JPH05314544A - Optical recording medium - Google Patents

Abstract

(57) [Abstract] [Purpose] Since it is possible to form thinner grooves and smaller pits than in the past, and to make a substrate used for a high-density optical recording medium, it is possible to increase the density of the optical recording medium. To do. [Effect] Since the width of the track groove of the stamper used for the optical recording medium can be made narrower than the conventional one and the pits can be made smaller than the conventional one, a recording film for short wavelength recording which increases the recording density of the optical recording medium is used. It becomes possible to provide the substrate necessary for the existing system, and thereby it is possible to increase the recording density of the optical recording medium, and
There is an effect that a narrow groove or a small pit can be formed by using the conventional optical system.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to the recording of information using light,
The present invention relates to an optical recording medium for reproducing or erasing.

[0002]

2. Description of the Related Art In order to form grooves and pits in mastering of an optical recording medium such as an optical disk, a positive type resist coated on a glass master is exposed using a HeCd laser or Ar laser, A method of developing with an alkaline developer and removing the resist in the exposed portion is adopted.

According to this method, the groove width and pit shape to be formed are determined by the spot diameter of the laser irradiated on the resist surface, the laser intensity distribution, and the sensitivity characteristics of the resist material. Generally, the resist has a reverse trapezoidal cross section in which the lower surface portion is narrow and the surface portion is wide.
This is because the intensity distribution of the laser light used for exposing the resist has a Gaussian distribution, and the spread of the intensity distribution is a factor that widens the pit width of the surface portion.

The width of the groove or pit is substantially equal to the diameter of the laser light and is determined by the numerical aperture NA of the objective lens and the wavelength λ of the laser light. This is 0.82 x λ / NA
HeCd laser (λ = 442 nm) with a short wavelength among the lasers used for mastering given by
Even if the highest NA (0.9) is used, the spot diameter is only 0.4 μm. For example, in the case of the current optical disc, a laser having a wavelength of about 830 nm or 780 nm is used and an NA of about 0.5 is used. Therefore, the spot diameter of the reproduction laser light is not so small, and is about 1.2 μm. It will be about. Therefore, the recording pit has a size of about 0.5 to 0.6 μm due to the contraction of the magnetic domain, and recording / reproducing is performed with this.

[0005]

However, in recent years, a compact and lightweight short wavelength laser of relatively high power,
Short wavelength lasers using SHG elements have been developed. When an optical system using these short-wavelength lasers is put into practical use, a recording technique of the order of 0.2 to 0.3 μm is required for recording, which cannot be handled by the current manufacturing process of optical recording media.

Further, it is difficult to use light having a wavelength of less than 300 nm in the optical system for forming thinner grooves and small pits, and therefore, the resolution of the resist in the system using light is limited. In order to draw a line thinner than 0.4 μm formed by a conventional process, it is considered to use an electron beam or an X-ray in a semiconductor process. To apply this to an optical recording medium, a vacuum system is used. However, there is a problem that the reflection optical system is likely to cause aberrations and the size of the apparatus becomes large.
Therefore, as a result of the above, it is impossible to resolve a line finer than 0.4 μm, and there is a limit to increase the recording density of the optical recording medium.

Therefore, the present invention solves such a problem, and the purpose thereof is as follows.
Since it is possible to form grooves and pits having a width equal to or smaller than the diffraction limit of the optical system, it is possible to form grooves and pits having a width smaller than 0.4 μm, which has been very difficult to produce conventionally. As a result, it becomes possible to form thinner grooves and smaller pits than before, and it is possible to create a substrate used for high-density recording using a short-wavelength laser whose wavelength is shorter than that of semiconductor lasers that are currently mainly used. It is possible to increase the storage capacity of the medium.

[0008]

[Means for Solving the Problems]

(Means 1 for Solving the Problem) In the optical recording medium according to claim 1 of the present invention, a positive resist layer 10 is coated on a master 9 and an organic silica layer 11 is formed on the resist layer 10. Then, a positive type resist layer 12 is further coated on the organic silica layer 11, and a specific region of the resist layer 12 is exposed while the laser beam is focused and the master 9 is rotated. After developing the exposed portion of the resist layer 12, the organic silica layer 11 opened in the developed portion of the resist layer 12 is etched, and the undeveloped resist layer 12 and the organic silica layer 11 are The above-mentioned resist layer 10 opened in the etching portion is etched, the above-mentioned organic silica layer 11 not etched in the first etching is etched, a metal film 19 is formed, and a gold film is further formed. The film 20 is formed, and the metal film 19 and the metal film 20 are used as electrodes to electroform a metal layer 21 of the same kind or different kind as the metal film 20 and peeled off from the master 9 described above to form the metal film 19 described above. A stamper formed by removing is used. (Means 2 for solving the problem) An optical recording medium according to claim 2 of the present invention has a positive resist layer 31 on a master 30.
Is applied, and the organic silica layer 32 is formed on the resist layer 31.
Is formed, a positive resist layer 33 is further applied on the organic silica layer 32, and a specific region of the resist layer 33 is exposed while condensing laser light and rotating the master 30. After developing the exposed portion of the resist layer 33, the organic silica layer 32 opened in the developed portion of the resist layer 33 is etched, and the resist opened in the etched portion of the organic silica layer 32 is etched. The layer 31 is etched to form a metal film 39, the resist 31, the organic silica layer 32, and the resist layer 33 remaining on the master 30 are removed, and the metal film 40 is further formed. The metal film 40 is formed into a film, and the same or different metal layer 41 as the metal film 40 is electroformed by using the metal film 40 as an electrode, and is peeled from the above-mentioned master 30 to form a metal plate. The metal film 30 is removed metal film 42
Is used, and a metal layer 43 of the same kind or different kind as the above-mentioned metal film 40 is electroformed, and a stamper manufactured by peeling from the above-mentioned metal plate is used.

(Means 3 for Solving the Problem) An optical recording medium according to claim 3 of the present invention has a metal film 54 on a master 53.
Is formed, and the metal film 54 is used as an electrode.
The same or different kind of metal layer 55 is electroformed and the metal layer 5
5 is coated with a positive resist layer 56, an organic silica layer 57 is formed on the resist 56, a positive resist layer 58 is further coated on the organic silica layer 57, and laser light is applied. After exposing the specific area of the resist 58 while converging and rotating the master 53, and developing the exposed portion of the resist 58, the resist 5 is removed.
8, the above-mentioned organic silica layer 57 opened in the developing portion is etched, the above-mentioned resist layer 56 opened in the above-mentioned etched portion of the above-mentioned organic silica layer 57 is etched, and a metal film of the same kind as the above-mentioned metal layer 55. A stamper formed by depositing 64 and removing the above-mentioned resist layer 56, the above-mentioned organic silica layer 57 and the above-mentioned resist layer 58 remaining on the above-mentioned master 53 is used.

