JPH06162829A - Electrically conductive transparent body - Google Patents
Electrically conductive transparent bodyInfo
- Publication number
- JPH06162829A JPH06162829A JP4310197A JP31019792A JPH06162829A JP H06162829 A JPH06162829 A JP H06162829A JP 4310197 A JP4310197 A JP 4310197A JP 31019792 A JP31019792 A JP 31019792A JP H06162829 A JPH06162829 A JP H06162829A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- copper
- hole
- heat
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002344 surface layer Substances 0.000 claims abstract description 26
- 239000012777 electrically insulating material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 16
- 239000004020 conductor Substances 0.000 abstract description 13
- 229910052802 copper Inorganic materials 0.000 abstract description 13
- 239000010949 copper Substances 0.000 abstract description 13
- 238000007747 plating Methods 0.000 abstract description 9
- 238000005476 soldering Methods 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、表示装置などに好適な
導電性透明体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive transparent body suitable for display devices and the like.
【0002】[0002]
【従来の技術】本願出願人は、特開昭63−17421
6号公報に記載のように、電球や発光ダイオードなどの
電気素子を表示手段とした表示装置に好適な導電性透明
体を提案している。この導電性透明体は、透明電気絶縁
材料からなる基体部に複数の導電線を互いに短絡しない
ように埋設させて構成されている。2. Description of the Related Art The applicant of the present invention is disclosed in JP-A-63-17421.
As described in Japanese Patent Publication No. 6, a conductive transparent body suitable for a display device using an electric element such as a light bulb or a light emitting diode as a display means is proposed. This conductive transparent body is formed by embedding a plurality of conductive wires in a base portion made of a transparent electrically insulating material so as not to short-circuit with each other.
【0003】そして、導電性透明体内の導電線と外部導
線とを接続する場合には、まず、導電性透明体に導電線
の端面を露出させた孔を設けて、この孔の内面にメッキ
を施すなどして導電層を形成し、この導電層に外部導線
を半田付けするのがもっとも簡単な方法であった。When connecting the conductive wire inside the conductive transparent body to the external conductive wire, first, a hole is formed in the conductive transparent body such that the end face of the conductive wire is exposed, and the inner surface of this hole is plated. The simplest method was to form a conductive layer by applying it and solder an external conductor to this conductive layer.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の導電性透明体と電気素子の接続構造にあって
は、外部導線を導電層の表面に半田付けする際に、半田
付けの熱が導電性透明体の基体部に伝わるので、基体部
が変形して導電層に亀裂や剥離が生じるなどして導通不
良を起こすことがあった。However, in such a conventional connecting structure of a conductive transparent body and an electric element, when the external conductor wire is soldered to the surface of the conductive layer, the heat of the soldering is generated. Since it is transmitted to the base portion of the conductive transparent body, the base portion may be deformed and cracks or peeling may occur in the conductive layer, resulting in poor conduction.
【0005】そこで本発明は、上記のような問題に着目
し、外部導線を半田付けによって導電線と接続しても導
通不良が起こらない導電性透明体を提供することを目的
としている。In view of the above problems, the present invention has an object to provide a conductive transparent body which does not cause conduction failure even if an external conductive wire is connected to a conductive wire by soldering.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明の導電性透明体は、透明電気絶縁材料からな
る基体部と、該基体部に互いに短絡しないように埋設さ
れた複数の導電線と、前記基体部の表面に接着された耐
熱板と、を備え、前記耐熱板の表面に導電性の表面層が
設けられ、この導電性の表面層に、前記導電線の端面を
露出させた孔が設けられ、この孔の内面に、前記導電性
の表面層に連続した導電性の内面層が設けられている。In order to achieve the above object, the conductive transparent body of the present invention comprises a base portion made of a transparent electrically insulating material and a plurality of base portions embedded in the base portion so as not to short-circuit with each other. A conductive wire and a heat-resistant plate adhered to the surface of the base portion are provided, and a conductive surface layer is provided on the surface of the heat-resistant plate, and the end surface of the conductive wire is exposed on the conductive surface layer. The hole is provided, and a conductive inner surface layer continuous with the conductive surface layer is provided on the inner surface of the hole.
