=CC(N)=CC=2)C=C1 QBSMHWVGUPQNJJ-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- HWKHQQCBFMYAJZ-UHFFFAOYSA-N 4-amino-n-(3-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC(N)=C1 HWKHQQCBFMYAJZ-UHFFFAOYSA-N 0.000 description 1
- SKDHHIUENRGTHK-UHFFFAOYSA-N 4-nitrobenzoyl chloride Chemical compound [O-][N+](=O)C1=CC=C(C(Cl)=O)C=C1 SKDHHIUENRGTHK-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- MRSWDOKCESOYBI-UHFFFAOYSA-N anthracene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C=C(C(C(=O)O)=C3)C(O)=O)C3=CC2=C1 MRSWDOKCESOYBI-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000004807 desolvation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- KJWHEZXBZQXVSA-UHFFFAOYSA-N tris(prop-2-enyl) phosphite Chemical compound C=CCOP(OCC=C)OCC=C KJWHEZXBZQXVSA-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、耐熱性に優れると共
に、柔軟で高い機械的強度及び低い熱膨張係数を有し、
ファインパターン化フレキシブルプリント配線基板等の
基材として好適なポリイミド共重合体及びその製造方法
に関する。The present invention has excellent heat resistance, flexibility, high mechanical strength and a low coefficient of thermal expansion.
The present invention relates to a polyimide copolymer suitable as a base material for a fine patterned flexible printed wiring board and the like and a method for producing the same.
【0002】[0002]
【従来の技術及び発明が解決しようとする課題】従来よ
り、ポリイミド樹脂は非常に優れた耐熱性・耐薬品性・
電気特性・機械的特性その他の優れた諸特性を有してい
ることが知られており、例えば、特公昭36−1099
9号公報に見られるような4,4’−ジアミノジフェニ
ルエーテルとピロメリット酸二無水物とから得られるポ
リイミドが良く知られている。このポリイミドは主鎖に
屈曲性に富むエーテル結合を含むため、全芳香族ポリイ
ミドでありながら可撓性に富むが、その反面弾性率が低
く、線膨張係数が大きく、熱的寸法安定性が悪いもので
ある。2. Description of the Related Art Conventionally, polyimide resins have been extremely superior in heat resistance and chemical resistance.
It is known to have excellent electrical and mechanical characteristics and other various characteristics. For example, Japanese Patent Publication No. 36-1099.
Polyimides obtained from 4,4′-diaminodiphenyl ether and pyromellitic dianhydride as seen in Japanese Patent Publication No. 9 are well known. Since this polyimide contains a highly flexible ether bond in the main chain, it is a fully aromatic polyimide but is highly flexible, but on the other hand, its elastic modulus is low, its linear expansion coefficient is large, and its thermal dimensional stability is poor. It is a thing.
【0003】このため、従来からより優れた熱的寸法安
定性を有し、しかも機械的強度に優れたポリイミド樹脂
の開発に対する要求が高まっており、種々検討が行われ
ている。かかる試みの中で二種以上の芳香族ジアミンを
用い、機械的特性・熱的寸法安定性等の向上を目指す取
り組みが多く見られる。しかしながら、これらの取り組
みのいずれの場合にも上記の熱的寸法安定性と機械的特
性の両者において満足するものではなかった。Therefore, there has been an increasing demand for the development of a polyimide resin having more excellent thermal dimensional stability and mechanical strength, and various studies have been conducted. Among such attempts, many efforts have been made to use two or more kinds of aromatic diamines to improve mechanical properties and thermal dimensional stability. However, neither of these approaches was satisfactory in both the above thermal dimensional stability and mechanical properties.
【0004】即ち、従来広く使用されているポリイミド
樹脂は線膨張係数が約3×10-5/℃と大きく、熱的寸
法安定性が悪く、金属などと積層した場合に、反りやカ
ールを生ずる問題点を有しており、このためかかる点の
解決が求められていた。That is, conventionally widely used polyimide resins have a large coefficient of linear expansion of about 3 × 10 -5 / ° C., poor thermal dimensional stability, and warp and curl occur when laminated with metal or the like. There is a problem, and there is a need to solve such a problem.
【0005】本発明は上記事情に鑑みなされたもので、
耐熱性に優れている上、柔軟で機械的強度が高く、かつ
熱的寸法安定性に優れたポリイミド共重合体及びその製
造方法を提供することを目的とする。The present invention has been made in view of the above circumstances.
An object of the present invention is to provide a polyimide copolymer having excellent heat resistance, flexibility, high mechanical strength, and excellent thermal dimensional stability, and a method for producing the same.
