JPS62190791A - Wiring board and connector - Google Patents
Wiring board and connectorInfo
- Publication number
- JPS62190791A JPS62190791A JP3343486A JP3343486A JPS62190791A JP S62190791 A JPS62190791 A JP S62190791A JP 3343486 A JP3343486 A JP 3343486A JP 3343486 A JP3343486 A JP 3343486A JP S62190791 A JPS62190791 A JP S62190791A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- wiring
- wiring board
- contact
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、配線基板上の多数の配線と他の配線基板上の
多数の配線とを一括して電気的に接続するコネクタ技術
に適用して有効な技術に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applied to a connector technology that electrically connects a large number of wires on a wiring board to a large number of wires on another wiring board at once. It is about effective techniques.
従来、プリント配線基板上の高周波信号を伝送する多数
配線は、夫々のコネクタ接点に接続され。Conventionally, multiple wires for transmitting high frequency signals on a printed wiring board are connected to respective connector contacts.
次の方法で他の配線基板の多数の配線と電気的に接続さ
れている。(1)一方のプリント配線基板上のコネクタ
接点に、ばね性液点を接触させて他方のプリント配線基
板の接点と電気的に接続を行う方法。(2)一方のプリ
ント配線基板上のコネクタ接点上に半田、金等の突起を
形成し、この突起に他方のプリント配線基板の接点を接
触圧接し、両者を電気的に接続する方法。It is electrically connected to many wirings of other wiring boards by the following method. (1) A method of electrically connecting a connector contact on one printed wiring board with a contact on the other printed wiring board by bringing a spring liquid point into contact with it. (2) A method in which protrusions of solder, gold, etc. are formed on the connector contacts on one printed wiring board, and the contacts of the other printed wiring board are brought into pressure contact with the protrusions to electrically connect the two.
前記(1)の方法を第4図を用いて説明する。The method (1) above will be explained using FIG. 4.
プリント配線基板1上のコネクタ接点3には、引出用配
線2が電気的に接続されている。この引出用配線2の接
続の相手となる配線4は、他の構造体(例えば、プリン
ト配線基板)上に設けられている。配線4は、半田等の
接着金属でばね性を有する接点部材5に電気的に接続さ
れている。前記コネクタ接点3と接点部材5は、接点部
材5のばねが弾性限界以内の適切な曲げ状態となるよう
な外囲器(図示していない)を用いて、電気的に安定な
状態で接続されている。A lead wire 2 is electrically connected to the connector contact 3 on the printed wiring board 1 . The wiring 4 to which the lead wiring 2 is connected is provided on another structure (for example, a printed wiring board). The wiring 4 is electrically connected to a contact member 5 having spring properties with adhesive metal such as solder. The connector contact 3 and the contact member 5 are connected in an electrically stable state using an envelope (not shown) that allows the spring of the contact member 5 to be appropriately bent within its elastic limit. ing.
次に、前記(2)の方法を第5図を用いて説明する。プ
リント配線基板1上には、コネクタ接点3及びこのコネ
クタ接点3に電気的に接続されている引出し用配線2が
設けられている。コネクタ接点3には、半田、金メッキ
等により、接点突起部材6を設けている。この接点突起
部材6に電気的に接続しようとする相手のプリント配線
基板7上にはコネクタ接点8及びこのコネクタ接点8に
電気的に接続される引出用配線4に接続されている。前
記各引出用配線2と4は、前記プリント配線基板1と7
を対向させ、接点突起部材6とコネクタ接点8が接触す
るように位置合わせした後、ねじ等で面配線基板1,7
を固定することにより、電気的に接続される。Next, the method (2) will be explained using FIG. 5. On the printed wiring board 1, a connector contact 3 and a lead-out wiring 2 electrically connected to the connector contact 3 are provided. The connector contact 3 is provided with a contact projection member 6 by soldering, gold plating, or the like. A connector contact 8 and a lead-out wiring 4 electrically connected to the connector contact 8 are connected to a mating printed wiring board 7 to which the contact projection member 6 is electrically connected. The respective lead wires 2 and 4 are connected to the printed wiring boards 1 and 7.
