JPH0568857B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique for inserting an electronic component into a base body, and particularly to a technique that is effective when applied to a handler used when measuring characteristics of a semiconductor device.

[Background technology]

The handler basically consists of the following parts. (1) Device supply section, (2) Measurement section, (3) Storage section, (4)
Control operation section (Electronic materials 1981 special issue, Kogyo Kenkyukai, November 10, 1981, P226-P230).

However, the above document does not mention anything about the mechanism for inserting a semiconductor device as a sample into a measurement socket.

Therefore, the inventor of the present invention has repeatedly studied various techniques for inserting a semiconductor device into a measurement socket.

As one of these, the present inventor has found that in order to insert a semiconductor device into a socket by perfectly aligning the terminals of the socket and the leads of the semiconductor device, it is necessary to use a device in which the leads protrude in all directions from the side of the package (hereinafter referred to as When targeting an FP type IC (hereinafter referred to as an FP type IC), there are many leads protruding from the side of the package in all directions, so it is difficult to completely align the socket terminals and the FP type IC leads by simply aligning them during handling. I thought it would be difficult to insert the FP type IC into the socket. Therefore, during handling, after roughly aligning the FP type IC with the socket, the FP type IC is placed in the socket (hereinafter referred to as temporary insertion), and then the block provided in the center of the socket moves up and down several times. Therefore, move the FP type IC up and down several times to
The idea was to swing the type IC over the socket, perfectly align the socket terminals and the leads of the FP type IC, and then insert the FP type IC into the socket.

However, according to the method described above, in order to perfectly align the terminals of the socket and the leads of the FP type IC, the block is moved up and down multiple times, and the FP type IC is moved up and down multiple times to align the FP type IC on the socket. The need to rock the IC;
Furthermore, it is necessary to move the FP type IC up to a height that allows it to swing sufficiently on the socket, and while the FP type IC is swinging on the socket, the block will type IC
This improves throughput because it is difficult to reduce the time required to completely align and insert the socket terminals and FP type IC leads, such as by lowering the socket to a height that allows the socket to be released. The inventor has found that it is difficult to do so.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for measuring electronic components that can reduce the time required for positioning the terminals of a socket and the leads of the electronic component and improve throughput.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, almost at the same time as the FP type IC is temporarily inserted into the socket as a base, the FP type IC is vibrated relative to the socket by applying vertical and horizontal vibrations to the socket. Immediately change the relative position of the FP type IC leads and socket terminals.
Type IC can be quickly inserted into the socket,
Throughput can be improved.

Note that the above-mentioned temporary insertion refers to a state in which the semiconductor device is inserted (placed) near a predetermined position in the socket because it is difficult to insert the FP type IC into the predetermined position in the socket due to handling.

Embodiment 1 FIG. 1 is a schematic plan view showing the main parts of a handler used for measuring the characteristics of a semiconductor device, in which the electronic component substrate insertion technique according to an embodiment of the present invention is applied.

FIG. 2 is a schematic sectional view taken along the - line in FIG. 1.

In the figure, reference numeral 1 denotes a socket mounting base on which a socket 2 can be removably mounted, and is formed in the shape of a disk, and its outer periphery is tapered.
The socket mounting table 1 is placed on a tester (not shown) via a flexible spacer 3, and is supported on a substrate 4 electrically connected to the tester. The flexible spacer 3 is
For example, it is made of silicone rubber or the like, and can support the socket mounting base 1 so as to be able to vibrate. 5
is a connection line that electrically connects the socket 2 and the board 4. 6 is a socket guide;
Tapered surfaces 7 are formed at the upper portions of the four inner side surfaces. The socket guide 6 has its tapered surface 7 to guide the FP type IC 8 into the socket 2.
The FP type IC can be guided near the part where it is to be inserted. Reference numeral 9 denotes a diaphragm, which is formed into a rectangular plate shape and has a circular opening near its center, and the socket mounting base 1 is inserted into this circular opening.
is inserted, so that the circular opening and the socket mounting base 1 can almost match. 10 is
The support body can support the diaphragm 9 so that it can vibrate freely in the X-Y-Z directions, and supports the diaphragm 9 in a predetermined position when no external force is applied to the diaphragm 9. The structure is such that it can be done. 11 is
It is a frame body of a handler (not shown), and the support body 1
The diaphragm 9 can be supported through the diaphragm 9. Vibration motors 12 and 13 are placed on the frame 11. Vibration motor 12, via vibration transmitter 14,
The diaphragm 9 can be vibrated in the horizontal direction. The vibration motor 13 is capable of vertically vibrating the diaphragm 9 via the vibration transmitter 15.