【0006】[0006]
【課題を解決するための手段及び作用】本発明者等は上
記目的を達成するため鋭意検討を行った結果、2−ヒド
ロキシ−4,4’−ジアミノベンズアニリドと4,4’
−ジアミノジフェニルエーテルとを主成分とする芳香族
ジアミンと芳香族テトラカルボン酸二無水物とを重合す
ることにより、下記式(3)と(4)で示される反復単
位を主構成単位とするポリアミド酸共重合体が得られる
こと、このポリアミド酸を熱的又は化学的に脱水閉環す
ることによって、下記一般式(1)で示される反復単位
(A)と下記一般式(2)で示される反復単位(B)と
を主構成単位として含むポリイミド共重合体、好ましく
は下記反復単位(A)と下記反復単位(B)とがモル比
で(A)/(B)=10/90〜90/10である反復
単位を含むポリイミド共重合体が得られること、このポ
リイミド共重合体が耐熱性に優れている上、高い弾性率
と柔軟性を有し、機械的強度が高く、かつ低い熱膨張係
数、低吸水率で熱的寸法安定性に優れていることを知見
し、本発明をなすに至ったものである。Means and Actions for Solving the Problems The inventors of the present invention have conducted extensive studies to achieve the above object, and as a result, 2-hydroxy-4,4'-diaminobenzanilide and 4,4 '
A polyamic acid containing a repeating unit represented by the following formulas (3) and (4) as a main constituent unit by polymerizing an aromatic diamine containing diaminodiphenyl ether as a main component and an aromatic tetracarboxylic dianhydride. A copolymer is obtained, and the polyamic acid is thermally or chemically dehydrated and cyclized to form a repeating unit (A) represented by the following general formula (1) and a repeating unit represented by the following general formula (2). A polyimide copolymer containing (B) as a main constituent unit, preferably the following repeating unit (A) and the following repeating unit (B) in a molar ratio of (A) / (B) = 10/90 to 90/10. A polyimide copolymer containing a repeating unit is obtained, which is excellent in heat resistance, has a high elastic modulus and flexibility, has high mechanical strength, and has a low coefficient of thermal expansion. , Low water absorption and heat And finding that it is superior in dimensional stability, in which the present invention has been accomplished.
【0007】[0007]
【化2】 [Chemical 2]
【0008】従って、本発明は、上記一般式(1)で示
される反復単位(A)と上記一般式(2)で示される反
復単位(B)とを主構成単位として含むポリイミド共重
合体、好ましくは上記反復単位(A)と反復単位(B)
とがモル比で(A)/(B)=10/90〜90/10
であるポリイミド共重合体、及び、2−ヒドロキシ−
4,4’−ジアミノベンズアニリドと4,4’−ジアミ
ノジフェニルエーテルとを主成分とする芳香族ジアミン
とテトラカルボン酸二無水物とを重合してポリアミド酸
共重合体を得、次いで該ポリアミド酸共重合体を熱的又
は化学的に脱水閉環することを特徴とする上記ポリイミ
ド共重合体の製造方法を提供する。Therefore, the present invention provides a polyimide copolymer containing the repeating unit (A) represented by the general formula (1) and the repeating unit (B) represented by the general formula (2) as main constituent units. Preferably the above repeating unit (A) and repeating unit (B)
Is a molar ratio of (A) / (B) = 10/90 to 90/10.
Is a polyimide copolymer and 2-hydroxy-
An aromatic diamine containing 4,4'-diaminobenzanilide and 4,4'-diaminodiphenyl ether as main components is polymerized with a tetracarboxylic acid dianhydride to obtain a polyamic acid copolymer, and then the polyamic acid copolymer is obtained. There is provided a method for producing the above polyimide copolymer, which comprises thermally or chemically dehydrating and ring-closing the polymer.
【0009】以下、本発明について更に詳しく説明する
と、本発明のポリイミド共重合体は、下記一般式(1)
で示される反復単位(A)と下記一般式(2)で示され
る反復単位(B)とを主構成単位として含むものであ
る。The present invention will be described in more detail below. The polyimide copolymer of the present invention has the following general formula (1).
The repeating unit (A) represented by and the repeating unit (B) represented by the following general formula (2) are included as main constituent units.
【0010】[0010]
【化3】 [Chemical 3]
【0011】この場合、R1は4価の芳香族基を示し、
具体的には後述する芳香族テトラカルボン酸二無水物の
芳香族基に由来するものである。In this case, R 1 represents a tetravalent aromatic group,
Specifically, it is derived from the aromatic group of the aromatic tetracarboxylic dianhydride described later.
【0012】ここで、上記反復単位(A)と上記反復単
位(B)とはポリイミド共重合体中にモル比で(A)/
(B)=10/90〜90/10、特に30/70〜8
0/20の割合で存在することが好ましい。反復単位
(A)のモル比が90%を超えると得られるポリイミド
共重合体の柔軟性が低下する場合がある。一方、反復単
位(B)のモル比が90%を超えると、ポリイミド共重
合体の線膨張係数及び弾性率の改善効果が十分に得られ
ない場合がある。Here, the repeating unit (A) and the repeating unit (B) are present in the polyimide copolymer in a molar ratio of (A) /
(B) = 10/90 to 90/10, especially 30/70 to 8
It is preferably present in a ratio of 0/20. When the molar ratio of the repeating unit (A) exceeds 90%, the flexibility of the obtained polyimide copolymer may decrease. On the other hand, when the molar ratio of the repeating unit (B) exceeds 90%, the effect of improving the linear expansion coefficient and elastic modulus of the polyimide copolymer may not be sufficiently obtained.
