JPH06266446A - Pressure controller for vacuum chamber - Google Patents
Pressure controller for vacuum chamberInfo
- Publication number
- JPH06266446A JPH06266446A JP8133893A JP8133893A JPH06266446A JP H06266446 A JPH06266446 A JP H06266446A JP 8133893 A JP8133893 A JP 8133893A JP 8133893 A JP8133893 A JP 8133893A JP H06266446 A JPH06266446 A JP H06266446A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- vacuum chamber
- variable capacity
- capacity valve
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Fluid Pressure (AREA)
Abstract
(57)【要約】
【目的】真空室の圧力制御で、圧力制御の応答性の向
上、安定化時間の短縮を図る。
【構成】真空室1と、該真空室に接続されたガス供給部
2と、該真空室に接続され可変容量バルブ4を有する排
気ライン3と、前記真空室の圧力を検出する圧力検出器
7と、前記圧力検出器からの検出圧力と圧力目標値6と
の比較により可変容量バルブの開度を制御する圧力制御
器5と、前記可変容量バルブを全閉する手段とを具備
し、真空室を真空状態から目標圧力6迄昇圧させる場
合、先ず真空室の圧力とは無関係に可変容量バルブを閉
塞し、真空室圧力上昇を行い、次に真空室内の圧力が所
定圧11となったところで、前記圧力制御器によりフィ
ードバック制御を行って、真空室を目標圧にする。
(57) [Summary] [Purpose] To improve the responsiveness of pressure control and shorten the stabilization time by controlling the pressure in the vacuum chamber. A vacuum chamber 1, a gas supply unit 2 connected to the vacuum chamber, an exhaust line 3 connected to the vacuum chamber and having a variable capacity valve 4, and a pressure detector 7 for detecting the pressure in the vacuum chamber. And a pressure controller 5 for controlling the opening of the variable capacity valve by comparing the detected pressure from the pressure detector with a target pressure value 6, and a means for fully closing the variable capacity valve. When the pressure is increased from the vacuum state to the target pressure 6, first, the variable capacity valve is closed regardless of the pressure in the vacuum chamber, the pressure in the vacuum chamber is increased, and then, when the pressure in the vacuum chamber reaches the predetermined pressure 11, Feedback control is performed by the pressure controller to bring the vacuum chamber to a target pressure.
Description
【0001】[0001]
【産業上の利用分野】本発明は、真空室の圧力制御装
置、特にプラズマエッチング装置、減圧CVD装置等、
半導体デバイスを生産する半導体製造装置の真空室を減
圧、昇圧する場合の真空室の圧力制御装置に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure control device for a vacuum chamber, particularly a plasma etching device, a low pressure CVD device, etc.
The present invention relates to a pressure control device for a vacuum chamber of a semiconductor manufacturing apparatus that produces semiconductor devices, when the pressure in the vacuum chamber is reduced or increased.
【0002】[0002]
【従来の技術】真空室の圧力制御は、半導体製造装置に
於いて広く用いられている技術の一つであり、特にプラ
ズマエッチング装置、減圧CVD装置等、真空処理室を
有し半導体デバイスの量産を行う装置には必要不可欠な
技術である。近年、一層の自動化要求が高まる中、高速
に制御ができ、広い圧力範囲に適用できる真空室の圧力
制御装置が望まれている。2. Description of the Related Art Pressure control in a vacuum chamber is one of the techniques widely used in semiconductor manufacturing equipment, and particularly in plasma etching equipment, low pressure CVD equipment, etc., which has a vacuum processing compartment and mass-produces semiconductor devices. This is an indispensable technology for equipment that performs In recent years, as the demand for automation further increases, there is a demand for a pressure control device for a vacuum chamber that can control at high speed and can be applied to a wide pressure range.
【0003】図3により従来の真空室の圧力制御装置に
ついて説明する。A conventional pressure control device for a vacuum chamber will be described with reference to FIG.
