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JPH06104491A - Light emitting diode lamp - Google Patents

Light emitting diode lamp

Info

Publication number
JPH06104491A
JPH06104491A JP4275350A JP27535092A JPH06104491A JP H06104491 A JPH06104491 A JP H06104491A JP 4275350 A JP4275350 A JP 4275350A JP 27535092 A JP27535092 A JP 27535092A JP H06104491 A JPH06104491 A JP H06104491A
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
light
lead terminal
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4275350A
Other languages
Japanese (ja)
Inventor
Kazuo Kitamura
和男 北村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP4275350A priority Critical patent/JPH06104491A/en
Publication of JPH06104491A publication Critical patent/JPH06104491A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Led Device Packages (AREA)

Abstract

(57)【要約】 【目的】 製造ラインの共通化を図ることができ、しか
も、光の取り出し効率の良い発光ダイオードランプを提
供する。 【構成】 一方のリード端子１ａの先端部に固着された
発光ダイオード素子５と、前記発光ダイオード素子５と
他方のリード端子１ｂとの間を接続する金属細線６とを
透光性樹脂で封止することにより形成される所定形状の
モールド部７に、前記モールド部７のリード端子導出面
を除く外周面に対して、任意形状の透光性キャップ８を
密着状態に取り付ける。 (57) [Abstract] [Purpose] To provide a light-emitting diode lamp which can achieve common production lines and has high light extraction efficiency. A light emitting diode element 5 fixed to the tip of one lead terminal 1a and a thin metal wire 6 connecting between the light emitting diode element 5 and the other lead terminal 1b are sealed with a transparent resin. A transparent cap 8 of an arbitrary shape is attached to the outer peripheral surface of the molded portion 7 excluding the lead terminal lead-out surface so as to be in close contact with the molded portion 7 having a predetermined shape.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、発光ダイオード素子を
封止したドーム状のレンズ部等のランプ本体から２本
（２色表示の場合は３本）のリード端子が導出されてな
る発光ダイオードランプに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode in which two lead terminals (three in the case of a two-color display) are led out from a lamp body such as a dome-shaped lens portion encapsulating a light emitting diode element. It is about lamps.

【０００２】[0002]

【従来の技術】この種の発光ダイオードランプは多岐の
分野に使用され、そのランプ本体の形状も用途に応じて
種々のものがある。例えば、ランプ本体がドーム状のレ
ンズ部から構成された発光ダイオードランプであって
も、レンズ径が３ｍｍ、５ｍｍ、８ｍｍのものなどがあ
る。従来、このような仕様の異なる発光ダイオードラン
プを製造するにあたっては、ランプ本体を成型する際の
樹脂量の調整や、発光ダイオード素子の位置等を個別に
設定していたので、製造ラインが多様化し、生産効率を
低下させる要因となっていた。また、ランプ本体の大き
さが著しく異なるもの（例えば、レンズ径が３ｍｍと８
ｍｍのもの）では、リードフレームの仕様も変える必要
が生じることもあり、材料コストの低減の面からも不都
合を生じていた。2. Description of the Related Art Light emitting diode lamps of this kind are used in various fields, and there are various shapes of lamp bodies according to their applications. For example, even a light emitting diode lamp having a dome-shaped lens portion as a lamp body may have a lens diameter of 3 mm, 5 mm, or 8 mm. In the past, when manufacturing light-emitting diode lamps with different specifications like this, the amount of resin when molding the lamp body and the position of the light-emitting diode element were individually set, so the manufacturing line diversified. , Was a factor that reduced production efficiency. Also, if the size of the lamp body is significantly different (for example, if the lens diameter is 3 mm or 8 mm
In the case of (mm), it may be necessary to change the specifications of the lead frame, which causes inconvenience in terms of material cost reduction.