【0013】なお、本発明のポリイミド共重合体は、好
ましくは10モル%を超えない量、より好ましくは5モ
ル%を超えない量で後述する式(3)で示されるジアミ
ン化合物などの多価アミンと芳香族テトラカルボン酸二
無水物との反応生成物に由来する反復単位を含んでいて
もよい。The polyimide copolymer of the present invention is preferably a polyvalent polyamine such as a diamine compound represented by the formula (3) described below in an amount not exceeding 10 mol%, more preferably not exceeding 5 mol%. It may contain a repeating unit derived from a reaction product of an amine and an aromatic tetracarboxylic dianhydride.
【0014】上記ポリイミド共重合体は高分子量の重合
体であり、ポリアミド酸としての粘度は、例えば0.5
g/100mlDMF中で測定した場合、測定温度30
℃における対数粘度が0.5〜5であることが好まし
い。The above-mentioned polyimide copolymer is a high molecular weight polymer, and the viscosity as a polyamic acid is, for example, 0.5.
Measurement temperature 30 when measured in g / 100 ml DMF
The logarithmic viscosity at 0 ° C. is preferably 0.5 to 5.
【0015】本発明の上記ポリイミド共重合体は、2−
ヒドロキシ−4,4’−ジアミノベンズアニリドと4,
4’−ジアミノジフェニルエーテルとを主成分とする芳
香族ジアミンと芳香族テトラカルボン酸二無水物とを好
ましくは有機極性溶媒中で重合してポリアミド酸共重合
体を得、得られたポリアミド酸共重合体を公知の方法で
熱的又は化学的に脱水閉環することによって製造するこ
とができる。The polyimide copolymer of the present invention has a 2-
Hydroxy-4,4'-diaminobenzanilide and 4,
An aromatic diamine containing 4'-diaminodiphenyl ether as a main component and an aromatic tetracarboxylic dianhydride are preferably polymerized in an organic polar solvent to obtain a polyamic acid copolymer, and the polyamic acid copolymer obtained is obtained. The combined product can be produced by a known method such as thermal or chemical dehydration ring closure.
【0016】ここで、芳香族酸テトラカルボン酸二無水
物としては、具体的にピロメリット酸二無水物、3,
3’,4,4’−ビフェニルテトラカルボン酸二無水
物、2,3,3’,4’−ビフェニルテトラカルボン酸
二無水物、3,3’,4,4’−ベンゾフェノンテトラ
カルボン酸二無水物、2,3,6,7−ナフタレンテト
ラカルボン酸二無水物、1,4,5,8−ナフタレンテ
トラカルボン酸二無水物、2,2−ビス(3,4−ジカ
ルボキシフェニル)プロパン二無水物、ビス(3,4−
ジカルボキシフェニル)エタン二無水物、ビス(3,4
−ジカルボキシフェニル)エーテル二無水物、1,1−
ビス(3,4−カルボキシフェニル)エタン二無水物、
3,4,9,10−ペリレンテトラカルボン酸二無水
物、ベンゼン−1,2,3,4−テトラカルボン酸二無
水物、2,3,6,7−アントラセンテトラカルボン酸
二無水物、1,2,7,8−フェニレンテトラカルボン
酸二無水物などを挙げることができ、これら1種を単独
で又は2種以上を併用して使用することができる。Here, as the aromatic acid tetracarboxylic acid dianhydride, specifically, pyromellitic dianhydride, 3,
3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride Anhydrous, bis (3,4-
Dicarboxyphenyl) ethane dianhydride, bis (3,4
-Dicarboxyphenyl) ether dianhydride, 1,1-
Bis (3,4-carboxyphenyl) ethane dianhydride,
3,4,9,10-perylenetetracarboxylic dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride, 1 , 2,7,8-phenylenetetracarboxylic dianhydride and the like can be mentioned, and one of these can be used alone or two or more can be used in combination.
【0017】また、芳香族ジアミン成分として、2−ヒ
ドロキシ−4,4’−ジアミノベンズアニリドと4,
4’−ジアミノジフェニルエーテルとの二種のジアミン
のみを使用するのが本発明の効果を得るのに最も好まし
いが、必要により下記一般式(3) H2N−R−NH2 …(3) (式中、Rは2価の有機基である。)で表されるジアミ
ン化合物、例えば、4,4’−ビス(4−アミノフェノ
キシ)ビフェニル、4,4’−ジアミノジフェニルスル
フォン、3,3’−ジアミノジフェニルスルフォン、ビ
ス[4−(4−アミノフェノキシ)フェニル]スルフォ
ン、ビス[4−(3−アミノフェノキシ)フェニル]ス
ルフォン、ビス[4−(2−アミノフェノキシ)フェニ
ル]スルフォン、1,4−ビス(4−アミノフェノキ
シ)ベンゼン、1,3−ビス(4−アミノフェノキシ)
ベンゼン、1,3−ビス(3−アミノフェノキシ)ベン
ゼン、1,4−ビス(4−アミノフェニル)ベンゼン、
ビス[4−(4−アミノフェノキシ)フェニル]エーテ
ル、4,4’−ジアミノジフェニルメタン、ビス(3−
メチル−4−アミノフェニル)メタン、ビス(3−クロ
ロ−4−アミノフェニル)メタン、3,3’−ジメトキ
シ−4,4’−ジアミノジフェニル、3,3’−ジメチ
ル−4,4’−ジアミノビフェニル、3,3’−ジクロ
ロ−4,4’−ジアミノビフェニル、2,2’,5,
5’−テトラクロロ−4,4’−ジアミノビフェニル、
3,3’−ジカルボキシ−4,4’−ジアミノビフェニ
ル、3,3’−ジヒドロキシ−4,4’−ジアミノビフ
ェニル、4,4’−ジアミノジフェニルスルフィド、
3,3’−ジアミノジフェニルエーテル、3,4’−ジ
アミノジフェニルエーテル、4,4’−ジアミノジフェ
ニルメタン、4,4’−ジアミノビフェニル、4,4’
−ジアミノオクタフルオロビフェニル、2,4−ジアミ
