JPH0628224Y2 - Substrate rotation processing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial application field> The present invention is designed to rotate a substrate such as a rectangular glass substrate for a liquid crystal display or a round substrate such as a semiconductor wafer while adsorbing and holding the substrate, and rotating the substrate surface. The present invention relates to a substrate rotation processing device for performing required processing.

<Prior Art> Conventionally, in this type of substrate rotation processing apparatus, when the processing liquid dropped on the front surface of the substrate goes around to the back surface of the substrate, various adverse effects may occur in the subsequent steps, or the vacuum device for adsorbing the substrate may malfunction. It is known to cause it. Therefore, in order to prevent the processing liquid from flowing around to the back surface of the substrate, techniques such as those described in JP-A-57-201564 and JP-B-1-9169 have been proposed.

The "coating method" described in JP-A-57-201564 is provided with a mechanism for ejecting a fluid such as a gas or a solvent toward a peripheral portion of a chuck that adsorbs and holds a substrate, and the fluid is applied during rotation processing of the substrate. The jetting toward the back surface of the substrate prevents the processing liquid from flowing around to the back surface of the substrate.

On the other hand, the "Vacuum chuck for holding a thin plate" disclosed in Japanese Utility Model Publication No. 1-9169 has a groove portion that is open to the lower surface of the chuck, which is formed outside the substrate suction portion formed in the center of the upper surface of the chuck. The processing liquid that has spilled around to the back surface of the substrate is blocked by this groove, and the air taken in from the opening on the lower surface of this groove is sucked into the adsorption part so that the processing liquid is not sucked into the vacuum device. .

<Problems to be Solved by the Invention> However, the conventional example having such a configuration has the following problems.

According to the former "coating method", the solvent may be sucked into the substrate suction part through the gap created between the back surface of the substrate and the chuck surface and enter the vacuum device, eliminating the cause of failure of the vacuum device. There is a problem that you cannot do it.

On the other hand, according to the latter "vacuum chuck for holding a thin plate",
Although it is possible to prevent the processing liquid from entering the vacuum device,
There is a problem that it is not possible to prevent the processing liquid from adhering to the back surface of the substrate.

The present invention has been made in view of such circumstances, and a substrate capable of preventing the processing liquid from wrapping around and adhering to the back surface of the substrate and preventing the liquid from flowing into the vacuum device. An object is to provide a rotation processing device.

<Means for Solving the Problem> In order to achieve such an object, the present invention has the following configuration.

That is, according to the present invention, the substrate is placed on a chuck having substantially the same shape as the substrate to be processed, and the substrate is sucked and held by a substrate suction portion formed inside the chuck so that the substrate is supplied to the surface of the substrate. In the substrate rotation processing apparatus that performs the required processing with the processed liquid, a cleaning liquid ejection groove for ejecting the cleaning liquid for preventing the processing liquid from flowing around is provided in the peripheral portion of the upper surface of the chuck, and between the cleaning liquid ejection groove and the substrate adsorption portion. In addition, a concave groove for preventing suction of the cleaning liquid is provided.

<Operation> According to the present invention, since the cleaning liquid ejected from the cleaning liquid ejecting groove is filled between the peripheral portion of the chuck upper surface and the peripheral portion of the substrate back surface, the processing liquid dropped on the substrate front surface to the substrate rear surface. It is possible to prevent wraparound and adhesion. Further, the cleaning liquid sucked toward the center of the chuck due to the suction action of the substrate suction portion is prevented from proceeding by the concave groove between the cleaning liquid jetting groove and the substrate suction portion, and thus reaches the substrate suction portion. There is no such thing.

<Embodiment> An embodiment of the present invention will be described below in detail with reference to the drawings.

1 to 3 are views showing a schematic configuration of a main part of a substrate rotation processing apparatus according to an embodiment of the present invention. FIG. 1 is a plan view of a chuck, and FIG. 2 is a longitudinal sectional view thereof. 3 is an enlarged cross-sectional view of the peripheral edge of the chuck.

The substrate rotation processing apparatus according to the present embodiment is an apparatus for processing a glass substrate for a liquid crystal display, and includes a rectangular chuck W having substantially the same shape as a rectangular substrate W. A rotary shaft 2 is provided at the center of the lower surface of the chuck 1, and the rotary shaft 2 is connected to a motor (not shown).

Inside the upper surface of the chuck 1, there is a substrate suction portion composed of a plurality of substrate suction grooves 3 formed concentrically for sucking the substrate W. The substrate suction portion does not necessarily have to be a groove, but may be formed as a small hole opened on the upper surface of the chuck.

Each of the substrate suction grooves 3 described above communicates with a suction hole 4 formed inside the rotary shaft 2, and the suction hole 4 communicates with a vacuum device (not shown) so that the substrate placed on the chuck 1 is connected. W is adsorbed and held. Above the chuck 1, a treatment liquid supply mechanism (not shown) for dropping the treatment liquid on the surface of the substrate W before or during rotation is provided.

The peripheral portion of the upper surface of the chuck 1 is slightly lower than the chuck surface on which the substrate adsorption groove 3 is formed, and the cleaning liquid jetting groove 5 is smaller than the chuck 1 along the periphery of the chuck 1 on the outer side of this surface. It is formed in a shape that circulates in a similar rectangular shape. The cleaning liquid ejection groove 5 communicates with a cleaning liquid supply hole 6 provided inside the rotary shaft 2 independently of the suction hole 4, and the cleaning liquid supply hole 6 communicates with a cleaning liquid supply device (not shown). The cleaning liquid is ejected from the cleaning liquid ejection groove 5.