【0004】真空室1にはガス供給部2、排気ライン3
が接続され、該排気ライン3の管路途中には可変容量バ
ルブ4が設けられている。該可変容量バルブ4は圧力制
御器5によって開度が調整される様になっており、該圧
力制御器5には圧力目標値6が設定入力されると共に前
記真空室1に設けられた圧力検出器7からの圧力検出値
が入力される様になっている。The vacuum chamber 1 has a gas supply section 2 and an exhaust line 3
Is connected, and a variable capacity valve 4 is provided midway in the pipeline of the exhaust line 3. The opening of the variable capacity valve 4 is adjusted by a pressure controller 5, and a target pressure value 6 is set and input to the pressure controller 5 and a pressure detection valve provided in the vacuum chamber 1 is detected. The pressure detection value from the device 7 is input.
【0005】従来の真空室の圧力制御装置では上記構成
を有し、比例制御(PID)が行われていた。The conventional vacuum chamber pressure control device has the above-described structure and performs proportional control (PID).
【0006】先ず、真空室1は排気ライン3により真空
引きされ、次に反応ガスが前記真空室1より導入され
る。前記可変容量バルブ4は全開の状態からスタート
し、反応ガスの導入により真空室1内の圧力が増加する
と、この圧力は前記圧力検出器7によって検出され、前
記圧力制御器5に入力される。該圧力制御器5は前記圧
力検出器7からの信号と前記圧力目標値6との偏差を求
め、該偏差と予め設定してあるPID定数とで目標バル
ブ開度を演算し、この目標バルブ開度に対応したバルブ
駆動信号を前記可変容量バルブ4に出力し、該可変容量
バルブ4の開度を減少させる。更に、可変容量バルブ4
の開度は前記圧力制御器5にフィードバックされ、クロ
ーズドループによる制御が行われる。First, the vacuum chamber 1 is evacuated by the exhaust line 3, and then the reaction gas is introduced from the vacuum chamber 1. The variable capacity valve 4 starts from the fully opened state, and when the pressure in the vacuum chamber 1 increases due to the introduction of the reaction gas, this pressure is detected by the pressure detector 7 and input to the pressure controller 5. The pressure controller 5 obtains the deviation between the signal from the pressure detector 7 and the pressure target value 6, calculates the target valve opening with the deviation and a preset PID constant, and opens the target valve opening. The valve drive signal corresponding to the degree is output to the variable capacity valve 4, and the opening degree of the variable capacity valve 4 is decreased. Furthermore, the variable capacity valve 4
The degree of opening is fed back to the pressure controller 5 and closed loop control is performed.
【0007】この圧力制御による真空室1内の圧力値と
可変容量バルブ4の開度の関係を図4に示す。FIG. 4 shows the relationship between the pressure value in the vacuum chamber 1 and the opening of the variable capacity valve 4 by this pressure control.
【0008】図4から分かる様に、PID制御では検出
圧力が圧力目標値6を超える迄可変容量バルブ4を全閉
方向に制御し、完全に閉塞した後、その後可変容量バル
ブ4を開口方向に制御し、検出圧力値が圧力目標値6に
対して増減を繰返すのと対応して開度の調整が行われ、
やがて圧力値の変動を収斂させるものである。As can be seen from FIG. 4, in the PID control, the variable displacement valve 4 is controlled in the fully closing direction until the detected pressure exceeds the target pressure value 6 and completely closed, after which the variable displacement valve 4 is opened in the opening direction. The opening is adjusted in response to the control and the detected pressure value repeatedly increasing and decreasing with respect to the target pressure value 6.
Eventually, the pressure value will converge.
【0009】[0009]
【発明が解決しようとする課題】上記した従来の真空室
の圧力制御装置は、PID定数によるフィードバックル
ープ制御であるが、設定したPID定数により開口速
度、応答速度が異なり、PID定数が適正でない場合、
作動条件が変わった場合等、ハンチング現象、アンダー
シュート等の不整合状態を生じ、安定制御迄に長時間を
要することとなる。半導体製造装置、特に枚葉処理方式
の半導体製造装置では圧力の応答性、安定制御迄の時間
が生産性に大きく影響するので、圧力制御の応答性、安
定化時間の短縮は大きな問題となっている。The above-mentioned conventional pressure control device for the vacuum chamber performs feedback loop control based on the PID constant. However, when the opening speed and the response speed differ depending on the set PID constant, the PID constant is not appropriate. ,
When the operating conditions are changed, a hunting phenomenon, an inconsistent state such as undershoot occurs, and it takes a long time to achieve stable control. In semiconductor manufacturing equipment, especially in single-wafer processing type semiconductor manufacturing equipment, pressure responsiveness and the time until stable control greatly affect productivity, so pressure control responsiveness and shortening of stabilization time are major problems. There is.
