JPH06152237A - Patch antenna device - Google Patents
Patch antenna deviceInfo
- Publication number
- JPH06152237A JPH06152237A JP31415792A JP31415792A JPH06152237A JP H06152237 A JPH06152237 A JP H06152237A JP 31415792 A JP31415792 A JP 31415792A JP 31415792 A JP31415792 A JP 31415792A JP H06152237 A JPH06152237 A JP H06152237A
- Authority
- JP
- Japan
- Prior art keywords
- patch antenna
- pattern
- antenna
- circuit pattern
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
(57)【要約】 （修正有）
【目的】 パッチアンテナに低雑音増幅器を接続したパ
ッチアンテナ装置の組立を容易にする。
【構成】 地導体５と地導体５の上面に第１の誘電体基
板１３を介して形成されたアンテナパタ−ン４とからな
るパッチアンテナと，地導体の下面に第２の誘電体基板
１４を介して形成された回路パタ−ンと，この回路パタ
−ン１５とアンテナパタ−ンとを電気的に接続する手段
と，回路パタ−ン１５に給電する同軸ケ−ブルと，回路
パタ−ン１５にそれぞれ実装される回路部品１７，１
８，１９とにより構成すること。
【効果】 構造が簡単であるとともに，組立工程数が少
なくなり，コストもやすくなる。またＳ／Ｎ比を向上で
きる。
(57) [Summary] (Modified) [Purpose] To facilitate the assembly of a patch antenna device in which a low noise amplifier is connected to the patch antenna. [Structure] A patch antenna including a ground conductor 5 and an antenna pattern 4 formed on an upper surface of the ground conductor 5 via a first dielectric substrate 13, and a second dielectric substrate 14 on a lower surface of the ground conductor. Circuit pattern formed through the circuit pattern, means for electrically connecting the circuit pattern 15 and the antenna pattern, a coaxial cable for supplying power to the circuit pattern 15, and a circuit pattern. Circuit components 17, 1 respectively mounted on the
Consists of 8 and 19. [Effect] The structure is simple, the number of assembling steps is small, and the cost is easy. Moreover, the S / N ratio can be improved.
Description
【０００１】[0001]
【産業上の利用分野】この発明は，人工衛星からの電波
を受信するアンテナ装置等，通信システムに使われるパ
ッチアンテナ装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a patch antenna device used in a communication system such as an antenna device for receiving radio waves from artificial satellites.
【０００２】[0002]
【従来の技術】近年，人工衛星を使用した衛星通信シス
テムが発展し，これを使用した移動体通信システムの開
発が活発に行われている。その内，特に，船舶や自動車
等の位置測定，表示を行うＧＰＳ（ｇｌｏｖａｌ ｐｏ
ｓｉｔｉｏｎｉｎｇ ｓｙｓｔｅｍ）が発達している。2. Description of the Related Art In recent years, satellite communication systems using artificial satellites have been developed, and mobile communication systems using them have been actively developed. Among them, in particular, GPS (global poo) that measures and displays the position of ships and automobiles.
The sitting system is well developed.
【０００３】これ等のシステムを利用する自動車等の産
業分野においては，人工衛星からの電波を受信するアン
テナとしては，図３〜図５に示すように，放射素子を構
成するアンテナパタ−ンが矩形状のものや，図８に示す
ように，円形状の小型のパッチアンテナ１が使用されて
いる。このパッチアンテナ１は，図３〜図５，図８に示
すように，テフロン（登録商標）樹脂製の誘電体基板３
の両面に銅箔等の導電部材が形成されており，上面側の
銅箔がフォトエッチングされて放射素子を構成するアン
テナパタ−ン４が形成されて，誘電体基板３の裏面は地
導体５となっている。In the industrial field of automobiles and the like utilizing these systems, as an antenna for receiving radio waves from an artificial satellite, an antenna pattern forming a radiating element is used as shown in FIGS. A rectangular patch antenna 1 or a circular small patch antenna 1 is used as shown in FIG. As shown in FIGS. 3 to 5 and 8, the patch antenna 1 includes a dielectric substrate 3 made of Teflon (registered trademark) resin.
