JP2006236206A - Method for manufacturing memory card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a memory card for perfectly sealing a chip module. <P>SOLUTION: The chip module is provided on a base and electrically connected to a connecting terminal. A plastic material is then directly injected to the base to cover the chip module with the plastic material. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a memory card, and more particularly to a method for manufacturing a memory card used as a storage medium for storing and deleting computer or peripheral equipment data.

  Currently, computer science and technology are advancing rapidly every day. Memory cards have become a necessity for computer users and are used as storage media for digital peripheral products. A memory card is smaller in volume than a floppy disk, but has a large capacity and a high storage speed. Further, the memory card is not easily affected by moisture or damaged like a floppy (registered trademark) disk. For this reason, memory cards are being used in place of floppy (registered trademark) disks having a small capacity and a large volume.

  Currently, in order to adapt to different types and types of digital products or computer peripheral equipment sold in the market, various types of memory cards of different sizes and standards are released and used for storage, reading, deletion, etc. of various computers. Yes.

The current method of manufacturing a memory card is to provide a flash memory, control chip, passive element, etc. on the base, and connect it to the output / input terminal connected to one edge of the base to form the required electrical circuit. Finally, welding is performed using ultrasonic waves, or the cover is stuck on the base by a method such as embossing or adhesive. The basic combination is formed as described above, but has the following drawbacks when used and must be improved.
1. Contact terminals used for signal output / input are formed by continuously embossing copper pieces of metal. Thereafter, it is connected to one edge of the base of the memory card in which plastic is injection-molded. Since the combination method of connecting the stamped contact terminals to the base is complicated, human work is inevitable and the yield is high.
2. The memory card including the base and the cover cannot completely isolate the memory provided inside from the outside. Therefore, it is easily affected by moisture, and the accuracy and service life of the memory card are short. Furthermore, there is a problem that the scale package unit is out of capacity. For example, Taiwan's utility model registration number No. 556908 “Improved structure of memory card” is used to fill the space in the memory card so that moisture enters the memory card and the accuracy of the memory card is increased. Technology has been developed to prevent impacts. However, the manufacturing process becomes complicated and the cost increases.
Taiwan Utility Model Registration No. 556908

  It is an object of the present invention to provide a method for manufacturing a memory card that can completely seal a chip module provided inside the memory card.

  Therefore, as a result of intensive research in view of the drawbacks found in the prior art, the present inventor has provided a chip module on the base, electrically connected to a contact terminal provided on one end of the base, and further connected the base. An object of the present invention is to provide a memory card manufacturing method in which a plastic material is directly coated by injection molding, or a cover is provided on the base to cover the chip module, and the cover and the base are sealed by injection molding. The present invention was completed based on such knowledge.

The present invention will be specifically described below.
The method of manufacturing a memory card according to claim 1 includes a base, a chip module including a plurality of passive elements, a flash memory, a control chip, and the like provided on the base, and one end of the base. A method of manufacturing a memory card including a contact terminal electrically connected to a chip module,
Providing the chip module on the base;
Plastic is directly injected into the base provided with the chip module, and the chip module is covered with plastic to ensure sealing and insulation.

  According to a second aspect of the present invention, there is provided a method of manufacturing a memory card, wherein the contact terminal according to the first aspect is directly implanted in the base by plastic injection molding.

According to a third aspect of the present invention, there is provided a memory card manufacturing method comprising: a base; a chip module including a plurality of passive elements, a flash memory, a control chip, and the like; and provided at one end of the base. A method of manufacturing a memory card including a contact terminal to be connected and a cover provided on the base and sealing the chip module,
The chip module is provided on the base, and injection molding is performed on a structure provided with the cover, and the gap between the cover and the base is completely sealed, and the chip module is securely sealed and insulated. .

  The method for manufacturing a memory card according to the present invention has an effect that the chip module is completely sealed in plastic, the manufacturing process is simplified, the yield of the product is increased, and the manufacturing cost is reduced.

