JPH0686363U - Flexible wiring board - Google Patents

Abstract

(57) [Abstract] [Purpose] When a flexible wiring board is bent, it can be bent surely and easily at a predetermined position. In a bendable flexible wiring board (5) in which a conductor layer is laminated on a flexible insulating substrate (1) to form a wiring pattern (2), a bending portion of the flexible wiring board (5) is The formation ratio of the wiring pattern (2) on the insulating substrate (1) of the bent portion is made smaller than that of the area adjacent to the bent portion so that the hardness is lower than the hardness of the area adjacent to the bent portion. For example, a blank pattern portion (4) is formed on the solid pattern (3) of the wiring pattern (2) along the fold line.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a bendable flexible wiring board in which a wiring pattern is formed on a flexible insulating substrate, and more particularly to a technique for making it possible to easily bend the flexible wiring board at a desired location.

[0002]

[Prior art]

 Flexible wiring boards are used as wiring boards in electronic circuit devices and for mounting electronic components. This flexible wiring board is a wiring pattern formed by laminating a conductor layer on a flexible insulating film such as a polymer film, and can be curved or bent as necessary. Further, since it has a film shape, it has an advantage that the wiring board can be thinned.

Therefore, by utilizing such characteristics, a limited space is provided between an optical system mechanism housed inside the camera body and the housing of the camera, such as in recent electronic cameras. It can be used to efficiently store electronic circuits, and by mounting electronic components on a thin flexible wiring board and wiring inside the camera with the wiring pattern formed on the same board. Since the electronic circuit can be formed and mounted according to the shape of the space inside the camera body, mounting efficiency is greatly improved.

Further, when wiring is performed to an electronic device having a movable portion such as a printer head of a serial printer, the drive circuit and the printer head are connected by a flexible wiring board so that the movement of the printer head is not hindered. A drive signal can be supplied.

[0005]

[Problems to be solved by the device]

 When mounting such a flexible wiring board on an electronic device, it is bent at a specific position due to the shape of the mounting part and the layout of the wiring.However, the flexibility of the flexible board depends on the insulation film being laminated. It depends on the wiring pattern formation rate. For example, in a portion where the wiring pattern is a very wide solid pattern, the occupied area of the conductor layer having a high hardness is large, so that the flexible wiring board in that portion becomes hard and difficult to bend.

Therefore, the conventional flexible wiring board has a disadvantage that it is difficult to bend it at a desired position depending on the state of the wiring pattern. In addition, when the hardness of the flexible substrate is uniform throughout, the bending position may vary.

Therefore, an object of the present invention is to make it possible to easily bend a flexible wiring board at a desired position and reduce variations in the bending position.

[0008]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, according to the present invention, a flexible wiring board is formed by laminating a conductor layer on a flexible insulator board, and a wiring pattern is formed by the conductor layer. In order that the hardness of the bent part of the board is smaller than that of the area adjacent to the bent part, the formation ratio of the wiring pattern on the insulator substrate should be smaller in the bent part than in the area adjacent to the bent part. To be formed.

[0009]

[Action]

 In the above configuration, in the flexible wiring board in which the wiring pattern is formed by the conductor layer, the formation ratio of the wiring pattern on the insulator substrate and the thickness of the conductor layer are larger in the bent portion than in the area adjacent to the bent portion. By forming it so as to be smaller, the amount of the conductor member in the bent portion of the flexible substrate can be made smaller than that in the phosphorus contact portion. As a result, the hardness of the bent portion can be made smaller and the bending can be made extremely easy.

Further, since the hardness of the flexible wiring board at the bending position is made small in advance to facilitate the bending, the flexible wiring board can be surely bent at the position where the bending is required, and variations in the bending position are eliminated.

[0011]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a partially enlarged view around a bent portion of a flexible wiring board 5 according to an embodiment of the present invention, and FIG. 2 is a schematic view showing the entire flexible wiring board 5 having the bent portion of FIG. In the flexible wiring substrate shown in these figures, a conductor layer is laminated on a flexible insulating substrate 1 such as a polymer film to form a wiring pattern 2.

When the flexible wiring board 5 is mounted on an electronic device, the flexible wiring board 5 is bent at the portions indicated by the bending lines AA ′ and BB ′. Therefore, a blank pattern portion or a pattern lacking portion 4 having no linear conductor layer is formed in the solid pattern 3 of the wiring pattern 2 along these bending lines AA 'and BB'.

FIG. 3 is an enlarged view schematically showing the relationship between the blank pattern portion 4 and the bending line (indicated by CC ′ here), which is formed on the insulating substrate 1. A blank pattern portion 4 is formed on the solid pattern 3 along the bending line CC '.