A conductive member such as a copper foil is formed on both surfaces of the substrate, the copper foil on the upper surface side is photo-etched to form an antenna pattern 4 constituting a radiating element, and the back surface of the dielectric substrate 3 is a ground conductor 5 Has become.
【０００４】このアンテナパタ−ン４の中心点Ｏから５
０Ωに相当する位置に給電点となる穴６が透設されてお
り，この穴６と地導体５とは互いに絶縁部材で形成され
ている基板３により絶縁されている構造となっている。
給電点用の穴６には，図５に示すように，頭部８ａを備
えた構造のピン８が挿入されるとともに，このピン８の
頭部８ａを半田付けしてアンテナパタ−ン４と電気的に
接続されている。From the center point O of this antenna pattern 4 to 5
A hole 6 serving as a feeding point is transparently provided at a position corresponding to 0Ω, and the hole 6 and the ground conductor 5 are insulated from each other by a substrate 3 formed of an insulating member.
As shown in FIG. 5, a pin 8 having a head portion 8a is inserted into the feeding point hole 6, and the head portion 8a of the pin 8 is soldered to form an antenna pattern 4 and an antenna pattern 4. It is electrically connected.
【０００５】このパッチアンテナ１で受信された電波は
非常に微弱であるため，低雑音の前置増幅器２（以下，
低雑音増幅器２と記す）で増幅する必要がある。そこ
で，図６に示すように，ピン８から同軸ケ−ブル（図示
せず）を介して低雑音増幅器２に接続して，受信電波を
増幅する方法が採用されている。低雑音増幅器２は，回
路基板９に回路パタ−ン（図示せず）が形成されてお
り，この回路パタ−ンの所定部分に回路部品（図示せ
ず）が実装され，周囲はカバ−１０により覆われた構造
となっている。Since the radio wave received by the patch antenna 1 is extremely weak, a low noise preamplifier 2 (hereinafter, referred to as
It is necessary to amplify with a low noise amplifier 2). Therefore, as shown in FIG. 6, a method of connecting the pin 8 to the low noise amplifier 2 via a coaxial cable (not shown) to amplify the received radio wave is adopted. The low noise amplifier 2 has a circuit pattern (not shown) formed on a circuit board 9, and a circuit component (not shown) is mounted on a predetermined portion of the circuit pattern, and the periphery is covered with a cover 10. The structure is covered by.
【０００６】一方，最近では，図７に示すように，パッ
チアンテナ１の裏面に，図６に示す構造の低雑音増幅器
２を直接固定した一体構造のものもある。On the other hand, recently, as shown in FIG. 7, there is an integrated structure in which the low noise amplifier 2 having the structure shown in FIG. 6 is directly fixed to the back surface of the patch antenna 1.
【０００７】[0007]
【発明が解決しようとする問題点】前者の形式のもの
は，パッチアンテナ１から低雑音増幅器２まで同軸ケ−
ブルで接続されているので，この同軸ケ−ブルの長さ
（電気的位相）のずれに伴う不整合および受信電波の減
衰が大であるという問題があった。その上，低雑音増幅
器２も回路基板上に回路パタ−ンを形成し，これに回路
部品を実装する等，特別に作成しなければならず，その
組立工程数も多くなるという問題があった。In the former type, the coaxial cable from the patch antenna 1 to the low noise amplifier 2 is used.
Since they are connected by a cable, there is a problem that the mismatch (corresponding to the shift of the length (electrical phase) of the coaxial cable and the attenuation of the received radio wave are large). In addition, the low noise amplifier 2 also has to be formed specially by forming a circuit pattern on the circuit board and mounting circuit parts on the circuit pattern, which causes a problem that the number of assembling steps increases. .
【０００８】一方，後者の形式のものは，同軸ケ−ブル
を用いていない分，アンテナとの不整合，受信電波の減
衰はないが，前者の形式のものと同様に，低雑音増幅器
２の組立，取付の手間がかかるという問題があった。On the other hand, the latter type has no mismatch with the antenna and no attenuation of received radio waves because the coaxial cable is not used, but like the former type, the low noise amplifier 2 has There was a problem that it took time to assemble and install.
【０００９】[0009]
【問題点を解決するための手段】この発明は，地導体
と，この地導体の上面に第１の誘電体基板を介して形成
されたアンテナパタ−ンとからなるパッチアンテナと，
地導体の下面に第２の誘電体基板を介して形成された回
路パタ−ンと，この回路パタ−ンとアンテナパタ−ンと
を電気的に接続する手段と，回路パタ−ンに給電する同
軸ケ−ブルと，回路パタ−ンにそれぞれ実装される回路
部品とによりパッチアンテナ装置を構成するようにした
ものである。SUMMARY OF THE INVENTION The present invention provides a patch antenna comprising a ground conductor and an antenna pattern formed on the upper surface of the ground conductor via a first dielectric substrate,
A circuit pattern formed on the lower surface of the ground conductor through the second dielectric substrate, a means for electrically connecting the circuit pattern and the antenna pattern, and power feeding to the circuit pattern. The patch antenna device is configured by the coaxial cable and the circuit components mounted on the circuit pattern.
【００１０】[0010]
【作用】パッチアンテナ１と低雑音増幅器２とが，多層
プリント基板にハイブリットに形成されているので，人
工衛星からの電波は，パッチアンテナのアンテナパタ−
ン４で受信され，スル−ホ−ル１６を介して直接低雑音
増幅器２の入力端に入力して増幅され，同軸ケ−ブル２
３から受信部（図示せず）に入力され，受信電波が減衰
することはない。Since the patch antenna 1 and the low-noise amplifier 2 are hybridly formed on the multilayer printed circuit board, the radio waves from the artificial satellite are transmitted to the antenna pattern of the patch antenna.
It is received by the coaxial cable 2 and is directly input to the input end of the low noise amplifier 2 through the through hole 16 to be amplified.
3 is input to a receiving unit (not shown), and the received radio wave is not attenuated.
【００１１】[0011]
【発明の実施例１】この発明の第１の実施例を，図１に
基づいて詳細に説明する。なお，従来例と同一名称のも
のは，同一符号を用いその説明を省略する。図１は，１
点給電形のパッチアンテナ装置１１を示すもので，多層
セラミック基板（又は，多層プリント基板）１２は第１
の誘電体基板１３と第２の誘電体基板１４とにより構成
されており，第１の誘電体基板１３の上面には，フォト
エッチングによりアンテナパタ−ン４が銅箔等の導電体
部材で形成されており，下面には地導体５が形成されて
パッチアンテナ１が構成されている。パッチアンテナ１
の形状は，従来例の図３〜図５に示すように，矩形状で
あってもよくあるいは，図８に示すように，円形状であ
っても良い。Embodiment 1 of the present invention will be described in detail with reference to FIG. In addition, the same reference numerals are used for the same names as the conventional example, and the description thereof is omitted. Figure 1
1 shows a point-feed type patch antenna device 11, in which a multilayer ceramic substrate (or a multilayer printed circuit board) 12 is a first
Of the dielectric substrate 13 and the second dielectric substrate 14, and the antenna pattern 4 is formed on the upper surface of the first dielectric substrate 13 by photo-etching with a conductor member such as copper foil. The ground conductor 5 is formed on the lower surface of the patch antenna 1. Patch antenna 1
The shape may be rectangular as shown in FIGS. 3 to 5 of the conventional example, or may be circular as shown in FIG.
