JPH06188629A - Microstrip antenna - Google Patents

Abstract

PURPOSE:To make a microstrip antenna compact, to simplify the manufacture and to reduce the cost. CONSTITUTION:A center region of a ground plate 3 on the rear side of a dielectric plate is used for a region 3a on which no conductor film 31 is formed and a coaxial connector 4 of surface mount type is provided to the region 3a. A package 5 is provided to the conductor film 31 through soldering, an amplifier circuit is contained in the package, an output lead 52 is connected to the coaxial connector 4 and an input lead 51 is connected to a conductor film of a pattern plate on the front side via a throughhole penetrated through the dielectric plate. A separate printed circuit board to provide the coaxial connector 4 and the package 5 is not required, the assembly man-hour is saved and the thickness of the entire antenna is made thin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact microstrip antenna which can be used for satellite communication.

[0002]

2. Description of the Related Art A compact antenna for receiving microwave radio waves of a GPS (Global Positioning System) satellite is required for a navigation system mounted on a vehicle, and a microstrip antenna (MSA) is used instead of a conventional parabolic antenna. Attention has been paid.

The MSA is one in which a conductor is formed in a predetermined pattern on one surface of a dielectric plate to form a radiating conductor pattern, and on the other surface, a conductor film is formed on the entire surface to form a ground pattern. Therefore, compactness is realized.

[0004]

By the way, when it is mounted on a vehicle, further downsizing is required.
In addition to the MSA, it is necessary to provide a low noise amplifier (LNA) that amplifies weak radio waves from the satellite and a coaxial connector for connecting to the receiver in the antenna section. Then, this printed board is attached to an aluminum plate by screwing or the like, or is housed in a shield case and attached to the MSA.

However, in such a structure, there is a problem that the assembly of the printed circuit board is troublesome and the thickness of the antenna is not sufficiently thin.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a microstrip antenna which is compact, easy to manufacture and low in cost.

[0007]

To explain the structure of the present invention, a conductor film 21 is formed on one surface of a dielectric plate 1 in a predetermined pattern to form a radiating conductor pattern 2, and the other surface of the dielectric plate 1 is formed. In the microstrip antenna in which the conductor film 31 is formed on the entire surface to form the ground pattern 3,
The central region of the ground pattern 3 is formed as a region 3a where the conductor film 31 is not formed, the surface-mounting type coaxial connector 4 is provided there, and the conductor pattern 31 constituting the ground pattern 3 is fixed by soldering. The package 5 is provided to accommodate the amplifier circuit in the package 5, the output terminal 52 of the amplifier circuit is connected to the coaxial connector 4, and the input terminal 51 of the amplifier circuit is penetrated through the dielectric plate 1. The radiation conductor pattern 2 is connected to the conductor film 21.

[0008]

In the above structure, the coaxial connector 4 is provided in the conductor film non-forming region 3a of the ground pattern 3, and the package 5 accommodating the amplifier circuit is directly connected to the conductor film 31.
Since it is soldered and fixed to the antenna, a separate printed circuit board is not required, and the number of assembling steps is reduced and the thickness of the entire antenna is reduced.

At this time, the antenna performance is hardly affected by securing the conductor film non-forming region 3a at the center of the ground pattern 3 and fixing the package 5 directly to the conductor film 31 of the ground pattern 3.

[0010]

FIG. 1 shows a microstrip antenna (MS
In the rear perspective view of A), a conductor film 31 is formed on the entire back surface of a square dielectric plate to form a ground pattern 3. Near the center of the ground pattern 3, a surface mounting type (SOP) type is used. An IC package 5 is provided.

The details will be described with reference to FIG. 2. The conductor film 31 of the ground pattern 3 is a central portion, and a rectangular region similar to the dielectric plate 1 is removed by etching or the like to become a conductor film non-formed region 3a. A surface-mounting type coaxial connector 4 having a small-diameter rectangle is fixed to the area 3a.

In this embodiment, one side of the ground pattern 3 has a length of 68 mm, and the conductor film non-forming region 3a is formed.
It's 4mm. The area of the non-formed region 3a is preferably 1% or less of the area of the ground pattern 3.

The package 5 is a low noise amplifier circuit (LN
A) is built in, and the ground lead 53 excluding the input / output leads 51 and 52 protruding from both side surfaces is directly fixed to the conductor film 31 by reflow soldering (FIG. 3). A through hole 11 penetrating the dielectric plate 1 is formed near the input lead 51 of the package 5, and a conductive film 31 having a predetermined width is provided between the input lead 51 and the through hole 11.
Are removed, and the wiring conductor film 61 extends there. The wiring conductor film 61 passes through the through hole 11 and then passes through the dielectric plate 1.
Conductive to the radiation conductor pattern 2 formed on the surface side of
This is connected to the input lead 51. The radiating conductor pattern 2 is formed by forming a conductor film 21 in a predetermined pattern (for example, a radial pattern) so as to form an antenna.

Also, the conductor film 31 is removed with a predetermined width between the output lead 52 of the package 5 and the non-formation region 3a, where the output lead 52 and the coaxial connector 4 are formed.
The wiring conductor film 62 for connecting the wires extends.

In the MSA having the above structure, the received radio wave is input from the input lead 51 to the LNA in the package 5, and is output to the coaxial connector 4 via the output lead 52.

The reception performance in this case is shown in FIG. 4, where the voltage standing wave ratio (VSWR) is the reception target frequency (point A in the figure,
The minimum value is shown at 1575 MHz). Comparing this with the MSA of the conventional structure (FIG. 5), it is known that its reception performance is almost comparable.

In the MSA of the present invention, since the coaxial connector 4 and the package 5 are both provided directly on the dielectric plate 1 of the antenna, compared with the conventional case where a separate printed board is assembled, The thickness of the antenna can be reduced, and the manufacturing labor and cost can be reduced.

In this embodiment, the conductor film non-formation region 3 is formed.
Although the shape of a is quadrangular, it may be circular, polygonal, or the like.

Further, a metal pin for power supply can be used instead of the through hole.

The package is SO because it can be automatically soldered.
P or the like is advantageous, but is not limited to this as long as surface mounting is possible.

[0021]

As described above, the microstrip antenna of the present invention is compact and easy to manufacture, and can be suitably used as an on-vehicle antenna.

[Brief description of drawings]

FIG. 1 is a rear perspective view of an antenna showing an embodiment of the present invention.

FIG. 2 is a plan view of an antenna.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a graph showing reception performance of an antenna.

FIG. 5 is a graph showing reception performance of a conventional antenna.

[Explanation of symbols]

 1 Dielectric Plate 2 Radiation Conductor Pattern 21 Conductor Film 3 Ground Pattern 31 Conductor Film 4 Coaxial Connector 5 Package 51 Input Lead (Input Terminal) 52 Output Lead (Output Terminal)

Claims (1)

[Claims] 1. A microstructure in which a conductor film is formed on one surface of a dielectric plate in a predetermined pattern to form a radiating conductor pattern, and a conductor film is formed on the entire other surface of the dielectric plate to form a ground pattern. In the strip antenna, a central region of the ground pattern is formed as a region in which a conductor film is not formed, a surface mount type coaxial connector is provided therein, and a package fixed by soldering to the conductor film forming the ground pattern is provided. The amplifier circuit is provided in the package, the output terminal of the amplifier circuit is connected to the coaxial connector, and the input terminal of the amplifier circuit is connected to the conductor film of the radiation conductor pattern by penetrating the dielectric plate. A microstrip antenna characterized in that.