In the flexible wiring board 5 having the above-described structure, since the blank pattern portion 4 is formed along the bending lines A-A 'and BB', the bending portion near the bending line is formed. In, the formation ratio of the wiring pattern 2 on the insulating substrate 1 becomes small. Therefore, since the amount of the conductor member having high hardness is reduced in the bent portion and the hardness of the substrate is reduced, the flexible wiring board 5 can be easily bent in the vicinity of the bending line.

Although a blank pattern is formed in the solid pattern of the wiring pattern in the present embodiment, the width of the normal wiring pattern which is not the solid pattern is slightly narrowed at the bent portion, so that the wiring pattern The easy-bending portion may be formed by reducing the forming ratio.

FIG. 4 is a partially enlarged view of a bent portion of a flexible wiring board 5 according to another embodiment of the present invention, in which both sides of the bent portion along the bending line CC ′ are insulated. The width of the wiring pattern 2 formed on the body substrate 1 is widened to form a so-called top hat pattern.

FIG. 5 is a partially enlarged view of a flexible wiring board 5 according to yet another embodiment of the present invention in the vicinity of a bent portion, in which the widths of two wiring patterns 2 that intersect with the bent portion and are adjacent to each other. , The blank portion of the wiring pattern 2 is formed in the bent portion by changing the ratio so that the ratio is opposite on both sides of the bent portion along the bending line CC ′.

FIG. 6 is a partially enlarged view of a flexible wiring board 5 according to yet another embodiment of the present invention around a bent portion, in which the widths of two adjacent wiring patterns 2 that intersect the bent portion and are adjacent to each other. , A wide portion is formed so that the portions adjacent to the bent portion along the bending line C-C 'can be interlaced with each other.

In these embodiments, in the portion adjacent to the bent portion of the flexible wiring board 5, the amount of the conductor member is large, so that the hardness of the substrate is larger than that of the bent portion, and the relative bent portion is relatively large. Since the hardness of the flexible wiring board 5 is small and it is easy to bend, the flexible wiring board 5 can be surely bent along the bending line C-C '.

In the above embodiment, the wide portion of the wiring pattern is formed on both sides of the bent portion, but in some cases, the wide portion may be formed on only one side.

[0021]

[Effect of device]

 As described above, according to the present invention, since the hardness of the bent portion of the flexible wiring board is made smaller than the hardness of the area adjacent to the bent portion, the bending of the board at the bending position becomes extremely easy. In addition, since it can be surely bent at the bending position, variations in the bending position at the time of bending are significantly reduced.

Therefore, even when the flexible wiring board is mounted along the corners of the electronic circuit device or when the wiring is folded back by 180 degrees, the flexible circuit board can be easily bent at an appropriate position. Not only can the assembly efficiency of the device be greatly improved, but it is also possible to eliminate unnecessary bending of the wiring and minimize the space required for wiring.

[Brief description of drawings]

FIG. 1 is a partially enlarged view around a bent portion of a flexible wiring board according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a schematic shape of the entire flexible wiring board having the bent portion shown in FIG.

FIG. 3 is an explanatory view showing a simplified wiring pattern of a bent portion of a flexible wiring board according to an embodiment of the present invention.

FIG. 4 is an enlarged plan view of a bent portion of a flexible wiring board according to another embodiment of the present invention.

FIG. 5 is an enlarged plan view of a bent portion of a flexible wiring board according to another embodiment of the present invention.

FIG. 6 is an enlarged plan view of a bent portion of a flexible wiring board according to still another embodiment of the present invention.

[Explanation of symbols]

 1 Insulator substrate 2 Wiring pattern 3 Solid pattern 4 Blank pattern part 5 Flexible wiring board

Claims (3)

[Scope of utility model registration request] 1. A bendable flexible wiring board in which a conductor layer is laminated on a flexible insulating substrate, and a wiring pattern is formed by the conductor layer, wherein the bending portion of the flexible wiring board has hardness. The formation ratio of the wiring pattern of the bent portion on the insulating substrate is made smaller than the formation ratio of the area adjacent to the bent portion so that the hardness is lower than the hardness of the area adjacent to the bent portion. Flexible wiring board characterized by. 2. The flexible wiring board according to claim 1, wherein the width of the wiring pattern in the bent portion is smaller than the width of the wiring pattern in a region adjacent to the bent portion. 3. The flexible wiring board according to claim 1, wherein a pattern missing portion is formed in the wiring pattern at the bent portion.