【0010】本発明は斯かる実情に鑑み、圧力制御の応
答性の向上、安定化時間の短縮を図ろうとするものであ
る。In view of the above situation, the present invention is intended to improve the responsiveness of pressure control and shorten the stabilization time.
【0011】[0011]
【課題を解決するための手段】本発明は、真空室と、該
真空室に接続されたガス供給部と、該真空室に接続され
可変容量バルブを有する排気ラインと、前記真空室の圧
力を検出する圧力検出器と、前記圧力検出器からの検出
圧力と圧力目標値との比較により可変容量バルブの開度
を制御する圧力制御器と、前記可変容量バルブを全閉す
る手段とを具備し、前記圧力検出器からの検出圧力が所
定圧に達すると前記圧力制御器による前記可変容量バル
ブの開閉制御を行う様構成したことを特徴とするもので
ある。According to the present invention, there is provided a vacuum chamber, a gas supply unit connected to the vacuum chamber, an exhaust line connected to the vacuum chamber and having a variable capacity valve, and a pressure in the vacuum chamber. A pressure detector for detecting, a pressure controller for controlling the opening of the variable capacity valve by comparing the detected pressure from the pressure detector with a target pressure value, and means for fully closing the variable capacity valve. The pressure controller controls the opening / closing of the variable capacity valve when the pressure detected by the pressure detector reaches a predetermined pressure.
【0012】[0012]
【作用】真空室を真空状態から目標圧力迄昇圧させる場
合、先ず真空室の圧力とは無関係に可変容量バルブを閉
塞し、真空室圧力上昇を行い、次に真空室内の圧力が所
定圧となったところで、前記圧力制御器によりフィード
バック制御を行って、真空室を目標圧にする。When the pressure in the vacuum chamber is raised from the vacuum state to the target pressure, the variable capacity valve is first closed regardless of the pressure in the vacuum chamber to raise the pressure in the vacuum chamber, and then the pressure in the vacuum chamber becomes a predetermined pressure. By the way, feedback control is performed by the pressure controller to bring the vacuum chamber to a target pressure.
【0013】[0013]
【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0014】図1で示す本実施例中、図2中で示したも
のと同一のものには同符号を付してある。In this embodiment shown in FIG. 1, the same parts as those shown in FIG. 2 are designated by the same reference numerals.
【0015】真空室1の圧力を検出する圧力検出器7を
比較器8に接続すると共に該比較器8を介して圧力制御
器5に接続する。前記比較器8を制御切替えスイッチ9
を介して可変容量バルブ4に接続し、前記比較器8には
上位コンピュータ10を接続する。該上位コンピュータ
10は前記比較器8に前記制御切替えスイッチ9切替え
時期を設定する比較基準値11を入力する。A pressure detector 7 for detecting the pressure in the vacuum chamber 1 is connected to a comparator 8 and is also connected to the pressure controller 5 via the comparator 8. Control changeover switch 9 for the comparator 8
A variable capacity valve 4 is connected to the comparator 8, and a high-level computer 10 is connected to the comparator 8. The host computer 10 inputs the comparison reference value 11 for setting the switching timing of the control changeover switch 9 to the comparator 8.
【0016】以下、作動を説明する。The operation will be described below.
【0017】圧力制御は真空室1が真空の状態から始め
られ、圧力制御開始時には制御切替えスイッチ9の状態
は前記比較器8からの弁駆動信号が前記可変容量バルブ
4に入力される様になっている。The pressure control is started when the vacuum chamber 1 is in a vacuum state, and when the pressure control is started, the state of the control changeover switch 9 is such that the valve drive signal from the comparator 8 is input to the variable capacity valve 4. ing.
