JPH0697614A - Multilayer board - Google Patents
Multilayer boardInfo
- Publication number
- JPH0697614A JPH0697614A JP24232992A JP24232992A JPH0697614A JP H0697614 A JPH0697614 A JP H0697614A JP 24232992 A JP24232992 A JP 24232992A JP 24232992 A JP24232992 A JP 24232992A JP H0697614 A JPH0697614 A JP H0697614A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- resin
- resin plate
- layer
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010949 copper Substances 0.000 claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 9
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 8
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 abstract description 10
- 125000003118 aryl group Chemical group 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 3
- 229920000728 polyester Polymers 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 35
- 230000001070 adhesive effect Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- -1 aromatic diol Chemical class 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板等として
使用される積層基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated board used as a printed board or the like.
【０００２】[0002]
【従来の技術】一般的なプリント基板は、樹脂製の基板
に銅または銅合金層を形成し、この銅または銅合金層を
エッチング等により部分的に除去することによって回路
を形成したもので、前記基板の材質としては、ベークラ
イト，フェノール樹脂，エポキシ樹脂，ガラス繊維添加
エポキシ樹脂などが通常使用されている。2. Description of the Related Art A general printed circuit board has a circuit formed by forming a copper or copper alloy layer on a resin substrate and partially removing the copper or copper alloy layer by etching or the like. As the material of the substrate, bakelite, phenol resin, epoxy resin, glass fiber added epoxy resin, etc. are usually used.
【０００３】[0003]
【発明が解決しようとする課題】ところで、最近では温
度変化に強い素子が開発されるに伴い、温度変化の烈し
い環境下でも電子機器が広範に使用されつつあり、プリ
ント基板の熱膨張に関する問題が生じ始めている。By the way, with the recent development of elements that are resistant to temperature changes, electronic devices are being widely used even in an environment where the temperature changes drastically, and there is a problem related to thermal expansion of the printed circuit board. Is starting to occur.
【０００４】例えば、一般的な樹脂を使用した基板では
高温時にプリント基板に反りが生じ易く、短絡や断線の
おそれが生じる。また、繊維添加樹脂では、温度サイク
ルが大きい場合に銅層が基板から剥離してやはり前記同
様の配線不良を引き起こすおそれがある。For example, in a board using a general resin, the printed board is apt to warp at a high temperature, which may cause a short circuit or disconnection. Further, in the fiber-added resin, when the temperature cycle is large, the copper layer may be peeled off from the substrate to cause the same wiring failure as described above.
【０００５】これらの問題は、いずれも基板と銅層の熱
膨張係数の差に起因するものである。すなわち、一般的
な樹脂基板の場合には、銅層よりも基板の熱膨張係数が
大きいために銅層側が凹面になるように基板が反り、ま
た、繊維添加樹脂では銅層よりも熱膨張係数が小さいた
めに熱サイクルにつれて銅層が弛み、基板から剥離する
のである。All of these problems result from the difference in the coefficient of thermal expansion between the substrate and the copper layer. That is, in the case of a general resin substrate, the substrate has a larger thermal expansion coefficient than the copper layer, so the substrate warps so that the copper layer side becomes a concave surface, and in the fiber-added resin, the thermal expansion coefficient is larger than that of the copper layer. Because of the small value, the copper layer becomes loose and peels from the substrate as the heat cycles.
【０００６】なお、従来使用されている基板および銅層
の熱膨張係数を挙げると次の通りである。（単位：／
℃） ベークライト ：３０〜４０×１０-6 フェノール樹脂 ：２０〜７０×１０-6 エポキシ樹脂 ：２５〜４０×１０-6 ガラス繊維添加エポキシ樹脂：５〜１０×１０-6 銅（銅合金もほぼ同様） ：１７×１０-6 The thermal expansion coefficients of the conventionally used substrate and copper layer are as follows. (unit:/
C.) Bakelite: 30-40 × 10 −6 Phenolic resin: 20-70 × 10 −6 Epoxy resin: 25-40 × 10 −6 Glass fiber-added epoxy resin: 5-10 × 10 −6 Copper (Almost copper alloy is also used) The same): 17 × 10 -6
【０００７】繊維添加樹脂は、繊維の添加量や材質を調
整することにより銅層と同程度の熱膨張係数に設定する
ことも可能ではあるが、繊維添加樹脂は、繊維の混入に
より樹脂の回収・再生が困難であるため、資源再利用の
点からは好ましくない。The fiber-added resin can be set to have a thermal expansion coefficient similar to that of the copper layer by adjusting the amount and material of the fiber added, but the fiber-added resin is recovered by mixing the fibers. -Reproduction is difficult, which is not preferable from the viewpoint of resource reuse.