【００１２】この円形状のパッチアンテナ１の場合に
は，円の直径で共振周波数ｆL ，ｆHが決まり，図３〜
図５に示す矩形状のパッチアンテナ１の場合には，対角
線の長さにより共振周波数ｆL ，ｆH が決定される。こ
の共振周波数ｆL ，ｆH に基づいて，図９に示すよう
に，使用周波数ｆ0 が決定される。円形状のパッチアン
テナ１の場合には，第１の誘電体基板１３の厚さｈ，比
誘電率εr ，使用周波数ｆ0 ，光速Ｃ，パッチアンテナ
の半径ａとすると，一般に，ａ＝（１．８Ｃ／２πｆ0
√εr ）−（１．３９ｈ／π）で表され，この式から第
１の誘電体基板１３の厚さｈが決定される。矩形状のパ
ッチアンテナ１の場合も同様にして第１の誘電体基板１
３の厚さｈが決定される。In the case of this circular patch antenna 1, the resonance frequencies f L and f H are determined by the diameter of the circle.
In the case of the rectangular patch antenna 1 shown in FIG. 5, the resonance frequencies f L and f H are determined by the length of the diagonal line. Based on the resonance frequencies f L and f H , the use frequency f 0 is determined as shown in FIG. In the case of the circular patch antenna 1, assuming that the thickness h of the first dielectric substrate 13, the relative permittivity ε r , the operating frequency f 0 , the speed of light C, and the radius a of the patch antenna, a = ( 1.8C / 2πf 0
√ε r )-(1.39h / π), and the thickness h of the first dielectric substrate 13 is determined from this equation. Similarly, in the case of the rectangular patch antenna 1, the first dielectric substrate 1
A thickness h of 3 is determined.
【００１３】このパッチアンテナの地導体５の下面に
は，第２の誘電体基板１４を介して低雑音増幅器２の回
路パタ−ン１５が形成されている。１６は給電点となる
スル−ホ−ルで，アンテナパタ−ン４の中心点から５０
Ωに対応する位置に開設されており，アンテナパタ−ン
４と低雑音増幅器２の入力端に対応する回路パタ−ン１
５部分とが電気的に接続されている。なお，このスル−
ホ−ル１６の位置，直径，長さは基本的にはアンテナの
特性で決定される。但し，スル−ホ−ル１６の長さは，
抵抗成分とインダクタンス成分とがあるので，第２の誘
電体基板１４の厚みを薄くした方がそれだけ受信電波の
減衰が少なくなるから，第２の誘電体基板１４は可能な
限り薄く形成される。この際，多層プリント配線板１２
の強度は第１の誘電体基板１３で補強されている。On the lower surface of the ground conductor 5 of this patch antenna, a circuit pattern 15 of the low noise amplifier 2 is formed via a second dielectric substrate 14. Reference numeral 16 is a through hole serving as a feeding point, which is 50 from the center point of the antenna pattern 4.
The circuit pattern 1 is provided at the position corresponding to Ω and corresponds to the input ends of the antenna pattern 4 and the low noise amplifier 2.
The five parts are electrically connected. In addition, this
The position, diameter and length of the hole 16 are basically determined by the characteristics of the antenna. However, the length of the through-hole 16 is
Since the second dielectric substrate 14 has a resistance component and an inductance component, the thinner the thickness of the second dielectric substrate 14 is, the less the attenuation of received radio waves is. Therefore, the second dielectric substrate 14 is formed as thin as possible. At this time, the multilayer printed wiring board 12
Is reinforced by the first dielectric substrate 13.
【００１４】１７は低雑音増幅器２を構成する回路部品
のＦＥＴ，１８はキャパシタ，１９は抵抗器で，それぞ
れ回路パタ−ン１５の所定箇所にそれぞれ実装されてい
る。２０は低雑音増幅器２の部分を覆うカバ−で，銅，
鉄・ニッケル・コバルト合金（コバ−ル）等で形成され
ており，回路パタ−ン１５のア−スパタ−ン２１に半田
２２により半田付けされている。２３は同軸ケ−ブル
で，低雑音増幅器２の出力端に接続されている。２４は
同軸ケ−ブルのコネクタである。Reference numeral 17 is a FET which is a circuit component of the low noise amplifier 2, 18 is a capacitor, and 19 is a resistor, which are mounted at predetermined positions of the circuit pattern 15, respectively. Reference numeral 20 is a cover for covering the low noise amplifier 2, which is made of copper,
It is formed of iron / nickel / cobalt alloy (cobalt) or the like, and is soldered to the aspert pattern 21 of the circuit pattern 15 with solder 22. A coaxial cable 23 is connected to the output terminal of the low noise amplifier 2. Reference numeral 24 is a coaxial cable connector.