【0007】[0007]
【作用】本発明の導電性透明体では、導電性の表面層に
外部導線を半田付けすると、外部導線は、導電性の表面
層と導電性の内面層を通じて導電線と電気的に接続され
る。このとき、半田付けの熱は、基体部に到達する前に
耐熱板によって吸収されるので、基体部が変形するのを
防止でき、それによって導電性の表面層や導電性の内面
層に剥離や亀裂が生じないようにできる。In the conductive transparent body of the present invention, when the external conductive wire is soldered to the conductive surface layer, the external conductive wire is electrically connected to the conductive wire through the conductive surface layer and the conductive inner surface layer. . At this time, since the heat of soldering is absorbed by the heat-resistant plate before reaching the base portion, it is possible to prevent the base portion from being deformed, thereby peeling off the conductive surface layer or the conductive inner surface layer. It can prevent cracks from occurring.
【0008】[0008]
【実施例】以下、本発明の実施例を図1〜図5に基づい
て詳述する。図1及び図2は、本実施例の導電性透明体
を示す図で、図中10は基体部、11は導電メッシュ、
12は耐熱板である。Embodiments of the present invention will be described below in detail with reference to FIGS. 1 and 2 are views showing a conductive transparent body of the present embodiment, in which 10 is a base portion, 11 is a conductive mesh,
12 is a heat-resistant plate.
【0009】前記基体部10は、無彩色もしくは有彩色
の透明電気絶縁材料(樹脂材料やガラスなど)で形成さ
れた板材を2枚貼り合わせて構成されている。The base portion 10 is formed by laminating two plate members made of an achromatic or chromatic color transparent electrically insulating material (resin material, glass, etc.).
【0010】前記導電メッシュ11は、図3に示すよう
に、複数の導電線13を、電気絶縁線14を組材として
相互に短絡しないように網状に組み込んで構成されてお
り、前記基体部10に埋設されている(2枚の板材間に
挟み込まれている)。なお、導電線13は、直径または
幅が0.1mm 以下の極細素線によって形成されており、上
記素線は、金線、銀線、亜鉛線、ステンレス線などの金
属素線から形成される他、ポリエステル線などの樹脂素
線の表面に金属を蒸着もしくはメッキすることによって
形成されたものが使用されている。また、電気絶縁線1
4も直径または幅が0.1mm 以下の極細素線によって形成
されており、上記素線は、ポリエステル線、ナイロン線
などの樹脂素線によって形成されたものが使用されてい
る。As shown in FIG. 3, the conductive mesh 11 is constructed by incorporating a plurality of conductive wires 13 in a mesh shape so that they do not short-circuit with each other by using the electrically insulating wires 14 as an assembly material. Is embedded in (is sandwiched between two plate materials). The conductive wire 13 is formed of an ultrafine wire having a diameter or width of 0.1 mm or less, and the wire is formed of a metal wire such as a gold wire, a silver wire, a zinc wire, or a stainless wire. , Which is formed by depositing or plating a metal on the surface of a resin element wire such as a polyester wire. In addition, electrical insulation wire 1
4 is also formed of ultrafine wire having a diameter or width of 0.1 mm or less, and the wire used is a resin wire such as polyester wire or nylon wire.
【0011】また、前記耐熱板12は、紙やガラスなど
で形成されており、前記基板部10の縁部表面に接着さ
れている。また、この耐熱板12の表面には銅箔161
と銅メッキ162の2層から成る導電性の表面層16が
一定間隔置きに離間して設けられており、各表面層16
には、前記導電線13の端面を露出させた孔15が貫通
して形成されている。また、この孔15の内面には銅メ
ッキから成る導電性の内面層17が前記導電性の表面層
16に連続して設けられている。The heat-resistant plate 12 is made of paper, glass or the like, and is adhered to the surface of the edge of the substrate 10. Further, a copper foil 161 is formed on the surface of the heat-resistant plate 12.
A conductive surface layer 16 composed of two layers, a copper plating 162 and a copper plating 162, is provided at regular intervals.
A hole 15 exposing the end face of the conductive wire 13 is formed therethrough. A conductive inner surface layer 17 made of copper plating is provided on the inner surface of the hole 15 so as to be continuous with the conductive surface layer 16.