After aligning so that the contact protrusion member 6 and the connector contact 8 are in contact with each other, the surface wiring boards 1 and 7 are fixed with screws or the like.
An electrical connection is established by fixing the
しかしながら、この種の構造の多端子コネクタは、ばね
性を有する接点部材5が電気的導体要素を兼ねており、
静電容量、インダクタンス等電気的性能の上で不利な屈
曲構造が生じる問題があった。However, in a multi-terminal connector with this type of structure, the contact member 5 having spring properties also serves as an electrical conductor element.
There is a problem in that a bent structure is disadvantageous in terms of electrical performance such as capacitance and inductance.
また、接点部材5と配線4の接続時の位置のばらつきや
接着金属のふくらみ、接着部材5の形状のばらつきがあ
り、それを見込んだコネクタ接点間隔1寸法にしなけれ
ばならないこと、および接点部材の弾性を確保するため
には、ある程度広い面積を必要とすること等のため、引
出用配線2領域の微細パターン寸法に見合った高密度な
コネクタ接点が実現できないという問題があった。In addition, there are variations in the position of the contact member 5 and the wiring 4 when they are connected, bulges in the adhesive metal, and variations in the shape of the adhesive member 5, so the connector contact spacing must be set to 1 dimension to account for this, and the contact member In order to ensure elasticity, a relatively large area is required, and therefore, there is a problem in that it is not possible to realize high-density connector contacts commensurate with the fine pattern dimensions of the two lead-out wiring areas.
また、前記(2)の方法では、コネクタ接点3に接点突
起部材6を形成する必要上、コネクタ接点3のパターン
加工寸法をあまり小さくすることができず、さらにコネ
クタ接点3間に引出用配線2を引き回すので、引出用配
線2領域の配線密度を高めることができないという問題
があった。また、接点突起部材6の高さにばらつ が出
やすく、多数のコネクタ接点3を同時に他のコネクタ接
点8に接続した場合、接触圧力にばらつきが生じ、電気
的接続の信頼性が低下するという問題があった。 本発
明は、前記問題点を解決するためになされたものであり
、その目的は、多数の高尚波信号を伝送するコネクタ接
点を有する配線基板およびそのコネクタにおいて、不要
な浮遊容量を低減することができる技術を提供すること
にある。In addition, in the method (2) above, since it is necessary to form the contact projection member 6 on the connector contact 3, the pattern processing dimensions of the connector contact 3 cannot be made very small. Since the wires are routed around, there is a problem in that it is not possible to increase the wiring density in the area of the two lead-out wirings. In addition, the height of the contact projection member 6 tends to vary, and when a large number of connector contacts 3 are connected to other connector contacts 8 at the same time, the contact pressure will vary and the reliability of the electrical connection will decrease. There was a problem. The present invention has been made to solve the above problems, and its purpose is to reduce unnecessary stray capacitance in a wiring board and its connector that have connector contacts that transmit a large number of high-frequency signals. Our goal is to provide the technology that makes it possible.
本発明の他の目的は、配線基板のコネクタ接点を高密度
に形成するとともに、配線基板間を電気的に安定な状態
で接続すると仁ができる技術を提供することにある。Another object of the present invention is to provide a technology that allows connector contacts of wiring boards to be formed at high density and to connect wiring boards in an electrically stable state.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面によって明らかになるであろ
う。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願において開示される発明のうち、代表的なものの概
要を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.
すなわち、フレキシブルで絶縁性を有する基板の一面上
に厚い膜厚の導電性薄膜で構成したコネクタ接点用突起
部を設け、その他方の面上に薄い膜厚の導電性薄膜で構
成した引出用配線を設け、前記コネクタ接点用突起部と
引出用配線とを基板に構成したスルーホールを通して電
気的に接続するスルーホール配線を設けたことを特徴と
するコネクタ接点を有する配線基板である。また、この
配線基板のコネクタ接点と他の配線基板の接点とを接触
させた状態で、前者の配線基板側に圧縮弾性を有する弾
性部材を介在させて両者の配線基板を固定する加圧部材
を設けたことを特徴とする配線基板の実装用コネクタで
ある。In other words, a connector contact protrusion made of a thick conductive thin film is provided on one side of a flexible insulating substrate, and a lead-out wiring made of a thin conductive thin film is provided on the other side. A wiring board having a connector contact, characterized in that a through-hole wiring is provided for electrically connecting the connector contact protrusion and the lead-out wiring through a through-hole formed in the board. In addition, with the connector contacts of this wiring board and the contacts of another wiring board in contact, a pressure member is inserted on the former wiring board side to fix both wiring boards by interposing an elastic member having compressive elasticity. This is a connector for mounting a wiring board, which is characterized by the following.