【０００３】上記のような不都合を解消するために、特
開昭５６−２３７８９号公報において、発光素子を樹脂
封止して所望形状の外形をもたせ、その樹脂部に種々の
形状のキャップを被せて、仕様の異なる発光ダイオード
ランプを実現する手法が開示されている。図４は、上記
手法で実現された発光ダイオードランプの一例を示して
いる。図中、１はリード端子、２はリード端子１の先端
部に組み込まれた発光ダイオード素子等を封止している
樹脂部、３は樹脂部２に嵌め付けられたキャップであ
る。この手法によれば、キャップ３の外形を任意に変更
することによって、異なる仕様の発光ダイオードランプ
を製造できるので、製造ラインの共通化を図ることがで
きる。In order to solve the above inconvenience, in JP-A-56-23789, a light emitting element is sealed with a resin so as to have an outer shape of a desired shape, and the resin portion is covered with variously shaped caps. Then, a method for realizing light emitting diode lamps having different specifications is disclosed. FIG. 4 shows an example of a light emitting diode lamp realized by the above method. In the figure, 1 is a lead terminal, 2 is a resin portion for sealing a light emitting diode element or the like incorporated in the tip portion of the lead terminal 1, and 3 is a cap fitted to the resin portion 2. According to this method, since the light emitting diode lamps having different specifications can be manufactured by arbitrarily changing the outer shape of the cap 3, the manufacturing line can be shared.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな構成を有する従来例の場合には、次のような問題が
ある。すなわち、上記特開昭５６−２３７８９号公報に
開示された発光ダイオードランプによれば、樹脂部２の
上面とキャップ３との間に空間が存在し、そのため樹脂
部２から出射された光がキャップ３の内面で反射される
ので、光の取り出し効率が悪く、充分な光度を得ること
ができないという問題点がある。However, the conventional example having such a structure has the following problems. That is, according to the light-emitting diode lamp disclosed in the above-mentioned JP-A-56-23789, there is a space between the upper surface of the resin portion 2 and the cap 3, so that the light emitted from the resin portion 2 is capped. Since the light is reflected on the inner surface of No. 3, there is a problem that the light extraction efficiency is poor and a sufficient luminous intensity cannot be obtained.

【０００５】本発明は、このような事情に鑑みてなされ
たものであって、製造ラインの共通化を図ることがで
き、しかも、光の取り出し効率の良い発光ダイオードラ
ンプを提供することを目的としている。The present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting diode lamp which can achieve common production lines and have high light extraction efficiency. There is.

【０００６】[0006]

【課題を解決するための手段】本発明は、このような目
的を達成するために、次のような構成をとる。すなわ
ち、本発明に係る発光ダイオードランプは、一方のリー
ド端子の先端部に固着された発光ダイオード素子と、前
記発光ダイオード素子と他方のリード端子との間を接続
する金属細線とを透光性樹脂で封止することにより形成
される所定形状のモールド部に、前記モールド部のリー
ド端子導出面を除く外周面に対して、任意形状の透光性
キャップを密着状態に取り付けたものである。The present invention has the following constitution in order to achieve such an object. That is, the light emitting diode lamp according to the present invention includes a light emitting diode element fixed to the tip of one of the lead terminals, and a thin metal wire connecting the light emitting diode element and the other lead terminal to a transparent resin. A light-transmissive cap of an arbitrary shape is attached to the outer peripheral surface of the molded portion excluding the lead terminal lead-out surface in a close contact state with the molded portion formed by sealing with.

【０００７】[0007]

【作用】本発明によれば、モールド部に嵌め付けられる
キャップを任意形状にすることにより、種々の仕様の発
光ダイオードランプを実現できるので、モールド部の成
型工程までの各製造工程の共通化が図られる。また、キ
ャップはモールド部に対して密着状態に取り付けられる
ので、モールド部から出射された光がキャップ内面で反
射されることが少なく、光が効率良く取り出される。According to the present invention, since the light-emitting diode lamps having various specifications can be realized by forming the cap fitted in the mold part into an arbitrary shape, the manufacturing process up to the molding process of the mold part can be standardized. Planned. Further, since the cap is attached in close contact with the mold part, the light emitted from the mold part is rarely reflected on the inner surface of the cap, and the light is efficiently extracted.

【０００８】[0008]

【実施例】以下、図面を参照して本発明の一実施例を説
明する。図１は本発明に係る発光ダイオードランプの一
実施例の構成を示した断面図である。リード端子１ａの
先端部に発光ダイオード素子５が固着されており、この
発光ダイオード素子５と他方のリード端子１ｂとが金属
細線６で接続されている。上記発光ダイオード素子５お
よび金属細線６は、透光性樹脂からなるモールド部７で
封止されている。透光性樹脂としては例えば、熱硬化性
エポキシ樹脂が用いられる。本実施例では、可能な限り
製造ラインの共通化を図るために、モールド部７を透明
樹脂で形成し、発光ダイオード素子５の発光色に応じ
て、後述するキャップ８の色を変えている。ただし、本
発明はこれに限定されず、発光ダイオード素子５の発光
色に応じて、モールド部７の色を替えてもよい。モール
ド部７の形状は特に限定しないが、本実施例では、発光
ダイオードランプの一仕様である最小寸法（例えば、３
ｍｍ径）のドーム状レンズに形成している。こうするこ
とにより、最小寸法のドーム状レンズを備えた発光ダイ
オードランプを製造する場合には、キャップ８を嵌め付
ける必要がなくなるので、製造工程を一層簡素化するこ
とができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing the structure of an embodiment of a light emitting diode lamp according to the present invention. A light emitting diode element 5 is fixed to the tip of the lead terminal 1a, and the light emitting diode element 5 and the other lead terminal 1b are connected by a thin metal wire 6. The light emitting diode element 5 and the thin metal wire 6 are sealed with a mold portion 7 made of a translucent resin. As the translucent resin, for example, a thermosetting epoxy resin is used. In this embodiment, in order to make the manufacturing line as common as possible, the mold portion 7 is formed of a transparent resin, and the color of the cap 8 described later is changed according to the emission color of the light emitting diode element 5. However, the present invention is not limited to this, and the color of the mold part 7 may be changed according to the emission color of the light emitting diode element 5. The shape of the molded portion 7 is not particularly limited, but in this embodiment, the minimum dimension (for example, 3
mm diameter) dome-shaped lens. By doing so, it is not necessary to fit the cap 8 in the case of manufacturing a light emitting diode lamp having a dome-shaped lens of the minimum size, so that the manufacturing process can be further simplified.