ノトルエン、パラフェニレンジアミン、メタフェニレン
ジアミン、4,4’−ジアミノベンズアニリド、3,
4’−ジアミノベンズアニリド、4,3’−ジアミノベ
ンズアニリド、2,2−ビス[4−(4−アミノフェノ
キシ)フェニル]プロパン、2,2−ビス[4−(4−
アミノフェノキシ)フェニル]ヘキサフルオロプロパ
ン、2,2−ビス(3−ヒドロキシ−4−アミノフェニ
ル)プロパン、2,2−ビス(3−ヒドロキシ−4−ア
ミノフェニル)ヘキサフルオロプロパン、9,9−ビス
(4−アミノフェニル)−10−ヒドロ−アントラセ
ン、オルトトリジンスルフォン、更には例えば、3,
3’,4,4’−ビフェニルテトラアミン、3,3’,
4,4’−テトラアミノジフェニルエーテル等のテトラ
アミン類の一部使用も可能である。2−ヒドロキシ−
4,4’−ジアミノベンズアニリドと4,4’−ジアミ
ノジフェニルエーテル以外の多価アミンは、本発明の目
的、効果が達成される範囲内の量で使用できるが、全ア
ミンに対して10モル%を超えない量、好ましくは5モ
ル%を超えない少量が適当である。As the aromatic diamine component, 2-hydroxy-4,4'-diaminobenzanilide and 4,
It is most preferable to use only two kinds of diamines with 4′-diaminodiphenyl ether to obtain the effect of the present invention, but if necessary, the following general formula (3) H 2 N—R—NH 2 (3) ( In the formula, R is a divalent organic group.), For example, 4,4′-bis (4-aminophenoxy) biphenyl, 4,4′-diaminodiphenylsulfone, 3,3 ′. -Diaminodiphenyl sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (2-aminophenoxy) phenyl] sulfone, 1,4 -Bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy)
Benzene, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenyl) benzene,
Bis [4- (4-aminophenoxy) phenyl] ether, 4,4′-diaminodiphenylmethane, bis (3-
Methyl-4-aminophenyl) methane, bis (3-chloro-4-aminophenyl) methane, 3,3′-dimethoxy-4,4′-diaminodiphenyl, 3,3′-dimethyl-4,4′-diamino Biphenyl, 3,3'-dichloro-4,4'-diaminobiphenyl, 2,2 ', 5
5'-tetrachloro-4,4'-diaminobiphenyl,
3,3'-dicarboxy-4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4'-diaminobiphenyl, 4,4'-diaminodiphenyl sulfide,
3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'-diaminobiphenyl, 4,4 '
-Diaminooctafluorobiphenyl, 2,4-diaminotoluene, paraphenylenediamine, metaphenylenediamine, 4,4'-diaminobenzanilide, 3,
4'-diaminobenzanilide, 4,3'-diaminobenzanilide, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-
Aminophenoxy) phenyl] hexafluoropropane, 2,2-bis (3-hydroxy-4-aminophenyl) propane, 2,2-bis (3-hydroxy-4-aminophenyl) hexafluoropropane, 9,9-bis (4-Aminophenyl) -10-hydro-anthracene, orthotolidine sulfone, and also, for example, 3,
3 ', 4,4'-biphenyltetraamine, 3,3',
It is also possible to use a part of tetraamines such as 4,4′-tetraaminodiphenyl ether. 2-hydroxy-
Polyhydric amines other than 4,4'-diaminobenzanilide and 4,4'-diaminodiphenyl ether can be used in an amount within the range in which the objects and effects of the present invention are achieved. Suitable amount is not more than 5 mol%, preferably a small amount not exceeding 5 mol%.
【0018】また、有機極性溶媒としては、例えばジメ
チルスルフォキシド等のスルフォキシド系溶媒、N,N
−ジメチルホルムアミド、N,N−ジエチルホルムアミ
ド等のホルムアミド系溶媒、N−メチル−2−ピロリド
ン、N−ビニル−2−ピロリドン等のピロリドン系溶
媒、フェノール、o−,m−又はp−クレゾール、キシ
レノール、ハロゲン化フェノール、カテコール等のフェ
ノール系溶媒、あるいはヘキサメチルホスホルムアミ
ド、γ−ブチロラクトン等を挙げることができ、これら
を単独又は混合物として用いるのが望ましいが、更には
キシレン、トルエンのような芳香族炭化水素の一部使用
も可能である。Further, as the organic polar solvent, for example, a sulfoxide-based solvent such as dimethyl sulfoxide, N, N
Formamide solvents such as dimethylformamide and N, N-diethylformamide, pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone, phenol, o-, m- or p-cresol, xylenol , Halogenated phenols, phenolic solvents such as catechol, or hexamethylphosphoramide, γ-butyrolactone, and the like. These are preferably used alone or as a mixture, and further aromatic such as xylene and toluene. Partial use of hydrocarbons is also possible.
【0019】これらの有機極性溶媒中で0〜70℃、好
ましくは0〜30℃の温度で重合してポリアミド酸が得
られる。重合時間は特に制限されないが、通常2〜20
時間、好ましくは3〜8時間である。なお、このポリア
ミド酸は有機極性溶媒中に5〜30重量%、特に10〜
20重量%の範囲で溶解していることが好ましく、この
ような溶解量となるように原料、有機溶媒の使用量を決
定しておくことが良い。Polymerization in these organic polar solvents at a temperature of 0 to 70 ° C., preferably 0 to 30 ° C. gives a polyamic acid. The polymerization time is not particularly limited, but is usually 2 to 20.
The time is preferably 3 to 8 hours. The polyamic acid is contained in an organic polar solvent in an amount of 5 to 30% by weight, particularly 10 to
It is preferable that the amount is dissolved in the range of 20% by weight, and it is preferable to determine the amounts of the raw material and the organic solvent to be used so that the amount is dissolved.
【0020】このようにして得られたポリアミド酸を常
法に従い、熱的又は化学的に脱水閉環して本発明のポリ
イミド共重合体をフィルム等として得ることができる。The polyamic acid thus obtained can be thermally or chemically dehydrated and cyclized by a conventional method to obtain the polyimide copolymer of the present invention as a film or the like.
【0021】この場合、熱的な閉環法によるポリイミド
フィルム製造法としては、例えばポリアミド酸をエンド
レスベルト等の支持体に流延又は塗布して膜状とし、そ
の膜を100〜150℃で乾燥し、溶剤を10〜30%
含有する該ポリアミド酸の自己支持性膜を得る。次い
で、この膜を支持体上から引き剥し、端部を固定した
後、約200〜250℃に加熱して溶媒をとばし、更に
300〜450℃で脱水することによりポリイミドフィ
ルムを得ることができる。この熱処理によってイミド環
が形成されると共に、ベンゼン環に結合した−CONH
−基とオルト位にあるOH基の脱水縮合反応によりベン
ズオキサゾール環が形成される。In this case, as a method for producing a polyimide film by the thermal ring-closing method, for example, polyamic acid is cast or applied on a support such as an endless belt to form a film, and the film is dried at 100 to 150 ° C. , Solvent 10-30%
A self-supporting membrane of the polyamic acid containing is obtained. Next, the polyimide film can be obtained by peeling off this film from the support, fixing the ends, heating to about 200 to 250 ° C. to remove the solvent, and further dehydrating at 300 to 450 ° C. By this heat treatment, an imide ring is formed and -CONH bonded to the benzene ring is formed.
A benzoxazole ring is formed by a dehydration condensation reaction between the -group and the OH group in the ortho position.
【0022】また、化学的な脱水閉環法を採用するに際
しては、脱水剤及び触媒を用いる方法が好適である。こ
の場合、脱水剤としては、例えば脂肪族酸無水物、芳香
族酸無水物、N,N−ジアルキルカルボンイミド、低級
脂肪酸ハロゲン化物、ハロゲン化低級脂肪酸ハロゲン化
物、ハロゲン化低級脂肪酸無水物、アリルフォスフォン
酸ジハロゲン化物、チオニルハロゲン化物又はそれらの
2種以上の混合物が挙げられる。脱水剤の使用量は、ポ
リアミド酸の繰り返し単位あたり約0.5〜10モル
量、特に2〜6モル量が好ましい。触媒としては、例え
ばトリエチルアミン等の脂肪族第三級アミン、ジメチル
アニリン等の芳香族第三級アミン、ピリジン、β−ピコ
リン、イソキノリン等の複素環式第三級アミンの1種又
はそれらの2種以上の混合物が挙げられる。触媒の使用
量は、ポリアミド酸の繰り返し単位あたり約0.01〜
4モル量、特に0.1〜2モル量が好ましい。なお、こ
の化学的脱水閉環の反応条件は、70〜400℃で0.
2〜20時間、特に100〜300℃で1〜5時間が好
ましい。When employing the chemical dehydration ring closure method, a method using a dehydrating agent and a catalyst is preferable. In this case, examples of the dehydrating agent include aliphatic acid anhydrides, aromatic acid anhydrides, N, N-dialkylcarbonimides, lower fatty acid halides, halogenated lower fatty acid halides, halogenated lower fatty acid anhydrides and allyl phosphite. Examples thereof include phosphonic acid dihalide, thionyl halide, or a mixture of two or more thereof. The amount of the dehydrating agent used is preferably about 0.5 to 10 mols, and particularly preferably 2 to 6 mols per polyamic acid repeating unit. Examples of the catalyst include aliphatic tertiary amines such as triethylamine, aromatic tertiary amines such as dimethylaniline, and heterocyclic tertiary amines such as pyridine, β-picoline, and isoquinoline, or two of them. The above mixture may be mentioned. The amount of the catalyst used is about 0.01 to about 0.1 per repeating unit of polyamic acid.
An amount of 4 moles, particularly 0.1 to 2 moles is preferred. The reaction conditions for this chemical dehydration ring closure are 70 to 400 ° C.
It is preferably 2 to 20 hours, particularly 1 to 5 hours at 100 to 300 ° C.
【0023】このようにして得られるポリイミド重合体
は、耐熱性に優れ、柔軟性を有し、高い機械的強度と低
い熱膨張係数を有するため、例えば電気絶縁材料やファ
インパターン化フレキシブルプリント配線基板等のフィ
ルム基材として好適であり、この場合フィルムの厚さは
10〜150μm程度とすることができる。The polyimide polymer thus obtained has excellent heat resistance, flexibility, high mechanical strength and low coefficient of thermal expansion, so that it can be used, for example, in electrically insulating materials and fine patterned flexible printed wiring boards. And the like, and in this case, the thickness of the film can be about 10 to 150 μm.
【0024】[0024]
【実施例】以下、実施例と比較例を示し、本発明を具体
的に示すが、本発明は下記の実施例に制限されるもので
はない。EXAMPLES Hereinafter, the present invention will be specifically shown by showing Examples and Comparative Examples, but the present invention is not limited to the following Examples.
【0025】[参考例]まず、下記のように2−ヒドロ
キシ−4,4’−ジアミノベンズアニリドを合成した。Reference Example First, 2-hydroxy-4,4'-diaminobenzanilide was synthesized as follows.
【0026】テトラヒドロフラン500mlに2−アミ
ノ−5−ニトロフェノール77.1g(0.500モ
ル)とトリエチルアミン50.6g(0.520モル)
を溶解し、0℃に冷却後、その中にテトラヒドロフラン
150mlにp−ニトロ塩化ベンゾイル92.8g
(0.500モル)を溶かした溶液を、反応液の温度が
10℃以下になるように滴下した。その後、室温に戻
し、2時間撹拌を続けた。77.1 g (0.500 mol) of 2-amino-5-nitrophenol and 50.6 g (0.520 mol) of triethylamine in 500 ml of tetrahydrofuran.
Was dissolved and cooled to 0 ° C., and then tetrahydrofuran (150 ml) was added with p-nitrobenzoyl chloride (92.8 g).
A solution in which (0.500 mol) was dissolved was added dropwise so that the temperature of the reaction liquid was 10 ° C or lower. Then, it returned to room temperature and continued stirring for 2 hours.
【0027】次いで、反応液を1リットルのメタノール
中に注ぎ、反応物を析出させ、析出物を濾過し、テトラ
ヒドロフランで洗浄し、更に水、メタノールで洗浄した
後、乾燥して2−ヒドロキシ−4,4’−ジニトロベン
ズアニリドの黄色結晶を得た。その収量は147.7g
(収率97.4%)であった。粗結晶をN,N’−ジメ
チルホルムアミド/メタノールにより再結晶し、純品を
得た。Then, the reaction solution was poured into 1 liter of methanol to precipitate the reaction product, which was filtered, washed with tetrahydrofuran, further washed with water and methanol, and then dried to give 2-hydroxy-4. Yellow crystals of 4'-dinitrobenzanilide were obtained. The yield is 147.7g
(Yield 97.4%). The crude crystal was recrystallized from N, N'-dimethylformamide / methanol to obtain a pure product.
【0028】1000mlのオートクレーブに上で得ら
れた2−ヒドロキシ−4,4’−ジニトロベンズアニリ
ド70.0g(0.231モル)を5%Pd/C4g、
N,N−ジメチルホルムアミド500mlと共に装入し
た。60℃で激しく撹拌しながら水素を導入し、水素の
吸収が認められなくなるまで撹拌を続けた。In a 1000 ml autoclave, 70.0 g (0.231 mol) of 2-hydroxy-4,4'-dinitrobenzanilide obtained above was added to 4 g of 5% Pd / C.
Charged with 500 ml N, N-dimethylformamide. Hydrogen was introduced with vigorous stirring at 60 ° C., and stirring was continued until hydrogen absorption was no longer observed.
【0029】冷却後濾過して触媒を除去し、減圧濃縮し
て水1000mlへ注ぎ、沈澱物を濾過し、水で洗浄
後、減圧乾燥し、2−ヒドロキシ−4,4’−ジアミノ
ベンズアニリドの赤紫色結晶を得た。収量は53.8g
(収率95.7%)であった。粗結晶を水/メタノール
の混合溶媒により再結晶し、純品を得た。After cooling, the catalyst was removed by filtration, concentrated under reduced pressure and poured into 1000 ml of water. The precipitate was filtered, washed with water and dried under reduced pressure to obtain 2-hydroxy-4,4'-diaminobenzanilide. Red purple crystals were obtained. Yield 53.8g
(Yield 95.7%). The crude crystal was recrystallized with a mixed solvent of water / methanol to obtain a pure product.
【0030】[実施例1]500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)142.9g入
れ、窒素ガスを流しながら、2−ヒドロキシ−4,4’
−ジアミノベンズアニリド2.250g(0.0092
5モル)と4,4’−ジアミノジフェニルエーテル5.
557g(0.02775モル)をDMFに溶解させ
た。次にピロメリット酸二無水物8.070g(0.0
37モル)を加え、25℃で3時間反応させた。Example 1 A 500 ml flask was charged with N,
142.9 g of N-dimethylformamide (DMF) was added, and 2-hydroxy-4,4 ′ was added while flowing nitrogen gas.