【０００８】本発明は上記事情に鑑みてなされたもの
で、温度変化にともなう銅層の剥離や基板の変形を防
ぎ、かつ樹脂の再利用が容易な積層基板を提供すること
を課題としている。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laminated substrate in which peeling of a copper layer and deformation of a substrate due to temperature change are prevented and a resin can be easily reused.
【０００９】[0009]
【課題を解決するための手段】以下、本発明に係る積層
基板を具体的に説明する。この積層基板は、熱膨張係数
が１５〜１９×１０-6 ／℃である液晶ポリマー製の樹
脂板と、その上に設けられた銅含有率が９５％以上の銅
または銅合金層とを具備したものである。The laminated substrate according to the present invention will be specifically described below. This laminated substrate comprises a resin plate made of a liquid crystal polymer having a coefficient of thermal expansion of 15 to 19 × 10 −6 / ° C., and a copper or copper alloy layer having a copper content of 95% or more provided thereon. It was done.
【００１０】前記樹脂板の具体的な材質としては、サー
モトロピック液晶ポリマーである芳香族液晶ポリエステ
ルが一般的であり、芳香族ジオール、芳香族ジカルボン
サン、芳香族ヒドロキシカルボン酸の組み合わせと組成
比、重合配列などを変えることにより、熱膨張係数を１
５〜１９×１０-6／℃に設定すればよい。ただし、その
他の液晶ポリマーも熱膨張率の範囲を満たす限り使用可
能である。As a concrete material of the resin plate, an aromatic liquid crystal polyester which is a thermotropic liquid crystal polymer is generally used, and a combination and a composition ratio of an aromatic diol, an aromatic dicarboxylic sun and an aromatic hydroxycarboxylic acid, The thermal expansion coefficient is set to 1 by changing the polymerization sequence.
It may be set to 5 to 19 × 10 -6 / ° C. However, other liquid crystal polymers can be used as long as they satisfy the range of the coefficient of thermal expansion.
【００１１】なお、本発明に係る積層基板では樹脂板と
銅層との熱膨張率の差の問題を解決することができるの
で、樹脂板の厚さ範囲を従来品よりも拡大することがで
きる。Since the laminated board according to the present invention can solve the problem of the difference in coefficient of thermal expansion between the resin plate and the copper layer, the thickness range of the resin plate can be expanded as compared with the conventional product. .
【００１２】導電層の材質としては、Ｃｕ含有率が９５
％以上の銅または銅合金が使用される。Ｃｕ含有率が９
５％未満では銅層の電気伝導度がＩＡＣＳ６０％未満
（純銅の電気伝導度の６０％未満）となって積層基板の
電気伝導度に関する規格を満たすことができない。具体
的な材質としては無酸素銅、ジルコニウム銅、鉄入銅、
りん脱酸銅、電解銅などが挙げられる。具体的な組成例
は以下の通りである。The material of the conductive layer has a Cu content of 95.
% Or more of copper or copper alloy is used. Cu content is 9
If it is less than 5%, the electrical conductivity of the copper layer will be less than IACS 60% (less than 60% of the electrical conductivity of pure copper), and the standard regarding the electrical conductivity of the laminated substrate cannot be satisfied. Specific materials include oxygen-free copper, zirconium copper, iron-containing copper,
Examples include phosphorous deoxidized copper and electrolytic copper. A specific composition example is as follows.
