JPH0672263U - LED lamp - Google Patents
LED lampInfo
- Publication number
- JPH0672263U JPH0672263U JP013464U JP1346493U JPH0672263U JP H0672263 U JPH0672263 U JP H0672263U JP 013464 U JP013464 U JP 013464U JP 1346493 U JP1346493 U JP 1346493U JP H0672263 U JPH0672263 U JP H0672263U
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- led chip
- transparent resin
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】ＬＥＤランプの光洩れを防止して光度を高め
る。
【構成】ＬＥＤチップ搭載部材２，１１，３１と、ＬＥ
Ｄチップ搭載部材２，１１，３１上に搭載されたＬＥＤ
チップ５，１３，３４と、これらが封入された透明樹脂
体７，１６，３８とを備えたＬＥＤランプの前記透明樹
脂体７，１６，３８内に、ＬＥＤチップ５，１３，３４
を囲んで、ＬＥＤチップ５，１３，３４が発する光を反
射させて光照射方向Ｌに導く光反射部材８，１７，３３
を設けた。
(57) [Summary] [Purpose] To prevent light leakage from LED lamps and increase the luminous intensity. [Structure] LED chip mounting members 2, 11, 31 and LE
LED mounted on the D-chip mounting member 2, 11, 31
The LED chips 5, 13, 34 are provided in the transparent resin bodies 7, 16, 38 of the LED lamp including the chips 5, 13, 34 and the transparent resin bodies 7, 16, 38 in which they are encapsulated.
The light reflecting members 8, 17, 33 that surround the light and reflect the light emitted from the LED chips 5, 13, 34 to guide it in the light irradiation direction L
Was set up.
Description
【０００１】[0001]
本考案は、センサ等において発光部として用いられるＬＥＤランプに関する。 The present invention relates to an LED lamp used as a light emitting unit in a sensor or the like.
【０００２】[0002]
従来から、この種のＬＥＤランプとして、図４および図５に示したものがある 。図４のＬＥＤランプ５０は搭載基板５１上のランド部５２にＬＥＤチップ５３ を搭載するとともに、このＬＥＤチップ５３と搭載基板５１上の配線パターン５ ４とをワイヤ５５で接続し、さらに、搭載基板５１の表面を透明樹脂体５６で覆 って構成されている。 Conventionally, as this type of LED lamp, there is one shown in FIGS. 4 and 5. In the LED lamp 50 of FIG. 4, an LED chip 53 is mounted on a land portion 52 on a mounting substrate 51, and the LED chip 53 and the wiring pattern 54 on the mounting substrate 51 are connected by a wire 55. The surface of 51 is covered with a transparent resin body 56.
【０００３】 また図５のＬＥＤランプ６０はリードフレーム６１先端に設けたランド部６２ にＬＥＤチップ６３を搭載するとともに、このＬＥＤチップ６３ともう一方のリ ードフレーム６４とをワイヤ６５で接続し、さらに、ＬＥＤチップ６３をリード フレーム６１，６４もろとも透明樹脂体６６で覆って構成されている。In the LED lamp 60 of FIG. 5, an LED chip 63 is mounted on a land portion 62 provided at the tip of the lead frame 61, and the LED chip 63 and the other lead frame 64 are connected by a wire 65. The LED chip 63 is covered with a transparent resin body 66 together with the lead frames 61 and 64.
【０００４】 なお、これらＬＥＤランプ５０，６０は透明樹脂体５６，６６の上面が光照射 面５７，６７となっている。In the LED lamps 50 and 60, the upper surfaces of the transparent resin bodies 56 and 66 are light irradiation surfaces 57 and 67.
