JPH05335390A - Inspection apparatus of bonding wire - Google Patents
Inspection apparatus of bonding wireInfo
- Publication number
- JPH05335390A JPH05335390A JP14227492A JP14227492A JPH05335390A JP H05335390 A JPH05335390 A JP H05335390A JP 14227492 A JP14227492 A JP 14227492A JP 14227492 A JP14227492 A JP 14227492A JP H05335390 A JPH05335390 A JP H05335390A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- pad
- edge
- bonding wire
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 51
- 238000003384 imaging method Methods 0.000 claims abstract description 9
- 238000013500 data storage Methods 0.000 claims abstract description 8
- 238000005286 illumination Methods 0.000 claims abstract description 6
- 238000003708 edge detection Methods 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 230000005484 gravity Effects 0.000 claims 1
- 238000011179 visual inspection Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】本発明は，ＩＣ，ＬＳＩ等のボンディングワイ
ヤの外観検査装置に関し，ワイヤ部分をボンディングボ
ール部として検出しないようにし，ボンディングの位置
ずれを精度良く検査することのできるボンディングワイ
ヤ検査装置を得ることを目的とする。
【構成】照明手段11, 撮像手段12, 画像メモリ14, 画像
処理手段16を有するボンディングワイヤ検査装置におい
て, パッド５の位置，或いは外形に関するデータを格納
するパッドデータ記憶手段17，ボンディングボールを検
出するためのスライスレベルを設定するスライスレベル
設定手段18，ボール中心3B位置を検出するボール中心検
出手段19，ボールエッジ検出領域を設定するボールエッ
ジ検出領域設定手段20，ボールエッジ検出領域設定手段
20で設定した領域において，スライスレベル設定手段18
で設定したスライスレベルを用いてボールエッジ3Aを検
出するボールエッジ検出手段21，パッドエッジ5Aとボー
ルエッジ3Aとの相対的位置関係からボール３のパッド５
外へのはみ出し，隣接パッド７への短絡を検出するボー
ル位置ずれ検出手段22を備えているように構成する。
(57) [Summary] [Object] The present invention relates to a visual inspection apparatus for bonding wires such as ICs and LSIs, which is capable of accurately inspecting the positional deviation of bonding by preventing the wire portion from being detected as a bonding ball portion. The purpose is to obtain a bonding wire inspection device. A bonding wire inspection apparatus having an illumination means 11, an imaging means 12, an image memory 14, and an image processing means 16 detects a pad data storage means 17 for storing data on the position or outer shape of a pad 5, and a bonding ball. Level setting means 18 for setting a slice level for setting, a ball center detecting means 19 for detecting the position of the ball center 3B, a ball edge detecting area setting means 20 for setting a ball edge detecting area, and a ball edge detecting area setting means.
In the area set by 20, slice level setting means 18
The pad 5 of the ball 3 is detected from the relative positional relationship between the ball edge 3A and the pad edge 5A, which detects the ball edge 3A using the slice level set in step 3.
A ball position deviation detecting means 22 for detecting the protrusion to the outside and a short circuit to the adjacent pad 7 is provided.
Description
【０００１】[0001]
【産業上の利用分野】本発明は，ＩＣ，ＬＳＩ等のボン
ディングワイヤの外観検査装置に関する。近年，ＩＣ，
ＬＳＩ等が広範囲で大量に使用されており，ボンディン
グワイヤの外観検査の自動化が行なわれている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection apparatus for bonding wires such as IC and LSI. In recent years, IC,
LSIs and the like are widely used in large quantities, and the visual inspection of bonding wires is automated.
【０００２】ボンディングワイヤがボンディングされる
半導体基板上のパッドの間隔は年々小さくなっており，
ボンディングワイヤ先端のボンディング部であるボール
の電気的短絡の検査が必須となる。The distance between the pads on the semiconductor substrate to which the bonding wires are bonded is becoming smaller year by year.
It is essential to inspect the ball, which is the bonding portion at the tip of the bonding wire, for an electrical short.
【０００３】これを外観検査により発見するためには，
ボールとパッドの位置関係を検査する必要がある。In order to discover this by visual inspection,
It is necessary to inspect the positional relationship between the ball and the pad.
