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JPH0644530A - Magnetic head device - Google Patents

Magnetic head device

Info

Publication number
JPH0644530A
JPH0644530A JP21971492A JP21971492A JPH0644530A JP H0644530 A JPH0644530 A JP H0644530A JP 21971492 A JP21971492 A JP 21971492A JP 21971492 A JP21971492 A JP 21971492A JP H0644530 A JPH0644530 A JP H0644530A
Authority
JP
Japan
Prior art keywords
magnetic head
magnetic
lead wire
conversion element
conductor film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21971492A
Other languages
Japanese (ja)
Other versions
JP3241448B2 (en
Inventor
Mikio Matsuzaki
幹男 松崎
Masaatsu Ishizuka
政温 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP21971492A priority Critical patent/JP3241448B2/en
Publication of JPH0644530A publication Critical patent/JPH0644530A/en
Application granted granted Critical
Publication of JP3241448B2 publication Critical patent/JP3241448B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Magnetic Heads (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)

Abstract

PURPOSE:To provide the magnetic head device with which a characteristic test and the assembly operation to a magnetic disk device are easy. CONSTITUTION:This magnetic head 1 has a magnetic conversion element on a slider. Lead wires 2 are constituted by embedding conductor films 22, 23 into a high-polymer resin film 21. These conductor films 22, 23 are connected at one end to the taking out recordings of the magnetic conversion element and are formed as free ends at the other end and have exposed conductive film parts 24, 25 exposed with the conductor films 22, 23 by notching the high- polymer resin film 21 in the intermediate part between the one end and the other end.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、磁気ヘッド装置に関
し、更に詳しくは、磁気変換素子の取出電極に接続され
るリード線の改良に係わる。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head device, and more particularly to improvement of a lead wire connected to a lead electrode of a magnetic conversion element.

【0002】[0002]

【従来の技術】従来の磁気ヘッド装置において、磁気変
換素子の取出電極に接続されるリード線はツイストペア
線で構成し、ツイストペア線によるループを作ったうえ
で、その先端部を磁気変換素子の取出電極に接続するの
が一般的であった。しかし、例えば特開昭64ー217
13号(米国特許第4928195号明細書)に見られ
る磁気ヘッドの小型化、ヘッド支持装置から磁気ヘッド
に加わる荷重の低荷重化、磁気ディスクの小径化に伴う
低周速化、低浮上量化、更には、多素子化に伴う取出電
極数の増大等に対して、ツイストペア線によるリード線
では対応が困難になっている。磁気ヘッドの小型化、低
荷重化、低浮上量化及び低周速化が進む程、ツイストペ
ア線によるループ部のバネ剛性の影響を受け易くなり、
磁気ヘッドの浮上量及び浮上特性に悪影響を与えるよう
になるからである。
2. Description of the Related Art In a conventional magnetic head device, a lead wire connected to an extraction electrode of a magnetic conversion element is composed of a twisted pair wire, a loop is formed by the twisted pair wire, and a tip portion thereof is taken out of the magnetic conversion element. It was common to connect to electrodes. However, for example, Japanese Patent Laid-Open No. 64-217
No. 13 (US Pat. No. 4,928,195), miniaturization of the magnetic head, reduction of load applied to the magnetic head from the head supporting device, reduction of peripheral speed due to reduction in diameter of the magnetic disk, reduction of flying height, Furthermore, it is difficult to deal with the increase in the number of extraction electrodes due to the increase in the number of elements with a lead wire using a twisted pair wire. The smaller the magnetic head, the lower the load, the lower the flying height, and the lower the peripheral speed, the more easily it is affected by the spring rigidity of the loop part due to the twisted pair wire.
This is because the flying height and flying characteristics of the magnetic head are adversely affected.

