JPH0645481A - Resin-sealed electronic component and manufacturing method thereof - Google Patents

Abstract

(57) [Abstract] [Object] The present invention provides a novel method for completely encapsulating an electronic component by injection-molding a thermoplastic resin molded article supporting an electronic element or the like using a thermoplastic resin. An electronic component sealed thereby is provided. [Structure] Hold electronic components with a support of thermoplastic resin,
This is completely sealed with a molten thermoplastic resin. [Effect] The support of the electronic component and the encapsulation resin are in close contact with each other, and in particular, the resin can be integrally heat-sealed, so that the reliability of the enclosed electronic component is highly maintained. In addition, it can be molded at high speed by injection molding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging an electronic device, an electric circuit and a composite component thereof, such as packaging of a component which is difficult to fix in a mold at the time of molding and external lead wires. And electronic parts that do not have lead terminals, such as antenna systems, sensors, data carrier systems, etc. that transmit information and energy by using radio waves, light, sound, magnetic force, or themselves such as watches. Therefore, it can be effectively used for manufacturing equipment that has one function and does not need to exchange energy with the outside.

[0002]

2. Description of the Related Art Conventionally, packaging of electronic devices has been
There are a method of putting an element in a container of metal, ceramics, etc. and hermetically sealing it, and a method of using plastic. The latter can be further divided into a molding method and an injection method. Currently, the transfer molding method using an epoxy resin is used. Mainstream.

Recently, sealing with an injection-molded article using a thermoplastic resin has been attempted for the purpose of improving productivity. For example, in an electronic component having no external lead wire or lead terminal,
(1) A method in which the element or the like is put in a preformed case, and the lid is screwed, adhered, or fused by high frequency. (2) The element or the like is put in the preformed case, Examples of the method include a method of filling a space with a liquid resin and the like, (3) timing molding method, and the like.

In these prior arts, in the case of (1), it is necessary to use packing or an adhesive for screwing, and the workability including the case of (2) is poor and is not suitable for mass production. Not enough sealing and low reliability. Also (3)
The timing molding of the mold is complicated and expensive,
It cannot be applied to parts to be inserted, such as wires, which are difficult to align and fix with several pins in the cavity.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to perform injection molding using a thermoplastic resin so that components that are not easily fixed in a mold at the time of molding or lead wires or lead terminals are not exposed to the outside. An object of the present invention is to provide a method for sealing an electronic element in which the components are sealed with good workability and the reliability of the obtained electronic component is high.

[0006]

Means for Solving the Problems The inventors of the present invention have made extensive studies in view of the above situation, and as a result, set a resin-bonded article incorporating an element in a mold, and injection-mold the resin-bonded article to form an element or the like. The present inventors have found that the inclusion significantly improves the moldability and the reliability as compared with the conventional method using a case and the timing molding, and the present invention has been completed.

That is, the present invention relates to a thermoplastic resin support (A)
And an electronic element or composite electronic component (B) supported thereby, and a thermoplastic resin member (C) containing the element or component (B), wherein the support (A) is the thermoplastic resin member. The present invention relates to a resin-sealed electronic component, which is integrally fused with (C), and the element or component (B) is entirely encapsulated in a resin, and a method for manufacturing the electronic component.

Thermoplastic resin support (A) in the present invention
Is, for example, (1) a resin molded product having at least one pre-formed at least one indentation, or (2) the support (A) is an electronic element or a composite electronic component (B). And a resin-bonded product integrally formed in advance may be configured. In (1), the element or the like (B) is placed on the saucer-shaped support (A), or is fixed by an adhesive, or at least one of them is a depression. The element or the like (B) is supported by being sandwiched by two or more members having

For example, in the case of a thin wire-shaped element such as an antenna, a method using a saucer-shaped support body or a method of holding the element is preferable to preliminarily integrally molding, and the portion where the element or the like is mounted is hollow. If it is necessary, the method of sandwiching is preferable.

Further, the thermoplastic resin support (A) may be preliminarily formed with a circuit by using plating, a conductive paste or the like. Further, the resin support (A) may be composed of several kinds of resins, and in order to achieve close contact with the thermoplastic resin member (C), the portion in contact with the thermoplastic resin member (C) is silane. A coupling agent or a hot melt adhesive may be applied.

Thermoplastic resin member (C) in the present invention
May be the same as or different from that of the thermoplastic resin support (A), but moisture or the like may enter inside from the interface between the thermoplastic resin member (C) and the thermoplastic resin support (A). In order to prevent the internal elements from deteriorating or cracking, molding is performed at a resin temperature higher than the melting point or glass transition point of the resin used for the thermoplastic resin support (A), and the support (A It is necessary that part of () be melted or softened and the interface be firmly fused.