【０００４】[0004]
【従来の技術】図６は従来例の説明図である。図におい
て，１はボンディングワイヤ，２はワイヤ，３はボー
ル，3Aはボールエッジ, 3Cははみ出し部, 3Dは短絡部,
６は検査パッド, ７は隣接パッド, ８は絶縁膜である。2. Description of the Related Art FIG. 6 is an explanatory view of a conventional example. In the figure, 1 is a bonding wire, 2 is a wire, 3 is a ball, 3A is a ball edge, 3C is a protruding portion, 3D is a short-circuited portion,
6 is an inspection pad, 7 is an adjacent pad, and 8 is an insulating film.
【０００５】図６（ａ）に正常なボンディング位置の場
合, 図６（ｂ）にボンディング位置が不良の場合で示す
ように，ボンディングワイヤ１のボンディング部分とな
る先端のボール３と検査対象となる検査パッド６の位置
関係を検査するために，検査装置の視野に入るチップ上
の絶縁膜８，ボール３と検査パッド６の色調は，大別す
れば，それぞれ中間色系，暗色系，明色系に分けられ
る。As shown in the case of a normal bonding position in FIG. 6A and in the case of a defective bonding position in FIG. 6B, the tip ball 3 which is the bonding portion of the bonding wire 1 and the inspection object. In order to inspect the positional relationship of the inspection pad 6, the color tone of the insulating film 8 on the chip, the ball 3 and the inspection pad 6 which are in the visual field of the inspection device are roughly classified into an intermediate color system, a dark color system and a light color system, respectively. It is divided into
【０００６】従来のボンディングワイヤ１の外観検査に
おいて，ボール３と検査パッド６の位置関係がずれてい
るかどうかのボール３のはみ出し検査では，図６（ａ）
のように，検査対象となる検査パッド６から隣接パッド
７方向へのはみ出し部3Cを，図６（ｃ）に示すように，
検査パッド６と隣接パッド７間，及び隣接パッド７上の
領域で明色（白）と暗色（黒）の二値化を行なって, は
み出し部3Cの大きさ,形状を検出していた。はみ出し部3
Cが大きい場合には, 図６（ｄ）に示すように，隣接パ
ッド７上の領域にはみ出し部3Cが掛り, 短絡部3Dとなっ
て, ボンディング不良と判定される。[0006] In the conventional visual inspection of the bonding wire 1, the protrusion of the ball 3 showing whether or not the positional relationship between the ball 3 and the inspection pad 6 is displaced is shown in FIG.
As shown in FIG. 6C, the protruding portion 3C from the inspection pad 6 to be inspected in the direction of the adjacent pad 7 is
The bright color (white) and the dark color (black) are binarized between the inspection pad 6 and the adjacent pad 7 and in the area on the adjacent pad 7 to detect the size and shape of the protruding portion 3C. Overhang part 3
When C is large, as shown in FIG. 6D, the protruding portion 3C is applied to the region on the adjacent pad 7 and becomes the short-circuited portion 3D, and it is determined that the bonding is defective.
【０００７】しかし，このような二値化の方式では, 実
際にボンディングワイヤ１のワイヤ２とボール３の境界
を区別することはできず, 図６（ｅ）に示すように，実
際は短絡していなくても，ボンディングワイヤ１の方向
によっては, はみ出し部3Cにボンディングワイヤ１のワ
イヤ２の部分も同時にはみ出し部3Cとして判定され，し
ばしば図６（ｆ）のように隣接パッド７にかかる部分が
短絡部3Dとみなされ，ボンディング不良として判定され
る場合があった。However, in such a binarization method, the boundary between the wire 2 of the bonding wire 1 and the ball 3 cannot be actually distinguished, and as shown in FIG. Even if the bonding wire 1 does not exist, depending on the direction of the bonding wire 1, the wire 2 portion of the bonding wire 1 is also determined as the protruding portion 3C at the protruding portion 3C at the same time, and as shown in FIG. In some cases, it was regarded as part 3D and was judged to be defective bonding.
【０００８】[0008]
【発明が解決しようとする課題】このように，従来の方
法では，ボンディングワイヤ１が斜め方向に延びている
場合でも，ボール３のネックからワイヤ２にかけての部
分もボール３の一部として検出していたため, しばしば
図６（ｆ）のようにボンディング不良として誤った判定
をされる場合があった。As described above, according to the conventional method, even when the bonding wire 1 extends obliquely, the portion from the neck of the ball 3 to the wire 2 is also detected as a part of the ball 3. Therefore, as shown in FIG. 6 (f), there is often a case where an incorrect determination is made as a defective bonding.