【００１５】このように構成されているので，人工衛星
からの電波は，パッチアンテナ１のアンテナパタ−ン４
で受信され，スル−ホ−ル１６を介して直接低雑音増幅
器２の入力端に入力して増幅され，同軸ケ−ブル２３か
ら受信部（図示せず）に入力される。この際，外部から
の不要電波は，カバ−２０により阻止される。又，スル
−ホ−ル１６の長さは，第２の誘電体基板１４が可能な
限り薄く形成されているので，受信電波の減衰はほとん
ど無視することができる。With this configuration, the radio waves from the artificial satellite are transmitted by the antenna pattern 4 of the patch antenna 1.
Is received by the input terminal of the low noise amplifier 2 via the through hole 16, is amplified, and is input from the coaxial cable 23 to a receiver (not shown). At this time, unnecessary radio waves from the outside are blocked by the cover 20. Further, since the length of the through-hole 16 is as thin as possible in the second dielectric substrate 14, the attenuation of the received radio wave can be almost ignored.
【００１６】[0016]
【発明の実施例２】図２は，この発明の第２の実施例
で，電磁結合形のパッチアンテナ装置３１を示すもの
で，パッチアンテナ１は，第１のアンテナパタ−ン４の
上面に第３の誘電体基板３２を介して第２のアンテナパ
タ−ン３３が形成された構造となっており，他の部分
は，上記実施例と同様である。Second Embodiment FIG. 2 shows a second embodiment of the present invention, which shows an electromagnetically coupled patch antenna device 31, in which the patch antenna 1 is provided on the upper surface of the first antenna pattern 4. The structure is such that the second antenna pattern 33 is formed via the third dielectric substrate 32, and the other parts are the same as in the above embodiment.
【００１７】このように構成されているので，人工衛星
からの電波は，第２のアンテナパタ−ン３３に誘導さ
れ，誘電体基板３２を介して第１のアンテナパタ−ン４
に誘導され，上記実施例と同様に，スル−ホ−ル１６を
介して直接低雑音増幅器２の入力端に入力して増幅さ
れ，同軸ケ−ブル２３を介して受信部に入力する。With this structure, the radio waves from the artificial satellite are guided to the second antenna pattern 33, and the first antenna pattern 4 is passed through the dielectric substrate 32.
In the same manner as in the above embodiment, the signal is directly input to the input end of the low noise amplifier 2 through the through hole 16 and amplified, and then input to the receiving portion through the coaxial cable 23.
【００１８】[0018]
【発明の効果】この発明は，地導体と，この地導体の上
面に第１の誘電体基板を介して形成されたアンテナパタ
−ンとからなるパッチアンテナと，地導体の下面に第２
の誘電体基板を介して形成された回路パタ−ンと，この
回路パタ−ンとアンテナパタ−ンとを電気的に接続する
手段と，回路パタ−ンに給電する同軸ケ−ブルと，回路
パタ−ンにそれぞれ実装される回路部品とにより構成さ
れているので，構造が簡単であるとともに，組立工程数
が少なくなり，コストも安くなる。その上，低雑音増幅
器等の前置増幅器部分のみならず受信部分全体をもハイ
ブリット構造でパッチアンテナと同一の誘電体基板に組
み込むことが出来るので，小型の受信機としての利用分
野が大幅に拡大される。又，スル−ホ−ルによりアンテ
ナパタ−ンと回路パタ−ンとが接続されているので，直
径と長さの比を適当に選択することによりＳ／Ｎ比を向
上させることができる。According to the present invention, a patch antenna including a ground conductor and an antenna pattern formed on the upper surface of the ground conductor via a first dielectric substrate and a second lower surface of the ground conductor are provided.