FIG. 3 is a schematic perspective view showing the main parts and peripheral mechanisms of the handler of this embodiment.

FIG. 4, FIG. 5, FIG. 6, and FIG. 7 are diagrams for explaining the operation of this embodiment.

In FIG. 3, 16 is a transport mechanism that carries multiple FP type ICs accumulated in a loader (not shown).
It has the function of transporting the material to two positions in front of the socket.
The transport mechanism 16 consists of a block 17 that holds the FP type IC 8 and is capable of heat-treating the FP type IC 8 if necessary, and rails 18 that are arranged on both sides of the block 17 in the longitudinal direction and are capable of rectangular movement in the longitudinal direction. ing. Reference numeral 19 denotes a tapered surface, which is provided on the block 17 in a direction perpendicular to its longitudinal direction. 20 is a tapered surface, which is provided in the longitudinal direction of the rail 18 and which is connected to the block 1.
FP type IC8 by the tapered surface 19 of 7,
It is designed so that it can be roughly aligned with the socket 2. That is, the FP type IC 8 is roughly aligned with the socket 2 by the tapered surfaces 19 and 20 while being conveyed by the rectangular movement of the rail 18. 21 is a transport arm, and the FP transported by the transport mechanism 16 is
It has the function of picking up type IC8 by vacuum suction etc. and transporting it to socket 2. 22 is a pusher, an FP type inserted into socket 2
Press the lead part of IC8 from above and press the FP type
IC8 lead and socket 2 terminal (not shown)
This is to ensure that they come into contact with each other. 23 is a transport mechanism, which carries a good FP type IC8 after measuring its characteristics.
It has a function of transporting it to the front of an unloader (not shown). Like the transport mechanism 16, the transport mechanism 23 includes a block 24 that holds the FP type IC 8;
It consists of rails 25 arranged on both sides of the block 24 in the longitudinal direction, and the FP type IC 8 can be transported by the rectangular movement of the rails 25.
26 is a transfer arm, which transports the FP type IC8 after characteristic measurement from the socket 2 to the transfer mechanism 2.
It is possible to transport up to 3.

Please note that the FP type was found to be defective based on the measurement results.
The IC is stored in a defective product box (not shown).

In FIGS. 4 to 7, reference numeral 27 indicates a plurality of leads protruding in all directions from the side surface of the package of the FP type IC 8. A guide 28 is provided in the socket 2 and can guide the FP type IC 8 into the socket 2 from all sides. That is, the guides 28 are guides for guiding the package body, and one of the guides is an L-shaped guide that guides one corner of the package body 8, as shown in FIG. The other package body guides are configured such that the portions that come into contact with the corners of the package body form a flat surface. 2
9 is a terminal provided in the recessed portion of the socket 2 as shown, and is arranged corresponding to the lead 27 of the FP type IC 8. 30 is a guide provided between some of the terminals 29, and is connected to the lead 27 of the FP type IC 8.
This is a lead guide for guiding the terminal 29 of the socket to the terminal 29 of the socket.

The operation of the handler configured as described above will be explained below.

In this embodiment, an example will be explained in which the characteristics of an FP type IC having leads protruding in all directions from the side surface of the package are measured (for example, functional measurements regarding access time, operating frequency, etc.).