【０００９】本発明は，以上の点を鑑み，ボンディング
ワイヤ１のワイヤ２の部分をボール３の部分として誤認
して検出しないようにし，ワイヤボンディング１の位置
ずれを精度良く検査することのできるボンディングワイ
ヤ検査装置を提供することを目的とする。In view of the above points, the present invention prevents the wire 2 portion of the bonding wire 1 from being erroneously recognized as the ball 3 portion so as not to be detected, and the positional deviation of the wire bonding 1 can be accurately inspected. An object is to provide a wire inspection device.
【００１０】[0010]
【課題を解決するための手段】図１は本発明のボンディ
ングワイヤ外観検査装置における画像処理手段の原理構
成図であり，図２は本発明のボール位置ずれ検査処理フ
ロー，図３は本発明によるボール二値化画像からのボー
ルエッジ検出手段説明図である。FIG. 1 is a diagram showing the principle configuration of an image processing means in a bonding wire appearance inspection apparatus according to the present invention, FIG. 2 is a ball position deviation inspection processing flow according to the present invention, and FIG. 3 is according to the present invention. It is a ball edge detection means explanatory drawing from a ball binarized image.
【００１１】図において，２はワイヤ，３はボール，3B
はボール中心，3Cはボールはみ出し部, ６は検査パッ
ド, ７は隣接パッド, 17はパッド・データ記憶手段，18
はスライスレベル設定手段，19はボール中心検出手段,
20はボールエッジ検出領域設定手段, 21はボールエッジ
検出手段, 22はボール位置ずれ検査手段である。In the figure, 2 is a wire, 3 is a ball, and 3B.
Is the ball center, 3C is the ball protrusion, 6 is an inspection pad, 7 is an adjacent pad, 17 is pad data storage means, 18
Is a slice level setting means, 19 is a ball center detecting means,
Reference numeral 20 is a ball edge detection area setting means, 21 is a ball edge detection means, and 22 is a ball position deviation inspection means.
【００１２】図１において，17はパッド・データ記憶手
段であり，チップ４上の各パッド５に関する座標位置，
寸法サイズ等のデータが格納してある。20はボールエッ
ジ検出領域設定手段であり，パッド・データ記憶手段17
のパッド・データを基にボール３のボールエッジ3Aを検
出する領域を設定する。21はボールエッジ検出手段であ
り，ボンディングワイヤ１のワイヤ２, ボール３, パッ
ド５の二値化を行ない, 更に, ボンディングワイヤ１の
ワイヤ２とボール３の境界を切り分ける。22は二値化の
データからボール３とパッド５の位置関係を検出し，ボ
ール３の位置ずれの程度を算出するボール位置ずれ検査
手段である。In FIG. 1, 17 is a pad data storage means, which is a coordinate position for each pad 5 on the chip 4,
Data such as size and size are stored. Reference numeral 20 is a ball edge detection area setting means, and pad / data storage means 17
An area for detecting the ball edge 3A of the ball 3 is set based on the pad data of 3. Reference numeral 21 denotes a ball edge detecting means, which binarizes the wire 2, the ball 3, and the pad 5 of the bonding wire 1, and further divides the boundary between the wire 2 of the bonding wire 1 and the ball 3. Reference numeral 22 is a ball position deviation inspection means for detecting the positional relationship between the ball 3 and the pad 5 from the binarized data and calculating the degree of positional deviation of the ball 3.
【００１３】即ち，本発明の目的は，図４に示すよう
な，照明手段（照明装置）11，撮像手段（撮像装置）1
2，画像メモリ14，画像処理手段（画像処理）16を有す
るボンディングワイヤ検査装置において,図１に示すよ
うに，チップ４上のパッド５の位置，或いは外形に関す
るデータを格納するパッド・データ記憶手段17，ボンデ
ィングワイヤ１のボール３を検出するためのスライスレ
ベルを設定するスライスレベル設定手段18，ボール３の
ボール中心3B位置を検出するボール中心検出手段19，ボ
ール３のボールエッジ3Aの検出領域を設定するボールエ
ッジ検出領域設定手段20，ボールエッジ検出領域設定手
段20で設定した領域において，スライスレベル設定手段
18で設定したスライスレベルを用いてボール３のボール
エッジ3Aを検出するボールエッジ検出手段21, 検査パッ
ド６のパッドエッジ5Aとボール３のボールエッジ3Aとの
相対的位置関係からボール３の検査パッド６外へのはみ
出し，隣接パッド７への短絡を検出するボール位置ずれ
検出手段22を備えていることにより達成される。That is, the object of the present invention is to illuminate means (illumination device) 11 and imaging means (imaging device) 1 as shown in FIG.
