JPH0651001Y2 - Optical coupling element - Google Patents
Optical coupling elementInfo
- Publication number
- JPH0651001Y2 JPH0651001Y2 JP1987088786U JP8878687U JPH0651001Y2 JP H0651001 Y2 JPH0651001 Y2 JP H0651001Y2 JP 1987088786 U JP1987088786 U JP 1987088786U JP 8878687 U JP8878687 U JP 8878687U JP H0651001 Y2 JPH0651001 Y2 JP H0651001Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light emitting
- light receiving
- bonding
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
Landscapes
- Die Bonding (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は光結合素子に関し、発光素子と受光素子間の距
離を近づけうる光結合素子に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an optical coupling element, and more particularly to an optical coupling element capable of reducing the distance between a light emitting element and a light receiving element.
従来、光結合素子は、発光素子及び受光素子をリードフ
レームにダイボンディングし、各素子とリードフレーム
を素子側にボールボンディングし、リードフレーム側に
ステッチボンディングする方式によりワイヤーボンディ
ングを行い、発光側リードフレームと受光側リードフレ
ームを対向させ形成されていた。Conventionally, an optical coupling element is wire-bonded by a method in which a light emitting element and a light receiving element are die-bonded to a lead frame, each element and the lead frame are ball-bonded to the element side, and stitch bonding is performed to the lead frame side. The frame and the lead frame on the light receiving side are formed to face each other.
光結合素子は各種安全規格により発光側と受光側の導体
間の間隔を定められた値以上に保つ必要がある。また、
光伝達率は発光側と受光側の間隔が小さいほど効率が良
くなることは明白である。It is necessary for the optical coupling element to keep the distance between the conductors on the light emitting side and the light receiving side at a predetermined value or more according to various safety standards. Also,
It is obvious that the light transmissivity becomes more efficient as the distance between the light emitting side and the light receiving side becomes smaller.
上述した従来の光結合素子は発光素子（あるいは受光素
子）にボールボンディングしリードフレームにステッチ
ボンディングするため、第３図に断面図を示す通りボン
ディング線と各素子あるいはボンディング線間の間隔で
発光側と受光側の間隔が決まってしまい、光伝達効率が
悪いという欠点がある。Since the above-described conventional optical coupling element is ball-bonded to the light-emitting element (or the light-receiving element) and stitch-bonded to the lead frame, as shown in the sectional view of FIG. Therefore, there is a drawback that the light transmission efficiency is poor because the distance between the light receiving side is determined.
本考案は、発光素子を搭載した第１のリードフレームと
前記発光素子とが第１のボンディング線により電気的に
接続された発光部と、受光素子を搭載した第２のリード
フレームと前記受光素子とが第２のボンディング線によ
り電気的に接続された受光部とを有し、前記発光素子へ
のボンディング側と前記受光素子へのボンディング側と
が向かい合うように前記第１のリードフレームと第２の
リードフレームとを対向配置して外装した光結合素子に
おいて、少なくとも前記第１のボンディング線はステッ
チボンディングにより前記発光素子にボンディングされ
ていることを特徴とする。The present invention provides a light emitting part in which a first lead frame mounting a light emitting element and the light emitting element are electrically connected by a first bonding wire, a second lead frame mounting a light receiving element, and the light receiving element. And a light receiving portion electrically connected by a second bonding wire, and the first lead frame and the second lead frame so that the bonding side to the light emitting element and the bonding side to the light receiving element face each other. In the optical coupling element, which is arranged so as to face the lead frame and is packaged, at least the first bonding line is bonded to the light emitting element by stitch bonding.
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本考案の一実施例の縦断面図である。リードフ
レーム１上に発光素子２をダイボンディングし、ボンデ
ィング線３でリードフレーム１と発光素子２を接続す
る。リードフレーム１上はボールボンディング，発光素
子２上はステッチボンディングとなる。同様にリードフ
レーム４上に受光素子５をダイボンディングし、ボンデ
ィング線６でリードフレーム４と受光素子５を接続す
る。ボンディング済発光側リードフレームと受光側リー
ドフレームを光径路シリコン樹脂７で接続しエポキシ樹
脂８で外形を形成する。FIG. 1 is a vertical sectional view of an embodiment of the present invention. The light emitting element 2 is die-bonded on the lead frame 1, and the lead frame 1 and the light emitting element 2 are connected by a bonding wire 3. Ball bonding is performed on the lead frame 1, and stitch bonding is performed on the light emitting element 2. Similarly, the light receiving element 5 is die-bonded on the lead frame 4, and the lead frame 4 and the light receiving element 5 are connected by the bonding line 6. The bonded light emitting side lead frame and the light receiving side lead frame are connected by a light path silicone resin 7 and an outer shape is formed by an epoxy resin 8.