【0003】ツイストペア線のループ部のバネ剛性の影
響を軽減するため、素線の線径を、例えば30μm程度
にする試みがなされたが、取出電極に対する接合強度が
低下すること、細い線径のために、磁気ヘッドの小型化
に伴う取出電極の小面積化とも相まって、取出電極に対
する接合作業が困難になること等の問題を生じる。更
に、多素子型の磁気ヘッドの場合は、小さい空間に多数
の素線が存在することになるため、接合作業が著しく面
倒になる。
In order to reduce the influence of the spring rigidity of the loop portion of the twisted pair wire, an attempt has been made to make the wire diameter of the wire about 30 μm, for example. Therefore, together with the reduction in the area of the extraction electrode due to the miniaturization of the magnetic head, there arises a problem that the work of joining the extraction electrode becomes difficult. Further, in the case of a multi-element type magnetic head, a large number of strands are present in a small space, so that the joining work is extremely troublesome.

【0004】特公昭59ー31128号公報、特公昭6
0ー12686号公報、特公昭60ー19045号公報
にはツイストペア線を用いたリード線に代えて、高分子
樹脂フィルムによって導体膜を支持したフレキシブルリ
ード線を用いる技術が開示されている。また、米国特許
4,761,699号明細書、米国特許第5,001,
583号明細書及び米国特許第5,006,946号明
細書には、ヘッド支持装置の少なくとも一部を、ポリイ
ミド等の高分子樹脂板によって構成し、高分子樹脂板に
埋設した導体膜を、リード線として用いる技術が開示さ
れている。
Japanese Patent Publication No. 59-31128, Japanese Patent Publication No. 6
Japanese Patent Publication No. 0-12686 and Japanese Patent Publication No. 60-19045 disclose a technique in which a flexible lead wire having a conductor film supported by a polymer resin film is used instead of the lead wire using a twisted pair wire. Also, US Pat. No. 4,761,699 and US Pat. No. 5,001,
No. 583 and U.S. Pat. No. 5,006,946, at least a part of the head supporting device is made of a polymer resin plate such as polyimide, and a conductor film embedded in the polymer resin plate is used. A technique used as a lead wire is disclosed.

【0005】[0005]

【発明が解決しようとする課題】この種の磁気ヘッド装
置においては、磁気ヘッドに対するリード線接続を完了
した後、リード線の自由端にテスタを接続し、特性試験
を行う。テスタ接続位置まで導くのに必要なリード線長
さは、磁気ディスク装置に組み込まれる時に要求される
長さよりも長い。従って、試験合格品は、磁気ディスク
組み込みに適した長さとなるようにリード線を切断した
後、ユーザに供給される。
In this type of magnetic head device, after the lead wire connection to the magnetic head is completed, a tester is connected to the free end of the lead wire to perform a characteristic test. The length of the lead wire required to lead to the tester connection position is longer than the length required when incorporated in the magnetic disk device. Therefore, the product that has passed the test is supplied to the user after cutting the lead wire so as to have a length suitable for incorporation into the magnetic disk.

【0006】ところが、高分子樹脂フィルムによって導
体膜を支持したフレキシブルリード線を用いた場合、磁
気ディスク組み込みに適した長さとなるようにリード線
を切断したとき、導体膜の端部が高分子樹脂フィル中に
埋設されたままとなるので、磁気ディスク装置への組み
込みに当って、高分子樹脂フィルムを除去し、内部に隠
れている導体膜を外部に露出させなければならない。こ
の作業は極めて煩わしい。
However, when a flexible lead wire having a conductor film supported by a polymer resin film is used, when the lead wire is cut to have a length suitable for incorporation in a magnetic disk, the end portion of the conductor film is made of polymer resin. Since it remains buried in the fill, the polymer resin film must be removed and the conductor film hidden inside must be exposed to the outside before being incorporated in the magnetic disk device. This work is extremely troublesome.

【0007】そこで、本発明の課題は上述する従来の問
題点を解決し、特性試験及び磁気ディスク装置への組み
込み作業の容易な磁気ヘッド装置を提供することであ
る。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems and to provide a magnetic head device which is easy to perform a characteristic test and a magnetic disk device.

【0008】[0008]

【課題を解決するための手段】上述した課題解決のた
め、本発明は、磁気ヘッドと、リード線とを含む磁気ヘ
ッド装置であって、前記磁気ヘッドは、スライダに磁気
変換素子を備えており、前記リード線は、高分子樹脂フ
ィルム中に導体膜を埋設して構成され、前記導体膜の一
端が前記磁気変換素子の取出電極に接続され、他端が自
由端となっていて、前記一端と前記他端との間の中間部
分に、前記高分子樹脂フィルムを切り欠いて前記導体膜
を露出させた導体膜露出部を有する。
In order to solve the above-mentioned problems, the present invention is a magnetic head device including a magnetic head and a lead wire, wherein the magnetic head has a magnetic conversion element on a slider. The lead wire is formed by embedding a conductor film in a polymer resin film, one end of the conductor film is connected to the extraction electrode of the magnetic conversion element, and the other end is a free end. And a conductor film exposed portion where the conductor film is exposed by cutting out the polymer resin film in an intermediate portion between the other end and the other end.

【0009】[0009]

【作用】リード線は、高分子樹脂フィルム中に導体膜を
埋設して構成されているから、例えば高分子樹脂フィル
ムを薄くする等の手段により、そのバネ剛性を低下さ
せ、リード線のバネ剛性を小さくすることができる。こ
のため、磁気ヘッドの小型化、低荷重化、低浮上量化及
び低周速化にも対応できる。
Since the lead wire is formed by embedding a conductor film in a polymer resin film, the spring rigidity of the lead wire is reduced by, for example, thinning the polymer resin film to reduce the spring rigidity of the lead wire. Can be made smaller. For this reason, the magnetic head can be downsized, the load can be reduced, the flying height can be reduced, and the peripheral speed can be reduced.

【0010】リード線は、高分子樹脂フィルム中に導体
膜を埋設してあるから、導体膜の先端部のパターンを大
きくして、接合面積を大きくとり、取出電極に対する接
合強度を増大させることができる。また、半田接続に限
らず、超音波接合技術等も使用でき、接合作業が容易に
なる。
Since the lead wire has the conductor film embedded in the polymer resin film, the pattern at the tip of the conductor film can be enlarged to increase the joint area and increase the joint strength to the extraction electrode. it can. Further, not only solder connection but also ultrasonic bonding technology can be used, and the bonding work becomes easy.

【0011】リード線は、導体膜の一端が磁気変換素子
の取出電極に接続され、他端が自由端となっているか
ら、他端にテスタを接続して特性試験を行うことができ
る。他端の位置はリード線の長さに応じて任意に設定で
きるから、特性試験を行う際、何ら障害を生じない。
Since one end of the conductor film of the lead wire is connected to the extraction electrode of the magnetic conversion element and the other end is a free end, a characteristic test can be conducted by connecting a tester to the other end. Since the position of the other end can be arbitrarily set according to the length of the lead wire, no trouble occurs when performing the characteristic test.

【0012】リード線は、一端と他端との間の中間部分
に、高分子樹脂フィルムを切り欠いて導体膜を露出させ
た導体膜露出部を有するから、導体膜露出部を磁気ディ
スク装置に組み込んだ時の外部配線接続部分として利用
できる。導体膜露出部よりは先の部分は切断して除去す
る。
Since the lead wire has a conductor film exposed portion where the conductor film is exposed by cutting out the polymer resin film in the intermediate portion between one end and the other end, the conductor film exposed portion is used in the magnetic disk device. It can be used as an external wiring connection part when assembled. The portion before the exposed portion of the conductor film is cut and removed.

【0013】[0013]

【実施例】図1は本発明に係る磁気ヘッドを用いた磁気
ヘッド装置の斜視図、図2は図1のA2ーA2線上にお
ける拡大断面図、図3は図1に示した磁気ヘッド装置の
磁気ヘッド取付け部分の拡大図である。1は磁気ヘッ
ド、2はリード線、3はヘッド支持装置である。
1 is a perspective view of a magnetic head device using a magnetic head according to the present invention, FIG. 2 is an enlarged cross-sectional view taken along the line A2-A2 of FIG. 1, and FIG. 3 is a view of the magnetic head device shown in FIG. It is an enlarged view of a magnetic head mounting portion. Reference numeral 1 is a magnetic head, 2 is a lead wire, and 3 is a head supporting device.

【0014】磁気ヘッド1は、スライダ11及び磁気変
換素子12を有する。図4は磁気ヘッドの一例を示す図
で、スライダ11は、一面側が媒体対向面111で、反
対側が支持面112となっている。スライダ11の媒体
対向面111は1〜3本のレール部を有することがあ
り、レール部を持たない平面となることもある。媒体対
向面111の最も突出する表面は、表面性の高い空気ベ
アリング面を構成する。図示のスライダ111は、媒体
対向面111に2本のレール部113、114を有し、
レール部113、114の表面を空気ベアリング面とし
て利用する。
The magnetic head 1 has a slider 11 and a magnetic conversion element 12. FIG. 4 is a diagram showing an example of a magnetic head. The slider 11 has a medium facing surface 111 on one side and a supporting surface 112 on the opposite side. The medium facing surface 111 of the slider 11 may have one to three rail portions, and may be a flat surface having no rail portions. The most projecting surface of the medium facing surface 111 constitutes an air bearing surface having a high surface property. The illustrated slider 111 has two rail portions 113 and 114 on the medium facing surface 111,
The surfaces of the rail portions 113 and 114 are used as air bearing surfaces.

【0015】磁気変換素子12は、スライダ11の側面
115に配置され、外部に現われる取出電極121、1
22を有する(図4参照)。磁気変換素子122を配置
するスライダ11の側面115は矢印aで示す媒体走行
方向(空気流出方向)の端部に位置する。磁気変換素子
12はIC製造技術と同様のプロセスに従って製造され
た薄膜磁気変換素子、ウインチェスタ型磁気変換素子ま
たはコンポジット型磁気変換素子の何れであってもよ
い。また、面内記録用として準備された磁気変換素子に
限らず、垂直記録用磁気変換素子であってもよいし、誘
導型磁気変換素子に限らず、磁気抵抗効果を利用した磁
気変換素子であってもよい。更に、単素子型に限らず、
多素子型であってあってもよい。
The magnetic conversion element 12 is disposed on the side surface 115 of the slider 11 and appears to the outside of the extraction electrodes 121 and 1.
22 (see FIG. 4). The side surface 115 of the slider 11 on which the magnetic conversion element 122 is arranged is located at the end in the medium traveling direction (air outflow direction) indicated by the arrow a. The magnetic conversion element 12 may be any of a thin film magnetic conversion element, a Winchester type magnetic conversion element, or a composite type magnetic conversion element manufactured according to the same process as the IC manufacturing technique. Further, it is not limited to the magnetic conversion element prepared for in-plane recording, it may be a magnetic conversion element for perpendicular recording, or it is not limited to an inductive type magnetic conversion element, but a magnetic conversion element utilizing a magnetoresistive effect. May be. Furthermore, not only the single element type,
It may be a multi-element type.

【0016】リード線2は、高分子樹脂フィルム21中
に導体膜22、23を埋設して構成されている。このよ
うなタイプのリード線2の代表例は、タブテープ(Ta
peAutomated Bonding テープ)で
あり、実施例においてもタブテープを用いた例を示して
いる。タブテープにおいて、高分子樹脂フィルム21は
テープ状であり、例えば、ポリイミド等のように、電気
絶縁性、耐熱性及び可撓性に優れた高分子樹脂材料によ
って構成されている。高分子樹脂フィルム21は導体膜
22、23を支持する支持フィルム211と、導体膜2
2、23を覆う保護フィルム212とから構成されてい
る。高分子樹脂フィルム21及び導体膜22、23を含
めた全体の厚みTは100μm以下となるように選定す
る。導体膜22、23は高分子樹脂フィルム21を構成
する支持フィルム211の面上に、接着層を介すること
なく、直接に付着されている。導体膜22、23は銅膜
であり、スッパタ等の薄膜技術及びフォトリソグラフィ
等の高精度パターン形成技術を用いて形成する。導体膜
22、23の膜厚は数μm〜数十μm程度に設定でき
る。図示の導体膜22、23は2本であるが、例えば多
素子型磁気ヘッドに用いる場合などには、それ以上の本
数となる。支持フィルム211、導体膜22、23及び
保護フィルム212の各厚みt1、t2、t3(図2参
照)は、全体の厚みTが例えば25μmに設定された場
合を例にとると、t1=10μm、t2=5μm、t3
=10μmのような関係に定める。
The lead wire 2 is formed by embedding conductor films 22 and 23 in a polymer resin film 21. A typical example of the lead wire 2 of this type is a tab tape (Ta
pe Automate Bonding tape), and an example using a tab tape is shown in the examples. In the tab tape, the polymer resin film 21 is in the form of a tape, and is made of a polymer resin material having excellent electric insulation, heat resistance and flexibility, such as polyimide. The polymer resin film 21 includes a support film 211 that supports the conductor films 22 and 23 and the conductor film 2
The protective film 212 covers the second and the second films 23. The total thickness T including the polymer resin film 21 and the conductor films 22 and 23 is selected to be 100 μm or less. The conductor films 22 and 23 are directly attached to the surface of the support film 211 forming the polymer resin film 21 without an adhesive layer. The conductor films 22 and 23 are copper films and are formed by using a thin film technique such as spatter and a high precision pattern forming technique such as photolithography. The film thickness of the conductor films 22 and 23 can be set to about several μm to several tens of μm. The number of conductor films 22 and 23 shown in the figure is two, but in the case of use in a multi-element magnetic head, for example, the number is more than that. The thicknesses t1, t2, and t3 (see FIG. 2) of the support film 211, the conductor films 22 and 23, and the protective film 212 are t1 = 10 μm when the total thickness T is set to, for example, 25 μm. t2 = 5 μm, t3
= 10 μm.

【0017】リード線2は、導体膜22、23の一端が
磁気変換素子12の取出電極121、122に接続され
ている。接続手段としては、半田接合または超音波接合
が採用できる。接合作業性の面からは超音波接合が望ま
しい。
In the lead wire 2, one ends of the conductor films 22 and 23 are connected to the extraction electrodes 121 and 122 of the magnetic conversion element 12. Solder joining or ultrasonic joining can be adopted as the connecting means. From the viewpoint of joining workability, ultrasonic joining is desirable.

【0018】リード線2は他端が自由端となっていて、
一端と他端との間の中間部分に、高分子樹脂フィルム2
1を切り欠いて導体膜22、23を露出させた導体膜露
出部24、25を有する。導体膜露出部24、25は、
高分子樹脂フィルム21を構成する支持フィルム211
または保護フィルム212の何れかを、部分的に切り欠
くことによって形成できる。導体膜露出部24、25に
露出する導体膜22、23の部分は、表面に半田26、
27を付着させておくことが望ましい(図2参照)。
The other end of the lead wire 2 is a free end,
The polymer resin film 2 is provided on the intermediate portion between one end and the other end.
1 has conductor film exposed portions 24 and 25 which are cut out to expose the conductor films 22 and 23. The conductor film exposed portions 24 and 25 are
Support film 211 constituting the polymer resin film 21
Alternatively, any of the protective films 212 can be formed by partially cutting out. The portions of the conductor films 22 and 23 exposed on the conductor film exposed portions 24 and 25 have solder 26,
It is desirable to attach 27 (see FIG. 2).

【0019】上述のように、リード線2は、高分子樹脂
フィルム21中に導体膜22、23を埋設してあるか
ら、例えば高分子樹脂フィルム21を薄くする等の手段
により、そのバネ剛性を低下させ、リード線2の全体の
バネ剛性を小さくすることができる。このため、磁気ヘ
ッド1の小型化、低荷重化、低浮上量化及び低周速化に
も対応できる。
As described above, since the lead wire 2 has the conductor films 22 and 23 embedded in the polymer resin film 21, its spring rigidity can be improved by, for example, thinning the polymer resin film 21. It is possible to reduce the spring rigidity of the lead wire 2 as a whole. Therefore, the magnetic head 1 can be downsized, the load can be reduced, the flying height can be reduced, and the peripheral speed can be reduced.

