JPH0553057B2 - - Google Patents
Info
- Publication number
- JPH0553057B2 JPH0553057B2 JP27759785A JP27759785A JPH0553057B2 JP H0553057 B2 JPH0553057 B2 JP H0553057B2 JP 27759785 A JP27759785 A JP 27759785A JP 27759785 A JP27759785 A JP 27759785A JP H0553057 B2 JPH0553057 B2 JP H0553057B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing
- cutting
- back surface
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 12
- 239000008151 electrolyte solution Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 25
- 238000003486 chemical etching Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Weting (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27759785A JPS62136032A (ja) | 1985-12-09 | 1985-12-09 | 半導体ウエハ−の裏面加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27759785A JPS62136032A (ja) | 1985-12-09 | 1985-12-09 | 半導体ウエハ−の裏面加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136032A JPS62136032A (ja) | 1987-06-19 |
| JPH0553057B2 true JPH0553057B2 (fr) | 1993-08-09 |
Family
ID=17585663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27759785A Granted JPS62136032A (ja) | 1985-12-09 | 1985-12-09 | 半導体ウエハ−の裏面加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62136032A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235699A (ja) * | 1988-03-17 | 1989-09-20 | Oki Electric Ind Co Ltd | Ｉｃカード及びｉｃチップの製造方法 |
| JP2766417B2 (ja) * | 1992-02-10 | 1998-06-18 | 三菱マテリアル株式会社 | 貼り合わせ誘電体分離ウェーハの製造方法 |
| US6582281B2 (en) * | 2000-03-23 | 2003-06-24 | Micron Technology, Inc. | Semiconductor processing methods of removing conductive material |
| JP4935212B2 (ja) * | 2006-07-13 | 2012-05-23 | セイコーエプソン株式会社 | 腕時計 |
| JP5743800B2 (ja) * | 2011-08-15 | 2015-07-01 | 新日鉄住金マテリアルズ株式会社 | ＳｉＣウェハの製造方法 |
-
1985
- 1985-12-09 JP JP27759785A patent/JPS62136032A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62136032A (ja) | 1987-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |