JPH03205859A - Semiconductor device - Google Patents

Abstract

PURPOSE:To provide many pins without altering the size of a package by providing first pins provided on the lower surface of the package, and second pins provided on the side of the package and bent downward from its side. CONSTITUTION:In a semiconductor device 3 having a package 31 which has a semiconductor chip 12 and a plurality of pins 33 so provided as to protrude externally of the package 31, the pins 33 has first pins 33a provided on the lower surface of the package 31, and second pins 33b provided on the side of the package and bent downward from its side. For example, the LSI 3 is placed on a printed board 10, the pins 33a are passed via the through holes 10a of the board 10 and soldered to be mounted similarly to the pins of the LSI of a PGA type, and the pins 33b are soldered to the wiring pattern 10b of the board to be mounted similarly to the pins of the LSI of a QFP type.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a semiconductor device mounted on the surface of a printed circuit board.

[Prior Art] A conventional semiconductor device will be described with reference to FIGS. 3 and 4. In FIG. 3, reference numeral 1 denotes a pin grid array (hereinafter referred to as PGA) type semiconductor device (hereinafter referred to as LSI) as an insert type package. This PGA type LS1 includes a package 11 molded from an insulating material such as resin or ceramic and having a semiconductor chip 12 mounted therein, and a signal and It consists of pins 13 for power supply, etc.

This PGA type LSII is mounted on a printed circuit board 10, and the pins 13 are passed through the through holes 10a formed in the printed circuit board 10 and soldered as shown in FIG. 3(b). Alternatively, a part of the pin 3 is soldered and mounted on the wiring pattern 10b formed on the printed circuit board 10.

Further, in FIG. 4, reference numeral 2 denotes a quarter flat package (hereinafter referred to as QFP) type LSI as a mount type package. This QFP type LSI2
It is molded from an insulating material and has a semiconductor chip inside. It consists of a package 21 on which 12 is placed, and pins 23 provided on four side surfaces 21a of this package 21. The pins 23 are shaped so as to be bent downward from the four side surfaces 21a of the package 21 and then protrude outward.

This QFP type LSI 2 is mounted on a printed circuit board 10, and the pins 23 are soldered to the wiring pattern 10b formed on the printed circuit board 10 as shown in FIG. 4 fbl.

[Problem to be solved by the invention] Since the conventional semiconductor device is structured as described above,
The number of pins 13, 23 that can be provided is limited by the size of the package 11, 21 and the spacing between pins that can be mounted, and it is not possible to provide a large number of wiring lines, making it impossible to respond to high integration of semiconductor chips. Additionally, increasing the number of pins required a larger package.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a semiconductor device in which a large number of pins can be provided without changing the size of the package.

[Means for Solving the Problems] A semiconductor device according to the present invention includes a package having a semiconductor chip, and a plurality of pins provided so as to protrude outward from the package, and the pins are connected to the package. It consists of a first pin provided on the bottom surface and a second pin provided on the side surface of the package and bent downward from the side surface.

[Function] The semiconductor device according to the present invention allows many wirings to be provided to the semiconductor chip by the first pin provided on the bottom surface of the package and the second pin provided on the side surface of the package.

[Embodiment] A semiconductor device which is an embodiment of the present invention will be described below with reference to FIG. Components that are the same as those in FIGS. 3 and 4 are designated by the same reference numerals, and the description thereof will be omitted. FIG. 1 al and FIG. 1 bl are upper and lower external perspective views of the LSI of this embodiment, and FIG. 1 tel is a side view showing the mounting state of this LSI.

In the figure, 3 is an LSI, and this LSI 3 includes a package 31 molded from an insulating material and on which a semiconductor chip 12 is mounted, and a first pin 33a provided so as to protrude downward from the lower surface 31a of this package 31. and a second pin 33 provided on the four side surfaces 3lb of the package 31.
It consists of.

The second pin 33b is connected to the side surface 3l of the package 31.
After being bent downward from b, the lower surface 3 of the package 31
It is shaped like it protrudes outward below 1.a.

This LSI 3 has a printed circuit board 1 as shown in FIG.
0, and the lth pin 33a is shown in FIG.
Printed circuit board 10 similar to pin 13 of type LSII
It is mounted by passing through the through hole 10a and soldering. Further, the second pin 33b is soldered and mounted on the wiring pattern 10b of the printed circuit board 10 in the same manner as the pin 23 of the QFP type LSI 2 shown in FIG.

With the above structure, it is possible to provide the package 31 with more than twice the number of pins compared to the conventional LSII,2, and the size of the package 31 can be reduced to 11.2 times that of the conventional package.
It is possible to provide a large number of wiring lines to the semiconductor chip 12 without changing the structure of the semiconductor chip 12, and it is possible to cope with higher integration of the semiconductor chip 12.

Note that in this embodiment, the first pin 33a is passed through the through hole 10a of the printed circuit board 10, but
The tip may be mounted as is on the wiring pattern 10b,
In this case, the tips of the first pin 33a and the second pin 33b may be formed at the same position.

Furthermore, in this embodiment, the second pin 33b is shaped so as to be bent downward from the side surface 33a of the package 33 and then protrude outward; however, as shown in FIG. It may be bent downward from the side surface 3lb of the package 31 and formed to have the same length as the first pin 33a; in this case, the first and second pins 33a, 33c
They may be mounted by passing through the through holes 10a of the printed circuit board 10 and soldering them respectively.

[Effects of the Invention] As described above, according to the present invention, in a semiconductor device, the first pin is provided on the bottom surface of the package, and the second pin is provided on the side surface of the package, so that pins can be formed without changing the size of the package. The number of chips can be increased, making it possible to cope with higher integration of semiconductor chips.

[Brief explanation of drawings]

FIGS. 1A and 1B are upper and lower external perspective views of a semiconductor device according to an embodiment of the present invention, FIG. Figure ta
+ and FIG. 2 (1)) are external perspective views and side views showing the mounting state of a semiconductor device according to another embodiment of the present invention, and FIG. 3 fa) and FIG. 4 ial are views of a conventional semiconductor device. -E perspective external view, FIG. 3(b) and FIG. 4 tb+ are side views showing the mounting state of a conventional semiconductor device. 1,2.3...LSI. 11, 21. 31... Package, 12... Semiconductor chip, 33a... First l pin, 33b... Second pin.

Claims (1)

[Claims] A semiconductor device comprising a package having a semiconductor chip and a plurality of pins provided so as to protrude outward from the package, the pins including a first pin provided on the bottom surface of the package and a side surface of the package. and a second pin bent downward from the side surface of the semiconductor device.