【0020】リード線2として、タブテープを用いた場
合には、導体膜22、23が高分子樹脂フィルム21を
構成する支持フィルム211に、接着層を介することな
く、直接に付着されるから、全体の厚みTを、従来は達
成できなかった100μm以下に選定することも容易で
ある。このため、可撓性が増し、曲げ易くなると共に、
曲げバネ剛性が小さくなる。従って、磁気ヘッドとの組
み合わせにおいて、リード線2の先端部を曲げ、導体膜
22、23を、磁気ヘッド1の磁気変換素子12に備え
られた取出電極121、122に接合する構造をとるこ
とが可能になると共に、磁気ヘッド1に対する曲げバネ
剛性が小さくなる。これらは、磁気ヘッドの小型化、低
荷重化、低浮上量化及び低周速化が進む程に、有効に作
用する。
When the tab tape is used as the lead wire 2, the conductor films 22 and 23 are directly attached to the support film 211 constituting the polymer resin film 21 without an adhesive layer, and therefore, the whole structure. It is also easy to select the thickness T of 100 μm or less which could not be achieved conventionally. For this reason, flexibility is increased, bending is facilitated, and
Bending spring rigidity decreases. Therefore, in combination with the magnetic head, the tip of the lead wire 2 may be bent to bond the conductor films 22 and 23 to the extraction electrodes 121 and 122 provided in the magnetic conversion element 12 of the magnetic head 1. In addition, the bending spring rigidity with respect to the magnetic head 1 is reduced. These functions effectively as the magnetic head becomes smaller, the load is reduced, the flying height is reduced, and the peripheral speed is reduced.

【0021】リード線2は、導体膜22、23の一端が
磁気変換素子12の取出電極121、122に接続さ
れ、他端が自由端となっているから、他端にテスタを接
続して特性試験を行うことができる。他端の位置はリー
ド線2の長さに応じて任意に設定できるから、特性試験
を行う際、何らの障害も生じることがない。
In the lead wire 2, one ends of the conductor films 22 and 23 are connected to the extraction electrodes 121 and 122 of the magnetic conversion element 12, and the other end is a free end. The test can be conducted. Since the position of the other end can be arbitrarily set according to the length of the lead wire 2, no trouble occurs during the characteristic test.

【0022】リード線2は、一端と他端との間の中間部
分に、高分子樹脂フィルム21を切り欠いて導体膜2
2、23を露出させた導体膜露出部24、25を有する
から、導体膜露出部24、25を磁気ディスク装置に組
み込んだ時の外部配線接続部分として利用できる。導体
膜露出部24、25に露出する導体膜22、23の表面
に半田26、27を付着させた場合は、磁気ディスク装
置への組込み時に外部配線を導体膜露出部24、25に
おいて容易に半田付けできる。磁気ディスク装置への組
み込みに当たっては、導体膜露出部24、25よりは先
の部分は、位置XーXの部分切断して除去する(図1参
照)。
The lead wire 2 is formed by cutting out the polymer resin film 21 at an intermediate portion between one end and the other end to form the conductor film 2.
Since the conductor film exposed portions 24 and 25 are formed by exposing the conductor film exposed portions 2 and 23, the conductor film exposed portions 24 and 25 can be used as external wiring connecting portions when incorporated in a magnetic disk device. When the solders 26 and 27 are attached to the surfaces of the conductor films 22 and 23 exposed in the conductor film exposed portions 24 and 25, the external wiring can be easily soldered in the conductor film exposed portions 24 and 25 when assembled in the magnetic disk device. Can be attached. In assembling into the magnetic disk device, the portions before the conductor film exposed portions 24 and 25 are partially cut at the position XX and removed (see FIG. 1).

