JPH0712108B2 - Package with adapter for surface mount components - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package, in particular, a surface mounting component is mounted on the upper surface side thereof, and another substrate is provided by a conductor pin protruding from the lower side thereof. The present invention relates to a package with an adapter for surface-mounting components for mounting on, for example,

(Prior Art) Generally, when a gate array IC or a programmable IC as a surface mount component is used to form a package for a surface mount component in which an electronic circuit block composed of a general-purpose individual IC is integrated, Since many I / O signal terminals are formed on the surface mounting component, it is necessary to attach a large number of connection pins or conductor pins corresponding to these I / O signal terminals in a grid pattern.

In order to meet such a demand, the applicant attaches a flat package programmable IC (3) on a printed wiring board (1) as shown in FIG. 3, and attaches it to a pin grid array type connecting pin. We have already proposed a package for surface mount components that is fixedly formed on a printed wiring board (2) having (4). Since this surface mount component package is standardized, interconnection between program ICs (3) must be performed when the logic circuit scale of one programmable IC (3) is exceeded. In such a case, the interconnection between the program ICs (3) needs to be made on the base printed wiring board (9), but the effect of bringing the functional blocks of the electronic circuit together may be diminished. . Therefore, the development cost of the base printed wiring board (9) is increased, and the printed wiring board (1) or (2) needs to have a high wiring density. It causes a cost increase. Furthermore, the pin grid array type connection pin arrangement is advantageous for surface mount component packages that have a large number of connection pins. It can be said that it is contrary to the fact that it is easy to manufacture.

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and a problem to be solved is insufficient density of a surface mount component package of this type. .

The object of the present invention is to use a conversion adapter printed wiring board (10) as a part of a standardized surface mount component package as shown in FIG. Other large printed wiring boards, usually called motherboards, correspond to this.) The connection pins (4) that need to be connected are connected to the external connection pins (14) using a conductor circuit (15) and surface mounted. The connection pins (4) that require connection between the pins of the component package are conductor circuits (1
By using 2), a large-scale electronic circuit that cannot be realized with one surface mounting component such as a programmable IC is integrated into one electronic circuit block, and a package for surface mounting component with only external connection pins is provided. Especially.

(Means for Solving Problems) In order to solve the above problems, the means adopted by the present invention will be described with reference to the drawings corresponding to the embodiments. “Surface mounting formed on the surface side A first substrate (1) having a connecting portion (5) for mounting the component (3) and a first through hole (7) electrically connected to the connecting portion (5); A first conductor pin (4) which is provided and is electrically connected to the adapter printed wiring board (10) and electrically connected to the first conductor pin (4) and has a one-to-one correspondence with the connection portion (5). And a second substrate (2) having a second through hole (8) which is integrated with the first substrate (1), and is disposed below the second substrate (2). The third through hole (16) in which the first conductor pin (4) is supported is different from these third through holes (16). And a conductor layer (12) selectively connecting the third through hole (16) and the fourth through hole (13).
(15) and a second conductor pin (14) supported by the fourth through hole (13), and each connection portion (5) on the first substrate (1) is provided by the second conductor pin (14). And an adapter printed wiring board (10) adapted to establish electrical continuity between the board and another board (9).

That is, it has a second substrate (2) having a large number of electrically conductive first conductor pins (4), and a connection portion (5) on which a surface mounting component (3) can be mounted. A package for a surface mount component, which has a structure in which a programmable IC (3) of a flat package is surface-mounted having a first substrate (1), and an adapter printed wiring board (10) as shown in FIG. Is what you use. As a result, the first conductor pin (4), which needs to be connected to the outside of the surface mount component package, is connected to the second conductor pin (14) using the conductor circuit (15). The first conductor pin (4) that requires connection between pins is the conductor circuit (1
2) can be used, and a large-scale electronic circuit that cannot be realized by one programmable IC is made into one surface mount component package, and only external connection pins can be taken out.

(Operation of the Invention) In the surface mount package having the structure of FIG. 1 which is manufactured as a standard in advance, the first conductor pin (4) arranged under the second substrate (2) has a surface. It has a one-to-one correspondence with the connection terminals of the programmable IC as the mounting component (3). Therefore, as shown in FIG. 2, the connection between the programmable ICs can be made using the third through hole (16) and the conductor circuit (12) via the first conductor pin (4). The wiring density of the base printed wiring board (9) (motherboard), which is another board shown in FIG. 1, can be reduced, and a large-scale electronic circuit can be constructed. Further, in this surface mount component package, the first conductor pin (4) that needs to be connected to the outside has a third through hole (16), a conductor circuit (15), and a fourth through hole (1).
By connecting to the second conductor pin (14) through (3) and taking out only the necessary connecting pins, the number of connecting pins is also reduced, so that the connecting pin arrangement can be converted to a dual in-line type or the like.