【0012】すなわち、導電性透明体1は、導電メッシ
ュ11を構成する導電線13及び電気絶縁線14として
極細素線を用いているため、全体が無彩色もしくは有彩
色の透明体として見える。なお、隣接する導電線13の
間隔及び隣接する電気絶縁線14の間隔は、見る者の透
明感を考慮して設定する。例えば、直径0.1mm 程度の導
電線13及び電気絶縁線14を用いる場合には、隣接す
る導電線13の間隔及び隣接する電気絶縁線14の間隔
をそれぞれ10mm程度以上に粗く設定するのが好ましく、
直径20μm 程度の導電線13及び電気絶縁線14を用い
る場合には、隣接する導電線13の間隔及び電気絶縁線
14の間隔を 0.5mm程度に密に設定するのが好ましい。That is, since the conductive transparent body 1 uses ultrafine element wires as the conductive wires 13 and the electric insulating wires 14 which form the conductive mesh 11, the whole looks like an achromatic or chromatic transparent body. The distance between the adjacent conductive wires 13 and the distance between the adjacent electrically insulating wires 14 are set in consideration of the transparency of the viewer. For example, when the conductive wire 13 and the electrically insulating wire 14 having a diameter of about 0.1 mm are used, it is preferable that the interval between the adjacent conductive wires 13 and the interval between the adjacent electrically insulating wires 14 are roughly set to about 10 mm or more,
When the conductive wire 13 and the electrically insulating wire 14 having a diameter of about 20 μm are used, it is preferable that the distance between the adjacent conductive wires 13 and the distance between the electrically insulating wires 14 are closely set to about 0.5 mm.
【0013】なお、上記導電性透明体1を製造する最も
簡単な方法としては、図4に示すような方法がある。す
なわち、まず、(i)に示すように、導電メッシュ11
が埋設されている基体部10の表面に、銅張積層板(例
えば、フェノール樹脂またはエポキシ樹脂などの積層板
やガラス板などの絶縁基板上に銅箔が張られたもので、
プリント配線用基板の材料として使用されている)Aを
接着し、次に、(ii)に示すように、前記銅張積層板A
に、導電メッシュ11の導電線13の端面が露出する孔
15を設ける。なお、確実に導電線13の端面が孔15
に露出するようにするためには、孔15の径を導電線1
3のピッチよりも大きくするとよい。そして、(iii) に
示すように、銅張積層板Aの表裏両面と孔15の内面に
銅メッキBを施す。なお、銅メッキBは、化学メッキを
行なった後、電気メッキを行なうのがよい。その後、
(iv)に示すように、エッチングにより銅メッキBと銅
張積層板Aの銅箔を、孔15の内面と銅張積層板Aの孔
15の周縁部を除いて腐食させる。このようにして、上
記導電性透明体1を製造することができる。The simplest method for producing the conductive transparent body 1 is as shown in FIG. That is, first, as shown in (i), the conductive mesh 11
A copper clad laminate (for example, a laminate of a phenol resin or an epoxy resin, an insulating substrate such as a glass plate, etc., on which a copper foil is stretched,
A) which is used as a material for a printed wiring board is adhered, and then, as shown in (ii), the copper clad laminate A
A hole 15 is provided in which the end face of the conductive wire 13 of the conductive mesh 11 is exposed. In addition, the end surface of the conductive wire 13 is surely provided with the hole 15
In order to be exposed to the
It is better to make it larger than the pitch of 3. Then, as shown in (iii), copper plating B is applied to both the front and back surfaces of the copper clad laminate A and the inner surface of the hole 15. The copper plating B is preferably electroplated after chemical plating. afterwards,
As shown in (iv), the copper plating B and the copper foil of the copper-clad laminate A are corroded by etching except for the inner surface of the hole 15 and the peripheral portion of the hole 15 of the copper-clad laminate A. In this way, the conductive transparent body 1 can be manufactured.
【0014】本実施例の導電性透明体1は、上述のよう
に構成されているので、図5に示すように、導電性の表
面層16に外部導線2を半田付けすると、外部導線2
は、導電性の表面層16と導電性の内面層17を通じて
導電線13と電気的に接続される。Since the conductive transparent body 1 of the present embodiment is constructed as described above, when the external conductor 2 is soldered to the conductive surface layer 16 as shown in FIG. 5, the external conductor 2 is soldered.
Are electrically connected to the conductive line 13 through the conductive surface layer 16 and the conductive inner surface layer 17.
【0015】また、表面層16に外部導線2を半田付け
した時の熱は、基体部10に到達する前に耐熱板12に
よって吸収される。従って、半田付けの熱によって基体
部10が変形するのを防止できるので、それによって表
面層16や内面層17に剥離や亀裂が生じないようにで
きる。The heat generated when the external conductor 2 is soldered to the surface layer 16 is absorbed by the heat resistant plate 12 before reaching the base portion 10. Therefore, since it is possible to prevent the base portion 10 from being deformed by the heat of soldering, it is possible to prevent the surface layer 16 and the inner surface layer 17 from peeling or cracking.
【0016】つまり、本実施例の導電性透明体1にあっ
ては、導通不良が起こらないように外部導線2を半田付
けによって導電線13に接続させることができるので、
接続作業が簡単かつ効率よく行なえる。That is, in the conductive transparent body 1 of the present embodiment, the external conductive wire 2 can be connected to the conductive wire 13 by soldering so that conduction failure does not occur.