(Means 4 for Solving the Problems) In the optical recording medium according to claim 4 of the present invention, a positive type resist layer 77 is coated on a master disk 76, and laser light is condensed to the master disk. While rotating 76, the specific area of the resist 77 is exposed, the exposed portion of the resist 77 is developed, and the metal film 83 is formed on the developed portion and the non-developed portion. In the stamper for an optical recording medium, which is formed by electroforming the same or different kind of metal layer 84, before the resist 77 is exposed, the entire surface of the resist 77 is irradiated with ultraviolet light, deep UV, ozone or heat. It is characterized by using a stamper created by

(Means 5 for Solving the Problems) In the optical recording medium according to claim 5 of the present invention, a positive type resist layer 91 is coated on a master plate 90, and a laser beam is condensed to the master plate. While rotating 90, the specific region of the resist layer 91 is exposed to light, the exposed portion of the resist layer 91 is developed, and then the metal film 96 is formed on the developed portion and the non-developed portion. In the stamper for an optical recording medium, which is produced by electroforming a metal layer 97 of the same kind or different kind as the metal film 96 using the electrode as an electrode, after forming the water-soluble resin layer 92 on the resist layer 91, Including the step of exposing a specific region of the resist layer 91, the above-mentioned water-soluble resin layer 92 having the property of increasing the transmittance by heat, or cations generated by light, and the cations described above are used. Characterized by using a stamper which is created by light transmittance to be used for light has a property to increase.

(Means 6 for Solving the Problems) In the optical recording medium according to claim 6 of the present invention, a negative resist layer 105 is coated on a master 104, and a laser beam is condensed to the master. While rotating 104, the above-mentioned resist layer 105
Of the metal film 108 is exposed to light and the non-exposed portion is developed, and then a metal film 108 is formed on the developed portion and the non-developed portion, and the metal film 108 formed on the non-developed portion and the non-developed portion is removed. After removal, a metal film 109 is formed, the metal layer 109 is used as an electrode, and the metal layer 110 is electroformed and separated from the above-mentioned master 104 to form a mother stamper, and the metal plate is used as a mold to further form the metal layer 111. A stamper produced by electroforming and peeling from the mother stamper is used.

(Means 7 for Solving the Problems) An optical recording medium according to claim 7 of the present invention has a metal film 1 on a master 118.
19, a metal layer 120 of the same or different type as that of the metal film 119 is electroformed, a negative resist layer 121 is applied on the metal layer of 120, and a laser beam is condensed to form the resist. After exposing a specific region of the layer 121 and developing the exposed portion, a metal film 124 of the same type as the metal layer 120 is formed.
Is used, and a stamper formed by removing the above-mentioned resist layer 121 remaining on the above-mentioned master 118 and the metal film 124 formed on the resist is used.

(Means 8 for Solving the Problems) In an optical recording medium according to claim 8 of the present invention, a positive type resist layer 134 is coated on a master 133, and amorphous silicon is formed on the resist layer 134. Film, amorphous metal film or microcrystalline metal film 13
5 is formed, and a positive type resist layer 1 is further formed on the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 135.
36 is applied, the laser beam is condensed, and the resist layer 1
The specific area of 36 is exposed, the exposed part is developed, and the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film opened in the developed part is etched halfway to expose the entire surface with light. Irradiation exposes the above-mentioned resist layer 134 in a part of the above-mentioned amorphous silicon film, amorphous metal film or microcrystalline metal film that has been etched halfway, and the above-mentioned resist layer 134 left undeveloped. And after removing the above-mentioned amorphous silicon film, amorphous metal film or microcrystalline metal film 135, a metal film 142 is formed, and a metal layer 143 of the same or different type as the metal film 142 is electroformed, Peeled from the above-mentioned master 133,
It is characterized by using a stamper formed by removing the above-mentioned amorphous silicon film, amorphous metal film or microcrystalline metal film, and the above-mentioned metal film 142.

(Means 9 for Solving the Problems) An optical recording medium according to claim 9 of the present invention comprises an amorphous silicon film, an amorphous metal film or a microcrystalline metal film 154 formed on a master 153. And a positive type resist layer 155 is applied on the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 154,
After exposure using a mask corresponding to the grooves and pits of the optical recording medium, the exposed portion is developed, and the amorphous silicon film, amorphous metal film or microcrystalline metal film 154 opened in the developed portion.
Of the above-mentioned resist layer 1 which was etched and not developed
55 is removed, a metal film 160 is formed, and the metal film 16
It is characterized in that a stamper made by electroforming a metal layer 161 film of the same kind or different kind as 0 and peeling it from the master 153 is used.

(Means 10 for Solving the Problems) In an optical recording medium according to claim 10 of the present invention, a positive resist layer 170 is coated on a master 169, and a metal film 171 is formed on the resist layer 170. Is formed into an extremely thin film, laser light is condensed, and a specific region of the resist layer 170 is exposed from above the metal film 171, the metal film 171 and the exposed portion are developed, and the developed portion and the non-development portion are developed. Metal film 17 on part
4 is formed, and the same kind or different kind of 29 as the metal film 174 is formed.
It is characterized by using a stamper made by electroforming the above metal.

(Means 11 for Solving the Problems) In an optical recording medium according to claim 11 of the present invention, a positive resist layer 183 is coated on a master 182, and a metal film 184 is formed on the resist 183. The metal film 184 is formed and etched using a mask corresponding to the pattern of the optical recording medium, and light having a photosensitive wavelength of the resist layer 183 is applied to the entire surface of the above-mentioned etched portion to expose the above-mentioned etched portion. The opened resist layer 183 is exposed to light, the exposed portion is developed, and the metal film 184 not etched is exposed.
Is removed, a metal film 189 is formed, and a stamper formed by electroforming the metal layer 190 using the metal film 189 as an electrode is used.

(Means 12 for Solving the Problems) In the optical recording medium according to claim 12 of the present invention, a positive resist layer 198 is coated on a master 197, and the resist layer 198 is applied.
A metal film 199 film is formed thereon, and a positive type resist layer 200 is further applied on the metal film 199 film, and a laser beam is condensed to expose a specific region of the resist layer 200, and the exposure is performed. The developed portion is developed, and the metal film 199 opened in the developed portion is etched to form the resist layer 19 described above.
Light having a photosensitive wavelength of 8 is applied to the entire surface of the etched portion to expose the resist layer 198 opened in the etched portion, and the exposed portion of the resist layer 198 and the resist layer 200 are developed using a developing solution. The metal film 199 that has not been etched is removed to remove the metal film 204.
Is formed, and the metal layer 205 is used as an electrode.
It is characterized by using a stamper produced by electroforming.

(Means 13 for Solving the Problems) In the optical recording medium according to claim 13 of the present invention, a positive type resist layer 215 is coated on a master plate 214, and a laser beam is condensed to form the above master plate. While rotating 214, the above-mentioned resist layer 2
15 specific areas are exposed, the above-mentioned exposed portions of the above-mentioned resist layer 215 are developed, a metal film 219 is formed on the developed and non-developed portions, and the same or different metal layer 220 as the metal film 219 is formed. In the stamper for an optical recording medium produced by electroforming, the resist layer 215 is developed before the metal film 219 is formed.
It is characterized by using a stamper formed by forming the B film and including the step of making the groove of the developing portion thin and shallow.