(Embodiment) Next, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view of FIG. The second substrate (2) has a second through hole (8) for inserting the first conductor pin (4), the side wall of which has the first through hole (7).
Is connected to a conductor pattern for surface-mounted components formed on the front surface side of the first substrate (1) via. In this way, the first conductor pins (4) are respectively mounted on the surface mounting parts (3).
Are electrically connected one to one. The arrangement of the first conductor pins (4) is normally arranged in a 0.1 inch inch grid and is located underneath the surface mount component (3). In this way, the adapter printed wiring board (10) is inserted into the connection pins of the surface mount component package standardized and soldered (6). Programmable adapter printed wiring board (10) is necessary if conductor pattern (12) connecting desired programmable IC terminals and third through hole (16) for inserting first conductor pin (4) are formed in advance. The first conductor pin (4) that can be connected to the IC terminal and needs to be connected to the outside of the surface mount package is the conductor pattern (15) and the fourth through hole (1).
It can be connected to the second conductor pin (14) via 3).

(Effects of the Invention) For a surface mount component package standardized by the number of first conductor pins (4) and the number of surface mount components (3) to be mounted as shown in FIG. Is a surface mount component (3) capable of forming one logic circuit, and when the electronic circuit is fixed by the method specified by the manufacturer of the surface mount component (3) and the logic circuit scale is insufficient, It can be used in combination with other surface mount components (3). At this time, if the connection is to be realized only on the illustrated first and second substrates (1) and (2), it is necessary to design and manufacture each substrate (1) and (2) for each target circuit. Yes, the standardization benefits are reduced. Wiring on the base printed wiring board (9) greatly reduces the effect of combining the functional blocks of the electronic circuit. Therefore, the development cost of the base printed wiring board (9) is increased, and the printed wiring boards (1) and (2) are required to have a high wiring density. Therefore, the cost of the base printed wiring board (9) having a large area is increased. Rises.

On the other hand, by adopting the configuration of the present invention and using the double-sided printed wiring board in which the positions and the outer shapes of the through holes are standardized for the pin-connector adapter printed wiring board as in the case of the surface mount component package, It can be manufactured at a low cost with the effect of bringing the functional blocks together, and the number of connection pins for the base printed wiring board (9) is reduced. Therefore, as an example of effective use of the base printed wiring board (9), it can be arranged like the electronic component (17) shown in FIG.

[Brief description of drawings]

FIG. 1 is a perspective view of a surface mount component package of the present invention,
2 is a partially enlarged sectional view of FIG. 1, and FIG. 3 is a perspective view of a conventional surface mount component package. Explanation of reference numerals (1), (2) ... First and second substrates, (3) ... Surface mounting component, (4) ... First conductor pin, (5) ... Surface mounting component conductor pattern Connection part, (6) ...... soldering, (7) ... first through hole, (8) ... second through hole, (9) ... base printed wiring board (other board) (10 ... … Adapter printed wiring board, (12) …… Pin-connecting conductor pattern, (13) …… Fourth through hole for inserting second conductor pin, (14) …… Second conductor pin, (1
5) ...... Connection pin-conductor pattern for external connection pin connection,
(16) …… Third through hole for inserting the first conductor pin,
(17) …… Electronic circuit parts, (21) …… Through holes for inserting external connection pins.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H05K 7/08 7301-4E

Claims (2)

[Claims] 1. A first substrate having a connection portion formed on the front surface side for mounting a surface mounting component, and a first through hole electrically connected to the connection portion; and a first substrate provided on the back surface side. A first conductor pin for electrically connecting to the adapter printed wiring board, and a second through hole electrically connected to the first conductor pin and having a one-to-one correspondence with the connecting portion, and the first substrate. A third through hole which is provided on the lower side of the second substrate and which supports the first conductor pins, and a fourth through hole which is different from the third through hole. A through hole, a conductor layer for selectively connecting the third through hole and the fourth through hole, and a second conductor pin supported by the fourth through hole. Each connection part on one board Other substrate and the surface mount package with component adapter comprising the adapter printed wiring board for enable conduction. 2. The surface mounting component is a programmable IC
The package with an adapter for surface-mounted components according to claim 1, wherein