第２図は本考案の一実施例の縦断面図である。受光側に
プレーナ型ホトTrを使用した場合等、ボンディング線６
が素子の端にふれショートする恐がある場合には受光側
を従来通り素子側にボールボンディングリードフレーム
側にステッチボンディングをし、発光側はリードフレー
ム側にボールボンディング、素子側にステッチボンディ
ングを行い、第１の実施例と同じように光結合素子を形
成する。FIG. 2 is a vertical sectional view of an embodiment of the present invention. When using a planar photo T r on the light receiving side, the bonding wire 6
If there is a fear that the element will touch the edge of the element and short-circuit, the light-receiving side will be ball-bonded to the element side as usual and stitch-bonded to the leadframe side, and the light-emitting side will be ball-bonded to the leadframe side and stitch-bonded to the element side. The optical coupling element is formed in the same manner as in the first embodiment.
以上説明したように本考案は、リードフレーム側にボー
ルボンディングし素子側にステッチボンディングした発
光側あるいは受光側リードフレームを組み合せることに
より、安全規格に定められる間隔を保ちながら発光素子
と受光素子の間隔を近づけることが出来るため、光結合
効率の高い光結合素子を供給出来かつ素子全体の厚さを
薄く出来る効果がある。As described above, according to the present invention, by combining the light emitting side or the light receiving side lead frame which is ball-bonded to the lead frame side and stitch-bonded to the element side, the light emitting element and the light receiving element can be separated while maintaining the interval defined by the safety standard. Since the intervals can be made closer, there is an effect that an optical coupling element having high optical coupling efficiency can be supplied and the thickness of the entire element can be reduced.
第１図は本考案の一実施例の断面図、第２図は本考案の
もう一つの実施例の断面図、第３図は従来の光結合素子
の断面図、 1,4……リードフレーム、２……発光素子、3,6……ボン
ディング線、５……受光素子、７……シリコン樹脂（光
径路）、８……エポキシ樹脂。1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of another embodiment of the present invention, FIG. 3 is a sectional view of a conventional optical coupling element, 1,4 ... Lead frame 2 ... Light emitting element, 3, 6 ... Bonding wire, 5 ... Light receiving element, 7 ... Silicon resin (light path), 8 ... Epoxy resin.
Claims (1)
と前記発光素子とが第１のボンディング線により電気的
に接続された発光部と、受光素子を搭載した第２のリー
ドフレームと前記受光素子とが第２のボンディング線に
より電気的に接続された受光部とを有し、前記発光素子
へのボンディング側と前記受光素子へのボンディング側
とが向かい合うように前記第１のリードフレームと第２
のリードフレームとを対向配置して外装した光結合素子
において、少なくとも前記第１のボンディング線はステ
ッチボンディングにより前記発光素子にボンディングさ
れていることを特徴とする光結合素子。1. A light emitting portion in which a first lead frame having a light emitting element mounted thereon and the light emitting element are electrically connected by a first bonding wire, a second lead frame having a light receiving element mounted therein, and the light receiving element. An element and a light receiving portion electrically connected by a second bonding wire, and the first lead frame and the first lead frame are arranged so that the bonding side to the light emitting element and the bonding side to the light receiving element face each other. Two
In the optical coupling element, which is arranged opposite to the lead frame and is packaged, at least the first bonding line is bonded to the light emitting element by stitch bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088786U JPH0651001Y2 (en) | 1987-06-08 | 1987-06-08 | Optical coupling element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088786U JPH0651001Y2 (en) | 1987-06-08 | 1987-06-08 | Optical coupling element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63197362U JPS63197362U (en) | 1988-12-19 |
| JPH0651001Y2 true JPH0651001Y2 (en) | 1994-12-21 |
Family
ID=30947194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088786U Expired - Lifetime JPH0651001Y2 (en) | 1987-06-08 | 1987-06-08 | Optical coupling element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651001Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049384A (en) * | 1998-07-29 | 2000-02-18 | Matsushita Electron Corp | Chip-type light-emitting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159746A (en) * | 1985-01-08 | 1986-07-19 | Kyodo Printing Co Ltd | Wire bonding method for IC module |
| JPS62123727A (en) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | semiconductor equipment |
| JPS63219131A (en) * | 1987-03-06 | 1988-09-12 | Nec Yamagata Ltd | Manufacture of semiconductor device |
-
1987
- 1987-06-08 JP JP1987088786U patent/JPH0651001Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049384A (en) * | 1998-07-29 | 2000-02-18 | Matsushita Electron Corp | Chip-type light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63197362U (en) | 1988-12-19 |
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