【００１３】 無酸素銅／Ｃｕ：９９．９９％，Ｏ2：１０ｐｐｍ以下
（熱膨張係数：１７．０×１０-6／℃） ジルコニウム銅／Ｚｒ：０．１％，Ｃｕ：残部（熱膨張
係数：１７．７×１０-6／℃） 鉄入銅／Ｆｅ：０．１２％，Ｐ：０．０３８％，Ｃｕ：
残部（熱膨張係数：１７．０×１０-6／℃） 鉄入銅／Ｆｅ：２．３５％，Ｐ：０．０３５％，Ｚｎ：
０．１５％，Ｃｕ：残部（熱膨張係数：１６．７×１０
-6／℃）Oxygen-free copper / Cu: 99.99%, O 2 : 10 ppm or less (coefficient of thermal expansion: 17.0 × 10 −6 / ° C.) Zirconium copper / Zr: 0.1%, Cu: balance (thermal expansion Coefficient: 17.7 × 10 −6 / ° C.) Iron-containing copper / Fe: 0.12%, P: 0.038%, Cu:
Remainder (coefficient of thermal expansion: 17.0 × 10 −6 / ° C.) Iron-containing copper / Fe: 2.35%, P: 0.035%, Zn:
0.15%, Cu: balance (coefficient of thermal expansion: 16.7 × 10
-6 / ℃)
【００１４】導電層の厚さは従来品と同様でよく、通常
は０．３〜０．５μｍ程度とされるが、本願発明ではこ
の範囲に限定されることはない。また、導電層は樹脂板
の両面に設けてもよい。The thickness of the conductive layer may be the same as that of the conventional product, and is usually about 0.3 to 0.5 μm, but the present invention is not limited to this range. The conductive layers may be provided on both sides of the resin plate.
【００１５】導電層を樹脂板に接着する方法としては、
通常の積層基板に使用されているいかなる方法も使用可
能であり、例えば熱圧着や接着が可能である。熱圧着は
導電層と樹脂板とをプレスし同時に加熱する方法であ
る。一方、具体的な接着剤としては、ポリエチレンテレ
フタレート（ＰＥＴ），エポキシ系接着剤，フェノール
系接着剤，ゴム系接着剤，アクリル系接着剤，ウレタン
系接着剤などが挙げられる。接着剤層の厚さは一般に５
〜２０μｍが好適であるが、この範囲に限定されること
はない。なお、本発明の積層基板では、基板の反りや導
電層の剥離が防止できることから、その分接着剤の接着
力が弱くて済み、リサイクル時に導電層を分離すること
を容易化できる。As a method for adhering the conductive layer to the resin plate,
Any method used for ordinary laminated substrates can be used, for example, thermocompression bonding or adhesion is possible. Thermocompression bonding is a method in which the conductive layer and the resin plate are pressed and heated at the same time. On the other hand, specific adhesives include polyethylene terephthalate (PET), epoxy adhesives, phenolic adhesives, rubber adhesives, acrylic adhesives, urethane adhesives and the like. The thickness of the adhesive layer is generally 5
-20 μm is preferable, but not limited to this range. In the laminated substrate of the present invention, since the warp of the substrate and the peeling of the conductive layer can be prevented, the adhesive strength of the adhesive can be weakened accordingly, and the conductive layer can be easily separated at the time of recycling.
【００１６】樹脂板に接合する前に、導電層の接着面に
Ｃｕ2ＳＯ4溶液やＨ2ＳＯ4溶液を作用させて表面粗化を
行ない、接合強度を高めても良い。Before bonding to the resin plate, the bonding surface of the conductive layer may be roughened by applying a Cu 2 SO 4 solution or a H 2 SO 4 solution to increase the bonding strength.