【０００５】[0005]
ところで、上記したような従来のＬＥＤランプ５０，６０には、ＬＥＤチップ ５３，６３が発する光が横方向に洩れてしまうために、光照射面５７，６７から 光照射方向Ｌ（図中、上方向）に照射される光の光度が上がらないという問題が あった。これは次のような理由による。すなわち、ＬＥＤチップ５３，６３はそ の光照射方向Ｌを中心として比較的広角度に光を照射するが、ＬＥＤチップ搭載 部材である搭載基板５１やリードフレーム６１の表面が平坦であるために、横方 向に照射される光が透明樹脂体５６，６６の側面から外部に洩れることを防止す ることができず、このようにして横方向に洩れる分、ＬＥＤランプ５，６０の光 度を低下させていた。 By the way, in the conventional LED lamps 50 and 60 as described above, the light emitted from the LED chips 53 and 63 leaks in the lateral direction. There was a problem that the intensity of the light radiated in the (direction) did not increase. This is for the following reasons. That is, the LED chips 53 and 63 irradiate light at a relatively wide angle around the light irradiation direction L, but since the mounting substrate 51 and the lead frame 61, which are LED chip mounting members, have flat surfaces, It is not possible to prevent the laterally radiated light from leaking to the outside from the side surfaces of the transparent resin bodies 56 and 66. In this way, the luminous intensity of the LED lamps 5 and 60 can be reduced by the amount of lateral light leakage. Had lowered.
【０００６】 また、ＬＥＤチップ５３，６３を搭載する部材として、リードフレーム６１を 用いた場合には、リードフレーム６１，６４の間に隙間６８が形成されることは 避けられず、ここから後方へも光が洩れてしまうために、さらに光度が低下する という問題があった。Further, when the lead frame 61 is used as a member for mounting the LED chips 53 and 63, it is unavoidable that a gap 68 is formed between the lead frames 61 and 64, and the gap 68 is inevitably rearward. However, there was a problem that the light intensity was further reduced because the light leaked out.
【０００７】 したがって、本考案においては、ＬＥＤランプの光洩れを防止して光度を高め ることを目的としている。Therefore, it is an object of the present invention to prevent light leakage of the LED lamp and increase the luminous intensity.
【０００８】[0008]
このような目的を達成するために、本考案においては、ＬＥＤチップ搭載部材 と、該ＬＥＤチップ搭載部材上に搭載されたＬＥＤチップと、これらが封入され た透明樹脂体とを備えたＬＥＤランプであって、前記透明樹脂体内に、前記ＬＥ Ｄチップを囲んで、ＬＥＤチップが発する光を反射させて光照射方向に導く光反 射部材を設けたことに特徴を有している。 In order to achieve such an object, the present invention provides an LED lamp including an LED chip mounting member, an LED chip mounted on the LED chip mounting member, and a transparent resin body encapsulating the LED chip. The transparent resin body is characterized in that a light reflecting member that surrounds the LED chip and reflects the light emitted from the LED chip to guide the light in the light irradiation direction is provided.
【０００９】[0009]
上記構成によれば、ＬＥＤチップからその光照射方向以外の方向に照射される 光は光反射部材によって反射されて光照射方向に導かれるので、照射光が光照射 方向以外の方向へ洩れることはなくなる。 According to the above configuration, the light emitted from the LED chip in a direction other than the light irradiation direction is reflected by the light reflecting member and guided in the light irradiation direction, so that the irradiation light does not leak in a direction other than the light irradiation direction. Disappear.
【００１０】[0010]
以下、本考案の一実施例を図面を参照して詳細に説明する。図１は、本考案の 第１実施例の断面図である。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view of a first embodiment of the present invention.