【0018】この比較器8からの弁駆動信号は圧力制御
開始と同時に可変容量バルブ4を全閉させる。この全閉
速度は、制御系の応答性とは無関係に可変容量バルブ4
が有する最大速度で閉塞する。該可変容量バルブ4の全
閉で真空室1内の圧力は急速に上昇し、前記圧力検出器
7は真空室1内の圧力を前記比較器8に入力する。該比
較器8は圧力検出器7からの検出圧力と前記比較基準値
11とを比較し、検出圧力が比較基準値11に達した時
点で前記制御切替えスイッチ9に切替え信号12を発
し、前記圧力目標値6からの信号が前記可変容量バルブ
4に入力される様に前記制御切替えスイッチ9を切替え
る。この切替えによって前記圧力制御器5によるPID
制御が開始される。The valve drive signal from the comparator 8 fully closes the variable capacity valve 4 at the same time when the pressure control is started. This full closing speed is controlled by the variable capacity valve 4 regardless of the response of the control system.
Closes at its maximum rate. When the variable capacity valve 4 is fully closed, the pressure in the vacuum chamber 1 rapidly rises, and the pressure detector 7 inputs the pressure in the vacuum chamber 1 to the comparator 8. The comparator 8 compares the detected pressure from the pressure detector 7 with the comparison reference value 11, and when the detected pressure reaches the comparison reference value 11, issues a changeover signal 12 to the control changeover switch 9 to change the pressure. The control changeover switch 9 is switched so that the signal from the target value 6 is input to the variable capacity valve 4. By this switching, the PID by the pressure controller 5
Control is started.
【0019】即ち、前記圧力検出器7からの検出圧力が
比較器8を経て前記圧力制御器5に入力され、該圧力制
御器5は検出圧力値と前記圧力目標値6との比較によ
り、検出圧力が前記圧力目標値6となる様に前記可変容
量バルブ4の開度を調整する。That is, the pressure detected from the pressure detector 7 is input to the pressure controller 5 via the comparator 8, and the pressure controller 5 detects the pressure by comparing the detected pressure value with the target pressure value 6. The opening of the variable capacity valve 4 is adjusted so that the pressure becomes the target pressure value 6.
【0020】本実施例の圧力制御の状態を図2に示す。
図2中実線で示す曲線が本実施例の圧力制御状態を示
し、破線で示すものは図4で示した従来の圧力制御状態
を示している。FIG. 2 shows the state of pressure control of this embodiment.
The curve shown by the solid line in FIG. 2 shows the pressure control state of this embodiment, and the curve shown by the broken line shows the conventional pressure control state shown in FIG.
【0021】従来との比較で明らかな様に、圧力安定化
迄の時間が大幅に短縮される。As is clear from the comparison with the prior art, the time until pressure stabilization is greatly shortened.
【0022】尚、前記制御切替えスイッチ9が切替え作
動を行う比較基準値11は前記上位コンピュータ10に
より適宜選択できる。又、制御切替えスイッチ9は電子
回路で構成することもトランジスタ等の半導体素子でス
イッチング作動を行わせることも、或は制御切替えスイ
ッチ9の機能を前記圧力制御器5に組込むことも可能で
あることは勿論であり、その他本発明の要旨を逸脱しな
い範囲で種々変更が可能であることは言う迄もない。The comparison reference value 11 at which the control changeover switch 9 performs the switching operation can be appropriately selected by the host computer 10. Further, the control changeover switch 9 may be composed of an electronic circuit, may be made to perform switching operation by a semiconductor element such as a transistor, or the function of the control changeover switch 9 may be incorporated in the pressure controller 5. Needless to say, various changes can be made without departing from the scope of the present invention.
【0023】[0023]
【発明の効果】以上述べた如く本発明によれば、圧力安
定迄の時間を大幅に短縮することができ、生産性の向上
に寄与するという優れた効果を発揮する。As described above, according to the present invention, it is possible to greatly reduce the time until the pressure stabilizes, and to exert an excellent effect of contributing to the improvement of productivity.
【図1】本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of the present invention.
