JPH0536896U - Semiconductor IC cooling structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve the cooling performance and reduce the size of the device, and to prevent the terminals of the IC and the printed circuit board from being damaged by vibration or shock. [Structure] In FIG. 1A, an IC pin socket 11 is mounted on a printed circuit board 1, a lead terminal of an IC 2 is slidably fitted therein, and a stud bolt 12 is mounted upright on the upper surface of an IC case. A cold plate 6 having a cooling water passage 3 is attached by a stud bolt 12 and a nut 13 so as to be in close contact with the upper surface of the IC case. In FIG. 1B, the leaf spring 21 is mounted on the printed circuit board 1 below the IC 2 without providing the stud bolt. IC
2 is pressed against the bottom surface of the cold plate 6 by the leaf spring 21.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a semiconductor IC cooling structure using cooling water, and more particularly to improvement of cooling performance and miniaturization thereof.

[0002]

[Prior Art]

 A conventional cooling structure of this type will be described with reference to FIG. A plurality of semiconductor ICs (hereinafter simply referred to as ICs) 2 are soldered to a printed circuit board 1, and a cooling module 4 having a cooling water passage 3 is attached so as to be in close contact with the upper surface of the case of these ICs 2. The cooling module 4 comprises a module housing 5 arranged so as to be in close contact with the upper surface of the case of the IC 2, and a cold plate 6 in close contact with the upper surface of the module housing 5 and in which the cooling water channel 3 is embedded. Composed.

A plurality of recesses 5 a are formed on the bottom surface of the module housing 5 so as to face the IC 2. The coil spring 7 and the piston 8 are sequentially inserted into the recess 5 a, and the piston 8 is biased by the coil spring 7 to allow the piston 8 to move. Of the module housing 5 projects from the bottom surface of the module housing 5 and is elastically pressed against the top surface of the case of the IC 2. Cooling water 9 is caused to flow in the cooling water passage 3, and the heat generated in the semiconductor IC 2 is conducted to the cooling water 9 through the heat transfer path 10 to be cooled.

Although not shown, the cooling module 4 is fixed to the housing of the apparatus. The module housing 5, the cold plate 6, and the piston 8 are made of metal such as copper and aluminum.

[0005]

[Problems to be solved by the device]

 In the conventional cooling structure, the sliding contact portion between the inner peripheral surface of the recess 5a of the module housing 5 and the piston 8 has a large thermal resistance, and there is a drawback that sufficient cooling performance cannot be obtained. Further, since the module housing 5 is provided with the concave portion 5a and the coil spring 7 and the piston 8 are housed therein, the cooling module 4 becomes large in size.

The piston 8 has a relatively large weight, and when an inertial force is supported by vibration, impact, etc., an abnormally large force is applied to the lead terminal of the IC by the piston 8, and the base of the lead terminal and the print are printed. There was a fear that the conductor pattern of the terminal soldering part of the board 1 would be damaged. It is an object of the present invention to solve these conventional drawbacks and provide a cooling structure for a semiconductor IC, which has a good cooling performance, is small, and does not damage IC terminals or a printed circuit board.

[0007]

[Means for Solving the Problems]

 According to another aspect of the semiconductor IC cooling structure of the present invention, the IC pin sockets are attached to the printed circuit board, the lead terminals of the semiconductor ICs are slidably fitted in the pin sockets, and the studs are mounted on the upper surface of the semiconductor IC case. A bolt is installed upright and a cold plate having a cooling water channel is attached so as to be in close contact with the upper surface of the case of the semiconductor IC by the studd bolt and a nut screwed with the studd bolt.

According to another aspect of the cooling structure of the present invention, an IC pin socket and a leaf spring are attached to a printed circuit board, and a lead terminal of a semiconductor IC disposed on the leaf spring slides on the IC pin socket. A cold plate, which is freely fitted and has a cooling water channel, is arranged in contact with the upper surface of the case of the semiconductor IC, and the upper surface of the case of the semiconductor IC is pressed against the bottom surface of the cold plate 6 by the leaf spring.

