JP3241448B2 - Magnetic head device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head device and, more particularly, to an improvement in a lead wire connected to an extraction electrode of a magnetic transducer.

[0002]

2. Description of the Related Art In a conventional magnetic head device, a lead wire connected to an extraction electrode of a magnetic transducer is formed of a twisted pair wire, a loop is formed by the twisted pair wire, and the tip of the loop is taken out of the magnetic transducer. It was common to connect to electrodes. However, for example, Japanese Unexamined Patent Publication No.
No. 13 (U.S. Pat. No. 4,928,195), the size of the magnetic head can be reduced, the load applied to the magnetic head from the head support device can be reduced, the peripheral speed can be reduced as the diameter of the magnetic disk decreases, and the flying height can be reduced. Furthermore, it is difficult to cope with an increase in the number of extraction electrodes due to the increase in the number of elements by using a twisted pair lead wire. As the miniaturization, lower load, lower flying height and lower peripheral speed of the magnetic head progress, the influence of the spring stiffness of the loop part by the twisted pair wire becomes more susceptible,
This is because the flying height and flying characteristics of the magnetic head are adversely affected.

[0003] In order to reduce the influence of the spring stiffness of the loop portion of the twisted pair wire, an attempt has been made to reduce the wire diameter of the wire, for example, to about 30 µm. For this reason, in conjunction with the reduction in the area of the extraction electrode accompanying the downsizing of the magnetic head, there arises a problem that the joining operation to the extraction electrode becomes difficult. Further, in the case of a multi-element type magnetic head, since a large number of element wires exist in a small space, the joining operation becomes extremely troublesome.

JP-B-59-31128, JP-B-6-31128
Japanese Patent Publication No. 0-12686 and Japanese Patent Publication No. 19045/1985 disclose a technique using a flexible lead wire having a conductive film supported by a polymer resin film instead of a lead wire using a twisted pair wire. Also, U.S. Pat. No. 4,761,699 and U.S. Pat.
Patent No. 583 and U.S. Pat. No. 5,006,946 describe that at least a part of the head support device is formed of a polymer resin plate such as polyimide, and a conductor film embedded in the polymer resin plate is A technique used as a lead wire is disclosed.

[0005]

In this type of magnetic head device, after the connection of the lead wire to the magnetic head is completed, a tester is connected to the free end of the lead wire to perform a characteristic test. The length of the lead wire required for guiding to the tester connection position is longer than the length required when the lead wire is incorporated in the magnetic disk drive. Therefore, a product that has passed the test is supplied to the user after cutting the lead wire to a length suitable for assembling the magnetic disk.

However, when a flexible lead wire having a conductive film supported by a polymer resin film is used, when the lead wire is cut so as to have a length suitable for assembling a magnetic disk, the end of the conductive film is formed of a polymer resin. Since it remains buried in the film, the polymer resin film must be removed and the conductive film hidden inside must be exposed to the outside when incorporating it into a magnetic disk drive.
This operation is extremely troublesome.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and to provide a magnetic head device which is easy to perform a characteristic test and assemble into a magnetic disk device.

[0008]

According to the present invention, there is provided a magnetic head device including a magnetic head and a lead wire, wherein the magnetic head includes a slider and a magnetic transducer. The lead wire is configured by embedding a conductive film in a polymer resin film, one end of the conductive film is connected to an extraction electrode of the magnetic transducer, and the other end is a free end; A conductive film exposed portion in which the polymer resin film is cut away to expose the conductive film, at an intermediate portion between the first and second ends.

[0009]

The lead wire is formed by embedding a conductive film in a polymer resin film. Therefore, the spring rigidity of the lead wire is reduced by, for example, thinning the polymer resin film. Can be reduced. Therefore, it is possible to cope with downsizing, low load, low flying height and low peripheral speed of the magnetic head.

Since the lead wire has a conductive film embedded in a polymer resin film, it is necessary to increase the pattern at the tip of the conductive film to increase the bonding area and increase the bonding strength to the extraction electrode. it can. In addition, not only the solder connection but also an ultrasonic bonding technique or the like can be used, and the bonding operation is facilitated.

In the lead wire, one end of the conductor film is connected to an extraction electrode of the magnetic transducer, and the other end is a free end. Therefore, a characteristic test can be performed by connecting a tester to the other end. Since the position of the other end can be set arbitrarily according to the length of the lead wire, no trouble occurs at the time of performing the characteristic test.

Since the lead wire has an exposed portion of the conductive film at the intermediate portion between one end and the other end, the exposed portion of the conductive film is formed by cutting out the polymer resin film. It can be used as an external wiring connection part when incorporated. A portion prior to the exposed portion of the conductive film is cut and removed.