2, a bonding wire inspection device having an image memory 14 and an image processing means (image processing) 16, as shown in FIG. 1, pad data storage means for storing data relating to the position or outer shape of the pad 5 on the chip 4 17, a slice level setting means 18 for setting a slice level for detecting the ball 3 of the bonding wire 1, a ball center detecting means 19 for detecting a ball center 3B position of the ball 3, and a detection area of a ball edge 3A of the ball 3. Slice level setting means in the area set by the ball edge detection area setting means 20 and the ball edge detection area setting means 20 to be set
Ball edge detecting means 21 for detecting the ball edge 3A of the ball 3 using the slice level set in 18, the inspection pad of the ball 3 from the relative positional relationship between the pad edge 5A of the inspection pad 6 and the ball edge 3A of the ball 3. 6 is provided by the ball position deviation detecting means 22 for detecting the protrusion to the outside and the short circuit to the adjacent pad 7.
【００１４】[0014]
【作用】図２はボール位置ずれ検査処理のフローを示し
ている。ボンディングボール検出手段では，パッドが隣
接する両側２方向，或いは，それと垂直な方向におい
て，パッドエッジを含むライン，或いはパッドエッジの
外側ラインから，隣のパッド，或いは，反ワイヤ方向へ
向かってパッドの辺に平行なラインを走査してボールエ
ッジを検出する。FIG. 2 shows a flow of ball position deviation inspection processing. In the bonding ball detecting means, in two directions on both sides where the pads are adjacent to each other, or in a direction perpendicular to the two sides, from the line including the pad edge or the line outside the pad edge to the adjacent pad or the anti-wire direction, The line parallel to the side is scanned to detect the ball edge.
【００１５】図３にボールエッジ検出方法を示す。走査
ライン上でボール画像を二値化し，その投影値が１以上
であればボールが存在し，０であればボールが無いと判
定する。FIG. 3 shows a ball edge detecting method. The ball image is binarized on the scanning line, and if the projection value is 1 or more, it is determined that the ball exists, and if 0, it is determined that the ball does not exist.
【００１６】若し，スタートライン上にボールが無けれ
ば，ボール検出処理を終わる。若し，ボールがあれば，
更にパッドの外側方向に向かってボール検出を行い，ボ
ールが検出できなくなるか，ある一定距離ボールが検出
されるまでボールの部分を検出する。ボールが検出でき
なくなるラインが見つかれば，その１ライン手前のライ
ンにボールエッジがある。If there is no ball on the start line, the ball detection process ends. If you have a ball,
Further, the ball is detected toward the outside of the pad, and the ball portion is detected until the ball cannot be detected or the ball is detected for a certain distance. If a line where the ball cannot be detected is found, there is a ball edge on the line immediately before the line.
【００１７】[0017]
【実施例】図４は本発明の一実施例のシステム構成図で
あり，ＩＣワイヤ外観検査装置を示している。また，図
５には実施例におけるいくつかの走査範囲を示してい
る。FIG. 4 is a system configuration diagram of an embodiment of the present invention, showing an IC wire appearance inspection device. Further, FIG. 5 shows some scanning ranges in the embodiment.
【００１８】図において，１はボンディングワイヤ，２
はワイヤ，３はボール，3Aはボール中心，3Bはボールエ
ッジ，3Cはボールはみ出し部, 3Dはボール短絡部, ４は
チップ，５はパッド，5Aはパッドエッジ, ６は検査パッ
ド, ７は隣接パッド, ８は絶縁膜，９はウィンドウ，10
はフレームフィーダ, 11は照明手段（照明装置) , 12は
撮像手段（撮像装置），13は画像入力回路, 14は画像メ
モリ, 15はウィンドウ生成部, 16は画像処理，17はパッ
ド・データ記憶手段（パッド・データ・メモリ），18は
スライスレベル設定手段（スライスレベル設定部），19
はボール中心検出手段（ボール中心検出部）, 20はボー
ルエッジ検出領域設定手段（ボールエッジ検出領域設定
部）, 21はボールエッジ検出手段（ボールエッジ検出
部）, 22はボール位置ずれ検査手段（ボール検査部）で
ある。In the figure, 1 is a bonding wire, and 2 is a bonding wire.