(Means 14 for Solving the Problems) In an optical recording medium according to claim 14 of the present invention, a metal film 228 is formed on a master 227, and the metal film 228 is used as an electrode to form a metal layer 229. Electroforming, coating a positive resist layer 230 on the metal layer 229, focusing laser light to expose a specific area of the resist layer 230, developing the exposed portion, and developing the exposed portion. The exposed metal layer 229 film is etched and the undeveloped resist layer 23.
0 is removed, a metal film 234 is formed, and the metal film 234 is formed.
A stamper formed by electroforming a metal layer 235 on the above, peeling it from the above-mentioned master 227, and removing the above-mentioned metal film 234 is used.

(Means 15 for Solving the Problems) In an optical recording medium according to claim 15 of the present invention, a metal film 243 is formed on a master 242, and a resist layer 244 is applied on the metal film 243. Then, the resist layer 2 is formed by using laser light.
A specific region of 44 is exposed, the exposed portion is developed, a silicon oxide layer is formed, the non-developed portion of the resist layer 244 is removed by etching, and the metal film 243 that appears in the removed portion is etched. Then, after removing the silicon oxide layer described above, a metal film 250 is formed, a metal layer 251 is electroformed on the metal film 250, and peeled from the master 242.
A stamper formed by removing the metal film 243 described above is used.

[0022]

[Action]

(Operation 1) In claim 1 of the present invention, the resist layer 12
The surface of the organosilica is exposed by exposing and developing. In this case, by adjusting the power so that the upper surface of the resist layer 12 is wide and the lower surface is narrow, the width of the next etching can be made narrower than the width of the upper surface of the resist layer 12. After that, the organic silica layer 11 opened in the developed portion of the resist layer 12 is etched by the first dry etching. Also in this case, by adjusting the power so that the lower surface is narrower than the upper surface of the organic silica layer, the width by the next etching can be made narrower than the width opened on the upper surface of the organic silica layer. Then, the resist layer 10 opened in the undeveloped portion of the resist layer 12 and the etched portion of the organic silica layer 11 is etched by, for example, a dry etching method using oxygen.
Then, baking is performed to eliminate the reactivity of the resist layer 10. Therefore, the organic silica layer 11 not etched in the first etching is further etched by the second dry etching. Then, a metal film 19 is formed thereon, a metal film 20 is further formed, and the metal film 19 and the metal film 20 are used as electrodes to form the metal film 20.
The same or different kind of metal layer 21 as that of
The stamper is formed by peeling the metal film 19 and removing the metal film 19 described above. By using the stamper, it is possible to form smaller grooves and smaller pits than the conventional one, so that the recording capacity of the optical recording medium can be increased.

(Function 2) In the second aspect of the present invention, when the specific region of the resist layer 33 is exposed and developed, the organic silica layer 32 is exposed. In that case, when the surface of the resist layer 33 is exposed to the diffraction limit, the width on the organic silica layer 32 becomes narrower than the diffraction limit width. And further organic silica layer 3
When 2 is dry-etched, the resist layer 31 is exposed. Also in that case, the bottom portion of the organic solica layer 2 tends to be narrower than the top portion. Then, when the resist layer 31 is exposed and developed by further irradiating light, its width becomes a line thinner than the diffraction limit of the optical system, and the surface of the master 30 is exposed. Then, by forming a film of a metal 4 which can be dissolved later, a line pattern thinner than the diffraction limit of the optical system is formed. After that, 3 and the resist layer 33 and the organic silica layer 32 are removed by a solvent, a metal of 5 is formed into a film, and it is used as an electrode.
The metal layer 41 is electroformed and separated from the master 30. Then, by melting the 4th metal, the groove width can be made narrower than the diffraction limit of the optical system used for the mastering, and the pits can be formed small. The capacity of the optical recording medium can be increased by using this stamper.

