JPH06224531A - Wiring structure of injection-molded printed board - Google Patents

Abstract

PURPOSE:To improve the parts packing density and wiring density of an injection-molded printed board so as to reduce the size and thickness of a product using printed board. CONSTITUTION:Two sets of spacer bases 12 having flat upper surfaces and projections 13 which are put in recessed sections 8 on a case 7 and a conductor pattern 15 which connects the projections 13 to each other are formed on a cover 11 composed of an injectionmolded printed board and, at the same time, the recessed sections 8 and conductor patterns 9 and 10 for recessed sections are formed on the case 7 composed of another injection-molded printed board. Then, after putting the cover 11 on the case 7, with the projections 13 being put in the sections 8, the patterns 9 and 10 on the case 7 are electrically connected to each other by using the pattern 15 on the cover 11 as a jumper. Therefore, the restriction on the wiring on the case 7 is reduced and the parts packing density and wiring density can be improved, since the jumper (conductor pattern 15) can be formed on the cover 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring structure for an injection molded printed circuit board.

[0002]

2. Description of the Related Art In recent years, due to the demand for smaller and thinner products, the mounting density of electronic components and the wiring density have been increased. It came to be used. On the other hand, for the same purpose, injection molded printed circuit boards, in which a complex shape including irregularities is molded by injection molding of thermoplastic resin and a conductor pattern is formed on the surface of the molded product by plating and etching, have come to be used. , A structure that doubles as a circuit board and a molded product such as a product case has been developed. But,
As described above, when it also serves as a case, only a single layer circuit inside the case can be provided, and there are great restrictions on forming a high-density circuit.

FIG. 4 shows an example in which jumpers (interlaced conducting paths) are provided on the conventional injection-molded printed circuit board 1 to increase the wiring density. FIG. 4 (a) shows a conductor such as a tin-plated wire. 2 is formed in advance, and both ends thereof are joined to two connection points on the conductor pattern 3 to be connected with solder 4 to form jumpers that jump over the intersecting conductor patterns 5. Also, FIG.
(B) shows a conventional example in which the jumper is different.
A jumper is provided on the conductor pattern 5 intersecting with the Ω chip resistor 6.

[0004]

When a jumper is provided to increase the wiring density as described above, if a conductor such as a tin-plated wire is used as the jumper, it is necessary to form the conductor and join it with a conductor pattern by hand soldering. As a result, productivity was reduced. Further, when the chip resistor is used, there is a problem that the jump distance cannot be increased and the cost becomes high.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an injection-molded printed circuit board that contributes to high density of component mounting and wiring, and can achieve downsizing and thinning of products. It is to provide a wiring structure.

[0006]

In order to solve the above-mentioned problems, the invention according to claim 1 has at least one injection-molded printed circuit board for at least one injection-molded printed circuit board.
One protrusion and at least one protrusion-side conductor pattern are formed on the protrusion surface, and on the other injection-molded printed circuit board, a recess to be fitted with the protrusion and the protrusion-side conductor pattern on the recess surface are formed. It is characterized in that a recess side conductor pattern is formed, the projection and the recess are fitted to each other, the injection molded printed boards are combined, and the injection molded printed boards are electrically connected.

According to a second aspect of the present invention, a convex or concave fitting portion A and a convex or concave fitting portion B are formed on the injection-molded printed circuit board A, and the fitting portion A and the The surface of the fitting portion B is connected by a conductor pattern, and a corresponding convex or concave fitting portion A that fits with each fitting portion on the injection molded printed circuit board A is projected on the injection molded printed circuit board B. A concave corresponding fitting portion B is formed, a conductor pattern is formed on the surface of each corresponding fitting portion, and at least one trapezoidal spacer base having a flat upper surface is formed on at least one of the injection-molded printed circuit boards. , The fitting portion and the corresponding fitting portion are fitted to each other, the both injection molded printed boards are combined, the conductor pattern on the injection molded printed board A is used as a jumper, and the injection molded printed board B is mounted on the injection molded printed board B. Electrical between corresponding mating parts It is characterized in that it has connections.

