JPH06152112A - Connection of circuit - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a connection method capable of confirming the connection state of a circuit. A connecting member is used in which particles 2 that deform during thermocompression are dispersed in the connecting member, and the electrode 3 and the film 3 on which the leads 4 are formed and the substrate 6 are pressure-bonded to each other through the connecting member. . [Effect] Even if the conductive particle 1 is a metal particle that is hard to be deformed, the deformed particle 2 is deformed if the pressure is good. You can check the status with certainty.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit connecting method.

[0002]

2. Description of the Related Art In the recent development of parts and devices, how to realize high-density circuit connection has become an issue.

Particularly in devices such as liquid crystal panels, realization of a large number of points and high-density connection is an important point in manufacturing.

A conventional circuit connecting method will be described below with reference to the drawings. FIG. 5 is a sectional view showing a conventional circuit connecting method. The leads 4 are provided on the film 3 made of polyimide or the like by using a copper foil, and the electrodes 5 are provided on the glass substrate 6 by a metal thin film. Film 3
Is adhered to the glass substrate 6 with the adhesive 7, and the adhesive 7
The conductive particles 1 in the inside electrically connect the leads 4 to the electrodes 5.

The arrangement of the electrodes 5 formed on the glass substrate 6 is shown as a plan view in FIG. Since the connection state of the outermost lead is likely to be unstable, the dummy electrode 9 is provided further outside thereof. FIG. 7 shows a state in which the film 3 is superposed on the glass substrate 6. Generally, the adhesive 7 is cured by thermocompression bonding the film 3 from above with a high temperature heater tool. Such a circuit connecting method is widely used as a mounting method using an anisotropic conductive adhesive (for example, Atsumi et al., "TAB mounting technology for liquid crystal modules", Electronic Technology Vol. 32, No. 7).

[0006]

However, in such a construction method, confirmation of the connection state is a problem. That is, a method for confirming that the conductive particles are surely in contact with the leads and the electrodes is required in the manufacturing process. In the process of liquid crystal panels, ITO (Indium) is used as the electrode material.
Since a transparent material such as Thin Oxide is often used, it can be confirmed that the conductive particles are deformed by being sandwiched between the lead and the electrode when confirmed from the back surface of the glass substrate, for example. Is taken.

However, if the conductive particles are hard particles such as Ni particles, it is difficult to determine the degree of collapse, and the electrode is A
If it is an opaque metal such as l, confirmation from the back surface is impossible.

Thus, confirmation of the connection state has been a major problem in the circuit connection method.

The present invention solves such a problem and provides a stable circuit connecting method.

[0010]

In order to achieve the above object, in the circuit connecting method of the present invention, two or more kinds of particles are dispersed in a connecting member, and particles having a low hardness are deformed. Alternatively, a part of the connection circuit is extended and an electrode for confirming the connection resistance is provided.

[0011]

Therefore, according to the present invention, the connection state can be easily confirmed by the action of the deformed particles for confirming the connection state or the connection resistance confirmation electrode.

[0012]

Embodiments of the present invention having the same function are denoted by the same reference numerals, detailed description thereof will be omitted, and different points will be described.

(Embodiment 1) FIG. 1 is a sectional view showing a circuit connecting method according to a first embodiment of the present invention. The conductive particles 1 were Ni, and the deformable particles 2 were resin balls. It is easy to make the particle size of resin balls uniform, for example, 10 μm.
It is possible to obtain a product with a variation in diameter within 1 μm. Therefore, the pressure applied during thermocompression bonding can be confirmed by observing the degree of collapse of the deformed particles 2. For example, as a reference in the process, the particle size after deformation is 2
If it is specified that the thickness is 0 μm or more, the thermocompression bonding process can be controlled.

When the electrode 5 is made of an opaque material such as Al, a confirmation lead 8 is provided as shown in FIG. 2, and the deformed particles 2 deformed between the glass substrate 6 and the confirmation lead 8 are transferred to the glass substrate. Check from the back side of 6. Confirmation lead 8
Can also serve as an alignment pattern for the film 8 and the glass substrate 6.

(Embodiment 2) The sectional structure of the connecting portion in this embodiment is the same as that in FIG. However, as shown in FIG. 4, a part of the dummy electrode 9 shown in FIG. Figure 3 shows how film 3 is crimped
Shown in. The measuring electrode 10 is short-circuited by the lead 4.
It can be confirmed that the connection is surely made by measuring the connection resistance between the two short-circuited measuring electrodes 10. Since the connection state at both ends is more likely to be unstable than at the center, it can be determined that the connection at the center is good if both ends are connected.

[0016]

As is apparent from the above-described embodiments, the present invention employs a structure in which particles that deform during pressure bonding are added to the connecting member, a confirmation dummy connection circuit is provided, and a connection resistance confirmation electrode is provided. With, it was possible to easily check the connection status.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of the same embodiment.

FIG. 3 is an explanatory diagram of a second embodiment of the present invention.

FIG. 4 is an explanatory view of the same embodiment.

FIG. 5 is an explanatory diagram of a conventional circuit connection method.

FIG. 6 is an explanatory view of a conventional circuit connection method.

FIG. 7 is an explanatory diagram of a conventional circuit connection method.

[Explanation of symbols]

 1 Conductive Particles 2 Deformed Particles 3 Film 4 Lead 5 Electrode 6 Glass Substrate 7 Adhesive 8 Confirmation Lead 9 Dummy Electrode 10 Measurement Electrode

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akemi Kawazu 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. A method for connecting circuits, in which connecting terminals formed on opposing supports are pressed against each other via a connecting member to connect them to each other, wherein the connecting member is an electrically insulating adhesive. Using particles in which at least two kinds of particles having different hardness are dispersed, the particles having low hardness are deformed by the pressing force at the time of connection, and the particles are made to exist between the terminals to perform electric conduction between the connection terminals. Circuit connection method. 2. The circuit connecting method according to claim 1, wherein the particles having low hardness are made of resin and the particles having high hardness are made of metal. 3. The circuit connecting method according to claim 1, wherein a dummy terminal is provided only on one of the supports, and the dummy terminal is used for connection while observing the state of particles in the connecting member. . 4. A method of connecting a circuit, wherein a part of a connection terminal formed on a support is extended to form a connection resistance measuring electrode, which is measured while measuring the connection resistance. 5. The circuit connecting method according to claim 4, wherein the adhesive is an anisotropic conductive adhesive.