Is a wire, 3 is a ball, 3A is a ball center, 3B is a ball edge, 3C is a ball protruding portion, 3C is a ball protruding portion, 3D is a ball shorting portion, 4 is a chip, 5 is a pad, 5A is a pad edge, 6 is an inspection pad, and 7 is adjacent. Pad, 8 insulating film, 9 window, 10
Is a frame feeder, 11 is an illuminating device (illuminating device), 12 is an imaging device (imaging device), 13 is an image input circuit, 14 is an image memory, 15 is a window generator, 16 is image processing, 17 is pad data storage Means (pad data memory), 18 means slice level setting means (slice level setting section), 19
Is a ball center detecting means (ball center detecting section), 20 is a ball edge detecting area setting means (ball edge detecting area setting section), 21 is a ball edge detecting means (ball edge detecting section), 22 is a ball position deviation checking means ( Ball inspection section).
【００１９】フレームフィーダ10で検査対象であるチッ
プ４を撮像装置12の真下に搬送する。同軸落射照明装置
11からの光をパッド５上のボンディングワイヤ１のボー
ル３の部分に照射し，その反射光を撮像装置12で撮像す
る。撮像した画像データを画像入力回路13で 256諧調の
ディジタル画像に変換し, 画像メモリ14に格納する。The chip 4 to be inspected is conveyed by the frame feeder 10 directly below the image pickup device 12. Coaxial epi-illumination device
The light from 11 is applied to the ball 3 portion of the bonding wire 1 on the pad 5, and the reflected light is imaged by the imaging device 12. The captured image data is converted into a 256-tone digital image by the image input circuit 13 and stored in the image memory 14.
【００２０】ウインドウ生成部15では, パッド・データ
・メモリ17のパッド中心位置を基に画像メモリ14の画像
データからボンディングワイヤ１のボール３の画像をウ
インドウ９内に切り出す。The window generator 15 cuts out the image of the ball 3 of the bonding wire 1 into the window 9 from the image data of the image memory 14 based on the pad center position of the pad data memory 17.
【００２１】ボール中心検出部19では, ボール３の画像
を二値化した後に距離変換を行って, 最大距離となる位
置をボール中心3Bとする。ボールエッジ検出領域設定部
20では, パッド・データ・メモリ17のパッドエッジ5Aの
座標と, ボール中心検出部19で検出したボール中心3Bの
位置を基に, ボールエッジ検出領域を設定する。In the ball center detection unit 19, the image of the ball 3 is binarized and then the distance is converted, and the position having the maximum distance is set as the ball center 3B. Ball edge detection area setting section
At 20, the ball edge detection area is set based on the coordinates of the pad edge 5A of the pad data memory 17 and the position of the ball center 3B detected by the ball center detection unit 19.
【００２２】ボールエッジ検出部21では，ボールエッジ
検出領域において先に二値化したボール３の画像から検
査ライン上の投影値を求め，値が零ならばボール３無
し，１以上ならばボール３有りと判定してボール３の部
分を検出する。The ball edge detection unit 21 obtains a projection value on the inspection line from the image of the ball 3 previously binarized in the ball edge detection area. If the value is zero, there is no ball 3, and if it is 1 or more, the ball 3 is present. The part of the ball 3 is detected as being present.
【００２３】隣接パッド７方向の二方向の処理領域は図
５（ａ）に示すように，ボール中心3Bに対応する位置か
ら，反ワイヤ方向へ標準ボール半径にマージンを持つ長
さとする。反ワイヤ方向の処理領域は図５（ｂ）に示す
ように，ボール中心3Bに対応する位置から両側へ標準ボ
ール半径にマージンを持つ長さとする。As shown in FIG. 5A, the processing areas in the two directions of the adjacent pads 7 have a length having a margin in the standard ball radius in the direction opposite to the wire from the position corresponding to the ball center 3B. As shown in FIG. 5B, the processing area in the anti-wire direction has a length having a margin in the standard ball radius from the position corresponding to the ball center 3B to both sides.
【００２４】ワイヤ２の方向を除く三方向において，以
下の処理を行う。先ず，パッドエッジ5A上ラインでボー
ル３を検出する。もし，パッドエッジ5A上のラインにボ
ール３が無い場合には，そこで処理を終わる。もし，ラ
イン上にボール３があれば更に，パッド５の外側に向か
ってボール３がないラインが見つかるまで同様の処理を
行う。最後にボール３を検出したラインにその方向のボ
ールエッジ3Aがある。The following processing is performed in three directions except the direction of the wire 2. First, the ball 3 is detected on the line above the pad edge 5A. If there is no ball 3 on the line on the pad edge 5A, the process ends there. If the ball 3 is on the line, the same process is further performed toward the outside of the pad 5 until a line without the ball 3 is found. Finally, the line where the ball 3 is detected has the ball edge 3A in that direction.
