JPH0648328Y2 - Optical film thickness automatic measurement device - Google Patents
Optical film thickness automatic measurement deviceInfo
- Publication number
- JPH0648328Y2 JPH0648328Y2 JP3125289U JP3125289U JPH0648328Y2 JP H0648328 Y2 JPH0648328 Y2 JP H0648328Y2 JP 3125289 U JP3125289 U JP 3125289U JP 3125289 U JP3125289 U JP 3125289U JP H0648328 Y2 JPH0648328 Y2 JP H0648328Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- measured
- calibration
- film thickness
- cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005259 measurement Methods 0.000 title claims description 22
- 239000012788 optical film Substances 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 120
- 230000007246 mechanism Effects 0.000 claims description 30
- 230000007723 transport mechanism Effects 0.000 claims description 25
- 239000010408 film Substances 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 description 30
- 230000003595 spectral effect Effects 0.000 description 6
- 238000012937 correction Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Description
【考案の詳細な説明】 ＜産業上の利用分野＞ 本考案は、半導体基板上のフォトレジスト膜、シリコン
酸化膜、クロムやアルミニウム等の金属膜、更には、ガ
ラス基板や透明電極（ITO）などの特殊膜といった基板
上の薄膜の膜厚を分光特性に基づいて自動的に測定する
ために、複数個の被測定基板を収納したカセットを載置
するカセット載置部と、被測定基板表面からの光を処理
して膜厚を測定する光学系と、光学系との相対位置合わ
せを行うため、被測定基板を載置して２次元方向に移送
するＸ−Ｙテーブルと、カセット載置部とＸ−Ｙテーブ
ルとにわたって被測定基板を搬送する被測定基板搬送機
構とを備えた光学式膜厚自動測定装置に関する。[Detailed Description of the Invention] <Industrial field of application> The present invention relates to a photoresist film on a semiconductor substrate, a silicon oxide film, a metal film such as chromium or aluminum, and further a glass substrate or a transparent electrode (ITO). In order to automatically measure the film thickness of a thin film on a substrate such as the special film of the above, based on the spectral characteristics, from the cassette mounting part that mounts the cassette that contains multiple substrates to be measured, and the surface of the substrate to be measured. An XY table for placing a substrate to be measured and transferring it in a two-dimensional direction in order to perform relative alignment with the optical system for processing the light of the above to measure the film thickness, and the cassette placing section. And an XY table for transporting a substrate to be measured across the substrate to be measured.
＜従来の技術＞ この種の光学式膜厚自動測定装置では、光学的に膜厚を
測定するため、例えば、対物レンズやフィルタ等のよう
な測定光学系を構成する各種光学手段を交換したり、調
整したりすることがある。その場合、測定光学系の分光
特性が変化する。このような場合、測定結果を補正する
ためのデータを得ることを目的として校正用基板を測定
することがなされる。また、膜厚測定の対象となる薄膜
の種類が替わる等のような場合にも、種々の理由から校
正用基板の測定が必要となることがあり、校正用基板を
測定することは、かなり頻繁に行われる。<Prior Art> In this type of optical film thickness automatic measuring apparatus, in order to optically measure the film thickness, for example, various optical means such as an objective lens and a filter that constitute a measuring optical system are replaced. , May be adjusted. In that case, the spectral characteristic of the measurement optical system changes. In such a case, the calibration substrate is measured for the purpose of obtaining data for correcting the measurement result. In addition, even when the type of thin film to be measured for film thickness is changed, it may be necessary to measure the calibration substrate for various reasons. To be done.