【０００９】前記モールド部７に、径大のドーム形状を
した透光性のキャップ８が嵌め付けられている。キャッ
プ８は、モールド部７のリード端子導出面を除く外周面
に対して密着するように取り付けられている。キャップ
８をモールド部７に密着状態に取り付けることにより、
モールド部７から出射された光が、キャップ８の内周面
で反射されにくくなるので、光の取り出し効率を高める
ことができる。キャップ８の成型材料は特に限定しない
が、モールド部７と同じ材料（例えば、エポキシ樹脂）
や、好ましくは、モールド部７を形成する材料よりも、
屈折率の低い材料で形成される。モールド部７よりも屈
折率の低い材料でキャップ８を形成すれば、モールド部
７とキャップ８との界面において光の反射が、さらに低
減し、光の取り出し効率を一層高めることができる。A dome-shaped translucent cap 8 having a large diameter is fitted on the molded portion 7. The cap 8 is attached so as to be in close contact with the outer peripheral surface of the molded portion 7 excluding the lead terminal lead-out surface. By attaching the cap 8 to the mold portion 7 in a close contact state,
The light emitted from the mold portion 7 is less likely to be reflected on the inner peripheral surface of the cap 8, so that the light extraction efficiency can be improved. The molding material of the cap 8 is not particularly limited, but the same material as the molding portion 7 (for example, epoxy resin)
Or, preferably, rather than the material forming the mold portion 7,
It is formed of a material having a low refractive index. If the cap 8 is formed of a material having a refractive index lower than that of the mold portion 7, light reflection at the interface between the mold portion 7 and the cap 8 can be further reduced, and the light extraction efficiency can be further enhanced.

【００１０】キャップ８の形状は発光ダイオードランプ
の仕様に応じて任意に選択される。例えば、図２に示す
ように、モールド部７が最小寸法のドーム状レンズに形
成された発光ダイオードランプに対して、中サイズ（例
えば、５ｍｍ径）のドーム状キャップ８ａ、大サイズ
（例えば、８ｍｍ径）のドーム状キャップ８ｂ、点光源
用キャップ８ｃ、三角柱状キャップ８ｄ等が嵌め付けら
れる。The shape of the cap 8 is arbitrarily selected according to the specifications of the light emitting diode lamp. For example, as shown in FIG. 2, for a light emitting diode lamp in which the mold part 7 is formed in a dome-shaped lens having a minimum size, a dome-shaped cap 8a having a medium size (for example, 5 mm diameter) and a large size (for example, 8 mm) are provided. A dome-shaped cap 8b having a diameter), a point light source cap 8c, a triangular prism cap 8d, and the like are fitted.

【００１１】次に、図３を参照して、実施例に係る発光
ダイオードランプの製造方法を説明する。まず、多数組
のリード端子１ａ，１ｂが並設連結されたリードフレー
ム９の各リード端子１ａの先端部に、発光ダイオード素
子５が固着（ダイボンディング）された後、発光ダイオ
ード素子５とリード端子１ｂとが金属細線６で接続（ワ
イヤーボンディング）される（図３の（ａ）参照）。Next, a method of manufacturing the light emitting diode lamp according to the embodiment will be described with reference to FIG. First, after the light emitting diode element 5 is fixed (die-bonded) to the tip of each lead terminal 1a of the lead frame 9 in which a large number of sets of lead terminals 1a and 1b are connected in parallel, the light emitting diode element 5 and the lead terminal are connected. 1b and metal wires 6 are connected (wire bonded) (see (a) of FIG. 3).