【0023】ヘッド支持装置3は、長手方向の一端側が
固定端E、他端側が自由端Fとなっていて、自由端Fの
側に可撓性支持部31を有し、可撓性支持部31がスラ
イダ11の支持面112に取付けられている。ヘッド支
持装置3は、磁気ヘッド1が磁気ディスク(図示しな
い)の表面変動に対して追従できるように、磁気ヘッド
1を支持している。このようなヘッド支持装置は、従来
より種々のタイプのものが提案され、実用に供されてい
る。図示のヘッド支持装置3において、可撓性支持部3
1は、長手方向に取られた第1の軸線の周りのロール運
動と、第1軸線と直交する第2軸の周りのピッチ運動を
許容するジンバルとなっており、その下面に磁気ヘッド
1を構成するスライダ11の支持面112を、例えば接
着等の手段によって結合してある。
The head support device 3 has a fixed end E on one end side in the longitudinal direction and a free end F on the other end side, and has a flexible support portion 31 on the free end F side. 31 is attached to the support surface 112 of the slider 11. The head supporting device 3 supports the magnetic head 1 so that the magnetic head 1 can follow the surface fluctuation of a magnetic disk (not shown). Conventionally, various types of head supporting devices of this type have been proposed and put to practical use. In the illustrated head support device 3, the flexible support portion 3
Reference numeral 1 denotes a gimbal that allows a roll movement about a first axis taken in the longitudinal direction and a pitch movement about a second axis orthogonal to the first axis. The supporting surface 112 of the slider 11 that is formed is joined by means such as adhesion.

【0024】[0024]

【発明の効果】以上述べたように、本発明によれば、次
のような効果が得られる。 (a)リード線は、高分子樹脂フィルム中に導体膜を埋
設して構成されているから、小型化、低荷重化、低浮上
量化及び低周速化に対応し得る磁器ヘッド装置を提供で
きる。 (b)リード線は、高分子樹脂フィルム中に導体膜を埋
設してあるから、取出電極に対する接合強度が大きく、
しかも半田接続に限らず、超音波接合技術等も使用で
き、接合作業の容易な磁気ヘッド装置を提供できる。 (c)リード線は、導体膜の一端が磁気変換素子の取出
電極に接続され、他端が自由端となっているから、他端
にテスタを接続して特性試験を行うことができる。他端
の位置はリード線の長さに応じて任意に設定できるか
ら、特性試験を行う際、何ら障害を生じることのない磁
気ヘッド装置を提供できる。 (d)リード線は、一端と他端との間の中間部分に、高
分子樹脂フィルムを切り欠いて導体膜を露出させた導体
膜露出部を有するから、導体膜露出部を磁気ディスク装
置に組み込んだ時の外部配線接続部分として利用すると
共に、導体膜露出部よりは先の部分は切断して除去し、
磁気ディスク装置組み込みに適したリード線長さに調整
して使用し得る磁気ヘッド装置を提供できる。
As described above, according to the present invention, the following effects can be obtained. (A) Since the lead wire is formed by embedding a conductor film in a polymer resin film, it is possible to provide a porcelain head device capable of coping with downsizing, load reduction, flying height reduction, and peripheral speed reduction. . (B) Since the lead wire has the conductor film embedded in the polymer resin film, it has a large bonding strength to the extraction electrode,
Moreover, not only solder connection but also ultrasonic bonding technology or the like can be used, and a magnetic head device with easy bonding work can be provided. (C) In the lead wire, one end of the conductor film is connected to the extraction electrode of the magnetic conversion element, and the other end is a free end. Therefore, a characteristic test can be performed by connecting a tester to the other end. Since the position of the other end can be arbitrarily set according to the length of the lead wire, it is possible to provide a magnetic head device that does not cause any trouble during the characteristic test. (D) Since the lead wire has a conductor film exposed portion where the conductor film is exposed by cutting out the polymer resin film in the intermediate portion between one end and the other end, the conductor film exposed portion is used in the magnetic disk device. It is used as an external wiring connection part when assembled, and the part before the exposed part of the conductor film is cut and removed.
It is possible to provide a magnetic head device that can be used by adjusting the lead wire length suitable for incorporation in a magnetic disk device.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る磁気ヘッドを用いた磁気ヘッド装
置の斜視図である。
FIG. 1 is a perspective view of a magnetic head device using a magnetic head according to the present invention.

【図2】図1のA2ーA2線上における拡大断面図であ
る。
FIG. 2 is an enlarged cross-sectional view taken along the line A2-A2 in FIG.

【図3】図1に示した本発明に係る磁気ヘッド装置の磁
気ヘッド取付け部分の拡大図である。
FIG. 3 is an enlarged view of a magnetic head mounting portion of the magnetic head device according to the present invention shown in FIG.