In FIG. 3, FP type ICs 8 stored in a loader (not shown) are placed in the transport mechanism 16.
The rectangular movement of the rail 18 transports it to the front of the socket 2. At this time, the FP type IC 8 contacts the block 17 and the tapered surfaces 19, 20 of the rail 18, and is aligned along the tapered surfaces 19, 20 by its own weight. Thereafter, the FP type ICs 8 are picked up one by one by the transport arm 21 and transported to the socket 2. For example, as shown in FIG. 4, the FP type IC 8 is released from the transfer arm 21 above the socket 2.
The lead 27 of the FP type IC 8 falls under its own weight while contacting the tapered surface 7 of the socket guide 6, and is temporarily inserted into the socket 2. As shown in FIG. Suppose that they are not properly aligned with the terminals 29 of the terminals 29 and are shifted. Therefore, the third
Vibration motor 12,1 shown in the figure
3, vibrations of about 50 Hz are applied to the diaphragm 9 in the horizontal and vertical directions, for example, during vibrations of about 200 microns, through the vibration transmitters 14 and 15, respectively. Due to the vibration of the diaphragm 9, the socket mounting base 1, which is inserted substantially in line with the diaphragm 9, vibrates. Then, the socket 2 vibrates, and the FP type IC 8 temporarily inserted into the socket 2 vibrates relatively.
As shown in FIG. 6, the FP type IC 8 moves relative to the socket 2. At this time, the FP type IC 8 is subjected to the guiding action of the guides 28, 30 and the socket guide 6, as well as its own weight, and as shown in FIG. 29 will be aligned respectively.
Thereafter, the lead portion of the FP type IC 8 is pressed by the pusher 22 shown in the figure.
The lead 27 and the terminal 29 of the socket 2 are brought into secure contact, and the characteristics are measured. When the characteristic measurement is completed, the pusher 22 is released, and the FR type IC 8 determined to be a good product by the measurement is adsorbed by vacuum suction or the like by the transfer arm 26 shown in FIG. 3, and is transferred to the transfer mechanism 23. . On the other hand, items determined to be defective are transported by the transfer arm 26.
The product is placed in a defective product box (not shown). The FP type ICs 8 that are determined to be non-defective products are transported to the front of an unloader (not shown) by the rectangular movement of the block 23, and are stored in an array in the unloader.

As described above, according to this embodiment, after the FP type IC is temporarily inserted into the socket by the transfer arm, vibration is applied to the socket, and at that time, the frequency applied to the socket is 50 Hz, relatively
The FP type IC can be vibrated quickly, and the relative position between the socket terminal and the FP type IC lead can be quickly changed.
Socket insertion is done quickly.

As mentioned above, by quickly inserting the FP type IC into the socket, it is possible to quickly insert the FP type IC into the socket, and for those that require heat treatment on the FP type IC when measuring characteristics, it is possible to prevent the temperature of the FP type IC from changing from the specified temperature. It is possible to perform characteristic measurements with a reduced amount of noise, and it is possible to perform accurate characteristic measurements.

Similarly, by being able to quickly insert the FP type IC into the socket, the throughput in measuring the characteristics of the FP type IC is improved compared to when the block is moved up and down.

According to this embodiment, the FP whose characteristics should be measured
Even if there are multiple types of ICs, each FP
By placing a socket compatible with a type IC on a socket mounting table, the characteristics of multiple types of FP type ICs can be measured using the same handling device.

Furthermore, compared to the case where the vertical movement of the block aligns the terminals of the socket with the leads of the FP type IC, there is no need for a mechanism for vertically moving the block, and the mechanism below the socket becomes simpler.

The number of sockets is not limited to one, but by providing a plurality of sockets, characteristics can be measured more efficiently than when measuring characteristics using one socket.

In this example, in order to quickly and reliably insert the FP type IC into the socket, vibrations are applied to the socket in both the horizontal and vertical directions. Often, this makes the socket peripheral mechanism simpler and provides better spacing.

Furthermore, in this embodiment, a vibration motor is used as a means for applying vibration to the socket, but it is also possible to apply vibration to the socket by using a device that can generate ultrasonic vibrations, or by rotating a motor that has an eccentric shaft. Very nice.

In this embodiment, the socket is vibrated via a socket mounting table on which the socket is placed, a vibration transmitter, and a diaphragm, but the socket may be vibrated directly.

In this embodiment, vibration is applied to the socket, but it is also possible to fix the socket, press the FP type IC on the socket with silicone rubber, etc., and vibrate the FP type IC via the silicone rubber, etc. Furthermore, it is also possible to use them together. In other words, any configuration that allows the FP type IC to move (vibrate) on the socket is sufficient.

Furthermore, in this embodiment, it is described that vibrations of about 50 Hz are transmitted to the diaphragm etc. and the socket vibrates during shaking of about 200 microns, but during shaking,
The vibration frequency is not limited to the above-mentioned values, and various values can be considered.

In this embodiment, a socket is used as the base, but the base may be a printed actual board or the like, in which case the electronic components can be mounted quickly.

〔effect〕

1 By vibrating the FP type IC relative to the socket, the terminals of the socket and the FP
Since the relative position to the type IC lead can be changed quickly, the FP type
The effect is that the work of inserting an IC into a socket can be done more quickly than when the block is moved up and down.