そこで、従来では、このような要望に対応するために、
カセットの最下段などに校正用基板を収納し、別のカセ
ットに変更するたびに、校正用基板を変更前のカセット
からピンセットなどにより取り出して変更後のカセット
に収納するとか、あるいは、校正用基板の測定が必要と
されるたびに、ピンセットなどにより校正用基板をＸ−
Ｙテーブル上などに載置し、その校正用基板によって得
られるデータに基づいて測定データを補正するようにし
ていた。Therefore, conventionally, in order to respond to such a request,
When the calibration board is stored at the bottom of the cassette and is changed to another cassette, the calibration board is taken out from the cassette before the change with tweezers and stored in the changed cassette, or the calibration board is changed. Whenever the measurement of
It was placed on a Y table or the like, and the measurement data was corrected based on the data obtained by the calibration substrate.
＜考案が解決しようとする課題＞ しかしながら、校正用基板に対する取り扱いは、上述の
ようにピンセットでもって慎重に行う必要があり、極め
て使い勝手が悪いうえに手間を要する欠点があった。<Problems to be Solved by the Invention> However, as described above, the calibration substrate needs to be carefully handled with tweezers, which is extremely inconvenient and time-consuming.
そこで、Ｘ−Ｙテーブルに基板載置部を二箇所設け、一
方には被測定基板を測定時に順次載置し、そして、他方
には校正用基板を常時載置して、校正用基板の測定が必
要となったときに、Ｘ−Ｙテーブルを大きく移動して校
正用基板からのデータを得るようにすることを検討した
が、Ｘ−Ｙテーブルを大きく移動することが可能である
ようにすると微少移動の精度を良くすることが困難であ
り、光学系に対する被測定基板の位置決め精度が低く、
精密な位置決めにより高精度を確保できるというＸ−Ｙ
テーブルの持つ本来的な特性を損なう欠点があり、ま
た、Ｘ−Ｙテーブルの移動範囲を確保するために装置全
体が大型化する欠点があった。Therefore, the XY table is provided with two substrate mounting portions, one of the substrates to be measured is sequentially mounted at the time of measurement, and the other is always mounted with the calibration substrate to measure the calibration substrate. When it becomes necessary to move the XY table, it is considered to obtain the data from the calibration substrate. However, if the XY table can be moved greatly, It is difficult to improve the precision of minute movements, and the positioning accuracy of the measured substrate with respect to the optical system is low,
XY that can ensure high accuracy by precise positioning
There is a drawback that the original characteristics of the table are impaired, and there is a drawback that the entire apparatus becomes large in order to secure the movement range of the XY table.
本考案は、このような事情に鑑みてなされたものであっ
て、装置を大型化すること無く、分光特性の変化に伴う
校正用基板によるデータ補正を容易に行うことができる
ようにすることを目的とする。The present invention has been made in view of such circumstances, and it is possible to easily perform data correction by a calibration substrate due to a change in spectral characteristics without increasing the size of the device. To aim.
＜課題を解決するための手段＞ 本考案は、上述のような目的を達成するために、被測定
基板表面からの光を処理して被測定基板上の薄膜の膜厚
を測定する光学系と、前記光学系との相対位置合わせを
行うため、被測定基板を載置して２次元方向に移動する
Ｘ−Ｙテーブルと、複数個の被測定基板を収納したカセ
ットを載置するカセット載置部と、前記カセット載置部
と前記Ｘ−Ｙテーブルとにわたって前記被測定基板を搬
送する被測定基板搬送機構とを備えた光学式膜厚自動測
定装置において、 前記カセット載置部とは別の箇所に校正用基板の保持部
を配設し、その保持部と前記被測定基板搬送機構とにわ
たって校正用基板を搬送する校正用基板搬送機構を設け
て構成され、校正用基板搬送機構は、前記被測定基板搬
送機構に兼用されるか、または、前記被測定基板搬送機
構とは別に設けられて構成する。<Means for Solving the Problem> In order to achieve the above-mentioned object, the present invention provides an optical system for processing light from the surface of a substrate to be measured to measure the thickness of a thin film on the substrate to be measured. , An XY table on which a substrate to be measured is placed and moves in a two-dimensional direction in order to perform relative alignment with the optical system, and a cassette mount on which a cassette containing a plurality of substrates to be measured is placed In the optical film thickness automatic measurement device, the optical film thickness automatic measuring device includes a portion, a cassette mounting portion, and a measured substrate transfer mechanism that transfers the measured substrate across the XY table. A holding portion for the calibration substrate is arranged at a position, and a calibration substrate transport mechanism that transports the calibration substrate across the holding portion and the substrate transport mechanism to be measured is provided. Is it also used as the measured substrate transfer mechanism? Alternatively, the the measured substrate transfer mechanism constituting provided separately.