【図4】磁気ヘッドの1例を示す斜視図である。FIG. 4 is a perspective view showing an example of a magnetic head.

【符号の説明】[Explanation of symbols]

1 磁気ヘッド 11 スライダ 12 磁気変換素子 121、122 取出電極 2 リード線 21 高分子樹脂フィルム 22、23 導体膜 3 ヘッド支持装置 DESCRIPTION OF SYMBOLS 1 magnetic head 11 slider 12 magnetic conversion element 121,122 extraction electrode 2 lead wire 21 polymer resin film 22,23 conductor film 3 head support device

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 磁気ヘッドと、リード線とを含む磁気ヘ
ッド装置であって、 前記磁気ヘッドは、スライダに磁気変換素子を備えてお
り、 前記リード線は、高分子樹脂フィルム中に導体膜を埋設
して構成され、前記導体膜の一端が前記磁気変換素子の
取出電極に接続され、他端が自由端となっていて、前記
一端と前記他端との間の中間部分に、前記高分子樹脂フ
ィルムを切り欠いて前記導体膜を露出させた導体膜露出
部を有する磁気ヘッド装置。
1. A magnetic head device including a magnetic head and a lead wire, wherein the magnetic head includes a magnetic conversion element on a slider, and the lead wire has a conductor film in a polymer resin film. The embedded conductive film has one end connected to the extraction electrode of the magnetic conversion element, the other end being a free end, and the polymer in the intermediate portion between the one end and the other end. A magnetic head device having a conductor film exposed portion in which a resin film is cut out to expose the conductor film.
【請求項2】 前記導体膜露出部に露出する導体膜は、
表面に半田が付着されている請求項1に記載の磁気ヘッ
ド装置。
2. The conductor film exposed in the conductor film exposed portion,
The magnetic head device according to claim 1, wherein solder is attached to the surface.
【請求項3】 前記磁気変換素子は、薄膜磁気変換素子
である請求項1または2に記載の磁気ヘッド。
3. The magnetic head according to claim 1, wherein the magnetic conversion element is a thin film magnetic conversion element.
【請求項4】 ヘッド支持装置を含んでおり、前記ヘッ
ド支持装置は、長手方向の一端側が固定端、他端側が自
由端となっていて、前記自由端側に可撓性支持部を有
し、前記可撓性支持部が前記スライダの前記支持面に取
付けられている請求項1、2または3に記載の磁気ヘッ
ド装置。
4. A head supporting device is included, wherein the head supporting device has a fixed end on one end side in the longitudinal direction and a free end on the other end side, and has a flexible support portion on the free end side. The magnetic head device according to claim 1, 2 or 3, wherein the flexible support portion is attached to the support surface of the slider.
JP21971492A 1992-07-27 1992-07-27 Magnetic head device Expired - Fee Related JP3241448B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21971492A JP3241448B2 (en) 1992-07-27 1992-07-27 Magnetic head device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21971492A JP3241448B2 (en) 1992-07-27 1992-07-27 Magnetic head device

Publications (2)

Publication Number Publication Date
JPH0644530A true JPH0644530A (en) 1994-02-18
JP3241448B2 JP3241448B2 (en) 2001-12-25

Family

ID=16739824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21971492A Expired - Fee Related JP3241448B2 (en) 1992-07-27 1992-07-27 Magnetic head device

Country Status (1)

Country Link
JP (1) JP3241448B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282064B1 (en) * 1994-03-15 2001-08-28 International Business Machines Corporation Head gimbal assembly with integrated electrical conductors
US6539609B2 (en) * 1994-07-05 2003-04-01 International Business Machines Corporation Method of forming a head gimbal assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282064B1 (en) * 1994-03-15 2001-08-28 International Business Machines Corporation Head gimbal assembly with integrated electrical conductors
US6539609B2 (en) * 1994-07-05 2003-04-01 International Business Machines Corporation Method of forming a head gimbal assembly

Also Published As

Publication number Publication date
JP3241448B2 (en) 2001-12-25

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