[0008]

A protrusion having a protrusion-side conductor pattern on its surface formed on an injection-molded printed circuit board, and a recess having a recess-side conductor pattern corresponding to the protrusion-side conductor pattern formed on another injection-molded printed circuit board. When they are fitted together, the protrusion-side conductor pattern and the recess-side conductor pattern come into contact with each other, and the two injection-molded printed circuit boards are electrically connected.

For the two injection-molded printed circuit boards A and B, a convex or concave fitting portion A and a convex or concave fitting portion B are formed on the injection-molded printed circuit board A. A
And the surface of the fitting portion B are connected by a conductor pattern, and on the injection-molded printed circuit board B, a convex or concave corresponding fitting portion A that is fitted to each fitting portion on the injection-molded printed circuit board A and convex or By forming concave corresponding fitting portions B, forming a conductor pattern on the surface of each corresponding fitting portion, fitting the fitting portion and the corresponding fitting portion, and combining both injection molded printed boards, injection molding The conductor pattern on the printed circuit board A acts as a jumper that electrically connects the corresponding fitting portions on the injection molded printed circuit board B.

Further, the spacer base, which has a flat upper surface and is formed on at least one of the injection-molded printed boards, forms a predetermined gap between the two boards when the injection-molded printed boards are combined.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the present invention, an example of forming a jumper on an injection molded printed circuit board will be described with reference to FIG. In the figure, reference numeral 7 denotes a resin case, which also serves as a circuit board on which electronic components for surface mounting are mounted as an injection molded printed circuit board. Reference numeral 8 denotes a concave portion provided on the case 7, which is fitted with a protrusion described later. Reference numerals 9 and 10 denote recess-side conductor patterns provided on the substrate surface of the case 7 from the inner surface of the recess 8.
Is a resin cover, which is an injection-molded printed circuit board like the case 7, and is attached to the case 7 to form the outer shell of the product. Reference numeral 12 is a spacer base provided so that a gap for mounting components is formed when the cover 11 is attached to the case 7, 13 is a protrusion that fits into the recess 8, and 14 is a continuous surface from the protrusion surface to the substrate surface of the cover 11. It is a protrusion side conductor pattern provided on the.

In this embodiment, the spacer base 12 and the protrusions 13 are formed on the cover 11, the protrusion side conductor patterns 14 on the respective protrusions 13 are connected to form the conductor patterns 15, and the protrusions 13 are formed on the case 7. The recess 8 that fits in
The recess side conductor patterns 9 and 10 are formed on the substrate surface of the case 7 from the inner surface of the recess 8 and the case 1 is covered with the cover 1.
When 1 is attached and the corresponding recesses 8 and protrusions 13 are respectively fitted, the recess side conductor patterns 9 and 10 are connected by the conductor pattern 15. By forming the conductor pattern 15 as a jumper on the cover 11 side in this way, restrictions on wiring on the case 7 are reduced, and the mounting density and wiring density of components can be increased.

In this example, only one jumper is formed on the cover 11 side, but a plurality of protrusions having a plurality of conductor patterns or a plurality of protrusions are provided to form a plurality of circuits between the case 7 and the cover 11. You may do it, or cover 11
Electronic components may be mounted on the side and connected.

Here, a combination of a spacer base, a protrusion and a conductor pattern on the protrusion side and a combination of a recess and a conductor pattern on the recess side are collectively referred to as a fitting portion.
The fitting portion may have a shape as shown in FIG.

FIG. 2A shows the projection 13 and the projection-side conductor pattern 14 provided on the injection-molded printed circuit board without the spacer stand therebetween, and FIG. 2B shows the recess on the spacer stand 12. 8 and the concave-side conductor pattern 9 are provided. The fitting portion shown in FIG. 2 (a) can be replaced with the fitting portion with the spacer base shown in FIG. 1, and the protrusion 13 shown in FIG. 2 (a) is made higher than the depth of the concave portion 8. If the cover 11 is attached to the case 7, the recess 8
The protrusion 13 abuts on the bottom of the base, and a gap for mounting components can be secured between the case 7 and the cover 11, and a spacer base is not necessary.