The present invention provides a method of manufacturing a memory card, which is provided with a chip module on a base, electrically connected to a contact terminal provided at one end of the base, and further, the base is made of a plastic material by injection molding. The objective of completely sealing the chip module is achieved by coating directly or by covering the chip module with a cover on the base and sealing the cover and the base by injection molding.
In order to detail the manufacturing method and characteristics of such a memory card, a specific example will be given and described in detail below with reference to the drawings.

  FIG. 1 is a free chart showing a method of manufacturing a memory card according to the present invention. In the memory card according to the present invention (see FIG. 2), a chip module 3 (including a flash memory, a control chip, and a passive element) is provided on a base 1 and electrically connected to a contact terminal 2 provided on an edge of the base 1 Connected to.

  In the manufacturing method according to the present invention, a contact piece 2 is formed by continuously embossing copper pieces with a press machine, a plastic material is directly injected with an injection molding machine, the base 1 is molded, and the contact terminal 2 is formed. It is planted in the base 1 (see FIG. 3). Such a manufacturing method can omit the step of manually assembling the base 1 and the contact terminal 2. Therefore, the manufacturing process is simplified and the cost can be reduced.

  Next, after the above-described steps are completed, a semi-finished product having a poor injection molding is selected to prevent the expensive chip module 3 from being embedded in a poorly molded base. This is to prevent the product yield from decreasing and the manufacturing cost from increasing.

  A chip module 3 (including a flash memory, a control chip, and a passive element) is provided on the selected base 1 having a good injection state, and is electrically connected to the contact terminal 2 at one end of the base 1. Next, as disclosed in FIG. 4, the cover 4 is provided on the base 1, and the chip module 3 is accommodated between the base 1 and the cover 4.

  Finally, plastic injection molding is performed again on the above structure, and the gap between the cover 4 and the base 1 is completely sealed. Therefore, the chip module 3 inside the memory card is securely sealed and insulated from the outside. Therefore, it is possible to effectively prevent moisture and moisture from entering, increase the reliability of the memory card, and improve the drawbacks of the conventional technology that the chip module 3 can be easily detached.

  FIG. 5 discloses a manufacturing process according to the second embodiment. In the second embodiment, the plastic module is directly molded after the chip module 3 is provided on the base 1 without using the cover 4. Therefore, the manufacturing process can be shortened. Other manufacturing steps are the same as those in the first embodiment, and therefore will not be described in detail here (see FIG. 6).

  As can be seen from the above, according to the present invention, the chip module in the memory card can be completely sealed according to a simple method. Therefore, not only the manufacturing process can be simplified, but also the yield can be increased and the manufacturing cost can be reduced.

  The above are preferred embodiments of the present invention, and do not limit the scope of the present invention. Accordingly, any modifications or changes that can be made by those skilled in the art, which are made within the spirit of the present invention and have an equivalent effect on the present invention, belong to the scope of the claims of the present invention. And

3 is a flowchart showing a method of manufacturing a memory card according to the present invention. It is a perspective view of the memory card in this invention. It is explanatory drawing which showed the manufacturing method of the memory card in this invention. It is another explanatory drawing which showed the manufacturing method of the memory card in this invention. It is the flowchart which showed the manufacturing method of the memory card by the 2nd example. It is other explanatory drawing which showed the manufacturing method of the memory card in this invention.

Explanation of symbols

1 Base 2 Contact terminal 3 Chip module 4 Cover

Claims (3)

A base; a chip module including a plurality of passive elements, a flash memory, a control chip, and the like provided on the base; and a contact terminal provided at one end of the base and electrically connected to the chip module A method of manufacturing a memory card,
Providing the chip module on the base;
A method of manufacturing a memory card, wherein plastic is directly injected to a base provided with the chip module, the chip module is covered with plastic, and is securely sealed and insulated.   2. The method of manufacturing a memory card according to claim 1, wherein the contact terminals are directly implanted in the base by plastic injection molding. A base, a chip module including a plurality of passive elements, a flash memory, a control chip, and the like; a contact terminal provided at one end of the base and electrically connected to the chip module; provided on the base; A method of manufacturing a memory card including a cover for sealing the chip module,
The chip module is provided on the base, and injection molding is performed on a structure provided with the cover, and the gap between the cover and the base is completely sealed, and the chip module is securely sealed and insulated. A method for manufacturing a memory card.

Images