【００１２】次に、リード端子１ａ，１ｂの先端部分
に、例えばキャスティング法やトランスファーモールド
法等によりモールド部７が形成され、発光ダイオード素
子５等が封止される（図３の（ｂ）参照）。ここまでの
工程は、発光ダイオードランプのランプ形状仕様等にか
かわらず共通化される。Next, a mold portion 7 is formed at the tip portions of the lead terminals 1a and 1b by, for example, a casting method or a transfer molding method, and the light emitting diode element 5 and the like are sealed (see FIG. 3B). ). The steps up to this point are common regardless of the lamp shape specifications of the light emitting diode lamp.

【００１３】各モールド部７に任意のキャップ８が、圧
入、あるいは接着剤等を介して嵌め付けられる（図３の
（ｃ）参照）。キャップ８は、インジョクション法やト
ランスファーモールド法等により、発光ダイオードラン
プの仕様に応じた形状、色をもつものが予め作成されて
いる。An arbitrary cap 8 is fitted into each mold portion 7 by press fitting or an adhesive (see FIG. 3 (c)). The cap 8 is formed in advance by an injection method, a transfer molding method, or the like, and has a shape and a color according to the specifications of the light emitting diode lamp.

【００１４】次に、タイバー１０と一方のリード端子
（例えば、リード端子１ａ）の基端部がそれぞれ切断さ
れて、電気的特性や光量の測定が行われて良品と不良品
とが選別された後、他方のリード端子（例えば、リード
端子１ｂ）の基端部が切り離される。Next, the tie bar 10 and one of the lead terminals (for example, the lead terminal 1a) are cut off at their base ends, and the electrical characteristics and the amount of light are measured to select good products and defective products. After that, the base end portion of the other lead terminal (for example, the lead terminal 1b) is separated.

【００１５】おな、上述の実施例では、単色表示の発光
ダイオードランプを例に採って説明したが、本発明は２
色表示の発光ダイオードランプにも適用することができ
る。また、リードフレームの形状や、発光ダイオードラ
ンプの製造方法等は、実施例で説明したものに限定され
ず、種々変更実施できることは言うまでもない。In the above embodiment, the light emitting diode lamp for single color display has been described as an example.
It can also be applied to a color display light emitting diode lamp. Further, it is needless to say that the shape of the lead frame, the manufacturing method of the light emitting diode lamp, and the like are not limited to those described in the embodiments, and various modifications can be made.

【００１６】[0016]

【発明の効果】以上の説明から明らかなように、本発明
によれば、所定形状のモールド部に、任意形状のキャッ
プを取り付けてランプ本体を形成しているので、ランプ
形状の種々の仕様にかかわらず、前記モールド部成型工
程までの各工程を共通化することができ、もって発光ダ
イオードランプの製造工程の生産効率を高めることがで
きる。As is apparent from the above description, according to the present invention, a lamp body is formed by attaching a cap of an arbitrary shape to a mold portion of a predetermined shape, so that various specifications of the lamp shape can be obtained. Regardless, the steps up to the molding step can be made common, so that the production efficiency of the manufacturing process of the light emitting diode lamp can be improved.

【００１７】また、モールド部に対してキャップが密着
状態に嵌め付けられるので、モールド部とキャップとの
界面における光の反射が低減され、光の取り出し効率を
高めることができる。Further, since the cap is fitted in close contact with the mold part, light reflection at the interface between the mold part and the cap is reduced, and the light extraction efficiency can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係る発光ダイオードランプの一実施例
の断面図である。FIG. 1 is a sectional view of an embodiment of a light emitting diode lamp according to the present invention.

【図２】キャップの種々の形態を示した図である。FIG. 2 is a view showing various forms of a cap.

【図３】製造方法の一例を示した図である。FIG. 3 is a diagram showing an example of a manufacturing method.

【図４】従来例の説明図である。FIG. 4 is an explanatory diagram of a conventional example.

【符号の説明】[Explanation of symbols]

１ａ…リード端子 １ｂ…リード端子 ５…発光ダイオード素子 ６…金属細線 ７…モールド部 ８…キャップ 1a ... Lead terminal 1b ... Lead terminal 5 ... Light emitting diode element 6 ... Metal thin wire 7 ... Mold part 8 ... Cap