(Function 3) In the third aspect of the present invention, the organic silica layer 57 is exposed when a specific region of the resist layer 58 is exposed and developed. In that case, when the surface of the resist layer 58 is exposed to the diffraction limit, the width on the organic silica layer 57 becomes narrower than the diffraction limit. And further organic silica layer 5
When 7 is dry-etched, the resist layer 56 is exposed. Also in this case, the bottom of the organic silica layer 57 tends to be narrower than the top. Then, when the resist layer 56 is exposed and developed by further irradiating light, its width becomes a line narrower than the diffraction limit of the optical system, and the surface of the metal layer 55 is exposed. By forming a metal film 64 of the same type as the metal layer 55, a line thinner than the diffraction limit of the optical system is formed. After that, the resist layer 56, the resist layer 58, and the organic silica layer 57 are removed by a solvent so that the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and the pits can be formed small. Become. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 4) In claim 4 of the present invention, before the positive resist 77 layer is coated and laser-cut, the entire surface of the resist 77 is irradiated with ultraviolet light or deep.
The surface property of the resist 77 is changed by UV irradiation, ozone treatment, or heat treatment. In the case of irradiation with ultraviolet rays, by limiting the amount of ultraviolet rays to act only on the surface of the resist 77, only the surface becomes alkali-soluble and is removed at the time of development, so that the groove width can be narrowed. In the case of Deep UV treatment, by treating to such an extent that it acts only on the resist surface,
The reactivity of the resist surface is reduced, which makes it possible to narrow the groove width. In the case of ozone treatment, the reactivity on the resist surface is lowered by treating the resist so that it acts only on the surface of the resist, whereby the groove width can be narrowed. In the case of heat treatment, for example, an infrared lamp or the like is used to treat the resist so that it acts only on the surface of the resist, thereby reducing the reactivity of the resist surface and thereby narrowing the groove width.
When the reactivity of the resist surface is reduced, the intensity distribution of the focused laser beam used for exposure has a Gaussian distribution, so the reactivity of the resist at the edges tends to decrease, and it appears thinner than before. It is developed. By making in this way, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it becomes possible to form pits having small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 5) In the fifth aspect of the present invention, the water-soluble resin layer 92 is formed on the resist layer 91 to expose a specific area, and the water-soluble resin layer 92 has increased transmittance due to heat. A material having such a property or a material having a property of generating a cation by light and increasing the transmittance of the light used for the above-mentioned exposure by the cation is used. In this case, since the alkali-soluble resin layer 92 dissolves during development,
The upper part developed in the V shape is dissolved during the development. Further, the heat used for exposure or the generation of cations increases the transmittance of light used for exposure, but the area of increased transmittance tends to deviate from the spot of light and the area tends to become narrower. It becomes thinner and smaller than the spot system. Therefore, by using this method, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it is possible to form pits having small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Function 6) In the sixth aspect of the present invention, the negative type resist layer 105 applied on the master 104 can make the non-exposed portion narrower than the exposed portion.
Although the non-exposed portion is developed, the metal film 108 is formed on the developed portion and the non-developed portion, the non-developed portion and the metal film 108 formed on the non-developed portion are removed, and the metal film 109 is formed. Is formed, and the metal layer 110 is electroformed by using the 17 metal film as an electrode and is peeled from the master 104 to form a master stamper. The metal plate is used as a mold to electroform the metal layer 111. By separating from the master stamper, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it becomes possible to form pits having small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 7) In claim 7 of the present invention, the metal layer 120 to be the base of the stamper is previously formed on the metal film 1.
19 is formed as an electrode. And the metal film 1
By coating a negative resist layer 121 on 19 and condensing laser light to expose a specific region of the resist layer 121, the non-exposed portion can be made narrower than the exposed portion. Thereafter, a metal film 124 of the same type as the metal layer 120 is formed, and the resist layer 121 remaining on the master 118 and the metal film 12 formed on the resist.
By using a stamper prepared by removing 4 using a solvent, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it is possible to form small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 8) In claim 8 of the present invention, a positive type resist layer 134 is applied on the master 133, and an amorphous silicon film, an amorphous metal film or microcrystals is applied on the resist layer 134. Of the amorphous metal film 135, a positive resist layer 136 is further applied on the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 135, and laser light is condensed to form the resist film 136. A specific region of the resist layer 136 is exposed, the exposed portion is developed with a developing solution, and the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 135 is opened in the developed portion. Dry etching until. This is because the distribution of the light transmittance is provided, and the transmittance of the central portion of the laser light distribution is strengthened from the end portion by dry etching to improve the resolution. Then, the entire surface is irradiated with light to dry-etch the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film up to the middle thereof.
Of the resist layer 134 and the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 13 which is exposed without being developed
After removing 5, the metal film 142 is formed.
The same or different metal layer 143 film as 42 is electroformed, peeled off from the master 133, and the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 135 and the metal film 142 are removed for mastering. The groove width can be made narrower than the diffraction limit of the optical system used, and it becomes possible to form small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 9) In claim 9 of the present invention, an amorphous silicon film, an amorphous metal film or a microcrystalline metal film 154 is formed on the master 153, and the amorphous silicon film, A positive type resist layer 155 is applied on the amorphous metal film or the microcrystalline metal film 154 and exposed using a mask corresponding to the grooves and pits of the optical recording medium, and then the exposed portion is exposed to a developing solution. Use and develop. Since the developed part tends to have a trapezoidal shape with a wide upper part and a narrower lower part, the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 154 opened therein should be dry-etched. By this, it becomes possible to resolve a thinner line than before. After that, the resist layer 155 which has not been developed is removed by using a solvent,
A metal film 160 is formed, a metal layer 161 film of the same or different type as that of the metal film 160 is electroformed, and the groove width is made narrower than the diffraction limit of the optical system used for mastering by peeling from the master 153. It is possible to form small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 10) In the tenth aspect of the present invention, the positive resist layer 170 is coated on the master 169, and the metal film 171 is formed extremely thinly on the resist layer 170, and laser light is applied. The light is focused and a specific region of the resist layer 170 is exposed from the metal film 171. Here, since the metal film 171 is formed to be extremely thin, light of the photosensitive wavelength of the resist can be transmitted, so that the resist layer 1 below is formed.
70 can be exposed. This resist layer 170
Since the light that sensitizes the light has a Gaussian distribution, the light intensity at the center is stronger than at the edges, and this ultra-thin metal film is removed. It is possible to improve. After that, the metal film 171 and the above-described exposed portion are developed with a developing solution, a metal film 174 is formed on the developed portion and the non-developed portion, and the same or different metal layer 17 as the metal film 174 is formed.
By electroforming No. 5, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it becomes possible to form pits having small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 11) In the eleventh aspect of the present invention, the positive type resist layer 183 is applied on the master 182, the metal film 184 is formed on the resist, and the metal film 184 is optically recorded. Reactive ion etching is performed using a mask corresponding to the pattern of the medium. In this case, the upper portion of the etched portion tends to have an inverted trapezoidal shape wider than the lower portion, which makes it possible to improve the resolution.
Thereafter, light having a photosensitive wavelength of the resist layer 183 is applied to the entire surface of the ion-etched portion to expose the resist layer 183 opened in the ion-etched portion, and the exposed portion is developed to remove the above-described unetched portion. The metal film 184 is removed, a metal film 189 is formed, and the metal film 1
By electroforming the metal layer 190 using 89 as an electrode, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it is possible to form small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 12) In the twelfth aspect of the present invention, a positive resist layer 198 is applied on the master 197, a metal film 199 film is formed on the resist layer 198, and the metal film 199 film is formed. A positive type resist layer 200 is further coated on the above, a laser beam is condensed to expose a specific region of the resist layer 200, and the exposed portion is developed using a developing solution. In this case, the developed portion tends to have an inverted trapezoidal shape in which the upper portion is wider than the lower portion. Then, the metal film 199 film opened in the developed portion is etched. Also in this case, the etched upper portion tends to have an inverted trapezoidal shape having a width wider than that of the lower portion, so that the resolution can be improved. Then, light having a photosensitive wavelength of the resist layer 198 is applied to the entire surface of the etched portion to expose the exposed resist layer 198 to the exposed portion, and a developing solution is used to expose the exposed portion of the resist layer 198 and the resist layer 200.
To develop. After that, the metal film 1 which was not etched
99 film is removed, a metal film 204 is formed, and the metal film 2
By electroforming the metal layer 205 using 04 as an electrode, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it is possible to form pits having small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 13) In the thirteenth aspect of the present invention, the positive resist layer 215 is coated on the master plate 214, and a specific region of the resist layer 215 is rotated while focusing the laser light and rotating the master plate 214. The exposed portion of the resist layer 215 is exposed and developed, the exposed portion of the resist layer 215 is developed, a metal film 219 is formed on the developed portion and the non-developed portion, and the same or different metal layer 220 as the metal film 219 is electroformed. In the stamper for optical recording medium created by
Before forming the metal film 219, the above-mentioned resist layer 215 is formed.
Is developed, an LB film is formed. In this case, since the groove of the resist layer 215 developed by the LB film is filled with a uniform film thickness, the groove can be made thin and the resolution can be improved. As a result, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it becomes possible to form small pits. The capacity of the optical recording medium can be increased by using this stamper.

(Operation 14) In the fourteenth aspect of the present invention, the metal film 228 is formed on the master 227, the metal film 228 is used as an electrode to electroform the metal layer 229, and the metal layer 229 is electroformed. A positive resist layer 230 is applied to the above, a laser beam is condensed to expose a specific region of the resist layer 230, the exposed portion is developed with a developing solution, and the exposed portion is exposed by dry etching. The metal film 228 is etched. In this case, the development of the resist tends to have an inverted trapezoidal shape in which the upper part is wider than the lower part, which makes it possible to improve the resolution as compared with the conventional case. After that, the resist layer 230 that has not been developed with a solvent is removed, a metal layer 229 film is formed, a metal layer 235 film is electroformed on the metal layer 229 film, and peeled from the master 227. By removing the film 234, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it becomes possible to form pits having small pits.
The capacity of the optical recording medium can be increased by using this stamper.