Connection work can be done easily and efficiently.
【0017】以上、本発明の実施例を図面により詳述し
てきたが、具体的な構成はこの実施例に限られるもので
はなく、本発明の要旨を逸脱しない範囲における設計の
変更等があっても本発明に含まれる。例えば、実施例で
は、導電線の端面を露出させる孔が基体部を貫通して形
成されている例を示したが、この孔は、導電線の端面が
露出する深さであれば、基体部を貫通している必要はな
い。また、孔の径は、複数の導電線の端面が露出する大
きさであってもよいし、一本の導電線の端面が露出する
大きさであってもよいが、外部導線に流す電流の必要量
に応じて設定することが望ましい。Although the embodiment of the present invention has been described in detail above with reference to the drawings, the specific structure is not limited to this embodiment, and there are design changes and the like within the scope not departing from the gist of the present invention. Also included in the present invention. For example, in the embodiment, the example in which the hole exposing the end face of the conductive wire is formed penetrating the base portion is shown. Need not penetrate. The diameter of the hole may be such that the end faces of a plurality of conductive wires are exposed or the end faces of a single conductive wire are exposed. It is desirable to set according to the required amount.
【0018】[0018]
【発明の効果】以上説明したように、本発明の導電性透
明体にあっては、導電性の表面層に加わる熱を基体部に
到達する前に耐熱板によって吸収できるので、導通不良
が起こらないように外部導線を半田付けによって導電線
に接続させることができるという効果が得られる。As described above, in the conductive transparent body of the present invention, the heat applied to the conductive surface layer can be absorbed by the heat-resistant plate before reaching the base portion, so that the conduction failure occurs. The effect is that the external conductor can be connected to the conductor by soldering so that it does not exist.
【図1】本実施例の導電性透明体を示す斜視図である。FIG. 1 is a perspective view showing a conductive transparent body of the present embodiment.
【図2】図1のII−II断面図である。FIG. 2 is a sectional view taken along the line II-II in FIG.
【図3】導電性透明体の構成部品を示す平面図である。FIG. 3 is a plan view showing components of a conductive transparent body.
【図4】導電性透明体の製造方法を示した断面図であ
る。FIG. 4 is a cross-sectional view showing a method for manufacturing a conductive transparent body.
【図5】導電性透明体に外部導線を接続した状態を示す
断面図である。FIG. 5 is a cross-sectional view showing a state in which an external conductive wire is connected to a conductive transparent body.
1 導電性透明体 10 基体部 12 耐熱板 13 導電線 15 孔 16 導電性の表面層 17 導電性の内面層 DESCRIPTION OF SYMBOLS 1 Conductive transparent body 10 Base part 12 Heat-resistant plate 13 Conductive wire 15 Hole 16 Conductive surface layer 17 Conductive inner surface layer
Claims (1)
基体部に互いに短絡しないように埋設された複数の導電
線と、前記基体部の表面に接着された耐熱板と、を備
え、前記耐熱板の表面に導電性の表面層が設けられ、こ
の導電性の表面層に、前記導電線の端面を露出させた孔
が設けられ、この孔の内面に、前記導電性の表面層に連
続した導電性の内面層が設けられていることを特徴とす
る導電性透明体。1. A base part made of a transparent electrically insulating material, a plurality of conductive wires embedded in the base part so as not to short-circuit with each other, and a heat-resistant plate adhered to a surface of the base part. A conductive surface layer is provided on the surface of the heat-resistant plate, a hole exposing the end surface of the conductive wire is provided in the conductive surface layer, and the inner surface of the hole is continuous with the conductive surface layer. A conductive transparent body, characterized in that the conductive inner surface layer is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4310197A JPH06162829A (en) | 1992-11-19 | 1992-11-19 | Electrically conductive transparent body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4310197A JPH06162829A (en) | 1992-11-19 | 1992-11-19 | Electrically conductive transparent body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06162829A true JPH06162829A (en) | 1994-06-10 |
Family
ID=18002347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4310197A Pending JPH06162829A (en) | 1992-11-19 | 1992-11-19 | Electrically conductive transparent body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06162829A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9182858B2 (en) | 2011-08-02 | 2015-11-10 | Korea Institute Of Machinery & Materials | Method for burying conductive mesh in transparent electrode |
-
1992
- 1992-11-19 JP JP4310197A patent/JPH06162829A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9182858B2 (en) | 2011-08-02 | 2015-11-10 | Korea Institute Of Machinery & Materials | Method for burying conductive mesh in transparent electrode |
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