Circuit pattern formed through the dielectric substrate, means for electrically connecting the circuit pattern and the antenna pattern, a coaxial cable for feeding the circuit pattern, and a circuit. Since it is composed of circuit components mounted on each pattern, the structure is simple, the number of assembling steps is small, and the cost is low. In addition, not only the preamplifier part such as a low noise amplifier but also the entire receiving part can be incorporated in the same dielectric substrate as the patch antenna with a hybrid structure, so the field of application as a small receiver is greatly expanded. To be done. Further, since the antenna pattern and the circuit pattern are connected by the through hole, the S / N ratio can be improved by appropriately selecting the diameter-length ratio.
【図１】この発明の第１の実施例を示す要部断面図であ
る。FIG. 1 is a cross-sectional view of essential parts showing a first embodiment of the present invention.
【図２】この発明の第２の実施例を示す要部断面図であ
る。FIG. 2 is a cross-sectional view of essential parts showing a second embodiment of the present invention.
【図３】従来のパッチアンテナの平面図である。FIG. 3 is a plan view of a conventional patch antenna.
【図４】図３に示すパッチアンテナの裏面図である。FIG. 4 is a rear view of the patch antenna shown in FIG.
【図５】図３に示すパッチアンテナの要部断面図であ
る。5 is a cross-sectional view of a main part of the patch antenna shown in FIG.
【図６】従来例を示す展開斜視図である。FIG. 6 is a developed perspective view showing a conventional example.
【図７】従来例を示す斜視図である。FIG. 7 is a perspective view showing a conventional example.
【図８】従来のパッチアンテナの平面図である。FIG. 8 is a plan view of a conventional patch antenna.
【図９】パッチアンテナのインピ−ダンス特性図であ
る。FIG. 9 is an impedance characteristic diagram of the patch antenna.
１ パッチアンテナ ２ 低雑音増幅器 ４ アンテナパタ−ン ５ 地導体 １１ パッチアンテナ装置 １３ 第１の誘電体基板 １４ 第２の誘電体基板 １５ 回路パタ−ン １６ スル−ホ−ル ３１ パッチアンテナ装置 1 Patch Antenna 2 Low Noise Amplifier 4 Antenna Pattern 5 Ground Conductor 11 Patch Antenna Device 13 First Dielectric Substrate 14 Second Dielectric Substrate 15 Circuit Pattern 16 Through Hole 31 Patch Antenna Device
Claims (6)
電体基板を介して形成された放射素子となるアンテナパ
タ−ンとからなるパッチアンテナと，前記地導体の下面
に第２の誘電体基板を介して形成された回路パタ−ン
と，この回路パタ−ンと前記アンテナパタ−ンとを電気
的に接続する手段と，前記回路パタ−ンに給電する同軸
ケ−ブルと，前記回路パタ−ンにそれぞれ実装される回
路部品とを備えたことを特徴とするパッチアンテナ装
置。1. A patch antenna comprising a ground conductor and an antenna pattern formed on the upper surface of this ground conductor via a first dielectric substrate, and a patch antenna, and a second lower surface of the ground conductor. Circuit pattern formed via the dielectric substrate, means for electrically connecting the circuit pattern and the antenna pattern, and a coaxial cable for supplying power to the circuit pattern. , A patch antenna device comprising circuit components respectively mounted on the circuit patterns.
ンとをスル−ホ−ルで電気的に接続したことを特徴とす
る請求項１に記載のパッチアンテナ装置。2. The antenna pattern and the circuit pattern
The patch antenna device according to claim 1, wherein the patch antenna device and the antenna are electrically connected by a through hole.
電体基板を介して第２のアンテナパタ−ンを形成したこ
とを特徴とする請求項１および請求項２にそれぞれ記載
のパッチアンテナ装置。3. The patch antenna according to claim 1, wherein a second antenna pattern is formed on the upper surface of the antenna pattern via a third dielectric substrate. apparatus.