(Operation 15) In the fifteenth aspect of the present invention, the metal film 243 is formed on the master 242, the resist layer 244 is applied on the metal layer 229 film, and the resist is formed by using a laser beam. Exposing specific areas of layer 244,
After developing the exposed portion with a developing solution, the silicon oxide layer 2
47 is formed, and the non-developed portion of the resist layer 244 is removed by dry etching. In this case, by narrowing the non-exposed portion of the resist, that portion is etched later, so that the resolution can be freely set, whereby a high resolution can be realized. Then, the metal film 243 that appears in the removed portion is etched to remove the silicon oxide layer 247, the metal film 250 is formed, and the metal layer 251 is electroformed on the metal film 250 to form the master 242. By peeling and removing the metal film 243, the groove width can be made narrower than the diffraction limit of the optical system used for mastering, and it is possible to form pits having a small size. The capacity of the optical recording medium can be increased by using this stamper.

[0037]

【Example】

(Embodiment 1) Hereinafter, claim 1 of the present invention will be described with reference to the drawings. 2 (a) to 2 (c) and FIG.
FIGS. 3A to 3C are conceptual diagrams of a method for manufacturing a stamper used for producing the optical recording medium according to claim 1 of the present invention.

Reference numeral 9 is a glass master disk, 10 is a positive resist layer, 11 is an organic silica layer, 12 is a positive resist layer, 13 is an exposed portion of the resist, 14 is a developed portion of the resist, and 15 is organic silica. 16 part of the layer to be etched
Is an etched portion of the organic silica layer, 17 is a resist development portion, 18 is a resist development portion, 19 is a metal film, 20 is a metal film, 21 is a metal layer electroformed using the metal film 20 as an electrode, 22 Is a stamper for an optical recording medium.

2 (a) to 2 (c) and FIG. 3
The manufacturing method of the stamper used to manufacture the optical recording medium shown in FIGS. 3A to 3C is as follows.

The surface of the glass master 9 is treated with hexamethyldisilazane (HMDS) for vapor treatment to improve the adhesion to the resist.

A positive resist 10 is applied onto the glass master 9 by spin coating.

An organic silica layer 1 on the resist 10
1 is formed.

A positive resist layer 12 is further applied onto the organic silica layer 11 by spin coating.

The master 9 is heated to pre-bak the resist layer 10, the organic silica layer 11 and the resist layer 12.

Using an optical system with a numerical aperture NA of 0.9 of the objective lens using a HeCd laser (442 nm), the light is focused on a specific region of the resist layer 12 while rotating the master 9 by converging the light to a diffraction limit. Exposure is performed according to the pattern of the recording medium. Then, the exposed portion 13 of the resist is formed, as shown in FIG.

When the exposed portion of the resist layer 13 is developed with an inorganic alkaline developing solution, a developed portion 14 of the resist 12 is formed. Then, the portion 15 of the organic silica layer 11 to be etched appears, and becomes as shown in FIG.

By the first dry etching method, the organic silica layer 11 opened in the developed portion of the resist 12 is etched to form the etched portion 16 of the organic silica layer 11, and the developed portion 17 of the resist 10 appears. Two
As shown in (c).

The resist layer 1 opened in the undeveloped portion of the resist 12 and the etched portion 16 of the organic silica layer 11 by the dry etching method using oxygen.
Etch 0. By doing so, the developed portion 18 of the resist is formed, as shown in FIG.

Next, the resist 10 is subjected to after-baking.
When the second dry etching is performed, the organosilica layer 11 not etched in the first etching is etched.

The metal film 19 is formed. This metal film 19
It was formed by vacuum deposition using a sputtering method using silver copper.

Further, a metal film 20 is formed. Nickel was used as the metal film 20 and was formed by vacuum film formation by the sputtering method similarly to the metal film 19.

When the metal films 21 and 20 are used as electrodes and a metal layer 21 of the same kind as or different from the metal film 20 is electroformed.
As shown in (b). The metal layer 21 was electroformed with nickel.

Separated from the master 9.

The metal film 19 is removed using a hydrogen peroxide-ammonia-based stripping solution.

When an optical recording medium stamper is produced by processing the inside and outside diameters, the optical recording medium stamper 22 is formed as shown in FIG. 3C.

FIG. 4 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 2 (a) to 2 (c) and FIGS. 3 (a) to 3 (c).

23 is a width determined by the diffraction limit of the optical system used for laser cutting. Reference numeral 24 is the width of the lower portion of the resist layer 12 formed by development, which is narrower than 23. 25 is the width of the lower part formed by etching the organic silica layer 11, and
Narrower than 4. Reference numeral 26 is a glass master and is the same as the master 9, 27 is a non-developed portion of the resist layer 10, 28 is a non-etched portion of the organic silica layer 11, and 29 is a non-developed portion of the resist layer 12.

A resist layer 10 is applied to a glass master plate 26, an organic silica layer 11 is formed on the resist layer 10, and a resist layer 12 layer is further formed on the resist layer 10. The laser beam is condensed to expose a specific area. And when developed, the resist layer 10 has an inverted trapezoidal shape in which the upper part of the developed part is wide and the lower part is narrow,
29 undeveloped areas remain. The upper part 23 of the inverted trapezoid is determined by the optical system used for the exposure, and 24 is thinner than that. The difference between 23 and 24 varies depending on the properties of the resist layer 12 used and the exposure conditions. Then, when the organic silica layer 11 opened with a width of 24 is dry-etched, the width 25 at the lower portion has a property of being narrower than 24,
28 non-etched parts remain. Then, when the resist layer 10 opened with a width of 25 is further etched, 27 non-developed portions remain, and a groove with a width of 25 is formed, which makes it possible to form a line thinner than the diffraction limit of the optical system used.

Then, AgCu, which is a metal layer 19 film that can be dissolved later, is formed in this portion, Ni is vacuum-formed as the metal layer 20, Ni is electroformed as the metal layer 21, and peeled from the master 9. Then, AgCu, which is the metal layer 19, is removed and washed with a hydrogen peroxide ammonia-based silver stripping solution, and the inner and outer dies are processed to form a stamper for an optical recording medium having narrower grooves and smaller pits than before. It will be possible. The storage capacity of the optical recording medium can be increased by using the stamper for the optical recording medium thus formed.

(Embodiment 2) A second embodiment of the present invention will be described below with reference to the drawings. 5 (a) to 5 (c)
6 (a) to 6 (d) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to claim 2 of the present invention.

Reference numeral 30 is a glass master disk, 31 is a positive resist layer, 32 is an organic silica layer, 33 is a positive resist layer, 34 is an exposed portion of the resist layer 33, and 35 is a developed portion of the resist layer 33. 36 is a portion of the organic silica layer 32 to be etched, 37 is a developed portion of the resist layer 33, 38
Is a portion of the resist layer 31 to be developed, 39 is a metal film, and 40 is
Is a metal film, 41 is a metal layer, 42 is a metal film, 43 is a metal layer, and 44 is an optical recording medium stamper.

FIGS. 5A to 5C and FIG.
The method for producing the stamper for an optical recording medium shown in FIGS. 6A to 6D is as follows.

The surface of the master 30 is subjected to a HMDS vapor treatment to improve the adhesion with the resist.

A positive resist layer 31 is applied thereon by spin coating.

An organic silica layer 32 on the resist layer 31
To form.

A positive resist layer 33 is further applied on the organic silica layer 32.