2. By quickly inserting the FP type IC into the socket, it is possible to quickly insert the FP type IC into the socket, and when measuring the characteristics of the FP type IC, it is possible to prevent the temperature of the FP type IC from changing from the specified temperature when the FP type IC requires heat treatment. This provides the advantage of being able to perform accurate measurements with less temperature change.

3. By quickly inserting the FP type IC into the socket, it is possible to improve the throughput when measuring the characteristics of the FP type IC.

4 By using sockets on the socket mounting table that are compatible with multiple types or FP type ICs, multiple types of semiconductor devices can be handled with the same handling device without requiring major changes. You can get the effect that you can.

5 At least, it is sufficient to provide a vibration mechanism that can vibrate the socket or the semiconductor device, and compared to a device in which the socket terminals and the leads of the semiconductor device are aligned by vertical movement of the block, a block vertical movement mechanism is not required. The effect is that the spacing below the socket is improved.

6 In the case of a device that forcibly vibrates the socket,
FP type IC uses force due to socket vibration and
The force of its own weight due to gravity acts; for example, after the leads of a semiconductor device are guided into the guide groove of a socket, or after the terminals of a socket and the leads of a semiconductor device are aligned,
Even if vibration is applied to the socket, a large force such as pressing is not applied to the semiconductor device, so that the possibility of bending the leads of the semiconductor device is reduced.

Although the invention made by the present inventor has been specifically explained based on the examples above, the present invention is not limited to the above examples, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.

For example, it is conceivable to provide an intermediate pocket near the socket as shown as the socket guide in the above embodiment, drop the FP type IC into it, and roughly align it with the socket.

Further, as the electronic component, devices other than the above-mentioned semiconductor devices, such as semiconductor devices having leads protruding from both sides of the package in the longitudinal direction, can also be used.

[Application field]

In the above explanation, the basic insertion technology of electronic components in the manufacturing process of electronic components, which is the field of application to which the invention made by the present inventor is based, has been explained, but the present invention is not limited thereto. .

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view showing the main parts of an embodiment of the present invention applied to a handler, FIG. 2 is a schematic sectional view taken along the - line in FIG. 1, and FIG. FIGS. 4 to 7, which are schematic perspective views showing the main parts of a handler according to an embodiment of the present invention and peripheral mechanisms thereof, are diagrams for explaining the operation of an embodiment of the present invention. 1...Socket mounting base, 2...Socket, 3...
...Flexible spacer, 4...Substrate, 5...
Connection line, 6...Socket guide, 7, 19, 20
... Tapered surface, 8 ... FP type IC, 9 ... Vibration plate, 10 ... Support body, 11 ... Frame, 12, 13
... Vibration motor, 14, 15 ... Vibration transmitter, 16, 23 ... Conveyance mechanism, 17, 24
...Block, 18,25...Rail, 21,2
6...transport arm, 22...pusher, 27...
...Lead, 28,30...Guide, 29...Terminal.

Claims (1)

[Scope of Claims] 1. A measuring method for measuring an electronic component by inserting a lead protruding from an electronic component having a rectangular package body into a socket for measuring characteristics, wherein the socket for measurement A recess is provided with a plurality of measurement terminals to which the leads come into contact, and a plurality of recesses are provided around the recess, corresponding to the corners of the electronic component package body, so that the electronic component can be guided from all sides to the socket. The package body guide includes a package body guide and a lead guide in the recess for guiding and positioning a lead located between the measurement terminals, and one of the package body guides guides and aligns one corner of the package body. The other package body guide is configured such that the portion that contacts the corner of the package body forms a flat surface, and is located above the socket and is connected to the package body guide. A socket guide having a tapered surface for guiding is provided, an electronic component is inserted into the socket guide, vibration is applied to the electronic component, and a corner of the package body of the electronic component is guided to the guide position of the package body. At the same time, the leads are guided and positioned by the lead guide, the package body of the electronic component is pushed with a pusher, the leads of the electronic component are brought into contact with the measurement terminals, and the characteristics of the electronic component are measured. A method for measuring electronic components characterized by the following. 2. The method for measuring an electronic component according to claim 1, wherein in the step of applying vibration to the electronic component, the vibration is transmitted to the electronic component by applying vibration to the socket. 3. The method for measuring an electronic component according to claim 1, wherein the electronic component is an FP type IC with leads protruding in all directions from the side surface of the package body.