本願の配線基板は、多数のコネクタ接点用突起部を引出
用配線と別の面に設けたので、引出用配線の引き回し等
でコネクタ用突起部間に無駄なスペースを設ける必要が
なくなり、前記コネクタ接点用突起部を独立に高密度に
形成することができる。また、引出用配線は、薄いため
微細な加工が可能となり、多数の配線を接点間に形成で
きる。The wiring board of the present application has a large number of protrusions for connector contacts on a different surface from the lead-out wiring, so there is no need to provide wasted space between the connector protrusions when routing the lead-out wires, etc. Contact protrusions can be formed independently and with high density. Furthermore, since the lead-out wiring is thin, it is possible to perform fine processing, and a large number of wirings can be formed between the contacts.
また、本願のコネクタは、前記コネクタ接点用突起部材
を厚い膜厚で構成し、基板にフレキシブル性を設けると
ともに、他の配線基板の接点と接触させた状態で、弾性
部材を介在させて加圧部材で両者の配線基板を固定した
ので、接点毎に確実な電気的接触がなされ、接続部の信
頼性を向上することができる。In addition, in the connector of the present application, the protrusion member for the connector contact is configured with a thick film thickness to provide flexibility to the board, and when it is in contact with the contact of another wiring board, pressure is applied by interposing an elastic member. Since both wiring boards are fixed with the member, reliable electrical contact can be made at each contact point, and the reliability of the connection portion can be improved.
以下、本発明の一実施例を図面を用いて具体的に説明す
る。Hereinafter, one embodiment of the present invention will be specifically described using the drawings.
なお、実施例を説明するための全図において、同一機能
を有するものは同一符号を付け、その繰り返しの説明は
省略する。In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.
第1図は、本発明の一実施例であるコネクタ接点を有す
るプリント配線基板の構成を示す斜視図、第2図は、第
1図のA−A切断線で切った断面図である。FIG. 1 is a perspective view showing the structure of a printed wiring board having connector contacts according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG. 1.
第1図及び第2図において、10はプリント配線基板で
ある。このプリント配線基板10は、フレキシブルで絶
縁性を有する基板(例えば、ポリイミド樹脂)の−面(
表面)に厚い膜厚の導電性薄膜で構成したコネクタ接点
用突起部11が設けられ、裏面にコネクタ接点用突起部
11よりも薄い膜厚の引出用配線12が設けられている
。この引出用配線12の膜厚は、引出用配線12に接続
=7−
される内部配線と同じ厚さで構成されている。コネクタ
接点用突起部11と引出用配線12は、例えば、銅薄膜
で構成されている。前記接点用突起部11の中央部、絶
縁性基板及び引出用配線12の積層部分には、夫々貫通
するスルーホール13が設けられている。このスルーホ
ール13内の基板、引出用配線12及びコネクタ接点用
突起部11の表面上には、スルーホール配線15が設け
られている。スルーホール配線15は、金等のメッキ層
で形成されている。このスルーホール配線15は、コネ
クタ接点用突起部材11と引出用配線12とを電気的に
接続するように構成されている。In FIGS. 1 and 2, 10 is a printed wiring board. This printed wiring board 10 is made of a flexible and insulating board (for example, polyimide resin).