The glass master 30 is heated to pre-bak the resist layer 31, the organic silica layer 32 and the resist layer 33.

An optical system having an NA of 0.9 using a HeCd laser (442 nm) is used to focus light to almost the diffraction limit, and a specific region of the resist layer 33 is patterned on an optical recording medium while rotating the master 30. Exposure according to. Then, the exposed portion 34 of the resist layer 33 is formed, and as shown in FIG.
As shown in (a).

When the exposed portion 34 of the resist layer 33 is developed with an inorganic alkaline developing solution, the developed portion 35 of the resist layer 33 appears, as shown in FIG. 5 (b).

The master 30 is heated and afterbaked.

When the organic silica layer 32 in the portion 36 to be etched of the organic silica layer 32 in FIG. 5B is etched by the dry etching method, the result becomes as shown in FIG. 5C, and the developed portion 37 of the resist layer 33 becomes appear.

Etching the development planned portion 38 of the resist layer 31 opened in the etching portions of the resist layer 33 and the organic silica layer 32 by a dry etching method using oxygen.

When the metal film 39 is formed, it becomes as shown in FIG. Here, as the metal film 39, a silver-copper alloy was vacuum-deposited by a sputtering method.

The resist layer 31 remaining on the master 30
And the organic silica layer 32 is removed using a solvent.

Form the metal film 40. Where the metal film 4
0 was used to form a vacuum deposition of a silver-copper alloy by a sputtering method.

When the metal film 40 is used as an electrode and a metal layer 41 which is the same as or different from the metal film 40 is electroformed,
As shown in (b). Here, nickel was electroformed as the metal layer 41. The metal film 40 may be a nickel film, and the metal film 41 may be a nickel film, and the same metal may be used.

Separated from the master 30 to make a mother stamper.

.Metal film 3 remaining on the stamper
Remove 9.

Form the metal film 42. Here, a silver-copper alloy was used as the metal film 42.

The same or different metal layer 43 as the metal film 42 is electroformed. Here, nickel was used as the metal layer 43. It is also possible to use the same kind of metal as the metal film 42 and nickel for the metal layer 43. The optical recording medium as shown in FIG. 6D by peeling from the mother stamper and processing the inner and outer dies. Stamper 44 is formed.

FIG. 7 is a diagram for explaining the principle of forming the stamper for an optical recording medium shown in FIGS. 5A to 4C and FIGS. 6A to 6D.

45 is a width determined by the diffraction limit of the optical system used for laser cutting. 46 is the width of the lower part of the resist layer 33 formed by development, which is narrower than 45. 47 is the width of the lower part of the groove formed by etching the organic silica layer 32, which is narrower than 46. Reference numeral 48 denotes a developing unit which opens on the glass master disk 30 by exposing and developing the resist layer 31, and 49 denotes a glass master disk, which is the same as the master disk 30,
Reference numeral 50 is a non-developed portion of the resist layer 31, 51 is a non-etched portion of the organic silica layer 32, and 52 is a non-developed portion of the resist layer 33.

When the resist layer 31, the organic silica layer 32, and the resist layer 33 are sequentially formed on the glass master 49 and exposed and developed at the diffraction limit of the optical system, the portion 52 remains undeveloped. The developing portion has the property of having an inverted trapezoid shape. The reverse trapezoidal shape depends on the resist layer 33 used.
It depends on the nature and exposure conditions. Then, when the surface portion of the resist layer 33 has a diffraction limit of 45, the lower surface portion 46 of the etched organic silica layer 32 becomes less than that, and the non-etched portion 51 of the organic silica layer 32 is formed. When this portion is further exposed and developed, the width of the resist layer 31 can be made as narrow as 47 and the width of 48 on the master 49. Then, the non-developed portion 50 of the resist layer 31 is formed.

Therefore, when a fusible metal film is vacuum-deposited later, its width becomes 48, which is narrower than the diffraction limit of the optical system used for exposure. After that, the resist layer 31, the organic silica layer 32, and the resist layer 33 remaining on the master 49.
The layers are stripped by the solvent. Then, a metal such as nickel that forms the base of the stamper for an optical recording medium is vacuum-deposited, and the vacuum deposition portion is used as an electrode for further electroforming to increase the thickness and peel it from the master 49. It becomes possible to form a stamper for an optical recording medium having a thinner groove or a smaller pit. The capacity of the optical recording medium can be increased by using the stamper for the optical recording medium.

(Third Embodiment) The third aspect of the present invention will be described below with reference to the drawings. 8 (a) to 8 (c)
9 (a) to 9 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to claim 3 of the present invention.

Reference numeral 53 is a glass master, 54 is a metal film, 5
5 is a metal layer, 56 is a positive resist layer, 57 is an organic silica layer, 58 is a positive resist layer, 59 is an exposed portion of the resist layer 56, 60 is a developed portion of the resist layer 56, 6
Reference numeral 1 is a portion to be etched in the organic silica layer 57, 62 is an etched portion in the organic silica layer 57, and 63 is a resist layer 5.
6 is a portion to be developed, 64 is a metal film, and 65 is a completed stamper for an optical recording medium.

8 (a) to 8 (c) and 9
The method of manufacturing the stamper for optical recording medium shown in FIGS. 9A to 9C is as follows.

After the glass master 53 is subjected to the HMDS vapor treatment, the metal film 54 is formed. in this case,
A metal film 54 'or a ceramic film may be formed before forming the metal film 54 so that the master film 53 can be easily peeled off later. Here, nickel is used as the metal film 54, and a silver-copper alloy is used as the metal film 54 '.

The metal film 54 is used as an electrode.
The same or different kind of metal layer 55 is electroformed to form the metal layer 55 layer. Although the same kind of nickel as the metal film 54 is used here as the metal layer 55, the metal film 54 and the metal layer 5 are not used.
It does not matter if it is different from 5.

Further, nickel is formed as a metal 55 'of the same kind as the metal layer 55 to improve the surface property. In this case, the surface property may be improved by mirror-polishing with cerium oxide.

A positive resist layer 56 is applied on the metal layer 55 or the metal layer 55 'by spin coating.

An organic silica layer 57 is formed on the positive resist layer 56.

A positive resist layer 58 is applied on the organic silica layer 57 by spin coating.

The resist layer 5 while rotating the master 53
When the specific region 6 is exposed by the focused laser beam according to the pattern of the optical recording medium, the exposed portion 59 of the resist layer 56 is formed as shown in FIG. 8A.

The exposed portion 59 of the resist layer 56 is developed with an inorganic alkaline developing solution. Then, the upper portion of the developed portion becomes wider than the lower portion, and the developed portion 60 of the resist layer 56 and the planned etching portion 61 of the organic silica layer 57 are formed, as shown in FIG. 8B.

When the organic silica layer 32 in the etching target portion 61 of the organic silica layer 32 of FIG. 8B is etched by the dry etching method, the result is as shown in FIG. 8C, and the etching portion 62 of the organic silica layer 57 is shown. And the development planned portion 63 of the resist layer 56 appears.