【００１７】なお、導電層にプリントパターンを作成す
る方法としては、従来と同様に以下のような方法が採ら
れる。 １．導電層表面に、脱脂処理、希Ｈ2ＳＯ4等を用いた酸
洗、および湯洗処理を施して清浄化する。 ２．導電層表面に感光剤（レジスト）を塗布する。 ３．感光剤表面に写真印刷し、さらに必要であれば印刷
面をエナメル化したのち現像する。 ４．導電層を塩化第二鉄水溶液等でエッチングし、回路
パターン外の部分の導電層を溶解除去する。 ５．回路パターン上の感光剤を除去して製品とする。As a conventional method for forming a print pattern on the conductive layer, the following method is adopted. 1. The surface of the conductive layer is cleaned by degreasing, pickling with diluted H 2 SO 4, etc., and washing with hot water. 2. A photosensitive agent (resist) is applied to the surface of the conductive layer. 3. Photographic printing is performed on the surface of the photosensitizer, and if necessary, the printed surface is enameled and then developed. 4. The conductive layer is etched with an aqueous solution of ferric chloride to dissolve and remove the conductive layer outside the circuit pattern. 5. The photosensitive material on the circuit pattern is removed to obtain a product.
【００１８】[0018]
【実施例】次に、実施例を挙げて本発明の効果を実証す
る。 （実施例）厚さ０．０７０ｍｍ×幅２５０ｍｍ×長さ５
００ｍｍの無酸素銅箔（Ｃｕ：９９．９９％，Ｏ2 ：１
０ｐｐｍ以下）を、樹脂板にエポキシ系接着剤を用いて
接着し、積層基板を作成した。樹脂板としては、液晶ポ
リマーである芳香族ポリエステル（商品名：エコノール
／住友化学株式会社製）の厚さ３ｍｍ×幅２５０ｍｍ×
長さ５００ｍｍの板材を使用した。導電層の熱膨張係数
は１７．０×１０-6／℃、樹脂基板の熱膨張係数は１
６．２×１０-6／℃であった。EXAMPLES Next, the effects of the present invention will be demonstrated with reference to examples. (Example) Thickness 0.070 mm x width 250 mm x length 5
00 mm oxygen-free copper foil (Cu: 99.99%, O 2 : 1
0 ppm or less) was bonded to a resin plate using an epoxy adhesive to form a laminated substrate. As the resin plate, an aromatic polyester (trade name: Econol / Sumitomo Chemical Co., Ltd.), which is a liquid crystal polymer, has a thickness of 3 mm and a width of 250 mm.
A plate material having a length of 500 mm was used. The thermal expansion coefficient of the conductive layer is 17.0 × 10 -6 / ° C, and the thermal expansion coefficient of the resin substrate is 1
It was 6.2 × 10 -6 / ° C.
【００１９】（比較例１〜３）前記と同じ無酸素銅箔
を、前記樹脂板と同寸法のエポキシ樹脂，フェノール樹
脂，およびガラス繊維添加エポキシ樹脂からなる樹脂板
に前記と同じ接着剤を用いて接着した。(Comparative Examples 1 to 3) The same oxygen-free copper foil as described above was used for a resin plate made of an epoxy resin, a phenol resin, and a glass fiber-added epoxy resin having the same dimensions as the resin plate, and the same adhesive was used as described above. Glued together.
【００２０】（実験１）前記実施例および比較例１−３
の積層基板に対しそれぞれＪＩＳＣ６４８１（印刷回路
用銅張積層板試験方法）の耐熱性試験５．６を行った。
各積層基板を５０×５０ｍｍに切断し、得られた試験片
を試験片立てに挿入し、１４０±２℃に保った恒温槽中
に入れ、３０分経過後、直ちに導電層の剥離強度を確認
した。実験結果を表１に示す。(Experiment 1) The above-mentioned Examples and Comparative Examples 1-3
The heat resistance test 5.6 of JIS C6481 (copper clad laminate test method for printed circuits) was performed on each of the laminated substrates of (1).
Each laminated substrate is cut into 50 × 50 mm, the obtained test piece is inserted into a test piece stand, placed in a constant temperature bath maintained at 140 ± 2 ° C., and after 30 minutes, the peel strength of the conductive layer is immediately confirmed. did. The experimental results are shown in Table 1.