＜作用＞ 上記構成によれば、対物レンズやフィルターの交換など
に伴って光学系の分光特性 が変化したり、その他種々
の理由により校正用基板の分光特性を測定する必要が生
じたときには、校正用基板搬送機構によって保持部から
校正用基板を取り出し、その校正用基板を被測定基板搬
送機構に搬送し、その被測定基板搬送機構を経てＸ−Ｙ
テーブルに搬送し、校正用基板に対する測定データを採
集し、その後に、前述の場合とは逆に、被測定基板搬送
機構から、校正用基板搬送機構を経て保持部に戻し、し
かる後に、カセット載置部から被測定基板搬送機構を経
て被測定基板をＸ−Ｙテーブルに搬送し、その膜厚を補
正データを加味した状態で精度良く測定することができ
る。<Operation> According to the above configuration, when the spectral characteristic of the optical system changes due to the replacement of the objective lens or the filter, or when it is necessary to measure the spectral characteristic of the calibration substrate for various reasons, the calibration is performed. The calibration substrate is taken out of the holding section by the substrate transport mechanism, the calibration substrate is transported to the measured substrate transport mechanism, and the XY is passed through the measured substrate transport mechanism.
The measurement data for the calibration substrate is transferred to the table, and then the measurement substrate transfer mechanism returns to the holding section via the calibration substrate transfer mechanism, and then the cassette is placed on the cassette. The substrate to be measured can be conveyed from the placing section to the XY table via the substrate-to-be-measured conveying mechanism, and the film thickness thereof can be accurately measured in a state where the correction data is taken into consideration.
＜実施例＞ 以下、本考案の実施例を図面に基づいて詳細に説明す
る。<Example> Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は、本考案に係る光学式膜厚自動測定装置の一部
省略平面図であり、台１上に、カセット載置部２、第１
の被測定基板搬送機構３、校正用基板Uaの保持部４、位
置決め部５、第２の被測定基板搬送機構６およびＸ−Ｙ
テーブル７が設けられている。なお、第１の被測定基板
搬送機構３と第２の被測定基板搬送機構６から成る一連
の搬送機構が、本考案の構成に言う「被測定基板搬送機
構」である。FIG. 1 is a partially omitted plan view of an optical film thickness automatic measuring apparatus according to the present invention, in which a cassette mounting portion 2 and a first
Substrate transport mechanism 3 for measuring, holding portion 4 of calibration substrate Ua, positioning portion 5, second substrate transport mechanism 6 for measurement, and XY
A table 7 is provided. It should be noted that a series of transfer mechanisms including the first measured substrate transfer mechanism 3 and the second measured substrate transfer mechanism 6 is the “measured substrate transfer mechanism” in the configuration of the present invention.
カセット載置部２は、複数個の被測定基板Ｕを上下方向
に段状に収納したカセット８を載置するように構成さ
れ、かつ、そのカセット載置部２が上下方向に駆動昇降
され、第１の被測定基板搬送機構３によって所定位置の
被測定基板Ｕをカセット８から取り出し、Ｘ−Ｙテーブ
ル７に移送して膜厚を測定し、膜厚を測定した後には、
同一経路を経て逆方向に戻し、取り出し前と同じ位置に
被測定基板Ｕを収納できるように構成されている。The cassette mounting portion 2 is configured to mount a cassette 8 in which a plurality of substrates to be measured U are vertically stored in a stepwise manner, and the cassette mounting portion 2 is vertically driven to move up and down. After the substrate to be measured U at a predetermined position is taken out from the cassette 8 by the first substrate to be measured transporting mechanism 3 and transferred to the XY table 7 to measure the film thickness, after measuring the film thickness,
It is configured such that the substrate to be measured U can be stored in the same position as before being taken out by returning to the opposite direction through the same path.