When the developing portion 63 of the resist layer 56 which is opened in the etching portion 62 of the resist layer 58 and the organic silica layer 57 is etched by the dry etching method using oxygen, the metal layer 55 is exposed.

When a metal film 64 of the same type as the metal layer 55 is vacuum-deposited on the exposed portion of the metal layer 55 and the non-etched portion of the organic silica layer 57, it becomes as shown in FIG. 9 (a). Here, the same kind of nickel as the metal layer 55 is used as the metal film 64.

-Organic silica layer 5 not etched
7. Metal film 64 formed on the organic silica layer 57
And when the non-developed portion of the resist layer 56 is removed, FIG.
As shown in (b).

After that, the stamper 65 for optical recording medium is formed as shown in FIG. 9D by peeling from the master 53 and processing the inner and outer dies.

FIG. 10 is a view for explaining the principle of producing the stamper for an optical recording medium shown in FIGS. 8A to 8C and 9A to 9B.

66 is a width determined by the diffraction limit of the optical system used for laser cutting. 67 is the width of the lower part of the resist layer 58 formed by development, which is narrower than 66. 68 is the width of the lower part of the groove formed by etching the organic silica layer 57, which is narrower than 67. Reference numeral 69 denotes a developing portion which opens on the glass master 71 by exposing and developing the resist layer 56, and 70, metal films 64, 7 formed on the metal layer 55 exposed by etching the resist layer 56.
Reference numeral 1 is a glass master and is the same as the master 53, 72 is a metal layer formed by electroforming and the same as the metal layer 55, 7
3 is a non-developed portion of the resist layer 56, and 74 is an organic silica layer 5.
7 is a non-etched portion, and 75 is a non-developed portion of the resist layer 58.

When a resist layer 56, an organic silica layer 57, and a resist layer 58 are sequentially formed on a glass master 71 and exposed and developed at the diffraction limit of the optical system, part 75 remains undeveloped. The developing portion has the property of having an inverted trapezoidal shape. The reverse trapezoidal shape depends on the resist layer 58 used.
It depends on the nature and exposure conditions. Then, when the surface portion of the resist layer 58 has a width of 66 which is the diffraction limit, the width 67 of the lower portion of the developed resist layer 58 becomes less than that. Then, when that portion is etched, a non-etched portion 74 of the organic silica layer 57 is formed, and the lower surface portion 68 of the etched organic silica layer 57 becomes less than that. Then, by further exposing and developing this portion, a non-developed portion 73 of the resist layer 56 is formed, and a width of 67 can be achieved in the lower surface portion of the developed portion.

Therefore, when the metal film 64 of the same kind as the metal layer 55 is vacuum-deposited, its width becomes 70, which is narrower than the diffraction limit of the optical system used for exposure. After that, the resist layer 56, the organic silica layer 57, and the resist layer 58 remaining on the master 71 are peeled off by a solvent, so that the metal film 64 is directly formed on the metal layer 72. Then, by peeling from the master 71, it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than that of the conventional one. As a result, it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than that of a conventional one, and by using this, the capacity of the optical recording medium can be increased.

(Fourth Embodiment) The fourth aspect of the present invention will be described below with reference to the drawings. 11 (a) to 11
(C) and FIGS. 12 (a) to 12 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing an optical recording medium according to claim 4 of the present invention.

Reference numeral 76 is a glass master, 77 is a positive resist layer, 78 is a surface-treated portion of the resist layer 77, 79
Is an exposed portion of the resist layer 77, 80 is a developed portion when no surface treatment is performed, 81 is a developed portion when surface treatment is performed by DeepUV treatment or heat treatment, and 82 is a surface-treated portion together with development by ultraviolet irradiation or ozone treatment. A developed portion of the resist layer 77 when removed, 83 is a metal film, 84 is a metal layer, and 85 is a stamper for an optical recording medium.

11 (a) to 11 (c) and FIG.
The method of producing the stamper for an optical recording medium shown in FIGS. 2 (a) to 12 (c) is as follows.

The surface of the glass master disk 76 is subjected to a HMDS vapor treatment to improve the adhesion to the resist.

A positive resist 77 is applied thereon by spin coating.

Preheat the resist layer 77 by heating the glass master disk 76.

UV irradiation on the surface of the resist layer 77, D
eeepUV treatment, ozone treatment or heat treatment,
A surface-treated portion 78 of the resist 77 layer is formed.

These UV irradiation, Deep UV treatment,
Ozone treatment or heat treatment is performed to such an extent that it acts only on the extreme surface of the resist layer 77. In the case of ultraviolet irradiation and ozone treatment, the surface portion of the resist layer 77 is reacted to make it alkali-soluble. In the case of Deep UV treatment or heat treatment, the reactivity of the surface of the resist layer 77 is lowered.

An objective lens using a HeCd laser (442 nm) having an NA of 0.9 is used to focus light to a substantially diffraction limit, and a specific area of the resist layer 77 is optically recorded while rotating the master disk 76. Exposure is performed according to the pattern of the medium. Then, the exposed portion 79 of the resist layer 77 is formed, as shown in FIG.

When the exposed portion of the resist layer 77 is developed with an alkaline developing solution, a developing portion 81 according to the present invention is formed when the surface treatment is performed by DeepUV treatment or heat treatment, and as shown in FIG. 11 (b). , It is narrower than the developing portion 80 when the surface treatment is not performed. Further, a developed portion 82 of the resist layer 77 is formed when the surface-treated portion is removed along with the development by ultraviolet irradiation or ozone treatment, as shown in FIG. 11C. After that, FIG.
An example using (c) will be described.

The master disk 76 is heated and afterbaked.

When the metal film 83 is formed at the developed portion 82 of the resist layer 77, it becomes as shown in FIG. 12 (a). Here, a silver-copper alloy was vacuum-deposited as the metal film 83 by a sputtering method.

When the metal layer 84 is electroformed by using the metal film 83 as an electrode, it becomes as shown in FIG. 12 (b).
Here, a nickel layer was electroformed as the metal layer 84.

The optical recording medium stamper 85 is formed as shown in FIG. 12C by peeling from the master disk 76 and processing the inner and outer dies.

FIG. 13 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 11A to 11C and FIGS. 12A to 12C.

86 is a width determined by the diffraction limit of the optical system used for laser cutting. 87 is the width of the resist layer 77 formed by development, and 8
Narrower than 6. 88 is a glass master and master 76
The numeral 89 is the non-developed portion of the resist layer 77.

A resist layer 77 is applied to a glass master 88, and the surface of the resist layer 77 is irradiated with ultraviolet rays and is subjected to Dee.
PUV treatment, ozone treatment or heat treatment is performed. These treatments are performed while the master disk 76 is being cooled so that the treatment only affects the extreme surface of the resist. Then, the reactivity of the surface of the resist layer 77 is lowered, and the contribution of the central part of the Gaussian distribution shown by the focused laser used is increased,
Since the influence of the edge is less likely to occur, it is possible to develop a line thinner than the width 86 determined by the diffraction limit of the optical system used for laser cutting. After that, development is performed with a width of 87 to form a non-developed portion 89 of the resist layer 77. Then, the metal film 83 is formed, and the metal film 83 is electroformed by using the metal film 83 as an electrode.
Peel from 6. Then, it becomes possible to form a stamper for an optical recording medium having a groove or a small pit smaller than in the conventional case, and by using this, the capacity of the optical recording medium can be increased.