[0013]

FIG. 1 is a perspective view of a magnetic head device using a magnetic head according to the present invention, FIG. 2 is an enlarged sectional view taken along line A2-A2 of FIG. 1, and FIG. 3 is a sectional view of the magnetic head device shown in FIG. It is an enlarged view of a magnetic head attachment part. 1 is a magnetic head, 2 is a lead wire, and 3 is a head support device.

The magnetic head 1 has a slider 11 and a magnetic transducer 12. FIG. 4 shows an example of the magnetic head. The slider 11 has a medium facing surface 111 on one side and a support surface 112 on the opposite side. The medium facing surface 111 of the slider 11 may have one to three rails, and may be a flat surface without the rails. The most protruding surface of the medium facing surface 111 forms an air bearing surface having high surface properties. The illustrated slider 11 has two rail portions 113 and 114 on the medium facing surface 111, and uses the surfaces of the rail portions 113 and 114 as air bearing surfaces.

The magnetic transducer 12 is arranged on a side surface 115 of the slider 11 and has externally-extracting electrodes 121, 1
22 (see FIG. 4). The side surface 115 of the slider 11 on which the magnetic transducer 12 is disposed is located at an end in the medium traveling direction (air outflow direction) indicated by an arrow a. Magnetic transducer 1
Reference numeral 2 may be any of a thin-film magnetic transducer, a Winchester-type magnetic transducer, and a composite-type magnetic transducer manufactured according to the same process as the IC manufacturing technology.
Further, the present invention is not limited to a magnetic transducer prepared for in-plane recording, but may be a magnetic transducer for perpendicular recording, and is not limited to an inductive magnetic transducer, but may be a magnetic transducer utilizing a magnetoresistance effect. You may. Further, the present invention is not limited to a single-element type, and may be a multi-element type.

The lead wire 2 is formed by embedding conductor films 22 and 23 in a polymer resin film 21. A typical example of such a type of lead wire 2 is a tab tape (Ta).
peAutomated Bonding tape), and also shows an example using a tab tape in the embodiment. In the tab tape, the polymer resin film 21 has a tape shape and is made of, for example, a polymer resin material having excellent electrical insulation, heat resistance and flexibility, such as polyimide. The polymer resin film 21 includes a support film 211 for supporting the conductive films 22 and 23, and a conductive film 2
2, 23, and a protective film 212. The total thickness T including the polymer resin film 21 and the conductor films 22 and 23 is selected to be 100 μm or less. The conductor films 22 and 23 are directly attached to the surface of the support film 211 constituting the polymer resin film 21 without interposing an adhesive layer. The conductor films 22 and 23 are copper films, and are formed using a thin film technique such as a sputtering technique and a high-precision pattern forming technique such as photolithography. The thickness of the conductor films 22 and 23 can be set to about several μm to several tens μm. Although the number of the conductor films 22 and 23 shown in the figure is two, the number of the conductor films 22 and 23 is more when used for a multi-element magnetic head, for example. The thicknesses t1, t2, and t3 (see FIG. 2) of the support film 211, the conductive films 22, 23, and the protective film 212 are, for example, t1 = 10 μm when the overall thickness T is set to, for example, 25 μm. t2 = 5 μm, t3
= 10 μm.

The lead wire 2 has one ends of the conductor films 22 and 23 connected to the extraction electrodes 121 and 122 of the magnetic transducer 12. As the connecting means, solder bonding or ultrasonic bonding can be adopted. Ultrasonic joining is desirable from the viewpoint of joining workability.

The other end of the lead wire 2 is a free end,
A polymer resin film 2 is provided in an intermediate portion between one end and the other end.
1 is provided with conductor film exposed portions 24 and 25 in which the conductor films 22 and 23 are exposed by notching. The conductor film exposed portions 24 and 25
Supporting film 211 constituting polymer resin film 21
Alternatively, it can be formed by partially cutting out any of the protective films 212. The portions of the conductor films 22 and 23 exposed to the conductor film exposed portions 24 and 25 have solder 26,
27 is desirably attached (see FIG. 2).

As described above, since the conductor films 22 and 23 are embedded in the polymer resin film 21, the lead wire 2 has its spring rigidity reduced by, for example, thinning the polymer resin film 21. This can reduce the spring rigidity of the entire lead wire 2. For this reason, it is possible to cope with downsizing, low load, low flying height, and low peripheral speed of the magnetic head 1.

When a tab tape is used as the lead wire 2, the conductor films 22 and 23 are directly attached to the support film 211 constituting the polymer resin film 21 without interposing an adhesive layer. It is also easy to select a thickness T of 100 μm or less, which could not be achieved conventionally. For this reason, flexibility increases, and it becomes easy to bend,
Bending spring rigidity decreases. Therefore, in combination with a magnetic head, a structure may be adopted in which the end portions of the lead wires 2 are bent and the conductor films 22 and 23 are joined to the extraction electrodes 121 and 122 provided on the magnetic transducer 12 of the magnetic head 1. At the same time, the bending spring stiffness for the magnetic head 1 is reduced. These functions become effective as the magnetic head becomes smaller, lower in load, lower in flying height, and lower in peripheral speed.