【００２５】反ワイヤ方向のボール検出ではみ出し部3C
が無い場合は，図５（ｃ）のようにパッド中心5B方向へ
走査を行ってボールエッジ3Aを検出する。ワイヤ方向の
ボール３とワイヤ２の境界はボール中心3Bから反ワイヤ
方向のボールエッジ3Aまでの距離だけワイヤ２の方向に
折り返した位置にあると仮定する。When detecting the ball in the opposite wire direction, the protruding portion 3C
If not present, the ball edge 3A is detected by scanning in the pad center 5B direction as shown in FIG. It is assumed that the boundary between the ball 3 and the wire 2 in the wire direction is at the position folded back in the direction of the wire 2 by the distance from the ball center 3B to the ball edge 3A in the opposite wire direction.
【００２６】ボール位置ずれ判定部22では，ボールエッ
ジ3Aの座標とパッドエッジ5Aの座標の相対関係からボー
ル３の位置ずれを判定する。ボール３が隣りのパッド５
上に入り込んでいたらショートと判定し，隣接パッド７
間にはみ出していたら警告する。パッド５の隣接する両
側でボール３がショートしておらず，それと垂直な二方
向でボールはみ出しが規定値内であれば，良品と判定す
る。The ball misalignment determination unit 22 determines the misalignment of the ball 3 from the relative relationship between the coordinates of the ball edge 3A and the coordinates of the pad edge 5A. Pad 3 with ball 3 next to it
If it gets in the upper part, it is judged as a short and the adjacent pad 7
Warn if it sticks out. If the balls 3 are not short-circuited on both sides of the pad 5 which are adjacent to each other and the protrusion of the balls in two directions perpendicular to the short-circuit is within the specified value, it is judged as a good product.
【００２７】上述の実施例においては，検査パッド６か
ら隣接パッド７の方向に走査を行っているが，隣接パッ
ド７から検査パッド６に走査して短絡部3Dの検出を優先
しても良い。In the above embodiment, scanning is performed from the inspection pad 6 to the adjacent pad 7, but the adjacent pad 7 may be scanned to the inspection pad 6 to give priority to the detection of the short circuit portion 3D.
【００２８】また，上述の実施例においては，検査パッ
ド６の外側方向にボール検出走査を行っているが，パッ
ド中心5Bの方向に走査を行い，検査パッド６内のボール
エッジ3Aを検出してボール３の径の検査を行っても良
い。Further, in the above-mentioned embodiment, the ball detection scanning is performed in the outer direction of the inspection pad 6, but scanning is performed in the direction of the pad center 5B to detect the ball edge 3A in the inspection pad 6. The diameter of the ball 3 may be inspected.
【００２９】更に，上述の実施例においては，隣接パッ
ド７の方向でパッド外側方向にボール３のはみ出し検出
を行い，パッドエッジ5A上にボール３が無ければ，その
方向の処理を終えているが，その後，検査パッド６の内
側方向へボールエッジ検出を行ってもよい。Further, in the above-described embodiment, the protrusion of the ball 3 is detected in the pad outer direction in the direction of the adjacent pad 7, and if there is no ball 3 on the pad edge 5A, the processing in that direction is finished. After that, ball edge detection may be performed inward of the inspection pad 6.
【００３０】[0030]
【発明の効果】以上説明したように, 本発明によれば,
ボンディングワイヤのボールのパッド外への位置ずれ
を，詳細な処理を行うことなく速やかに発見することが
でき，ボンディング精度の良否を早期にワイヤボンダに
フィードバックできるとともに，ボンディングワイヤ検
査の自動化に寄与するところが大きい。As described above, according to the present invention,
The misalignment of the bonding wire ball to the outside of the pad can be quickly detected without performing detailed processing, and the quality of the bonding accuracy can be fed back to the wire bonder at an early stage, which contributes to the automation of the bonding wire inspection. large.
【図１】 本発明の原理構成図FIG. 1 is a block diagram of the principle of the present invention.
【図２】 本発明のボール位置ずれ検査処理フローFIG. 2 is a flow chart of a ball position deviation inspection processing of the present invention.