【００２１】[0021]
【表１】 [Table 1]
【００２２】（実験２）前記実施例および比較例１〜３
の積層基板に対し、それぞれＪＩＳＣ−５０１２（印刷
配線板試験方法）の９．耐候性試験の９．２熱衝撃を行
った。各積層基板を５０×５０ｍｍに切断し、得られた
試験片を試験片立てに挿入し、熱衝撃試験器内にて、−
６５±３℃×３０分，１２５±３℃×３０分の冷却およ
び加熱を５サイクル行い、テスト後直ちに配線の剥離、
浮き上がりを確認した。実験２の結果を表２に示す。(Experiment 2) The above-mentioned Example and Comparative Examples 1 to 3
JIS C-5012 (printed wiring board test method) for each of the laminated substrates of 9). The weather resistance test of 9.2 thermal shock was performed. Each laminated substrate was cut into 50 × 50 mm, the obtained test piece was inserted into a test piece stand, and in a thermal shock tester, −
5 cycles of cooling and heating for 65 ± 3 ° C × 30 minutes, 125 ± 3 ° C × 30 minutes, peeling of wiring immediately after the test,
I confirmed the rise. The results of Experiment 2 are shown in Table 2.
【００２３】[0023]
【表２】 [Table 2]
【００２４】[0024]
【発明の効果】本発明に係る積層基板では、液晶ポリマ
ー製の樹脂板の熱膨張係数が、Ｃｕ含有率が９５％以上
の銅または銅合金層の熱膨張係数とほぼ等しいため、従
来の積層基板の使用可能温度を越える低温または高温に
おいても温度変化にともなう銅層の剥離や基板の変形が
生じにくい。In the laminated substrate according to the present invention, the coefficient of thermal expansion of the resin plate made of a liquid crystal polymer is almost equal to that of the copper or copper alloy layer having a Cu content of 95% or more. Even at a low temperature or a high temperature exceeding the usable temperature of the substrate, the copper layer is less likely to be peeled off or the substrate is deformed due to the temperature change.
【００２５】また、温度変化にともなう銅層の剥離や基
板の変形が生じにくい分、銅または銅合金層と樹脂板と
の接着強度が低くてもよく、従来の積層基板よりも、銅
または銅合金層と樹脂板との剥離を容易化することがで
きる。これにより、破棄時には樹脂板だけを回収するこ
とが容易になり、樹脂板に繊維等の添加物が含まれない
ことと相まって樹脂板の再利用が容易である。Further, since the peeling of the copper layer and the deformation of the substrate due to the temperature change are less likely to occur, the adhesive strength between the copper or copper alloy layer and the resin plate may be lower, and the copper or copper layer may be formed more than the conventional laminated substrate. It is possible to easily separate the alloy layer and the resin plate. This makes it easy to collect only the resin plate at the time of discarding, and the resin plate is easy to be reused in combination with the fact that the resin plate does not contain additives such as fibers.
Claims (1)
ある液晶ポリマー製の樹脂板と、その上に設けられたＣ
ｕ含有率が９５％以上の銅または銅合金からなる導電層
とを具備することを特徴とする積層基板。1. A resin plate made of a liquid crystal polymer having a coefficient of thermal expansion of 15 to 19 × 10 −6 / ° C., and C provided thereon.