A connector contact protrusion 11 made of a thick conductive thin film is provided on the front surface, and an extraction wiring 12 having a thinner film thickness than the connector contact protrusion 11 is provided on the back surface. The film thickness of this lead-out wiring 12 is the same as that of the internal wiring connected to the lead-out wiring 12. The connector contact protrusion 11 and the lead-out wiring 12 are made of, for example, a copper thin film. Through-holes 13 are provided in the central portion of the contact protrusion 11 and in the laminated portion of the insulating substrate and the lead-out wiring 12, respectively. Through-hole wiring 15 is provided on the surfaces of the substrate, lead-out wiring 12 and connector contact protrusion 11 within this through-hole 13 . The through-hole wiring 15 is formed of a plated layer of gold or the like. This through-hole wiring 15 is configured to electrically connect the connector contact projection member 11 and the lead-out wiring 12.
スルーホール配線工5は、コネクタ接点用突起部材11
を覆うように延在し、コネクタ接点層14を構成してい
る。The through-hole wiring worker 5 has a protruding member 11 for connector contact.
It extends to cover the connector contact layer 14.
前記コネクタ接点用突起部11は、引出用配線12と別
の基板面に設けられているので、引出用配線12を引き
回す領域を考慮する必要がなく、その間隔を独立に高密
度にすることができる。また、引出用配線12は、コネ
クタ接点用突起部1■と別の基板面に設けられており、
しかも、その膜厚が薄いので、高密度に構成することが
できる。Since the connector contact protrusions 11 are provided on a different substrate surface from the lead-out wiring 12, there is no need to consider the area in which the lead-out wiring 12 is routed, and the spacing between them can be independently made high-density. can. Further, the lead-out wiring 12 is provided on a different board surface from the connector contact protrusion 1■,
Moreover, since the film thickness is thin, it can be constructed with high density.
第3図は、前記本実施例のコネクタ接点を有するプリン
ト配線基板10と他のプリント配線基板16の接点(パ
ッド)を接触させてコネクタを形成する状態の構成を示
す断面展開図である。FIG. 3 is a cross-sectional developed view showing a configuration in which the printed wiring board 10 having the connector contacts of the present embodiment is brought into contact with the contacts (pads) of another printed wiring board 16 to form a connector.
第3図において、16は前記コネクタ接点突起部11の
コネクタ接点層14と電気的に接続する相手側のプリン
ト配線基板である。このプリント配線基板16の一面に
は、複数の引出用配線17に接続された接点(パッド)
が設けられており、その接点表面には、接点層18が設
けられている。In FIG. 3, reference numeral 16 denotes a mating printed wiring board electrically connected to the connector contact layer 14 of the connector contact protrusion 11. As shown in FIG. One surface of this printed wiring board 16 has contacts (pads) connected to a plurality of lead-out wirings 17.
is provided, and a contact layer 18 is provided on the contact surface thereof.
そして、本実施例のコネクタは、プリント配線基板10
のコネクタ接点層14とプリント配線基板16の接点層
18とを接触させた状態で、プリント配線基板10側に
圧縮弾性を有する加圧部材19を重ね合せた後に、剛性
を有する押え部材20によってプリント配線基板10と
16を固定し、前記プリント配線基板10上の各引出用
配線12とプリント配線基板16上の各配線17とを電
気的に接続する構造になっている。加圧部材19は、例
えば、ゴム材、スポンジ等の絶縁性材料又は配線12と
接触する部分に絶縁性を設けた導電性材料で構成する。The connector of this embodiment has a printed wiring board 10.
With the connector contact layer 14 of the printed wiring board 16 in contact with the contact layer 18 of the printed wiring board 16, a pressure member 19 having compressive elasticity is placed on the printed wiring board 10 side, and then printing is performed using a rigid presser member 20. The structure is such that the wiring boards 10 and 16 are fixed, and each lead-out wiring 12 on the printed wiring board 10 and each wiring 17 on the printed wiring board 16 are electrically connected. The pressure member 19 is made of, for example, an insulating material such as a rubber material or sponge, or a conductive material whose portion that contacts the wiring 12 is provided with an insulating property.
この時、前記各プリント配線基板10のコネクタ接点部
材11は、基板のフレキシブル性と加圧部材19の圧縮
弾性により、わずかの形状9寸法のばらつきを独立的に
吸収し、相手側の接点層18と確実な電気的接触がなさ
れるので、電気的信頼性を向上することができる。At this time, the connector contact member 11 of each printed wiring board 10 independently absorbs slight variations in shape 9 dimensions due to the flexibility of the board and the compressive elasticity of the pressure member 19, and Since reliable electrical contact can be made with the terminal, electrical reliability can be improved.