In the present invention, the resins used for the thermoplastic resin support (A) and the thermoplastic resin member (C) are known and commonly used resins such as polyarylene sulfide resin, polyphenylene ether, polyarylate,
Polybutylene terephthalate, polyethylene terephthalate, poly 1,4-cyclohexane dimethylene terephthalate, polycarbonate, various liquid crystal polymers, polysulfone, polyether sulfone, polyallyl sulfone, polyether ketone, polyether ether ketone, polyimide, polyamide, , Polymethylpentene, and the like, among which polyarylene sulfide resin, polyphenylene ether, polyarylate, polybutylene terephthalate, polyethylene terephthalate, poly 1,4-cyclohexanedimethylene terephthalate, polycarbonate, various liquid crystal polymers are preferable. -Classes, polysulfones, polyamides, etc.

As the combination of the resin constituting the thermoplastic resin support (A) and the thermoplastic resin member (C), the temperature of the resin used for the member (C) at the time of injection molding is determined. It is preferable to employ a resin having a lower melting point or glass transition point for the support (A). If selected in this way, thermal fusion of both (A) and (C) will be good.

Particularly preferably, a polyarylene sulfide resin having excellent heat resistance, chemical resistance, oil resistance and low hygroscopicity is selected, and in addition to a resin simple substance (including a mixture of two or more kinds of resins and an alloy), Inorganic / organic fillers and known additives, for example, surface treatment agents such as titanate, zirconate, zircoaluminate, aluminum chelate compound coupling agents, antioxidants, heat stabilizers, alkali metals or alkaline earth metals. It may be a composition containing a corrosion inhibitor such as oxide, hydroxide or carbonate, a lubricant, a coloring agent, a crystal nucleating agent and the like.

Specific examples of the filler include silica, diatomaceous earth, dolomite, γ-alumina, alumina other than γ type, titanium oxide, iron oxide, zinc oxide, magnesium oxide, antimonic acid, antimony oxide, barium ferrite. , Oxides of strontium ferrite, beryllium oxide, pumice, pumice balloon, lead oxide, bismuth oxide, zirconium oxide; hydroxides of zinc hydroxide, aluminum hydroxide, magnesium hydroxide, basic magnesium carbonate; lithium carbonate, Carbonate such as calcium carbonate, magnesium carbonate, zinc carbonate, dawsonite; sulfuric acid or sulfite such as calcium sulfate, barium sulfate, ammonium sulfate, calcium sulfite; talc, clay,
Silica such as mica, asbestos, glass fiber, glass balloon, glass beads, calcium silicate, montmorillonite, bentonite, hydrosites; other carbon black, molybdenum sulfide, boron fiber, silicon carbide fiber, potassium titanate, titanic acid , Lead zirconate, zinc borate, barium metaborate, calcium borate, sodium borate, and other inorganic fillers in the form of particles, fibers, whiskers, spheres, hollows, aromatic polyamide fibers, polytetrafluoro Examples include organic fillers such as ethylene.

Polyarylene sulfide in the present invention
For the resin (A), the general formula -φ-S- (however, -φ-
Represents a p-phenylene group, and the same shall apply hereinafter. )of
PPS having repeating unit, general formula -φ-CO-φ
Polyphenylene wolf having repeating unit of -S-
Edoketone (hereinafter abbreviated as PPSK), general formula -φ-S
O ₂Polyphenylene suture having -φ- repeating unit
Polymers such as fidosulfone (hereinafter abbreviated as PPSS)
included. In addition, the PAS resin is a substantially linear polymerization.
Whether a body or a partially crosslinked polymer,
Further, it may be a mixture thereof. Also, the PA
Random of PPS, PPSK, PPSS as S-based resin
Polymers, grafts, block copolymers, carboxylic acid groups,
Having acid groups such as taconic acid groups, glycidyl groups, amino groups, etc.
Modified products are also included.

In the above PPS, PPSK and PPSS, a meta bond [-(m
-Phenylene) -S-], ether bond (-φ-O-φ
-S-), sulfone bond (-φ-SO ₂ -φ-S-),
Sulfide ketone bond (-φ-CO-φ-S-), biphenyl bond (-φ-φ-S-) and substituted phenyl sulfide bond (1) shown in Chemical formula 1 below, trifunctional phenyl sulfide bond (2) Of course, it does not matter even if it contains a naphthyl sulfide bond (3) or the like (wherein R represents an alkyl, nitro, phenyl or alkoxy group).