【図2】該実施例の作動を示す線図である。FIG. 2 is a diagram showing the operation of the embodiment.
【図3】従来例を示すブロック図である。FIG. 3 is a block diagram showing a conventional example.
【図4】該従来例の作動を示す線図である。FIG. 4 is a diagram showing an operation of the conventional example.
1 真空室 2 ガス供給部 3 排気ライン 4 可変容量バルブ 5 圧力制御器 6 圧力目標値 7 圧力検出器 8 比較器 9 制御切替えスイッチ 10 上位コンピュータ 11 比較基準値 12 切替え信号 1 vacuum chamber 2 gas supply part 3 exhaust line 4 variable capacity valve 5 pressure controller 6 target pressure value 7 pressure detector 8 comparator 9 control changeover switch 10 host computer 11 comparison reference value 12 changeover signal
Claims (1)
給部と、該真空室に接続され可変容量バルブを有する排
気ラインと、前記真空室の圧力を検出する圧力検出器
と、前記圧力検出器からの検出圧力と圧力目標値との比
較により可変容量バルブの開度を制御する圧力制御器
と、前記可変容量バルブを全閉する手段とを具備し、前
記圧力検出器からの検出圧力が所定圧に達すると前記圧
力制御器による前記可変容量バルブの開閉制御を行う様
構成したことを特徴とする真空室の圧力制御装置。1. A vacuum chamber, a gas supply unit connected to the vacuum chamber, an exhaust line having a variable capacity valve connected to the vacuum chamber, a pressure detector for detecting the pressure in the vacuum chamber, A pressure controller for controlling the opening of the variable capacity valve by comparing the detected pressure from the pressure detector with a target pressure value; and a means for fully closing the variable capacity valve. A pressure control device for a vacuum chamber, wherein the pressure controller controls opening and closing of the variable capacity valve when the pressure reaches a predetermined pressure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8133893A JPH06266446A (en) | 1993-03-16 | 1993-03-16 | Pressure controller for vacuum chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8133893A JPH06266446A (en) | 1993-03-16 | 1993-03-16 | Pressure controller for vacuum chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06266446A true JPH06266446A (en) | 1994-09-22 |
Family
ID=13743589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8133893A Pending JPH06266446A (en) | 1993-03-16 | 1993-03-16 | Pressure controller for vacuum chamber |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06266446A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0972561A2 (en) * | 1998-07-13 | 2000-01-19 | Seiko Seiki Kabushiki Kaisha | Vacuum apparatus |
US7253107B2 (en) | 2004-06-17 | 2007-08-07 | Asm International N.V. | Pressure control system |
JP2016046285A (en) * | 2014-08-20 | 2016-04-04 | 東京エレクトロン株式会社 | Wafer inspection apparatus |
US11104997B2 (en) | 2018-10-19 | 2021-08-31 | Kokusai Electric Corporation | Substrate processing apparatus and method of manufacturing semiconductor device |
US12209306B2 (en) | 2015-04-16 | 2025-01-28 | Ii-Vi Delaware, Inc. | Optically-finished thin diamond substrate or window of high aspect ratio and a method of production thereof |
-
1993
- 1993-03-16 JP JP8133893A patent/JPH06266446A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0972561A2 (en) * | 1998-07-13 | 2000-01-19 | Seiko Seiki Kabushiki Kaisha | Vacuum apparatus |
EP0972561A3 (en) * | 1998-07-13 | 2000-09-27 | Seiko Seiki Kabushiki Kaisha | Vacuum apparatus |
US7253107B2 (en) | 2004-06-17 | 2007-08-07 | Asm International N.V. | Pressure control system |
JP2016046285A (en) * | 2014-08-20 | 2016-04-04 | 東京エレクトロン株式会社 | Wafer inspection apparatus |
US12209306B2 (en) | 2015-04-16 | 2025-01-28 | Ii-Vi Delaware, Inc. | Optically-finished thin diamond substrate or window of high aspect ratio and a method of production thereof |
US11104997B2 (en) | 2018-10-19 | 2021-08-31 | Kokusai Electric Corporation | Substrate processing apparatus and method of manufacturing semiconductor device |
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