【図３】 本発明のボールエッジ検出手段説明図FIG. 3 is an explanatory view of a ball edge detecting means of the present invention.
【図４】 本発明の一実施例のシステム構成図FIG. 4 is a system configuration diagram of an embodiment of the present invention.
【図５】 本発明の実施例における幾つかの走査範囲FIG. 5 shows several scanning ranges according to an embodiment of the present invention.
【図６】 従来例の説明図FIG. 6 is an explanatory diagram of a conventional example.
１ ボンディングワイヤ ２ ワイヤ ３ ボール 3A ボールエッジ 3B ボール中心 3C はみ出し部 3D 短絡部 ４ チップ ５ パッド 5A パッドエッジ ６ 検査パッド ７ 隣接パッド ８ 絶縁膜 ９ ウィンドウ 10 フレームフィーダ 11 照明手段（照明装置) 12 撮像手段（撮像装置） 13 画像入力回路 14 画像メモリ 15 ウィンドウ生成部 16 画像処理手段 17 パッド・データ記憶手段（パッド・データ・メモ
リ） 18 スライスレベル設定手段（スライスレベル設定部） 19 ボール中心検出手段（ボール中心検出部） 20 ボールエッジ検出領域設定手段（ボールエッジ検出
領域設定部） 21 ボールエッジ検出手段（ボールエッジ検出部） 22 ボール位置ずれ検査手段（ボール検査部）1 bonding wire 2 wire 3 ball 3A ball edge 3B ball center 3C protruding part 3D short-circuited part 4 chip 5 pad 5A pad edge 6 inspection pad 7 adjacent pad 8 insulating film 9 window 10 frame feeder 11 illumination means (illumination device) 12 imaging means (Imaging device) 13 Image input circuit 14 Image memory 15 Window generation section 16 Image processing means 17 Pad data storage means (pad data memory) 18 Slice level setting means (slice level setting section) 19 Ball center detection means (ball Center detection section) 20 Ball edge detection area setting means (ball edge detection area setting section) 21 Ball edge detection means (ball edge detection section) 22 Ball position deviation inspection means (ball inspection section)
Claims (7)
リ(14), 画像処理手段(16)を有するボンディングワイヤ
検査装置において, 半導体基板上のパッド(5) の位置，或いは外形に関する
データを格納するパッドデータ記憶手段(17)， ボンディングワイヤ先端のボール(3) を検出するための
スライスレベルを設定するスライスレベル設定手段(1
8)， 該ボール(3) のボール中心(3B)位置を検出するボール中
心検出手段(19)， 該ボール(3) のボールエッジ(3A)の検出領域を設定する
ボールエッジ検出領域設定手段(20), 該ボールエッジ検出領域設定手段(20)で設定した領域に
おいて，該スライスレベル設定手段(18)で設定した該ス
ライスレベルを用いてボールエッジ(3A)を検出するボー
ルエッジ検出手段(21)， パッドエッジ(5A)とボールエッジ(3A)との相対的位置関
係から該ボール(3) の検査パッド(6) 外へのはみ出し，
隣接パッド(7) への短絡を検出するボール位置ずれ検出
手段(22)を備えていることを特徴とするボンディングワ
イヤ検査装置。1. A bonding wire inspection apparatus having an illumination means (11), an imaging means (12), an image memory (14), and an image processing means (16), in which the position of the pad (5) on the semiconductor substrate or the outer shape thereof is determined. Pad data storage means (17) for storing data relating to the above, and slice level setting means (1) for setting a slice level for detecting the ball (3) at the tip of the bonding wire.
8), ball center detection means (19) for detecting the ball center (3B) position of the ball (3), and ball edge detection area setting means (19) for setting the detection area of the ball edge (3A) of the ball (3) 20), a ball edge detection means (21) for detecting a ball edge (3A) using the slice level set by the slice level setting means (18) in the area set by the ball edge detection area setting means (20) ), The protrusion of the ball (3) out of the inspection pad (6) from the relative positional relationship between the pad edge (5A) and the ball edge (3A),
A bonding wire inspection device comprising a ball position deviation detection means (22) for detecting a short circuit to an adjacent pad (7).
前記ボール(3) の二値画像を距離変換して，最大距離の
位置をボール中心(3B)とすることを特徴とする請求項１
記載のボンディングワイヤ検査装置。2. The ball center detecting means (19),
The binary image of the ball (3) is subjected to distance conversion, and the position of the maximum distance is set as the ball center (3B).