[0009]

【Example】

 An embodiment of the present invention will be described with reference to FIG. 1A in which parts corresponding to those in FIG. The IC pin socket 11 is soldered to the printed circuit board 1, and the lead terminals of the IC 2 are slidably fitted to the pin socket 11. The stat bolt 12 is attached to the upper surface of the case of the IC 2 by welding or adhesion. The cold plate 6 having the cooling water passage 3 is attached in close contact with the upper surface of the case of the IC 2 by the stud bolt 12 and the nut 13 screwed to the stud bolt 12.

The heat generated inside the IC is conducted to the cold plate 6 directly from the upper surface of the case or to the cold plate 6 via the stud bolts 12, and is cooled by the cooling water 9. Normally, the IC 2 is soldered to the printed circuit board 1 as shown in FIG. 2, but in this state, the heights of the upper surfaces of the cases are different, and the cold plates 6 are placed on the cases of the plurality of ICs 2. Then, some parts of the IC 2 cannot come into contact with the cold plate 6. Therefore, conventionally, the piston 8 is biased by the coil spring 7 so as to press the upper surface of the case to solve this problem.

In this invention, since the lead terminal of the IC is slidable in the insertion / removal direction with respect to the pin socket 11 by using the pin socket 11, the height of the upper surface of the case from the printed circuit board 1 can be increased. Can be adjusted, and there is nothing that cannot touch the cold plate 6. Alternatively, a plurality of ICs 2 may be attached to the cold plate 6 in advance with the stat bolts 12 and nuts 13, and then the lead terminals of the ICs may be fitted into the pin sockets 11. In either case, the cold plate 6 is finally fixed to the housing of the device, which is not shown.

According to the second aspect of the invention, as shown in FIG. 1B, the leaf spring 21 is attached to the printed circuit board 1 below the IC case with screws and soldering, and the leaf spring 21 raises the IC case upward. To press the cold plate 6 into close contact. The leaf spring 21 is formed in an arc shape in the example of FIG. 1B, and is composed of an arc portion 21a and a flat portion 21b in which one end of the arc portion 21a is bent and extended inward, and the flat portion 21b is formed on the printed circuit board 1. It is mounted so that the outer surface (upper surface) of the arc portion 21a presses the bottom surface of the IC case. A heat transfer sheet 22 such as a silicone rubber sheet may be interposed between the IC case and the cold plate 6 as necessary.

[0013]

[Effect of the device]

 According to this invention, the upper surface of the case of the semiconductor IC is brought into close contact with the cold premute 6 by the stud bolt 12 or the plate panel 21, so that the sliding of the heat transfer path 6 with a large thermal resistance as in the conventional case. Since there is no contact portion and the IC case is directly adhered to the cold plate 6 without passing through the conventional module housing 5, heat dissipation performance is significantly improved as compared with the conventional case. Further, since the conventional module housing 5 is unnecessary, the cooling structure can be downsized accordingly.

In this invention, since a movable body having a relatively large weight like the conventional piston 8 is not used, there is no possibility of damaging the lead terminal of the IC or the conductor pattern of the printed circuit board by vibration or impact.

[Brief description of drawings]

FIG. 1A is a sectional view showing an embodiment of the device of claim 1;
FIG. 3 is a sectional view showing an embodiment of the invention of claim 2.

FIG. 2 is a cross-sectional view showing a conventional semiconductor IC cooling structure.

Claims (2)

[Scope of utility model registration request] 1. An IC pin socket is mounted on a printed circuit board, a lead terminal of a semiconductor IC is slidably fitted in the pin socket, and a stud bolt is erected on the upper surface of the case of the semiconductor IC for cooling. A cooling structure for a semiconductor IC, wherein a cold plate having a water channel is attached so as to be in close contact with the upper surface of the case of the semiconductor IC by a stud bolt and a nut screwed with the stud bolt. 2. An IC pin socket and a leaf spring are attached to a printed circuit board, and a lead terminal of a semiconductor IC disposed on the leaf spring is
The cold plate, which is slidably fitted in the IC pin socket and has a cooling water channel, is the semiconductor IC.
The semiconductor IC cooling structure, which is disposed so as to be in contact with the case upper surface, and the case upper surface of the semiconductor IC is pressed against the bottom surface of the cold plate 6 by the leaf spring.