-Diaminobenzanilide 2.250 g (0.0092
5 mol) and 4,4'-diaminodiphenyl ether 5.
557 g (0.02775 mol) was dissolved in DMF. Next, 8.070 g of pyromellitic dianhydride (0.0
37 mol) was added, and the mixture was reacted at 25 ° C. for 3 hours.
【0031】次に、これらのアミド酸溶液をガラス板上
にアプリケーターで薄く伸ばし、オーブン中110℃、
60分間乾燥してから剥離して、鉄枠に固定し、200
℃、60分、200℃から400℃に昇温しながら60
分、更に400℃で15分脱溶剤イミド化して約25μ
mの厚みのフィルムを得た。Next, these amic acid solutions were thinly spread on a glass plate with an applicator and heated in an oven at 110 ° C.
After drying for 60 minutes, peel it off, fix it to the iron frame, and
℃, 60 minutes, while raising the temperature from 200 ℃ to 400 ℃ 60
For about 25μ after desolvation imidization at 400 ℃ for 15 minutes
A film having a thickness of m was obtained.
【0032】[実施例2〜3]芳香族ジアミンとして2
−ヒドロキシ−4,4’−ジアミノベンズアニリドと
4,4’−ジアミノジフェニルエーテルを用い、それら
のモル比を表1に示したように種々変えて実施例1と同
様の方法によりフィルムを得た。[Examples 2 to 3] 2 as aromatic diamine
-Hydroxy-4,4'-diaminobenzanilide and 4,4'-diaminodiphenyl ether were used, and the molar ratio thereof was variously changed as shown in Table 1 to obtain a film by the same method as in Example 1.
【0033】[実施例4]DMFを171.8g使用
し、酸二無水物を3,3’,4,4’−ビフェニルテト
ラカルボンとした以外は実施例2と同様の方法によりフ
ィルムを得た。[Example 4] A film was obtained in the same manner as in Example 2 except that 171.8 g of DMF was used and the acid dianhydride was 3,3 ', 4,4'-biphenyltetracarboxylic. .
【0034】[比較例1]DMFを139.3g使用す
ると共に、芳香族ジアミンとして4,4’−ジアミノジ
フェニルエーテルのみを用いた以外は実施例1と同様の
方法によりフィルムを得た。Comparative Example 1 A film was obtained in the same manner as in Example 1 except that 139.3 g of DMF was used and only 4,4′-diaminodiphenyl ether was used as the aromatic diamine.
【0035】[比較例2]DMFを153.6g使用す
ると共に、芳香族ジアミンとして2−ヒドロキシ−4,
4’−ジアミノベンズアニリドのみを用いた以外は実施
例1と同様の方法によりフィルムを得た。[Comparative Example 2] 153.6 g of DMF was used, and 2-hydroxy-4, as an aromatic diamine.
A film was obtained in the same manner as in Example 1 except that only 4'-diaminobenzanilide was used.
【0036】[比較例3]DMFを179.0g使用す
ると共に、酸二無水物を3,3’,4,4’−ビフェニ
ルテトラカルボン酸二無水物とした以外は比較例2と同
様の方法によりフィルムを得た。[Comparative Example 3] The same method as in Comparative Example 2 except that 179.0 g of DMF was used and the acid dianhydride was 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride. To obtain a film.
【0037】得られたフィルムについて、機械的特性、
線膨張係数を下記のように測定した。測定結果を表1に
併記する。機械的特性(引張強度、弾性率、伸度) ASTM D882−88に基づき測定した。線膨張係数 真空理工(株)製熱分析計TMA−7000を用い、昇
温速度5(℃/分)で150〜200℃での線膨張係数
の平均値を求めた。Mechanical properties of the obtained film,
The linear expansion coefficient was measured as follows. The measurement results are also shown in Table 1. Mechanical Properties (Tensile Strength, Elastic Modulus, Elongation ) Measured based on ASTM D882-88. Linear expansion coefficient Using a thermal analyzer TMA-7000 manufactured by Vacuum Riko Co., Ltd., an average value of linear expansion coefficients at 150 to 200 ° C was obtained at a temperature rising rate of 5 (° C / min).
【0038】[0038]
【表1】 [Table 1]
【0039】表1の結果より、本発明のポリイミド共重
合体は、柔軟性を有すると共に機械的強度が良好であ
り、線膨張係数が低く、熱的寸法安定性に優れることが
認められる。From the results shown in Table 1, it is recognized that the polyimide copolymer of the present invention has flexibility and good mechanical strength, a low coefficient of linear expansion, and excellent thermal dimensional stability.
【0040】これに対し、芳香族ジアミンとして4,
4’−ジアミノジフェニルエーテルのみを用いた場合
(比較例1)は、線膨張係数が大きく、また2−ヒドロ
キシ−4,4’−ジアミノベンズアニリドのみを用いた
場合(比較例2)は、柔軟性が劣り、更に芳香族テトラ
カルボン酸二無水物として3.3’,4,4’−ビフェ
ニルテトラカルボン酸二無水物を用いた場合(比較例
3)も、柔軟性が劣ることが認められる。On the other hand, as an aromatic diamine, 4,
When only 4'-diaminodiphenyl ether was used (Comparative Example 1), the linear expansion coefficient was large, and when only 2-hydroxy-4,4'-diaminobenzanilide was used (Comparative Example 2), the flexibility was high. Is poor, and when 3.3 ', 4,4'-biphenyltetracarboxylic dianhydride is used as the aromatic tetracarboxylic dianhydride (Comparative Example 3), the flexibility is also inferior.