Bonding wire inspection device described.
前記ボール(3) の二値画像の重心位置を前記ボール中心
(3B)とすることを特徴とする請求項１記載のボンディン
グワイヤ検査装置。3. The ball center detecting means (19),
Set the center of gravity of the binary image of the ball (3) to the center of the ball.
The bonding wire inspection apparatus according to claim 1, wherein the bonding wire inspection apparatus is (3B).
において，前記ボール(3) の検出開始位置を，前記検査
パッド(6) のエッジを含むライン，或いはその付近のラ
インに設定し，前記ボールエッジ(3A)を検出するまで，
或いは一定面積，或いは一定距離だけ前記検査パッド
(6) 方向に走査することを特徴とする請求項１記載のボ
ンディングワイヤ検査装置。4. The ball edge detection area setting means (20)
In, the detection start position of the ball (3) is set to a line including the edge of the inspection pad (6) or a line in the vicinity thereof, until the ball edge (3A) is detected,
Alternatively, the inspection pad is a fixed area or a fixed distance.
The bonding wire inspection apparatus according to claim 1, wherein scanning is performed in the (6) direction.
において，前記ボール(3) の検出開始位置を，前記隣接
パッド(7) 上のラインに設定し，前記検査パッド(6) 方
向に走査して短絡検出することを特徴とする請求項１記
載のボンディングワイヤ検査装置。5. The ball edge detection area setting means (20)
2. The method according to claim 1, wherein the detection start position of the ball (3) is set to a line on the adjacent pad (7), and scanning is performed in the direction of the inspection pad (6) to detect a short circuit. Bonding wire inspection device.
て，前記ボール(3) の検出開始位置を，パッドエッジ(5
A)を含むライン，或いはその付近のラインに設定し，前
記ボールエッジ(3A)を検出するまで，或いは一定距離だ
け前記検査パッド(6) 中心方向に走査することを特徴と
する請求項１記載のボンディングワイヤ検査装置。6. In the ball edge detecting means (21), the detection start position of the ball (3) is set to the pad edge (5
The line including A) or a line in the vicinity thereof is set, and scanning is performed toward the center of the inspection pad (6) until the ball edge (3A) is detected or a certain distance. Bonding wire inspection device.
て，前記ボール(3) の前記検査パッド(6) 外はみ出し検
出を行い，はみ出しが無ければ前記検査パッド(6) 内を
走査して前記ボールエッジ(3A)を検出することを特徴と
する請求項１記載のボンディングワイヤ検査装置。7. The ball edge detecting means (21) detects the protrusion of the ball (3) outside the inspection pad (6). If there is no protrusion, the inside of the inspection pad (6) is scanned to detect the ball. The bonding wire inspection apparatus according to claim 1, wherein the edge (3A) is detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14227492A JPH05335390A (en) | 1992-06-03 | 1992-06-03 | Inspection apparatus of bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14227492A JPH05335390A (en) | 1992-06-03 | 1992-06-03 | Inspection apparatus of bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05335390A true JPH05335390A (en) | 1993-12-17 |
Family
ID=15311546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14227492A Withdrawn JPH05335390A (en) | 1992-06-03 | 1992-06-03 | Inspection apparatus of bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05335390A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011004617A1 (en) * | 2009-07-07 | 2011-01-13 | 株式会社新川 | Bonding apparatus and method of correcting bonding position in bonding apparatus |
| JP2012069732A (en) * | 2010-09-24 | 2012-04-05 | Nec Corp | Ball bond inspection device and ball bond inspection method used for the ball bond inspection device |
| CN103823147A (en) * | 2013-11-04 | 2014-05-28 | 中国人民解放军国防科学技术大学 | Bonding wire touch short circuit detection method based on pulse capture |
-
1992
- 1992-06-03 JP JP14227492A patent/JPH05335390A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011004617A1 (en) * | 2009-07-07 | 2011-01-13 | 株式会社新川 | Bonding apparatus and method of correcting bonding position in bonding apparatus |
| JP2012069732A (en) * | 2010-09-24 | 2012-04-05 | Nec Corp | Ball bond inspection device and ball bond inspection method used for the ball bond inspection device |
| CN103823147A (en) * | 2013-11-04 | 2014-05-28 | 中国人民解放军国防科学技术大学 | Bonding wire touch short circuit detection method based on pulse capture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990803 |