前記第１の被測定基板搬送機構３は、直線搬送と回転搬
送とを行う回転搬送機構９と、直線搬送のみを行う直線
搬送機構10とから構成されている。The first substrate transfer mechanism 3 to be measured is composed of a rotary transfer mechanism 9 that performs linear transfer and rotary transfer, and a linear transfer mechanism 10 that performs only linear transfer.
回転搬送機構９は、鉛直軸芯周りで回転駆動可能に設け
られた支持台11a上に、真空吸着によって基板Ｕまたは
校正用基板Uaを保待する吸着板11bを支待台11aの長手方
向に変位可能に設けて構成されている。The rotary transfer mechanism 9 includes a support 11a that is rotatably driven about a vertical axis, and a suction plate 11b that holds the substrate U or the calibration substrate Ua by vacuum suction in the longitudinal direction of the support 11a. It is configured to be displaceable.
一方、直線搬送機構10は、被測定基板Ｕまたは校正用基
板Uaの裏面の周縁部を載置支持する一対の基板載置アー
ム12,12を直線方向に往復駆動変位可能に設けて構成さ
れている。On the other hand, the linear transfer mechanism 10 is configured by providing a pair of substrate mounting arms 12, 12 for mounting and supporting the peripheral portion of the back surface of the substrate to be measured U or the calibration substrate Ua so as to be reciprocally movable in the linear direction. There is.
吸着板11bの往復変位と回転変位により、吸着板11bがカ
セット８内や保持部４に出退し、カセット８内や保待部
４に対して被測定基板Ｕや校正用基板Uaを取り出したり
収納したりし、かつ、直線搬送機構10との間で受け渡し
および送り受けを行うように構成されている。このよう
に、回転搬送機構９は、直線搬送機構10とで、本考案の
構成に言う「被測定基板搬送機構」の一部をなす第１の
被測定基板搬送機構３を構成し、しかも、本考案の構成
に言う「校正用基板搬送機構」も兼ねている。Due to the reciprocating displacement and the rotational displacement of the suction plate 11b, the suction plate 11b moves in and out of the cassette 8 and the holding unit 4, and the substrate to be measured U and the calibration substrate Ua are taken out from the cassette 8 and the holding unit 4. It is configured to be housed and to be delivered and received with the linear transport mechanism 10. Thus, the rotary transfer mechanism 9 and the linear transfer mechanism 10 constitute the first measured substrate transfer mechanism 3 which is a part of the "measured substrate transfer mechanism" in the configuration of the present invention, and further, It also serves as the "calibration substrate transfer mechanism" referred to in the configuration of the present invention.
前記保持部４は、第２図の側面図に示すように、回転搬
送機構９側に開口13を有するケーシング14で覆われると
ともに、そのケーシング14内に校正用基板Uaの裏面の周
方向３箇所を載置して支持する載置支持部15……を設け
て構成されている。As shown in the side view of FIG. 2, the holding portion 4 is covered with a casing 14 having an opening 13 on the side of the rotary transport mechanism 9, and inside the casing 14, three positions on the back surface of the calibration substrate Ua in the circumferential direction. A mounting support section 15 ... for mounting and supporting is provided.
位置決め部５は、被測定基板Ｕ（校正用基板Ua）の周端
面に当接する当て板16と、当て板16に当接された被測定
基板Ｕまたは校正用基板Uaを載置して真空吸着により固
定保持する保持部材17と、被測定基板Ｕまたは校正用基
板UaのオリエンテーションフラットＦを光学的に検出す
る光学検出部18と、検出されたオリエンテーションフラ
ットＦに対して位置を合わせ込むセンタリング部材19と
から構成され、被測定基板Ｕまたは校正用基板Uaを常に
特定の姿勢に調整できるようになっている。The positioning unit 5 mounts the backing plate 16 that abuts on the peripheral end surface of the substrate U to be measured (calibration substrate Ua) and the substrate U to be measured or the substrate Ua for calibration that abuts on the backing plate 16, and vacuum suction is performed. The holding member 17 fixedly held by the optical detecting unit 18 for optically detecting the orientation flat F of the measured substrate U or the calibration substrate Ua, and the centering member 19 for aligning the position with the detected orientation flat F. The measurement target substrate U or the calibration substrate Ua can always be adjusted to a specific posture.
第２の被測定基板搬送機構６は、回転体20に径方向で対
向させて、被測定基板Ｕまたは校正用基板Uaを真空吸着
によって保持する円弧状の吸着アーム21,21を取り付け
て構成され、吸着アーム21,21の回転に伴い、位置決め
部５とＸ−Ｙテーブル７とにわたって被測定基板Ｕまた
は校正用基板Uaを搬送するように構成されている。The second substrate transfer mechanism 6 to be measured is configured by attaching arc-shaped suction arms 21 and 21 that are opposed to the rotating body 20 in the radial direction and hold the substrate to be measured U or the calibration substrate Ua by vacuum suction. The substrate to be measured U or the calibration substrate Ua is configured to be transported over the positioning unit 5 and the XY table 7 as the suction arms 21, 21 rotate.
Ｘ−Ｙテーブル７上には、第３図の光学系の側面図に示
すように、昇降可能にＺテーブル22が設けられ、そのＺ
テーブル22の上方に、被測定基板Ｕまたは校正用基板Ua
の表面からの光を処理して膜厚を測定する光学系23が設
けられ、Ｘ−Ｙテーブル７によって水平面上の２次元方
向の測定位置を調整するとともに、Ｚテーブル22により
光学系23の焦点距離を調整するように構成されている。On the XY table 7, as shown in the side view of the optical system of FIG.
Above the table 22, the board under test U or the board for calibration Ua
Is provided with an optical system 23 for processing the light from the surface of the optical disk to measure the film thickness, the XY table 7 is used to adjust the measurement position in the two-dimensional direction on the horizontal plane, and the Z table 22 is used to focus the optical system 23. It is configured to adjust the distance.
光学系23には、対物レンズ24、オートフォーカスユニッ
ト25、接眼レンズ26、モニターカメラ27および分光器28
が備えられている。そして、図示しないが、光学系23に
は、ディスプレー装置や制御装置やキーボードなどを備
えたワークステーションが接続され、測定された膜厚デ
ータの二次加工や、対物レンズ24の変換等に起因する分
光特性の変化に伴う校正用基板Uaに対する膜厚測定に基
づくデータ補正などを自動的に行うように構成されてい
る。The optical system 23 includes an objective lens 24, an autofocus unit 25, an eyepiece lens 26, a monitor camera 27 and a spectroscope 28.
Is provided. Although not shown, the optical system 23 is connected to a workstation equipped with a display device, a control device, a keyboard, etc., which results from secondary processing of measured film thickness data, conversion of the objective lens 24, and the like. It is configured to automatically perform data correction and the like based on the film thickness measurement on the calibration substrate Ua due to the change in the spectral characteristic.
