JPH07170091A - Mounting method of electronic component and housing member of film carrier - Google Patents

Abstract

PURPOSE:To mount a film carrier on a board with high reliability by preventing the electrical connection defect of the film carrier to the board from being caused. CONSTITUTION:Film carriers 1 formed in such a way that electronic components are mounted on flexible tapes are positioned and housed inside a recessed part 9 one by one inside many individual housing recessed parts 8 formed so as to match the shape of every film carrier 1 in the length direction of a resin tape 7 while they escape in such a way their electronic-component mounting parts or their electronic-component mounting parts and molded outer leads do not come into contact with the resin tape 7. Then, the film carriers 1 are taken out from the housing recessed parts 8 in the resin tape 7, and they are mounted on a board 10. Thereby, it is possible to prevent a defective electrical connection due to dust particles on the film carriers 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting a film carrier formed by mounting electronic components on a flexible tape on a printed circuit board, a glass substrate or the like, and a film carrier storage member used for the same.

[0002]

2. Description of the Related Art In recent years, a film carrier obtained by a TAB (Tape Automated Bonding) method in which copper wiring is formed on a tape made of a resin such as polyimide and electronic parts such as an IC chip are mounted on the tape is used for various substrates. A method of implementation is proposed.

In this electronic component mounting method, as shown in FIG. 7A, an electronic component 5 such as an IC chip is connected to an inner lead 3 of a film carrier tape 4 made of a polyimide film having an outer lead 2. The film carrier 1 is constituted, and this film carrier 1 is shown in FIG.
As shown in (b), a die is punched into a predetermined size (shown by a dotted line in FIG. 7 (a)) in one device, and a film is formed as shown in (c) and (d) of FIG. The outer lead 2 of the carrier 1 is connected to the board 10 with the cream solder 11 and mounted.

Further, in Japanese Patent Application Laid-Open No. 5-21510 and Japanese Patent Application No. 4-345713, as shown in FIG.
As a method of performing the punching process of the film carrier and the mounting process on the substrate by separate equipment, the film carrier 1 is punched (FIG. 8A), housed in a resin-molded embossed tape 21, and temporarily fixed with an adhesive 22. (Fig. 8 (b)),
After that, the film carrier 1 is taken out from the embossing tape 21 in the mounting device (FIG. 8C), mounted on the substrate 10 coated with the cream solder 11 (FIG. 8D), and the cream solder 11 is reflowed and soldered. Yes (Fig. 8
(E)) A method has been proposed.

Further, in Japanese Unexamined Patent Publication No. 4-219990, as shown in FIG. 9, an outer lead 2 which is deformed into a predetermined shape when the film carrier 1 is punched is suction-held by a mounting tool 23. Then, a method of mounting on the substrate 10 has been proposed.

[0006]

However, in the electronic component mounting method shown in FIG. 7, when the film carrier 1 is punched out by a die, dust such as dust on the film carrier 1 is generated and scatters, so that the substrate 10 is crushed. There is a problem that they often adhere to each other and hinder the good electrical connection between the film carrier 1 and the substrate 10. Further, when the mold and the substrate 10 are separated from each other in order to prevent dust from scattering, the film carrier 1 may be damaged when the film carrier 1 is transferred from the mold equipment to the substrate mounting location. There is.

In the method of mounting electronic components shown in FIG. 8, the film carrier 1 is temporarily fixed with the adhesive 22 when the film carrier 1 is housed in the embossed tape 21, but a small film carrier 1 is temporarily fixed. It is difficult to do so, and the adhesive 22 may adhere to the electrodes of the film carrier 1 to hinder good electrical connection. Further, since the film carrier 1 is temporarily fixed by the adhesive 22, the film carrier 1 Often tilted, it may not be possible to pick it up with a tool,
On the other hand, if the film carrier 1 is simply stored, there is a problem that the film carrier 1 is moved during transportation and the film carrier 1 is damaged, or dust is generated due to contact between the electronic component mounting portion and the embossed tape 21.