A laminated substrate comprising a conductive layer made of copper or a copper alloy having a u content of 95% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24232992A JPH0697614A (en) | 1992-09-10 | 1992-09-10 | Multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24232992A JPH0697614A (en) | 1992-09-10 | 1992-09-10 | Multilayer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0697614A true JPH0697614A (en) | 1994-04-08 |
Family
ID=17087580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24232992A Withdrawn JPH0697614A (en) | 1992-09-10 | 1992-09-10 | Multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0697614A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918106A (en) * | 1995-06-28 | 1997-01-17 | Kuraray Co Ltd | Laminated plate and manufacturing method thereof |
| WO2001095683A1 (en) * | 2000-06-08 | 2001-12-13 | World Properties Inc. | Method of manufacturing circuit laminates |
| JP2002353634A (en) * | 2001-05-30 | 2002-12-06 | Kyocera Corp | Multilayer wiring board |
| US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
| JP2003101241A (en) * | 2001-09-25 | 2003-04-04 | Kyocera Corp | Insulating film and multilayer wiring board using the same |
| US6761834B2 (en) | 2000-09-20 | 2004-07-13 | World Properties, Inc. | Electrostatic deposition of high temperature, high performance liquid crystalline polymers |
| EP1180917A3 (en) * | 2000-08-17 | 2005-12-14 | Nikko Metal Manufacturing Co., Ltd | Copper-alloy foil to be used for laminate sheet |
-
1992
- 1992-09-10 JP JP24232992A patent/JPH0697614A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918106A (en) * | 1995-06-28 | 1997-01-17 | Kuraray Co Ltd | Laminated plate and manufacturing method thereof |
| WO2001095683A1 (en) * | 2000-06-08 | 2001-12-13 | World Properties Inc. | Method of manufacturing circuit laminates |
| US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
| EP1180917A3 (en) * | 2000-08-17 | 2005-12-14 | Nikko Metal Manufacturing Co., Ltd | Copper-alloy foil to be used for laminate sheet |
| US6761834B2 (en) | 2000-09-20 | 2004-07-13 | World Properties, Inc. | Electrostatic deposition of high temperature, high performance liquid crystalline polymers |
| JP2002353634A (en) * | 2001-05-30 | 2002-12-06 | Kyocera Corp | Multilayer wiring board |
| JP4508472B2 (en) * | 2001-05-30 | 2010-07-21 | 京セラ株式会社 | Multilayer wiring board |
| JP2003101241A (en) * | 2001-09-25 | 2003-04-04 | Kyocera Corp | Insulating film and multilayer wiring board using the same |
| JP4508498B2 (en) * | 2001-09-25 | 2010-07-21 | 京セラ株式会社 | Multilayer wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6451441B1 (en) | Film with metal foil | |
| JPH0732304B2 (en) | Method for manufacturing microelectronic package | |
| JPH0697614A (en) | Multilayer board | |
| US6013417A (en) | Process for fabricating circuitry on substrates having plated through-holes | |
| JP2001127429A (en) | Method for producing multilayer printed wiring board | |
| EP0675673A2 (en) | Reinforcement for flexible printed circuit board and reinforced flexible circuit board | |
| JP2002280689A (en) | Extremely thin copper foil with support and extremely thin copper foil board using the same | |
| JP4582436B2 (en) | Copper foil with water-soluble resin carrier and printed circuit board using the copper foil | |
| JP4283497B2 (en) | Method for manufacturing printed wiring board | |
| JP3172711B2 (en) | Transfer medium, method of manufacturing the same, and method of manufacturing wiring pattern using the transfer medium | |
| US10595416B2 (en) | Insertion loss reduction and increased bonding in a circuit apparatus | |
| JP4775986B2 (en) | Metal wiring circuit board and manufacturing method thereof | |
| JP2003017822A (en) | Protective film, resin conductor foil laminate with protective film, and method of manufacturing flexible printed wiring board using the same | |
| JP2004303856A (en) | Substrate manufacturing method | |
| US6309805B1 (en) | Method for securing and processing thin film materials | |
| JP3859030B2 (en) | Manufacturing method of multilayer wiring board | |
| KR100228257B1 (en) | Flexible pcb and manufacture method for suitable for fine circuit formation | |
| JPH045888A (en) | Printed wiring board | |
| JPH1110791A (en) | Joining material for manufacture of single metal-applied laminated plate | |
| JP4969147B2 (en) | Manufacturing method of flexible printed wiring board | |
| JPH0394494A (en) | Laminate for flexible printed circuit board | |
| JP3257582B2 (en) | Manufacturing method of TAB | |
| JPS6112873A (en) | Formation of liquid chemical protective layer on edge side of core material | |
| JP2005244039A (en) | Printed wiring board and manufacturing method thereof | |
| JP2000252594A (en) | Double-sided printed-wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991130 |