The type of cleaning liquid is appropriately selected according to the type of processing liquid. For example, in a substrate rotation processing device for cleaning a substrate,
When pure water or a hydrophilic liquid is used as the treatment liquid, pure water can also be used as the cleaning liquid. Further, in the substrate rotation processing apparatus for photoresist coating, MIBK (methyl isobutyl ketone) is used as the cleaning liquid.
Alternatively, an organic solvent such as ECA (ethyl cellosolve acetate) is used.

Inside the cleaning liquid ejection groove 5, that is, between the cleaning liquid ejection groove 5 and the substrate adsorption groove 3, a concave groove 7 along the cleaning liquid ejection groove 5 is formed.
Are formed.

Next, the operation of the substrate rotation processing apparatus described above will be described.

When the substrate W is placed on the chuck 1 and suction-held, the cleaning liquid is supplied to the cleaning liquid ejection groove 5 via the cleaning liquid supply hole 6. The cleaning liquid is filled in the cleaning liquid jetting groove 5 and overflows from the cleaning liquid jetting groove 5, and as shown in FIG. 3, the peripheral portion of the chuck upper surface and the peripheral portion of the back surface of the substrate where the cleaning liquid jetting groove 5 is formed. It is supplied until the gap is filled with the cleaning liquid 8 by the capillary phenomenon.

When the processing liquid is dropped on the substrate W in the state where the cleaning liquid 8 is filled in this way, the processing liquid that tries to flow from the front surface to the back surface of the substrate W is blocked by the cleaning liquid 8 filling the gap. Therefore, for example, when the processing liquid is a photoresist, by the action of the organic solvent that is a cleaning liquid,
The photoresist is prevented from adhering to the back surface of the substrate W.

On the other hand, between the chuck surface where the substrate suction groove 3 is formed and the back surface of the substrate W, some gap is unavoidable due to the influence of the unevenness of the substrate. Therefore, the cleaning liquid 8 is sucked toward the substrate suction groove 3 inside the chuck 1 through this gap. However, since the concave groove 7 is provided inside the cleaning liquid jetting groove 5, the cleaning liquid sucked toward the inside of the chuck 1 falls into the concave groove 7 and does not reach the substrate adsorption groove 3. Since the groove 7 is formed to have a size enough to contain the cleaning liquid sucked into the chuck 1 during one rotation of the substrate W, the cleaning liquid overflows from the groove 7. Does not reach the substrate suction groove 3.

When the rotation process of the substrate W is completed, the substrate W is chucked 1
After being removed from the chuck 1, the cleaning liquid in the groove 7 is spun out of the chuck 1 by idling the chuck 1.

In the above embodiment, the rotation processing apparatus for a rectangular substrate has been described as an example, but as shown in FIG. 4, the present invention is a rotation processing apparatus for a substrate having a round shape or a shape close to a circle such as a semiconductor wafer. It can also be applied to a device. In FIG. 4, the wafer chuck 11 is a semiconductor wafer (not shown).
And is formed in almost the same shape. After the semiconductor wafer is positioned, it is placed on the wafer chuck 11 and suction-held. Similar to the above embodiment, the cleaning liquid is ejected from the cleaning liquid ejection groove 15 to fill the cleaning liquid between the peripheral portion of the upper surface of the wafer chuck 11 and the peripheral portion of the semiconductor wafer. Since the concave groove 17 is provided inside the cleaning liquid jetting groove 5, the cleaning liquid is absorbed in the wafer suction groove.
It never reaches 13.

Further, the substrate rotation processing apparatus according to the present invention includes a spin coater for coating a substrate with a photoresist, a dopant, a silicide, or a brush such as nylon or mohair while supplying ultrapure water to the substrate surface. Various spin processing devices such as a spin scrubber for washing off particles on the substrate surface, a spin etcher for etching the substrate surface with a processing liquid, and a spin developer for developing a substrate are included.

<Effects of Device> As is clear from the above description, according to the present invention, the cleaning liquid is ejected from the cleaning liquid ejection grooves provided on the peripheral portion of the upper surface of the chuck, so that the peripheral portion of the upper surface of the chuck and the peripheral portion of the back surface of the substrate are surrounded. Since the cleaning liquid is filled between and, it is possible to prevent the processing liquid from flowing around and adhering to the back surface of the substrate.
Further, since the concave groove is formed between the cleaning liquid jetting groove and the substrate adsorption portion so as to prevent the cleaning liquid from advancing to the substrate adsorption portion, the processing liquid or the cleaning liquid is sucked into the vacuum device to prevent the vacuum device from operating. It doesn't break down.

[Brief description of drawings]

1 to 3 are views showing a schematic configuration of a main part of a substrate rotation processing apparatus according to an embodiment of the present invention. FIG. 1 is a plan view of a rectangular chuck, and FIG. 2 is a longitudinal section thereof. FIG. 3 and FIG. 3 are enlarged cross-sectional views of the periphery of the chuck. FIG. 4 is a plan view of a chuck for a semiconductor wafer according to another embodiment. 1 ... Chuck, 3 ... Substrate suction groove 5 ... Cleaning liquid jetting groove, 7 ... Recessed groove 8 ... Cleaning liquid, W ... Substrate

Claims (1)

[Scope of utility model registration request] 1. A substrate having a shape substantially the same as that of a substrate to be processed is placed on the chuck, and the substrate is supplied to the surface of the substrate by being rotated while being sucked and held by a substrate suction portion formed inside the chuck. In a substrate rotation processing apparatus for performing a required processing with a processing liquid, a cleaning liquid ejection groove for ejecting a cleaning liquid for preventing the processing liquid from flowing around is provided in the peripheral portion of the upper surface of the chuck, and between the cleaning liquid ejection groove and the substrate adsorption portion. A substrate rotation processing apparatus having a recessed groove for preventing suction of a cleaning liquid.