Further, as shown in FIG. 9, when the outer lead 2 of the film carrier 1 is formed into a predetermined shape, the outer lead 2 and the embossed tape 21 formed in the embossed tape 21 are molded. There is a problem that they may come into contact with each other and deform the outer leads 2 abnormally.

In view of the above problems of the prior art, the present invention can prevent the occurrence of electrical connection failure between the film carrier and the substrate due to dust or dust, and prevent damage and deformation of the outer leads due to the transport of the film carrier. An object of the present invention is to provide an electronic component mounting method and a film carrier accommodating member capable of mounting a film carrier on a substrate with high reliability.

[0010]

According to the electronic component mounting method of the present invention, a large number of film carriers formed by mounting electronic components on a flexible tape are formed in the longitudinal direction of a resin tape in accordance with the shape of the film carrier. One step in each storage recess, and a step of storing the electronic component mounting portion, or the electronic component mounting portion and the molded outer lead so that the electronic lead mounting portion and the molded outer lead do not come into contact with the resin tape, and are stored in the recessed portion. And removing the film carrier from the storage recess and mounting it on the substrate.

Preferably, a film carrier having lead protection tape portions formed on both outer sides of the outer lead row and a resin tape having a support portion for the lead protection tape portion formed in a storage recess are used. Alternatively, a film carrier having a notch formed in at least one place and a resin tape having a shape corresponding to the shape of the notch in the storage recess are used. Alternatively, a film carrier having a through hole formed at least at one place and a resin tape having a protrusion recessed into the storage hole formed in the storage recess are used.

Further, the film carrier accommodating member of the present invention has a large number of accommodating recesses for accommodating a film carrier formed by mounting electronic parts on a flexible tape in the longitudinal direction of the resin tape, and each accommodating recess is provided in each accommodating recess. It is characterized in that an escape recess for preventing contact between the electronic component mounting portion of the film carrier or the electronic component mounting portion and the molded outer lead is formed.

Preferably, the accommodating concave portion is provided with a support portion of the lead protection tape portion formed on both outer sides of the outer lead row in the film carrier, or a protrusion engaging with a notch portion formed in the film carrier. Protrusions that are formed or that fit into the through holes formed in the film carrier are formed.

[0014]

According to the electronic component mounting method of the present invention, the film carrier punched by the die is stored in the storage recess of the resin tape, and the film carrier is taken out from the resin tape and mounted on the substrate. The punching location and the board mounting location can be separated, and it is possible to prevent the electrical connection failure with the substrate due to the scattering of dust generated when punching the film carrier. Since the electronic component mounting portion is escaped and is positioned in the concave portion while the electronic component mounting portion is accommodated in the accommodating concave portion conforming to its shape, the film carrier is contaminated with the temporary fixing adhesive and electrical connection failure occurs. The electronic component mounting part does not come into contact with the resin tape during transport and may be damaged or generate dust. It can be prevented more of faulty electrical connection between the substrate occurs.

Further, when the film carrier has a molded outer lead, the outer lead can be surely prevented from being deformed by locating the outer lead in the relief recess, and a poor electrical connection with the substrate. Can be prevented.

Further, by forming a lead protection tape portion, a notch portion or a through hole on the film carrier and forming a supporting portion, a protrusion portion or a protrusion portion corresponding thereto on the resin tape side, the film carrier can be stored in the storage concave portion. The position can be regulated and held, and the inconvenience such as damage or deformation of the electronic component mounting portion and the outer leads due to the movement of the film carrier can be reliably prevented.

The mounting method described above can be carried out by using the film carrier accommodating member of the present invention.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to.

In FIG. 1, 1 is a film carrier,
An electronic component 5 such as an IC chip is mounted on the inner lead 3 of a film carrier tape 4 formed by forming an outer lead 2 and an inner lead 3 on a polyimide film, and the film carrier tape 4 is punched with a predetermined die. ing.

The film carrier 1 is transported while being accommodated in the accommodating recess 8 of the film carrier accommodating member 6 formed by embossing the accommodating recess 8 in the resin tape 7. The storage recess 8 is formed in conformity with the shape of the film carrier 1, and the storage recess 8 is formed with an escape recess 9 so that the mounting portion of the electronic component 5 does not come into contact with the resin tape 7.

The material of the resin tape 7 is not particularly limited, but it is preferable that the resin tape 7 has conductivity, and it is desirable that the resistance value is 1 × 10 ⁹ Ω or less. For example, a polyester resin or a polyolefin resin containing a conductive material such as carbon or metal can be used.

After the film carrier 1 is housed in the housing recess 8 of the film carrier housing member 6, the upper surface of the film carrier 1 can be covered with a cover tape or the like to prevent the film carrier 1 from falling off. The cover tape is not particularly limited, but a tape to which a hot melt type adhesive is applied is desirable.

Next, a method of mounting the film carrier 1 on a substrate will be described with reference to FIG. 2. The film carrier tape 4 is punched out at a position indicated by a broken line with a predetermined die to manufacture the film carrier 1 (a). ) Step, the step of accommodating the film carriers 1 one by one in the accommodating recesses 8 of the film carrier accommodating member 6, and the step of removing the film carrier 1 from the accommodating recesses 8 of the film carrier accommodating member 6 (c). , (D) step of mounting the film carrier 1 on the substrate 10. A suitable method for mounting on the substrate 10 is to print the cream solder 11 on the substrate 10 in advance, mount the film carrier 1 on the cream solder 11, and perform reflow soldering.

According to the above construction, the location where the film carrier 1 is punched by the mold and the film carrier 1 is the substrate 1
It is possible to make it separate from the place to be mounted on 0, and to prevent the occurrence of electrical connection failure between the film carrier 1 and the substrate 10 due to scattering of dust and the like generated when punching the film carrier 1 with a die.

Further, since the accommodating recess 8 of the film carrier accommodating member 6 is formed in conformity with the shape of the film carrier 1, the film carrier 1 can be formed without using an adhesive.
The film carrier 1 can be held, the film carrier 1 is not contaminated by the adhesive for temporary fixing, and the electrical connection is not defective, and the flatness of the film carrier 1 is secured. It is possible to prevent a work defect such as damage. Further, since the electronic component 5 is located inside the escape recess 9 and does not contact the resin tape 7, the electronic component 5 is not damaged or dust is not generated, and the dust does not cause an electrical connection failure.

Specific embodiments will be described below with reference to FIGS. 3 to 6.

(Embodiment 1) In FIG. 3, the film carrier 1 is die-cut into a shape as shown in FIG. 3 (a), and a storage recess 8 is formed in conformity with the shape of the film carrier 1 as shown in FIG. 3 (c). Film carrier storage member 6
Then, as shown in (b), the film carriers 1 were stored one by one, and a cover tape was attached so as not to jump out from the storage recess 8. In the film carrier 1 of this embodiment, the outer leads 2 are flush with the film carrier tape 4, and the protruding electronic component 5 is housed in the escape recess 9 so as not to contact the resin tape 7.

The film carrier storage member 6 is attached to the substrate 1
The film carrier 1 was mounted on the substrate 10 by mounting the film carrier 1 on a device for mounting the film carrier on the substrate 10. The mounting on the substrate 10 was performed by printing the cream solder 11 on the substrate 10 in advance, placing the film carrier 1 thereon, and performing reflow soldering.

(Embodiment 2) In FIG. 4, the film carrier 1 is die-cut into a shape as shown in FIG. 4 (a), and a storage recess 8 matching the shape of the film carrier 1 is provided as shown in FIG. 4 (c). Film carrier storage member 6
Then, the film carriers 1 were housed one by one as shown in (b). In the film carrier 1 of this embodiment, the outer leads 2 are formed so as to project toward the substrate 10, and lead protection tape portions 12 are formed on both outer sides of the row of the outer leads 2. Correspondingly, a large escape recess 9 is formed so that the electronic component 5 and the outer lead 2 do not come into contact with the resin tape 7, and the support portions 13 of the lead protection tape portion 12 are provided on both sides thereof.
Are formed.

Other conditions are the same as those in the first embodiment.