[0018]

[Chemical 1]

The PPS can be polymerized by polymerizing p-dichlorobenzene in the presence of sulfur and sodium carbonate, or by using sodium sulfide or sodium hydrosulfide and sodium hydroxide or hydrogen sulfide and sodium hydroxide in a polar solvent. Examples of the method include polymerization in the presence of p-chlorothiophenol and self-condensation of p-chlorothiophenol. Sodium sulfide and p-dichlorobenzene are used in an amide solvent such as N-methylpyrrolidone or dimethylacetamide or a sulfone solvent such as sulfolane. Is suitable. At this time, it is a preferable method to add an alkali metal salt of carboxylic acid or sulfonic acid or to add an alkali hydroxide in order to control the degree of polymerization.

As a method of polymerizing PPSK, for example,
A method of reacting dihalobenzophenone and an alkali metal sulfide in an organic amide solvent (Japanese Patent Laid-Open No. 63-11302).
No. 0 and JP-A-64-54031).

As a method for polymerizing PPSS, for example, a method in which a dihaloaromatic sulfone and an alkali metal sulfide are reacted in an organic amide solvent (US Pat. No. 4,102,875).
No.).

The viscosity of the resin constituting the thermoplastic resin member (C) in the present invention is not particularly limited, but it is 20,000 poise or less, preferably 10,000 poise or less at the temperature at the time of injection molding, and 300 ~ 2000
The poise range is optimal. By using the low-viscosity resin, a part of the thermoplastic resin support (A) is melted by resin heat or fluid pressure at the time of molding, and is easily fused with the thermoplastic resin member (C), and molding is performed. The pressure is 20 during normal resin molding
% Or less, deformation and destruction of the elements inside, damage on elements on the circuit, solder flow, etc. are also small, and thin molding is possible, contributing to miniaturization of molded electronic parts it can.

[0023]

EXAMPLES Next, the present invention will be described in detail with reference to examples, but the present invention is not limited to these.

Embodiment 1 FIGS. 2 and 3 are used to seal an antenna component 3 in which several kinds of electronic components (not shown) and a copper wire 2 are reflow-soldered on a printed circuit board 1 as shown in FIG. A dish-shaped molded product 4 as shown in FIG. This was put in a mold for insert molding and a thermoplastic resin for sealing was injection-molded to obtain a resin-sealed electronic component 5 shown in FIG.

It was confirmed by an X-ray photograph that there was no wire breakage or displacement of the electronic parts. The initial characteristics and 10
No difference in electrical properties was observed after 0 hour pressure cooker test (121 ° C., 2 atm).

Resin used: polyphenylene sulfide (D
IC / PPS EC-10 Dainippon Ink and Chemicals Co., Ltd. Low viscosity resin for encapsulation Insert molding conditions: Resin temperature 300 ° C. Mold temperature 150 ° C. Injection pressure 70 Kg / cm ² Example 2 As shown in FIG. Then, the electronic timepiece component 6 was sandwiched between a transparent resin lid 7 and a resin dish 8, and the electronic timepiece component 6 was placed in an insert molding die and molded with a resin 9 to obtain a resin-sealed timepiece. After the water pressure of 5 Kg / cm ² was applied and it was left for 30 minutes, no water entered and the watch operated normally.

Resin used: Lid Polyarylate (P-1001 Unitika Ltd.) Dish Polyphenylene sulfide (DIC / PPS)
FZ-1140 Dainippon Ink and Chemicals, Inc. Encapsulation material Polyphenylene sulfide (DIC / PPS)
EC-40 Dainippon Ink and Chemicals Co., Ltd. Sealing low viscosity high strength resin) Insert molding conditions: Resin temperature 300 ° C Mold temperature 150 ° C Injection pressure 80Kg / cm ² Example 3 Several kinds on printed circuit board 10 In order to seal the electronic component 11 to which the reflow soldering has been applied, the component 12 is set in the molds 13 and 14 as shown in FIG. 6, and the thermoplastic resin support 15 is integrally molded with the component 12. . This was housed in the insert molding dies 16 and 17 and molded to obtain an electronic component sealed by the support 15 and the thermoplastic resin member 18 as shown in FIG.

Example 4 Electronic parts were soldered to a thermoplastic resin support having an electric circuit formed of a conductive paste. This was placed in a mold for insert molding in the same manner as in Example 3 and a thermoplastic resin was injection-molded to obtain an electronic component sealed with the support and the thermoplastic resin member.

Comparative Example 1 The antenna part shown in Example 1 was tried to be molded by timing molding, but it was difficult to fix the copper wire and the wire was exposed on the surface after molding.

Comparative Example 2 The antenna part shown in Example 1 was molded in the same manner as in Example 1 except that a dish made of epoxy resin was used. However, since the interface with the epoxy resin was not fused, In the pressure cooker test (121 ° C., 2 atm) for 10 minutes, deterioration of electric characteristics was already observed.