記回路パタ−ンをハイブリットに形成したことを特徴と
する請求項１から請求項３のいずれかに記載のパッチア
ンテナ装置。4. The patch antenna device according to claim 1, wherein the circuit pattern is hybridly formed on the lower surface of the patch antenna on the conductor side.
部品とにより前置増幅器を構成したことを特徴とする請
求項１から請求項３のいづれかに記載のパッチアンテナ
装置。5. The patch antenna device according to claim 1, wherein a preamplifier is constituted by the circuit pattern and the mounted circuit components.
部品とにより受信部を構成したことを特徴とする請求項
１から請求項４のいづれかに記載のパッチアンテナ装
置。6. The patch antenna device according to claim 1, wherein the circuit pattern and the mounted circuit components constitute a receiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31415792A JPH06152237A (en) | 1992-10-29 | 1992-10-29 | Patch antenna device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31415792A JPH06152237A (en) | 1992-10-29 | 1992-10-29 | Patch antenna device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06152237A true JPH06152237A (en) | 1994-05-31 |
Family
ID=18049929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31415792A Pending JPH06152237A (en) | 1992-10-29 | 1992-10-29 | Patch antenna device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06152237A (en) |
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| WO2002003499A1 (en) * | 2000-06-30 | 2002-01-10 | Sharp Kabushiki Kaisha | Radio communication device with integrated antenna, transmitter, and receiver |
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| JP2002299947A (en) * | 2001-03-30 | 2002-10-11 | Fujitsu Quantum Devices Ltd | High frequency semiconductor device |
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| JP2006309738A (en) * | 2005-03-31 | 2006-11-09 | Semiconductor Energy Lab Co Ltd | Wireless chip and electronic device having wireless chip |
| WO2008031277A1 (en) * | 2006-09-13 | 2008-03-20 | E28 (Shanghai) Limited | Method for eliminating influence of elements nearby mobile telephone antenna on antenna radiant efficiency |
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|---|---|---|---|---|
| US6809688B2 (en) | 2000-06-30 | 2004-10-26 | Sharp Kabushiki Kaisha | Radio communication device with integrated antenna, transmitter, and receiver |
| WO2002003499A1 (en) * | 2000-06-30 | 2002-01-10 | Sharp Kabushiki Kaisha | Radio communication device with integrated antenna, transmitter, and receiver |
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| JP2002171117A (en) * | 2000-12-01 | 2002-06-14 | Dx Antenna Co Ltd | Plane antenna |
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| US7180440B2 (en) | 2001-02-03 | 2007-02-20 | Robert Bosch Gmbh | Integrated circuit for a radar device in a hermetically sealed housing comprising a patch antenna formed from a bent component from sheet metal |
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| US6759987B2 (en) | 2001-02-03 | 2004-07-06 | Robert Bosch Gmbh | Device for the transmission and /or reception of radar beams |
| JP2002299947A (en) * | 2001-03-30 | 2002-10-11 | Fujitsu Quantum Devices Ltd | High frequency semiconductor device |
| US6825809B2 (en) | 2001-03-30 | 2004-11-30 | Fujitsu Quantum Devices Limited | High-frequency semiconductor device |
| US6888503B2 (en) | 2002-08-27 | 2005-05-03 | Alps Electric Co., Ltd. | Antenna unit stable in antenna characteristics and achievable in lengthening of life |
| KR100495209B1 (en) * | 2002-10-01 | 2005-06-14 | 삼성전기주식회사 | A single unit antenna rf module forbluetooth |
| KR100586936B1 (en) * | 2003-06-03 | 2006-06-07 | 삼성전기주식회사 | Active antenna module and manufacturing method using multilayer ceramic sheet |
| JP2006309738A (en) * | 2005-03-31 | 2006-11-09 | Semiconductor Energy Lab Co Ltd | Wireless chip and electronic device having wireless chip |
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| US8742480B2 (en) | 2005-03-31 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and electronic device having wireless chip |
| US9350079B2 (en) | 2005-03-31 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and electronic device having wireless chip |
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