(Embodiment 3) In FIG. 5, the film carrier 1 is die-cut into a shape as shown in FIG. 5 (a), and a storage concave portion 8 matching the shape of the film carrier 1 is provided as shown in FIG. 5 (c). Film carrier storage member 6
Then, the film carriers 1 were housed one by one as shown in (b). In the film carrier 1 of this embodiment, the outer leads 2 are formed so as to project to the substrate 10 side, and notches 14 are formed on both sides of the film carrier 1. Correspondingly, the escape recess 9 is formed large so that the electronic component 5 and the outer lead 2 do not contact the resin tape 7, and the storage recess 8 is formed.
Projections 15 that engage with the notches 14 are formed on both sides of the
The film carrier 1 is prevented from moving inside the storage recess 8.

Other conditions are the same as those in the first embodiment.

(Embodiment 4) In FIG. 6, the film carrier 1 is punched into a shape as shown in FIG. 6A with a die, and a storage recess 8 matching the shape of the film carrier 1 is provided as shown in FIG. 6C. Film carrier storage member 6
Then, the film carriers 1 were housed one by one as shown in (b). In the film carrier 1 of this embodiment, the outer leads 2 are formed so as to project to the substrate 10 side, and the through holes 16 are formed on both sides of the film carrier 1. Correspondingly, electronic components 5
Also, the escape recess 9 is formed large so that the outer lead 2 does not come into contact with the resin tape 7, and the protrusions 17 that fit into the through holes 16 are formed on both sides of the storage recess 8, and the film carrier is stored in the storage recess 8. It prevents 1 from moving.

Other conditions are the same as those in the first embodiment.

(Comparative Example) A polyethylene terephthalate film (thickness: 0.3 mm) was punched with a predetermined die to form a hole, a resin tape was placed in this hole, and a storage recess was embossed to give a predetermined shape. An adhesive was applied to the position. Put a film carrier in the recess of the resin tape.
They were stored one by one and temporarily fixed with an adhesive.

Other conditions are the same as those in the first embodiment.

The results of the above examples and comparative examples are shown in Table 1. The number of produced samples was 100 in each example. In addition, the conduction failure rate in Table 1 is (the number of conduction failures) / (the number of samples) × 100, and the extraction failure rate is (the number of extraction failures) / (the number of samples) × 100.

[0038]

[Table 1]

As is apparent from Table 1, in the examples of the present invention, there were no conduction defects and no removal defects from the recesses of the film carrier.

[0040]

According to the electronic component mounting method and the film carrier accommodating member of the present invention, as is clear from the above description, the film carrier punched by the die is accommodated in the accommodating recess of the resin tape, and the resin Since the film carrier is taken out from the tape and mounted on the substrate, the place where the film carrier is punched and the place where it is mounted on the substrate can be separated, and it is possible to separate the substrate by the scattering of dust generated when punching the film carrier. Since it is possible to prevent the electrical connection failure of the film carrier from occurring and the film carrier is housed in the housing recess corresponding to its shape and the electronic component mounting portion is escaped and located in the recess, the film carrier is temporarily It is possible to prevent the electrical connection from being contaminated by the adhesive for fixing and to prevent the electrical connection failure. Damaged in contact with flops, there is no fear or to generate dust, it is possible to prevent the defective electrical connection between the substrate is generated by the dust.

Further, when the film carrier has a molded outer lead, the outer lead can be surely prevented from being deformed by locating the outer lead in the relief recess, and the occurrence of a poor electrical connection with the substrate. It can be prevented.

Further, by forming a lead protection tape portion, a notch portion and a through hole on the film carrier and forming a supporting portion, a protrusion portion and a protrusion portion corresponding to them on the resin tape side, the film carrier is stored in the accommodating concave portion. The position can be controlled and held, and the inconvenience such as damage and deformation of the electronic component mounting portion and the outer leads due to the movement of the film carrier can be reliably prevented.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a film carrier housing member according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a process of an electronic component mounting method in the same example.