[0031]

The manufacturing method according to the present invention particularly uses the conventional case for sealing components that are not easily fixed in the mold during molding and electronic components that do not have lead wires or lead terminals outside. Compared to the conventional method and timing molding, the reliability and moldability are greatly improved. In particular, the resin used is heat resistant,
A polyarylene sulfide-based resin having excellent chemical resistance, oil resistance, and low hygroscopicity is preferable, and when the viscosity of the resin used for encapsulating the finally mounted electronic parts is 10,000 poise or less at the time of molding. Since the molding pressure can be suppressed to 20% or less of that at the time of normal resin molding, there is little deformation or destruction of the elements inside, elements on the circuit, damage such as solder flow, and thin wall Molding is also possible, which can contribute to miniaturization of molded electronic parts. In addition, the obtained electronic component has no intrusion of water, chemicals, oils and other solvents into the inside thereof, and therefore has excellent durability and can maintain high reliability.

[Brief description of drawings]

FIG. 1 is a schematic diagram of an antenna component 3 that is a composite component to be sealed according to a first embodiment.

FIG. 2 is a plan view of a tray 4 made of a thermoplastic resin.

FIG. 3 is a cross-sectional view at each cutting position shown in FIG.

FIG. 4 is a front view of a completed electronic component 5.

FIG. 5 is a sectional view of a resin-sealed electronic timepiece component according to a second embodiment.

FIG. 6 is a cross-sectional view showing a state where a printed circuit board in Example 3 is set in a mold and a thermoplastic resin support is molded.

FIG. 7 is a cross-sectional view showing a state in which an electronic component integrated with a thermoplastic resin support is set in an insert mold and resin-sealed.

[Explanation of symbols]

1 Printed Circuit Board 9 Sealing Resin Member 2 Copper Wire 10 Printed Circuit Board 4 Dish Shaped Product 13, 14, 16, 1
7 Mold 6 Electronic timepiece component 15 Support 7 Lid 18 Sealing resin member 8 Plate

Claims (13)

[Claims] 1. A thermoplastic resin support (A), an electronic element or composite electronic component (B) supported by the support, and a thermoplastic resin member (C) containing the element or component (B). The resin-sealed electronic device, wherein the support (A) is integrally fused with the thermoplastic resin member (C), and the element or component (B) is wholly enclosed in resin. parts. 2. The resin-sealed electronic component according to claim 1, wherein the thermoplastic resin support (A) has a saucer shape. 3. The resin-sealed electron according to claim 1, wherein the thermoplastic resin support (A) is composed of two or more members that sandwich the element or component (B) and at least one of which has a recess. parts. 4. The thermoplastic resin support (A) is composed of a resin having a melting point or a glass transition point lower than the resin temperature at the time of injection molding of the thermoplastic resin member (C). Item 5. The resin-sealed electronic component according to Item 1, 2 or 3. 5. The resin-sealed electronic component according to claim 1, wherein the resin constituting the thermoplastic resin support (A) and the thermoplastic resin member (C) is a polyarylene sulfide resin. 6. The resin-encapsulated electron according to claim 5, wherein the resin constituting the thermoplastic resin member (C) is a polyarylene sulfide-based resin having a viscosity of 300 to 10,000 poise at the temperature at the time of its injection molding. parts. 7. A method for producing an electronic component in which an electronic device or a composite electronic component (B) is hermetically sealed with a resin composition, comprising a thermoplastic resin support (A) to which the device or component (B) is fixed. ) Is set in a mold, and then the molten thermoplastic resin (C) is injected and injected into the cavity in the mold to melt or soften a part of the resin forming the support (A). (A) and the resin (C) are fused together, and the element or component (B) is entirely enclosed in the support (A) and the resin (C). Manufacturing method of parts. 8. The method according to claim 7, wherein the thermoplastic resin support (A) is a resin molded product having at least one preformed one or more preformed dents. 9. The thermoplastic resin support (A) and the electronic element or composite electronic component (B) are integrally molded in advance.
The manufacturing method described. 10. The manufacturing method according to claim 7, wherein said element or component (B) is mounted on a thermoplastic resin support (A) on which a circuit is printed. 11. The thermoplastic resin support (A) is composed of a resin having a melting point or a glass transition point lower than the resin temperature at the time of injection molding of the thermoplastic resin member (C). The manufacturing method according to 7, 8, 9 or 10. 12. The thermoplastic resin (C) to be injected and injected is a polyarylene sulfide resin, 7.
9. The manufacturing method according to 9, 10 or 11. 13. A polyarylene sulfide-based resin,
The manufacturing method according to claim 12, which has a viscosity of 300 to 10,000 poise under the temperature at the time of the injection molding.