In the lead wire 2, one end of each of the conductive films 22 and 23 is connected to the extraction electrodes 121 and 122 of the magnetic transducer 12, and the other end is a free end. Testing can be performed. Since the position of the other end can be set arbitrarily according to the length of the lead wire 2, there is no problem when performing the characteristic test.

The lead wire 2 is formed by cutting a polymer resin film 21 at an intermediate portion between one end and the other end.
Since the conductive film exposed portions 24 and 25 having the exposed portions 2 and 23 are provided, they can be used as external wiring connection portions when the conductive film exposed portions 24 and 25 are incorporated in a magnetic disk drive. When the solders 26 and 27 are attached to the surfaces of the conductor films 22 and 23 exposed on the conductor film exposed portions 24 and 25, the external wiring can be easily soldered on the conductor film exposed portions 24 and 25 when incorporated into the magnetic disk drive. Can be attached. In assembling into a magnetic disk drive, portions prior to the exposed portions 24 and 25 of the conductor film are partially cut off at positions XX and removed (see FIG. 1).

The head support device 3 has a fixed end E at one end in the longitudinal direction and a free end F at the other end, and has a flexible support portion 31 on the free end F side. 31 is attached to the support surface 112 of the slider 11. The head support device 3 supports the magnetic head 1 so that the magnetic head 1 can follow a surface fluctuation of a magnetic disk (not shown). Various types of such head support devices have been proposed and put into practical use. In the illustrated head support device 3, the flexible support portion 3
Reference numeral 1 denotes a gimbal that allows a roll motion around a first axis taken in the longitudinal direction and a pitch motion around a second axis orthogonal to the first axis, and the magnetic head 1 is provided on the lower surface thereof. The supporting surface 112 of the slider 11 to be constituted is connected by means of, for example, adhesion.

[0024]

As described above, according to the present invention, the following effects can be obtained. (A) Since the lead wire is formed by embedding a conductive film in a polymer resin film, it is possible to provide a porcelain head device capable of responding to miniaturization, low load, low flying height, and low peripheral speed. . (B) Since the lead wire has the conductive film embedded in the polymer resin film, the bonding strength to the extraction electrode is large,
Moreover, not only the solder connection but also an ultrasonic bonding technique can be used, and a magnetic head device which can be easily bonded can be provided. (C) Since one end of the lead film is connected to the extraction electrode of the magnetic transducer and the other end is a free end, a characteristic test can be performed by connecting a tester to the other end. Since the position of the other end can be set arbitrarily according to the length of the lead wire, it is possible to provide a magnetic head device that does not cause any trouble when performing a characteristic test. (D) Since the lead wire has a conductor film exposed portion in which a polymer resin film is cut out to expose a conductor film at an intermediate portion between one end and the other end, the conductor film exposed portion is connected to the magnetic disk drive. It is used as an external wiring connection part when incorporated, and the part beyond the conductor film exposed part is cut and removed,
It is possible to provide a magnetic head device which can be used after being adjusted to a lead wire length suitable for being incorporated in a magnetic disk device.

[Brief description of the drawings]

FIG. 1 is a perspective view of a magnetic head device using a magnetic head according to the present invention.

FIG. 2 is an enlarged sectional view taken on line A2-A2 of FIG.

FIG. 3 is an enlarged view of a magnetic head mounting portion of the magnetic head device according to the present invention shown in FIG.

FIG. 4 is a perspective view showing an example of a magnetic head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Magnetic head 11 Slider 12 Magnetic conversion element 121, 122 Extraction electrode 2 Lead wire 21 Polymer resin film 22, 23 Conductive film 3 Head support device

Claims (4)

(57) [Claims] 1. A magnetic head device including a magnetic head and a lead wire, wherein the magnetic head has a magnetic transducer on a slider, and the lead wire has a conductive film in a polymer resin film. One end of the conductor film is connected to an extraction electrode of the magnetic transducer, the other end is a free end, and the polymer film is provided at an intermediate portion between the one end and the other end. by cutting the resin film and have a conductive film exposed portion to expose the conductor film, the other end of the conductor layer, the conductor constitutes a characteristic test end
A magnetic head device in which the exposed film portion constitutes an external wiring connection portion . 2. The conductive film exposed at the conductive film exposed portion,
2. The magnetic head device according to claim 1, wherein solder is attached to a surface. 3. The magnetic head device according to claim 1, wherein the magnetic transducer is a thin-film magnetic transducer. 4. A head support device, wherein the head support device has a fixed end on one end in the longitudinal direction, a free end on the other end, and a flexible support on the free end. 4. The magnetic head device according to claim 1, wherein the flexible support is attached to the support surface of the slider.