【0041】[0041]
【発明の効果】本発明のポリイミド共重合体は、耐熱性
に優れると共に、柔軟で高い機械的強度及び低い熱膨張
係数を有し、このためファインパターン化フレキシブル
基板等の基材として好適である。INDUSTRIAL APPLICABILITY The polyimide copolymer of the present invention is excellent in heat resistance, is flexible and has high mechanical strength and low thermal expansion coefficient, and is therefore suitable as a base material for fine patterned flexible substrates and the like. .
【0042】また、本発明の製造方法によれば、かかる
ポリイミド共重合体を容易かつ確実に製造することがで
きる。Further, according to the production method of the present invention, such a polyimide copolymer can be produced easily and reliably.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成7年1月10日[Submission date] January 10, 1995
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0038[Correction target item name] 0038
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0038】[0038]
【表1】 [Table 1]
───────────────────────────────────────────────────── フロントページの続き (72)発明者 湯山 昌弘 茨城県鹿島郡神栖町大字東和田1番地 信 越化学工業株式会社高分子機能性材料研究 所内 (72)発明者 本海 清 茨城県鹿島郡神栖町大字東和田1番地 信 越化学工業株式会社高分子機能性材料研究 所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masahiro Yuyama, Inventor Masahiro Yuyama 1 Towada, Kamisu-cho, Kashima-gun, Ibaraki Shin-Etsu Chemical Co., Ltd., Polymer Functional Materials Research Center (72) Inventor Kiyoshi Motoumi Kashima-gun, Ibaraki Prefecture No. 1 Towada, Kamisu Town, Shin-Etsu Chemical Co., Ltd.
Claims (3)
(A)と下記一般式(2)で示される反復単位(B)と
を主構成単位として含むポリイミド共重合体。 【化1】 (但し、式中R1は4価の芳香族炭化水素基を示す。)1. A polyimide copolymer containing a repeating unit (A) represented by the following general formula (1) and a repeating unit (B) represented by the following general formula (2) as main constituent units. [Chemical 1] (However, in the formula, R 1 represents a tetravalent aromatic hydrocarbon group.)
(B)とがモル比で(A)/(B)=10/90〜90
/10である請求項1記載のポリイミド共重合体。2. The repeating unit (A) and the repeating unit (B) according to claim 1 are in a molar ratio of (A) / (B) = 10/90 to 90.
The polyimide copolymer according to claim 1, which is / 10.
ンズアニリドと4,4’−ジアミノジフェニルエーテル
とを主成分とする芳香族ジアミンとテトラカルボン酸二
無水物とを重合してポリアミド酸共重合体を得、次いで
該ポリアミド酸共重合体を熱的又は化学的に脱水閉環す
ることを特徴とする請求項1記載のポリイミド共重合体
の製造方法。3. Polyamic acid copolymerization by polymerizing an aromatic diamine containing 2-hydroxy-4,4′-diaminobenzanilide and 4,4′-diaminodiphenyl ether as main components and tetracarboxylic dianhydride. The method for producing a polyimide copolymer according to claim 1, wherein the polyamic acid copolymer is dehydrated and ring-closed thermally or chemically.
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JP2006028073A (en) * | 2004-07-15 | 2006-02-02 | Toyobo Co Ltd | Diisocyanate compound and polyamide-imide resin |
JP2006199740A (en) * | 2005-01-18 | 2006-08-03 | Toyobo Co Ltd | Polyimide film and manufacturing method thereof |
WO2015047055A1 (en) * | 2013-09-30 | 2015-04-02 | 주식회사 엘지화학 | Substrate for organic electronic device |
US20160172591A1 (en) * | 2013-09-30 | 2016-06-16 | Lg Chem, Ltd. | Substrate for organic electronic device |
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1994
- 1994-01-11 JP JP01319094A patent/JP3168806B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006028073A (en) * | 2004-07-15 | 2006-02-02 | Toyobo Co Ltd | Diisocyanate compound and polyamide-imide resin |
JP2006199740A (en) * | 2005-01-18 | 2006-08-03 | Toyobo Co Ltd | Polyimide film and manufacturing method thereof |
WO2015047055A1 (en) * | 2013-09-30 | 2015-04-02 | 주식회사 엘지화학 | Substrate for organic electronic device |
US20160172591A1 (en) * | 2013-09-30 | 2016-06-16 | Lg Chem, Ltd. | Substrate for organic electronic device |
JP2016527358A (en) * | 2013-09-30 | 2016-09-08 | エルジー・ケム・リミテッド | Substrates for organic electronic devices |
US9761832B2 (en) | 2013-09-30 | 2017-09-12 | Lg Display Co., Ltd. | Substrate for organic electronic device |
US10090473B2 (en) * | 2013-09-30 | 2018-10-02 | Lg Display Co., Ltd. | Substrate for organic electronic device |
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