【００１１】 このＬＥＤランプ１は、搭載基板２と、この搭載基板２上に形成されたランド 部３および配線パターン４と、ランド部３上に搭載されたＬＥＤチップ５と、こ のＬＥＤチップ５と配線パターン４とを接続するワイヤ６と、搭載基板２の表面 を覆うエポキシ系樹脂からなる透明樹脂体７とを備えており、以上の構成は図４ の従来例と同様である。このＬＥＤランプ１は光反射部材８を設けたことに特徴 を有している。光反射部材８は環状の部材であって、例えば耐熱性を備えた白色 の熱可塑性樹脂からなっている。この光反射部材８がＬＥＤチップ５を囲んで搭 載基板２上に配設されて透明樹脂体７内に封入されている。また、光反射部材８ の内面９は、ＬＥＤチップ５から横方向に照射された光を反射してＬＥＤランプ １の光照射方向Ｌ（図中上方向）に集光するように曲面形状になっている。この 光反射部材８は、透明樹脂体７を搭載基板１表面上にモールド成形する際に、光 反射板成形体を透明樹脂体７内に封入することよってつくられる。The LED lamp 1 includes a mounting substrate 2, a land portion 3 and a wiring pattern 4 formed on the mounting substrate 2, an LED chip 5 mounted on the land portion 3, and an LED chip 5 of the LED chip 5. The wiring 6 is connected to the wiring pattern 4, and the transparent resin body 7 made of epoxy resin covering the surface of the mounting substrate 2 is provided. The above configuration is the same as that of the conventional example of FIG. This LED lamp 1 is characterized in that a light reflecting member 8 is provided. The light reflecting member 8 is an annular member, and is made of, for example, a white thermoplastic resin having heat resistance. The light reflecting member 8 is arranged on the mounting substrate 2 so as to surround the LED chip 5 and is enclosed in the transparent resin body 7. Further, the inner surface 9 of the light reflecting member 8 has a curved surface shape so as to reflect the light laterally irradiated from the LED chip 5 and collect the light in the light irradiation direction L (upper direction in the figure) of the LED lamp 1. ing. The light reflecting member 8 is manufactured by encapsulating a light reflection plate molded body in the transparent resin body 7 when the transparent resin body 7 is molded on the surface of the mounting substrate 1.
【００１２】 このようにＬＥＤランプ１は透明樹脂体７内にＬＥＤチップ５を囲んで光反射 部材８を配設したので、ＬＥＤチップ５からその横方向に照射される光はこの光 反射部材８で反射されて光照射方向Ｌに導かれるので、透明樹脂体７の側面から 外部に洩れることはなくなり、その分、光照射方向Ｌに照射される光の光度は高 まることになる。As described above, in the LED lamp 1, since the light reflecting member 8 is arranged in the transparent resin body 7 so as to surround the LED chip 5, the light emitted from the LED chip 5 in the lateral direction is the light reflecting member 8. Since the light is reflected by and is guided in the light irradiation direction L, it does not leak from the side surface of the transparent resin body 7 to the outside, and the luminous intensity of the light irradiated in the light irradiation direction L is correspondingly increased.
【００１３】 図２は本考案の第２実施例の断面図である。このＬＥＤランプ１０はリードフ レーム１１と、このリードフレーム１１先端のランド部１２に搭載されたＬＥＤ チップ１３と、このＬＥＤチップ１３ともう一方のリードフレーム１４とを接続 するワイヤ１５と、ＬＥＤチップ１３をリードフレーム１１，１４もろとも覆う 透明樹脂体１６とを備えており、以上の構造は図４の従来例と同様である。この ＬＥＤランプは第１実施例と同じく、光反射部材１７を設けたことに特徴がある が、この光反射部材１７の構造が第１実施例と異なっている。すなわち、光反射 部材１７はＬＥＤチップ１３を囲んでリードフレーム１１，１４の表面側に環状 に配設された側方反射部１８と、リードフレーム１１，１４の裏面に配設された 後方反射部１９とからなっており、これらはインサート成形法によってリードフ レーム１１，１４を間にして互いに一体に成形されている。この光反射部材１７ は、第１実施例の光反射部材８と同様、例えば耐熱性を備えた白色の熱可塑性樹 脂からなっている。側方反射部１８はその内面２０がＬＥＤチップ１３から横方 向に照射された光を反射して光照射方向Ｌ（図中上方向）に集光するように曲面 形状になっている。後方反射部１９はリードフレーム１１，１４裏面側を覆う平 板状に形成されており、リードフレーム１１，１４間に形成された隙間２１はこ の後方側反射部１９によって埋められている。FIG. 2 is a sectional view of a second embodiment of the present invention. This LED lamp 10 includes a lead frame 11, an LED chip 13 mounted on a land 12 at the tip of the lead frame 11, a wire 15 connecting the LED chip 13 and the other lead frame 14, and an LED chip 13. And a transparent resin body 16 that covers all the lead frames 11 and 14, and the above structure is similar to that of the conventional example of FIG. This LED lamp is characterized in that the light reflecting member 17 is provided as in the first embodiment, but the structure of the light reflecting member 17 is different from that of the first embodiment. That is, the light-reflecting member 17 surrounds the LED chip 13 and has a side-face reflecting portion 18 annularly arranged on the front surface side of the lead frames 11 and 14, and a rear reflecting portion arranged on the back surface of the lead frames 11 and 14. 19 are formed integrally with each other by the insert molding method with the lead frames 11 and 14 interposed therebetween. Like the light reflecting member 8 of the first embodiment, the light reflecting member 17 is made of, for example, a heat-resistant white thermoplastic resin. The side reflection part 18 has a curved surface shape so that the inner surface 20 thereof reflects the light emitted laterally from the LED chip 13 and collects the light in the light irradiation direction L (upward in the drawing). The rear reflection part 19 is formed in a flat plate shape covering the back side of the lead frames 11 and 14, and the gap 21 formed between the lead frames 11 and 14 is filled with the rear reflection part 19.
【００１４】 このようにＬＥＤランプ１０は、透明樹脂体１６内にＬＥＤチップ１３を囲ん でリードフレーム１１，１４表面に配設された側方側反射部１８がＬＥＤチップ １３からその横方向に照射される光を反射させて光照射方向Ｌに導びくので、照 射光が透明樹脂体１６の側面から外部に洩れることはなくなり、その分、光照射 方向Ｌに照射される光の光度は高まることになる。また、リードフレーム１１， １４の間に形成される隙間２１を後方側反射部１９が埋めるので、この隙間２１ から照射光が後方に洩れることはなくなり、その分でも光照射方向Ｌに照射され る光の光度は高まることになる。As described above, in the LED lamp 10, the side reflection portion 18 provided on the surfaces of the lead frames 11 and 14 surrounding the LED chip 13 in the transparent resin body 16 irradiates the LED chip 13 in the lateral direction. Since the reflected light is reflected and guided in the light irradiation direction L, the irradiation light does not leak from the side surface of the transparent resin body 16 to the outside, and the intensity of the light irradiated in the light irradiation direction L is correspondingly increased. become. Further, since the rear side reflection portion 19 fills the gap 21 formed between the lead frames 11 and 14, the irradiation light does not leak rearward from this gap 21 and the portion 21 is irradiated in the light irradiation direction L as well. The intensity of light will increase.
【００１５】 上記二つの実施例においては、光反射部材８，１７を別構成部材として準備し たうえで、透明樹脂体７，１６内に封入していたが、本考案はこれに限るわけで はなく、図３に示すＬＥＤランプ３０のように、リードフレーム３１の先端に設 けたランド部３２にプレス加工等を施してＬＥＤチップ搭載用の湾曲部３３を形 成し、この湾曲部３３を光反射部材としてもよい。この場合、ＬＥＤチップ３４ はこの湾曲部３３に搭載されるために、リードフレーム３１上面より若干下側に 配置されることになる。このような搭載位置では、ＬＥＤチップ３４と他方のリ ードフレーム３５とを接続するワイヤ３６が湾曲部３３の側壁部に当接して短絡 する恐れがあるが、本実施例においては、ワイヤ３６が当接する恐れがある湾曲 部３３の側壁部に切り込み３７を形成しており、ワイヤ３６が湾曲部３３の側壁 部に当接することはない。なお、図３の符号３８はＬＥＤランプ３０の透明樹脂 体である。In the above two embodiments, the light reflecting members 8 and 17 were prepared as separate components and then enclosed in the transparent resin bodies 7 and 16. However, the present invention is not limited to this. Instead, like the LED lamp 30 shown in FIG. 3, the land portion 32 provided at the tip of the lead frame 31 is subjected to press working or the like to form a curved portion 33 for mounting an LED chip, and the curved portion 33 is formed. It may be a light reflecting member. In this case, since the LED chip 34 is mounted on the curved portion 33, the LED chip 34 is arranged slightly below the upper surface of the lead frame 31. At such a mounting position, the wire 36 connecting the LED chip 34 and the other lead frame 35 may come into contact with the side wall of the bending portion 33 to cause a short circuit, but in the present embodiment, the wire 36 contacts. Since the notch 37 is formed in the side wall of the curved portion 33 that may contact, the wire 36 does not contact the side wall of the curved portion 33. The reference numeral 38 in FIG. 3 is a transparent resin body of the LED lamp 30.