上記実施例では、保持部４と第１の被測定基板搬送機構
３との間で校正用基板Uaを搬送する校正用基板搬送機構
として、第１の被測定基板搬送機構３を構成する回転搬
送機構９を利用しているが、本考案としては、校正用基
板Uaを専用に搬送する機構を構えるようにしても良く、
回転搬送機構９や専用の搬送機構など、校正用基板Uaを
保持部４と被測定基板搬送機構とにわたって搬送するも
のをして校正用基板搬送機構と総称する。In the above-described embodiment, as the calibration substrate transport mechanism that transports the calibration substrate Ua between the holder 4 and the first measurement substrate transport mechanism 3, the rotary transport that constitutes the first measurement substrate transport mechanism 3 is used. Although the mechanism 9 is used, as the present invention, a mechanism for exclusively carrying the calibration substrate Ua may be provided,
A device for transporting the calibration substrate Ua between the holding unit 4 and the measured substrate transport mechanism, such as the rotary transport mechanism 9 or a dedicated transport mechanism, is generically referred to as a calibration substrate transport mechanism.
また、第１の被測定基板搬送機構３に、例えば、直線搬
送機構10を設けずに、回転搬送機構９のみによって、カ
セット載置部２と位置決め部５とにわたって被測定基板
Ｕを搬送するように構成するものでも良い。Further, for example, the linear transfer mechanism 10 is not provided in the first measured substrate transfer mechanism 3, and only the rotary transfer mechanism 9 transfers the measured substrate U between the cassette placing section 2 and the positioning section 5. It may be configured as.
また、校正用基板Uaの保持部４としては、カセット載置
部２とは別の箇所であれば、任意の位置に配設すること
ができる。Further, the holding portion 4 for the calibration substrate Ua can be arranged at any position other than the cassette mounting portion 2.
また、必ずしも位置決め部を設けることを本考案は要し
ない。Further, the present invention does not necessarily need to provide the positioning portion.
なお、保持部４の校正用基板Uaの空気酸化を防止する目
的から、不活性ガス（例えば、N2）で保持部４を充填す
るか、あるいは、不活性ガスを校正用基板Uaに常時吹き
かけるようにするのが望ましい。In order to prevent air oxidation of the calibration substrate Ua of the holding unit 4, the holding unit 4 is filled with an inert gas (for example, N 2 ) or the inert gas is constantly sprayed on the calibration substrate Ua. It is desirable to do so.
＜考案の効果＞ 以上説明したように、本考案の光学式膜厚自動測定装置
によれば、校正用基板の専用の保持部を設け、カセット
載置部とＸ−Ｙテーブルとにわたって被測定基板を搬送
する本来の被測定基板搬送機構に対して、前記保持部と
被測定基板搬送機構との間に校正用基板搬送機構を設け
るから、作業者が校正用基板をピンセットなどにより直
接的に取り扱わずに済み、校正用基板に対する取り扱い
を手間少なく容易に行うことができ、膜厚測定のための
作業性を向上できるようになった。<Effects of the Invention> As described above, according to the optical film thickness automatic measuring apparatus of the present invention, a dedicated holding portion for the calibration substrate is provided, and the substrate to be measured is extended across the cassette mounting portion and the XY table. Since the calibration substrate transport mechanism is provided between the holder and the substrate transport mechanism to be measured, the operator directly handles the calibration substrate with tweezers. Therefore, the calibration substrate can be handled easily and easily, and the workability for film thickness measurement can be improved.
しかも、保持部と校正用基板搬送機構とを設けるだけ
で、被測定基板および校正用基板のいずれをもＸ−Ｙテ
ーブルに搬送し、互いに同一条件で膜厚を測定するか
ら、Ｘ−Ｙテーブル上に被測定基板の載置部とは別に校
正用基板の載置部を設ける場合のように、通常の膜厚測
定時と校正用基板に対する膜厚測定時とでＸ−Ｙテーブ
ルを大きく移動させずに済み、装置全体を小型化できる
とともに精度低下を回避できる。Moreover, since the substrate to be measured and the substrate for calibration are both transported to the XY table and the film thickness is measured under the same conditions, only by providing the holding unit and the calibration substrate transport mechanism, the XY table is provided. The XY table is moved greatly during normal film thickness measurement and during film thickness measurement on the calibration substrate, as in the case where a calibration substrate placement part is provided on top of the measurement substrate placement part. It is not necessary to do so, the entire device can be downsized, and a decrease in accuracy can be avoided.