Further, the shape of the protrusion 13 is not particularly limited, and if it is formed into a columnar shape as shown in FIG. 3, it is fitted and connected to a normal printed circuit board 16 having a through hole 17 provided with a conductor therein. Can be made.

The spacer base 12 may be formed anywhere on the injection-molded printed circuit board, and it is not necessary to form it under the projections or recesses, but it is more effective to form the spacer space under the fitting parts for the board space. Available for

In the present invention, since the conductor patterns are brought into contact with each other, it is desirable that the contact surface be plated with Au or the like in order to prevent corrosion and to reduce the contact reliability. Further, in FIG. 1, the protrusion-side conductor pattern 14 on the surface of the protrusion 13 is provided in a band shape, and the recess-side conductor pattern 9 of the recess 8 is formed.
Is provided on the entire surface from the substrate surface to the inner surface of the concave portion, and the projection-side conductor pattern 14 shown in FIG. 3 is provided on the entire projection surface. However, the shapes of the projection-side conductor pattern and the depression-side conductor pattern are not limited. When the substrates are combined, the corresponding conductor patterns may be formed in contact with each other.

[0019]

According to the present invention, two injection-molded printed circuit boards are provided with protrusions each having a projection-side conductive pattern on the surface thereof, and the protrusions are formed on one of the injection-molded printed circuit boards. If a concave portion provided with a conductor pattern is formed on the other injection-molded printed circuit board and the corresponding projection and concave portion are fitted together, and both injection-molded printed circuit boards are combined, the corresponding protrusion-side conductor pattern and concave-side conductor pattern Contacting each other and electrically connecting the two injection-molded printed circuit boards to each other reduces wiring restrictions, which can contribute to high-density wiring and high-density component mounting of the injection-molded printed circuit board. The effect is that the product can be made smaller and thinner.

Further, according to the second aspect of the present invention, the jumper can be formed on the injection-molded printed circuit board, so that there are less restrictions on wiring and the same effect as the above-mentioned effect can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a jumper wiring method using a case and a cover which are injection-molded printed circuit boards according to the present invention.

FIG. 2 is a perspective view showing another example of a fitting portion.

FIG. 3 is a perspective view showing a different embodiment of the present invention.

FIG. 4 is a perspective view showing an example of a conventional jumper wiring method.

[Explanation of symbols]

 1 board 2 conductor 3 conductor pattern 4 solder 5 intersecting conductor pattern 6 chip resistor 7 case 8 recess 9 and 10 recess side conductor pattern 11 cover 12 spacer stand 13 protrusion 14 protrusion side conductor pattern 15 conductor pattern 16 printed circuit board 17 conductor inside Through hole

Claims (2)

[Claims] 1. For two injection-molded printed circuit boards, at least one protrusion and at least one protrusion-side conductor pattern on the surface of the protrusion on one injection-molded printed circuit board.
On the other side of the injection molded printed circuit board,
A concave portion that fits with the protrusion and a concave-side conductor pattern corresponding to the protrusion-side conductor pattern are formed on the concave surface,
An injection-molded printed circuit board wiring structure, characterized in that the projections and the recesses are fitted to each other, the both injection-molded printed circuit boards are combined, and the two injection-molded printed circuit boards are electrically connected. 2. A convex or concave fitting portion A and a convex or concave fitting portion B are formed on an injection-molded printed circuit board A, and the surfaces of the fitting portion A and the fitting portion B are conductors. A convex or concave corresponding fitting portion A and a convex or concave corresponding fitting portion B, which are connected by a pattern and are fitted to each fitting portion on the injection molded printed board A, are connected on the injection molded printed board B. And forming a conductor pattern on the surface of each corresponding fitting portion, and forming at least one spacer base having a flat upper surface on at least one of the injection-molded printed circuit boards to form the fitting portion and the corresponding The fitting portions are fitted to each other, the both injection molded printed boards are combined, and the conductor pattern on the injection molded printed board A is used as a jumper to electrically connect the corresponding fitted portions on the injection molded printed board B. To be connected to Deformed printed circuit board wiring structure.