また、コネクタ接点を有するプリント配線基板10及び
コネクタは、プリント配線基板16との接続保持に必要
な弾力性を、信号を伝送する導体材料ではなく、基板側
又は外周器に設けたので、最端距離に近い経路によって
プリント配線基板16等の電気的接続を行うことができ
、高周波特性を向上することができる。In addition, the printed wiring board 10 and the connector having the connector contacts are provided with the elasticity necessary to maintain the connection with the printed wiring board 16 not in the conductive material that transmits the signal, but in the board side or the outer circumference. The printed wiring board 16 and the like can be electrically connected through a short route, and high frequency characteristics can be improved.
また、前記本実施例のようなコネクタ接点を有するプリ
ント配線基板及びコネクタ構造は、プリント配線の一連
の製造技術で構成することができるので、量産化及び低
コスト化を図ることができる。Further, since the printed wiring board and connector structure having the connector contacts as in this embodiment can be constructed using a series of printed wiring manufacturing techniques, mass production and cost reduction can be achieved.
以上、本発明を実施例にもとすき具体的に説明したが、
本発明は、前記実施例に限定されるものではなく、その
要旨を逸脱しない範囲において種々変更可能であること
は言うまでもない。The present invention has been specifically explained above using examples, but
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.
以上、発明したように、本発明によれば、以下に述べる
ような効果を得ることができる。As described above, according to the present invention, the following effects can be obtained.
(1)フレキシブルで絶縁性を有する基板の一方の面上
に厚い膜厚の導電性薄膜で構成したコネクタ接点用突起
部を設け、その他方の面上に薄い膜厚の導電性薄膜で構
成した引出し用配線を設け、前記コネクタ接点用突起部
と引出し用配線とを基板に形成したスルーホールを通し
て電気的に接続するスルーホール配線を設けたことによ
り、多数のコネクタ接点用突起部を、引出用配線と別の
面に設けたので、コネクタ接点用突起部を高密度に形成
することができる。(1) A connector contact protrusion made of a thick conductive thin film is provided on one side of a flexible and insulating substrate, and a thin conductive thin film is made on the other side. By providing lead-out wiring and through-hole wiring that electrically connects the connector contact projections and the lead-out wiring through through holes formed on the board, a large number of connector contact projections can be connected to the lead-out wiring. Since they are provided on a different surface from the wiring, the connector contact protrusions can be formed with high density.
(2)前記(1)の構成に、圧縮弾性を有する加圧部材
と押え部材とを設け、別々のプリント配線基板の接点を
接触させた状態で両者を固定する構成を加えることによ
り、接点部材の形状のばらつき等の影響を受けず、接点
毎に確実な接触がはかれるので、コネクタの電気的信頼
性を向上することができる。(2) By adding a configuration to the configuration of (1) above, which includes a pressure member having compressive elasticity and a pressing member, and fixing the contact points of separate printed wiring boards in a state where they are in contact with each other, the contact member Since reliable contact can be made for each contact without being affected by variations in the shape of the connector, the electrical reliability of the connector can be improved.
(3)前記(2)により、高周波特性がすくれたコネク
タを得ることができる。(3) According to (2) above, a connector with low high frequency characteristics can be obtained.
第1図は、本発明の一実施例であるコネクタ接点を有す
る配線基板の構成を示す斜視図、第2図は、第1図のA
−A切断線で切った断面図、
第3図は、前記第1図に示すプリント配線基板と他のプ
リント配線基板とを接触させてコネクタを形成した状態
の構成を示す断面展開図、第4図及び第5図は、従来の
コネクタ接点の問題点を説明するための図である。
図中、10・・・プリント配線基板、11・・・コネク
タ接点用突起部材、12.17・・・引出用配線、13
・・・スルーホール、14・・・コネクタ接点層、15
・・・スルーホール配線、16・・・他のプリント配線
基板、18・・・接点層、19・・・加圧部材、20・
・・押え部材である。FIG. 1 is a perspective view showing the configuration of a wiring board having connector contacts according to an embodiment of the present invention, and FIG. 2 is an A of FIG.