【００１６】[0016]
以上のように本考案によれば、ＬＥＤチップからその光照射方向以外の方向に 照射される光は光反射部材によって反射されて光照射方向に導かれるので、照射 光が光照射方向以外の方向から外部に洩れることはなくなった。そのため、ＬＥ Ｄランプが光照射方向に照射する光の光度は高まり、効率よく光照射を行うこと ができるようになった。 As described above, according to the present invention, the light emitted from the LED chip in a direction other than the light irradiation direction is reflected by the light reflecting member and guided in the light irradiation direction, so that the irradiation light is emitted in a direction other than the light irradiation direction. No longer leaks out. Therefore, the luminous intensity of the light emitted from the LED lamp in the light irradiation direction is increased, and the light irradiation can be efficiently performed.
【図１】本考案の第一実施例に係るＬＥＤランプの構造
を示す断面図である。FIG. 1 is a sectional view showing a structure of an LED lamp according to a first embodiment of the present invention.
【図２】本考案の第２実施例に係るＬＥＤランプの構造
を示す断面図である。FIG. 2 is a sectional view showing the structure of an LED lamp according to a second embodiment of the present invention.
【図３】本考案の第３実施例に係るＬＥＤランプの構造
を示す断面図である。FIG. 3 is a sectional view showing the structure of an LED lamp according to a third embodiment of the present invention.
【図４】第１の従来例の構造を示す断面図である。FIG. 4 is a sectional view showing a structure of a first conventional example.
【図５】第２の従来例の構造を示す断面図である。FIG. 5 is a cross-sectional view showing a structure of a second conventional example.
２ 搭載基板 ５，１３，３４ ＬＥＤチップ １１，３１ リードフレーム ７，１６，３８ 透明樹脂体 ８，１７ 光反射部材 ３３ 湾曲部 Ｌ 光照射方向 2 Mounting board 5,13,34 LED chip 11,31 Lead frame 7,16,38 Transparent resin body 8,17 Light reflection member 33 Curved part L Light irradiation direction
Claims (1)
搭載部材上に搭載されたＬＥＤチップと、これらが封入
された透明樹脂体とを備えたＬＥＤランプであって、 前記透明樹脂体内に、前記ＬＥＤチップを囲んで、ＬＥ
Ｄチップが発する光を反射させて光照射方向に導く光反
射部材を設けたことを特徴とするＬＥＤランプ。1. An LED lamp comprising an LED chip mounting member, an LED chip mounted on the LED chip mounting member, and a transparent resin body encapsulating the LED chip in the transparent resin body. LE around the LED chip
An LED lamp provided with a light reflecting member that reflects light emitted from a D chip and guides the light in a light irradiation direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP013464U JPH0672263U (en) | 1993-03-23 | 1993-03-23 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP013464U JPH0672263U (en) | 1993-03-23 | 1993-03-23 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0672263U true JPH0672263U (en) | 1994-10-07 |
Family
ID=11833871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP013464U Pending JPH0672263U (en) | 1993-03-23 | 1993-03-23 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0672263U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002289923A (en) * | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | Light-emitting diode and its manufacturing method |
| JP2010206231A (en) * | 2005-10-04 | 2010-09-16 | Samsung Electro-Mechanics Co Ltd | High power light-emitting diode package |
| WO2012124147A1 (en) * | 2011-03-15 | 2012-09-20 | オムロン株式会社 | Optical semiconductor package, optical semiconductor module, and manufacturing method of these |
-
1993
- 1993-03-23 JP JP013464U patent/JPH0672263U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002289923A (en) * | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | Light-emitting diode and its manufacturing method |
| JP2010206231A (en) * | 2005-10-04 | 2010-09-16 | Samsung Electro-Mechanics Co Ltd | High power light-emitting diode package |
| WO2012124147A1 (en) * | 2011-03-15 | 2012-09-20 | オムロン株式会社 | Optical semiconductor package, optical semiconductor module, and manufacturing method of these |
| US9006750B2 (en) | 2011-03-15 | 2015-04-14 | Omron Corporation | Optical semiconductor package, optical semiconductor module, and manufacturing method of these |
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