第１図は、本考案に係る光学式膜厚自動測定装置の実施
例を示す一部省略平面図、第２図は、校正用基板の保持
部の正面図、第３図は、光学系の側面図である。 ２……カセット載置部 ３……第１の被測定基板搬送機構 ４……校正用基板の保持部 ５……位置決め部 ６……第２の被測定基板搬送機構 ７……Ｘ−Ｙテーブル ８……カセット ９……回転搬送機構、校正用基板搬送機構 10……直線搬送機構 Ｕ……被測定基板 Ua……校正用基板FIG. 1 is a partially omitted plan view showing an embodiment of an optical film thickness automatic measuring device according to the present invention, FIG. 2 is a front view of a holding portion of a calibration substrate, and FIG. 3 is an optical system. It is a side view. 2 ... Cassette placement part 3 ... First measured substrate transfer mechanism 4 ... Calibration substrate holding part 5 ... Positioning part 6 ... Second measured substrate transfer mechanism 7 ... XY table 8: Cassette 9: Rotational transport mechanism, calibration substrate transport mechanism 10: Linear transport mechanism U: Substrate under measurement Ua: Calibration substrate
Claims (1)
定基板上の薄膜の膜厚を測定する光学系と、 前記光学系との相対位置合わせを行うため、前記被測定
基板を載置して２次元方向に移送するＸ−Ｙテーブル
と、 複数個の被測定基板を収納したカセットを載置するカセ
ット載置部と、 前記カセット載置部と前記Ｘ−Ｙテーブルとにわたって
前記被測定基板を搬送する被測定基板搬送機構とを備え
た光学式膜厚自動測定装置において、 前記カセット載置部とは別の箇所に校正用基板の保持部
を配設し、その保持部と前記Ｘ−Ｙテーブルとにわたっ
て校正用基板を搬送する校正用基板搬送機構が、前記被
測定基板搬送機構に兼用されているか、または、前記被
測定基板搬送機構とは別に設けられたことを特徴とする
光学式膜厚自動測定装置。1. An optical system for processing light from the surface of a substrate to be measured to measure the film thickness of a thin film on the substrate to be measured, and the substrate to be measured for relative alignment with the optical system. An XY table for placing and transferring in a two-dimensional direction, a cassette placing section for placing a cassette containing a plurality of substrates to be measured, the cassette placing section and the XY table, and In an optical film thickness automatic measuring device equipped with a measured substrate transporting mechanism for transporting a measured substrate, a holding portion for a calibration substrate is provided at a position different from the cassette mounting portion, and the holding portion is provided. A calibration substrate transport mechanism that transports the calibration substrate across the XY table is also used as the measurement substrate transport mechanism, or is provided separately from the measurement substrate transport mechanism. Optical film thickness automatic measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3125289U JPH0648328Y2 (en) | 1989-03-17 | 1989-03-17 | Optical film thickness automatic measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3125289U JPH0648328Y2 (en) | 1989-03-17 | 1989-03-17 | Optical film thickness automatic measurement device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02122306U JPH02122306U (en) | 1990-10-05 |
| JPH0648328Y2 true JPH0648328Y2 (en) | 1994-12-12 |
Family
ID=31256980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3125289U Expired - Lifetime JPH0648328Y2 (en) | 1989-03-17 | 1989-03-17 | Optical film thickness automatic measurement device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648328Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002267419A (en) * | 2001-03-14 | 2002-09-18 | Horiba Ltd | Film thickness measuring instrument |
| EP3081921B1 (en) * | 2015-04-16 | 2019-08-14 | Heraeus Electro-Nite International N.V. | Spectrometer calibration method |
-
1989
- 1989-03-17 JP JP3125289U patent/JPH0648328Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02122306U (en) | 1990-10-05 |
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