3 is a sectional view taken along cutting line A; FIG. 3 is a developed sectional view showing the configuration of a connector formed by bringing the printed wiring board shown in FIG. 1 into contact with another printed wiring board; 5 and 5 are diagrams for explaining problems with conventional connector contacts. In the figure, 10...Printed wiring board, 11...Protruding member for connector contact, 12.17... Wiring for extraction, 13
... Through hole, 14 ... Connector contact layer, 15
... Through-hole wiring, 16... Other printed wiring board, 18... Contact layer, 19... Pressure member, 20...
...It is a holding member.
Claims (4)
に厚い膜厚の導電性薄膜で構成したコネクタ接点用突起
部を設け、その他方の面上に薄い膜厚の導電性薄膜で構
成した引出し用配線を設け、前記コネクタ接点用突起部
と引出し用配線とを基板に形成したスルーホールを通し
て電気的に接続するスルーホール配線を設けたことを特
徴とする配線基板。(1) A connector contact protrusion made of a thick conductive thin film is provided on one side of a flexible and insulating substrate, and a thin conductive thin film is made on the other side. 1. A wiring board comprising a lead-out wiring and a through-hole wiring for electrically connecting the connector contact protrusion and the lead-out wiring through a through-hole formed in the board.
コネクタ接点用突起部を有することを特徴とする特許請
求の範囲第1項記載の配線基板。(2) The wiring board according to claim 1, wherein the wiring board has a large number of lead-out wirings and connector contact protrusions.
表面に形成されたメッキ層であることを特徴とする特許
請求の範囲第1項又は第2項に記載の配線基板。(3) The wiring board according to claim 1 or 2, wherein the through-hole wiring is a plating layer formed on the surface of the board inside the through-hole.
に厚い膜厚の導電性薄膜で構成したコネクタ接点用突起
部を設け、その他方の面上に薄い膜厚の導電性薄膜で構
成した引出し用配線を設け、前記コネクタ接点用突起部
と引出し用配線とを基板に形成したスルーホールを通し
て電気的に接続するスルーホール配線を設けた第1の配
線基板を備え、該第1の配線基板のコネクタ接点用突起
部と他の第2の配線基板の引出し用配線に接続された接
点とを接触させた状態で、第1の配線基板側に圧縮弾性
を有する加圧部材を介在させて第1及び第2配線基板を
固定する押え部材を設けたことを特徴とする配線基板の
実装用コネクタ。(4) A connector contact protrusion made of a thick conductive thin film is provided on one side of a flexible and insulating substrate, and a thin conductive thin film is made on the other side. A first wiring board provided with a lead-out wiring and a through-hole wiring for electrically connecting the connector contact protrusion and the lead-out wiring through a through hole formed in the board, the first wiring board With the connector contact protrusion of and the contact connected to the lead-out wiring of the other second wiring board in contact with each other, a pressure member having compressive elasticity is interposed on the first wiring board side. A connector for mounting a wiring board, characterized in that a holding member is provided for fixing the first and second wiring boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3343486A JPS62190791A (en) | 1986-02-17 | 1986-02-17 | Wiring board and connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3343486A JPS62190791A (en) | 1986-02-17 | 1986-02-17 | Wiring board and connector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62190791A true JPS62190791A (en) | 1987-08-20 |
Family
ID=12386429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3343486A Pending JPS62190791A (en) | 1986-02-17 | 1986-02-17 | Wiring board and connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62190791A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120632A (en) * | 1992-10-02 | 1994-04-28 | Sumitomo Electric Ind Ltd | Flexible wiring board for narrow pitch connectors |
JPH07202373A (en) * | 1993-12-28 | 1995-08-04 | Kel Corp | Stacked cable connector |
-
1986
- 1986-02-17 JP JP3343486A patent/JPS62190791A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120632A (en) * | 1992-10-02 | 1994-04-28 | Sumitomo Electric Ind Ltd | Flexible wiring board for narrow pitch connectors |
JPH07202373A (en) * | 1993-12-28 | 1995-08-04 | Kel Corp | Stacked cable connector |
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