FIG. 3 shows a specific example 1 of the same example, (a)
Is a plan view of the film carrier, (b) is a plan view of a state in which the film carrier is accommodated in the film carrier accommodating member, and (c) is a plan view of the film carrier accommodating member, its longitudinal sectional front view and longitudinal sectional side view.

FIG. 4 shows a specific example 2 of the same example, (a)
Is a plan view of the film carrier, (b) is a plan view of a state in which the film carrier is accommodated in the film carrier accommodating member, and (c) is a plan view of the film carrier accommodating member, its longitudinal sectional front view and longitudinal sectional side view.

FIG. 5 shows a specific example 3 of the same example, (a)
Is a plan view of the film carrier, (b) is a plan view of a state in which the film carrier is accommodated in the film carrier accommodating member, and (c) is a plan view of the film carrier accommodating member, its longitudinal sectional front view and longitudinal sectional side view.

FIG. 6 shows a specific example 4 of the same example, (a)
Is a plan view of the film carrier, (b) is a plan view of a state in which the film carrier is accommodated in the film carrier accommodating member, and (c) is a plan view of the film carrier accommodating member, its longitudinal sectional front view and longitudinal sectional side view.

FIG. 7 is a cross-sectional view showing steps of a conventional electronic component mounting method.

FIG. 8 is a cross-sectional view showing the steps of another conventional electronic component mounting method.

FIG. 9 is a vertical cross-sectional view of a mounting process of a film carrier having a molded outer lead in a conventional example.

[Explanation of reference numerals] 1 film carrier 2 outer lead 4 film carrier tape 5 electronic component 6 film carrier storage member 7 resin tape 8 storage recess 9 escape recess 10 substrate 12 lead protection tape portion 13 support portion 14 notch portion 15 protrusion portion 16 penetration Hole 17 protrusion

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H05K 13/02 B

Claims (10)

[Claims] 1. A plurality of film carriers formed by mounting electronic parts on a flexible tape, one in each accommodating recess formed in the longitudinal direction of the resin tape in accordance with the shape of the film carrier, and the electronic parts. An electronic component mounting method comprising: a step of locating and mounting the mounting portion in a recess so that the mounting portion does not come into contact with the resin tape; and a step of taking out a film carrier from the recessed portion of the resin tape and mounting it on a substrate. . 2. A film carrier formed by mounting electronic parts on a flexible tape, one in each storage recess formed in the longitudinal direction of the resin tape in accordance with the shape of the film carrier, and the electronic parts. The method includes a step of escaping the mounting portion and the molded outer lead so as not to contact the resin tape so as to be located in the concave portion, and a step of taking out the film carrier from the accommodating concave portion of the resin tape and mounting the film carrier on the substrate. Electronic component mounting method. 3. A film carrier having lead protection tape portions formed on both outer sides of an outer lead row, and a resin tape having a support portion for the lead protection tape portion formed in a storage recess. The electronic component mounting method according to 1 or 2. 4. A resin tape having a cutout formed at least at one location and a resin tape having a protrusion formed in the storage recess for engaging with the cutout. Electronic component mounting method. 5. A resin tape having a through hole formed at least at one location and a resin tape having a protrusion recessed into the storage recess formed in the storage recess. Electronic component mounting method. 6. A plurality of storage recesses for storing a film carrier formed by mounting electronic components on a flexible tape are formed in a longitudinal direction of a resin tape, and each storage recess is in contact with an electronic component mounting portion of the film carrier. A film carrier accommodating member, characterized in that a relief recess for preventing the above is formed. 7. The film carrier accommodating member according to claim 6, wherein the accommodating recess is provided with a relief recess for preventing contact between the electronic component mounting portion and the molded outer lead. 8. The member for accommodating a film carrier according to claim 6, wherein the accommodating recesses are provided with support portions for lead protection tape portions formed on both outer sides of the outer lead row in the film carrier. 9. The film carrier accommodating member according to claim 6, wherein the accommodating recess has a protrusion that engages with a notch formed in the film carrier. 10. The member for accommodating a film carrier according to claim 6, wherein the accommodating recess is formed with a protrusion that fits into a through hole formed in the film carrier.