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 一方のリード端子の先端部に固着された
発光ダイオード素子と、前記発光ダイオード素子と他方
のリード端子との間を接続する金属細線とを透光性樹脂
で封止することにより形成される所定形状のモールド部
に、前記モールド部のリード端子導出面を除く外周面に
対して、任意形状の透光性キャップを密着状態に取り付
けたことを特徴とする発光ダイオードランプ。1. A light-emitting diode element fixed to the tip of one lead terminal and a thin metal wire connecting between the light-emitting diode element and the other lead terminal are sealed with a translucent resin. A light-emitting diode lamp, wherein a transparent cap of an arbitrary shape is attached in close contact with an outer peripheral surface of the molded portion except the lead terminal lead-out surface of the molded portion.
JP4275350A 1992-09-17 1992-09-17 Light emitting diode lamp Pending JPH06104491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4275350A JPH06104491A (en) 1992-09-17 1992-09-17 Light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4275350A JPH06104491A (en) 1992-09-17 1992-09-17 Light emitting diode lamp

Publications (1)

Publication Number Publication Date
JPH06104491A true JPH06104491A (en) 1994-04-15

Family

ID=17554253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4275350A Pending JPH06104491A (en) 1992-09-17 1992-09-17 Light emitting diode lamp

Country Status (1)

Country Link
JP (1) JPH06104491A (en)

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JPH09116194A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device
JPH09116193A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device
JPH10163526A (en) * 1996-11-27 1998-06-19 Matsushita Electron Corp Light-emitting element and light-emitting diode
JPH1187784A (en) * 1997-07-07 1999-03-30 Asahi Rubber:Kk Transparent coating material for light emitting diode and fluorescent color light source
JP2001297622A (en) * 2000-04-14 2001-10-26 Rabo Sufia Kk Lighting device
JP2002221658A (en) * 2001-01-26 2002-08-09 Rabo Sufia Kk Bulk type lens, light emitting body, light receiving body, illumination instrument, optical information communication system and method for manufacturing bulk type lens
JP2002223636A (en) * 2001-01-29 2002-08-13 Rabo Sufia Kk Plant culture device using bulk type lens
JP2002228921A (en) * 2001-01-29 2002-08-14 Rabo Sufia Kk Bulk-type lens, light-emitting body, lighting fixture and optical information system using the same
JP2002225762A (en) * 2001-01-30 2002-08-14 Rabo Sufia Kk Bicycle light using bulk lens
JP2002231023A (en) * 2001-01-30 2002-08-16 Rabo Sufia Kk Interior lighting equipment
JP2002231003A (en) * 2001-01-26 2002-08-16 Rabo Sufia Kk Signaling light
JP2003069081A (en) * 2001-08-22 2003-03-07 Okaya Electric Ind Co Ltd Light emitting element and its manufacturing method
JP2004221620A (en) * 2004-04-30 2004-08-05 Sanken Electric Co Ltd Semiconductor light emitting device
JP2004221619A (en) * 2004-04-30 2004-08-05 Sanken Electric Co Ltd Semiconductor light emitting device
JP2004221621A (en) * 2004-04-30 2004-08-05 Sanken Electric Co Ltd Process for fabricating semiconductor light emitting device
JP2004235669A (en) * 2004-04-30 2004-08-19 Sanken Electric Co Ltd Semiconductor light emitting device
JP2004235668A (en) * 2004-04-30 2004-08-19 Sanken Electric Co Ltd Semiconductor light emitting device
JP2005513817A (en) * 2001-12-24 2005-05-12 ジー・エル・アイ・グローバル・ライト・インダストリーズ・ゲーエム・ベーハー Method for manufacturing light-guided LED module in two steps divided in time
EP1441397A3 (en) * 1996-06-26 2005-07-06 Osram Opto Semiconductors GmbH Radiation converting covering element for a light-emitting semiconductor device, method for the production thereof and light-emitting semiconductor device
JP2006323880A (en) * 2006-09-11 2006-11-30 Rabo Sufia Kk Signal lamp
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JP2007101932A (en) * 2005-10-05 2007-04-19 Matsushita Electric Ind Co Ltd Display device
JP2007165339A (en) * 2007-02-19 2007-06-28 Rabo Sufia Kk Signal light
JP2007227968A (en) * 2007-05-01 2007-09-06 Rabo Sufia Kk Optical information communication system
JP2007310419A (en) * 2007-08-06 2007-11-29 Rabo Sufia Kk Bulk lens, light emitting body, light receiving body, lighting equipment and method for manufacturing bulk lens
JP2009505251A (en) * 2005-08-19 2009-02-05 ギーゼッケ ウント デフリエント ゲーエムベーハー Card type data carrier
JP2009117375A (en) * 2009-01-13 2009-05-28 Rabo Sufia Kk Indoor illuminating device
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JP2002228921A (en) * 2001-01-29 2002-08-14 Rabo Sufia Kk Bulk-type lens, light-emitting body, lighting fixture and optical information system using the same
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