(Embodiment 5) The fifth aspect of the present invention will be described below with reference to the drawings. 14A to FIG.
15 (c) and FIGS. 15 (a) to 15 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 90 is a glass master, 91 is a positive resist layer, 92 is a water-soluble resin layer having a property of increasing the transmittance of laser light used for cutting by laser light irradiation, and 93 is a water-soluble resin layer 92. And the exposed portion of the resist layer 91, 94 the developed portion of the water-soluble resin layer, 95
Is a developed portion of the resist layer 91, 96 is a metal film, and 97 is 9
A metal layer is electroformed using the metal film 6 as an electrode, and 98 is an optical recording medium stamper.

14 (a) to 14 (c) and FIG.
The method for producing the stamper for optical recording medium shown in FIGS. 5 (a) to 15 (c) is as follows.

The surface of the glass master 90 is subjected to a HMDS vapor treatment to improve the adhesion with the resist.

A positive resist layer 91 is applied thereon by spin coating.

Preheat the resist layer 91 by heating the glass master 90.

The water-soluble resin layer 92 having the property of increasing the transmittance of the laser light used for cutting by irradiation with the laser light is formed in 200Å by the spin coating method. As this, polyvinylpyrrolidone was used in which a photocation generator and a substance having a property of fading due to a cation were dispersed.

The specific region of the resist layer 91 is replaced with HeCd.
Exposure is performed according to the pattern of the optical recording medium using a laser (442 nm) with an optical system having an NA of 0.9 at almost the diffraction limit. Then, the exposed portions of the water-soluble resin layer 93 and the resist layer 91 are formed, as shown in FIG.

Rinse while rotating the master 90 with an aqueous solution in which an anionic surfactant is dissolved.

By developing with an alkaline developing solution, a developed portion of the water-soluble resin layer 93 and a developed portion 94 of the resist layer 91 are formed, as shown in FIG. 14 (c) through FIG. 14 (b). .. However, since the developed portion of the water-soluble resin layer 93 is removed when rinsed, it does not exist, but it is given for the sake of explanation.

After-baking reduces the reactivity of the resist layer 91.

-Resist layer 9 that has been exposed and developed
When the metal film 96 is formed on the developed portion of FIG.
As shown in (a). Here, a nickel film is formed as the metal film 96 in vacuum by a sputtering method.

Using the metal film 96 as an electrode, the metal layer 9
When 7 is electroformed, it becomes as shown in FIG. Here, a nickel layer was electroformed as the metal layer 97.

The optical recording medium stamper 98 can be formed as shown in FIG. 15C by processing the inner and outer dies by separating from the master 90.

FIG. 16 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 14 (a) to 14 (c) and FIGS. 15 (a) to 15 (c).

99 is a width determined by the diffraction limit of the optical system used for laser cutting. 100 is a width formed by development, which is narrower than 99. 101
Is a glass master and is the same as the master 90, 102 is a resist layer 91 portion, and 103 is a water-soluble resin layer to be removed.

A resist layer 91 is formed on a glass master 101.
Is applied to form a resist layer 91 portion of 102. When a water-soluble resin layer is further formed thereon and rinsed or developed with water, the water-soluble resin layer 103 is removed, so that the groove width is correspondingly shallow and narrow. In this case, when the water-soluble resin layer has a property that cations are generated by the laser light used for cutting and the pH is changed to increase the transmittance, the area where the transmittance is increased by the laser light and the area of the light spot are separated. The deviation causes the resist to be exposed only in those overlapping portions, and a width 100 formed by development, which is narrower than the width 99 determined by the diffraction limit of the optical system used for laser cutting, is achieved. As a result, it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than that of a conventional one, and by using this, the capacity of the optical recording medium can be increased.

In Example 5, at least HeC was included in the water-soluble resin depending on the photocation generator and pH.
The d-laser contained a substance that improves the transmittance of light having a wavelength of 442 nm. N-vinylpyrrolidone was used as a base material for the water-soluble resin. Further, in Example 5, the water-soluble modified naphthoquinonediazide could be used in the water-soluble resin formed on the resist layer, but this is because the reactivity with the conventional resist is matched. In addition, since the surface of the resist layer is hydrophobic and it is very difficult to apply the water-soluble resin thinly thereon, it is necessary to carry out after activation of the surface of the resist layer. As a method of activation, it is possible to apply a surface active agent, perform plasma treatment, or the like. Further, since the water-soluble resin layer formed on the resist layer has to be formed very thin, it may be formed by an LB film having the optical characteristics with respect to light combined with the resist. In this case, a hydrophilic group and a hydrophobic group must be introduced into the molecule so that one to several molecular layers can be formed in the LB film.

In the fifth embodiment, the resist layer 9
Although the nickel film which is the metal film 96 is directly formed on the developing portion 95 of No. 1, the metal film 96 may be formed after forming a metal film such as AgSi which can be dissolved later. In this case, the number of processes for dissolving the dissolvable metal film thereafter increases. This is a case where it is used to prevent peeling from the master 90 when electroforming the metal layer 97, or to remove the resist residue when peeling the completed stamper from the master 90. Further, as the alkali-soluble resin, a resist-exposed product can also be used. That is, it is possible to expose the naphthoquinonediazide in the resist to form all indenecarboxylic acid and apply the indenecarboxylic acid on the resist layer 91.

(Embodiment 6) The sixth aspect of the present invention will be described below with reference to the drawings. 17 (a) to 17
18 (c) and FIGS. 18 (a) to 18 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 104 is a glass master, 105 is a negative resist layer, 106 is an exposed portion of the resist layer 105,
107 is a developed portion of the resist layer 105, 108 is a metal film, 109 is a metal film, 110 is a metal layer electroformed using the 10 metal film 54 as an electrode, 111 is a metal layer electroformed using a mother stamper as a mold, 112 Is a stamper for an optical recording medium.

17 (a) to 17 (c) and FIG.
The method of manufacturing the stamper for optical recording media shown in FIGS. 8 (a) to 18 (c) is as follows.

The surface of the glass master 104 of 104 is subjected to HMDS vapor treatment to improve the adhesion to the resist.

On the master 104, the negative resist layer 105 of 105 is applied by spin coating.

While rotating the master 104, the light of the HeCd laser using the objective lens with NA of 0.9 is condensed to almost the diffraction limit, and the specific region of the resist layer 105 is changed according to the pattern of the optical recording medium. After exposure, the exposed portion 106 of the resist layer 105 is formed, as shown in FIG.

When the unexposed portion is developed with a solvent type developing solution, a developing portion 107 of the resist is formed,
When the metal film 108 is formed on the developed portion 107 and the non-developed portion, it becomes as shown in FIG. here,
As the metal film 108, a silver-copper alloy was vacuum-deposited by a sputtering method.

The non-developed portion of the resist layer 105 and the metal film 1 formed on the non-developed portion of the resist layer 105
08 is removed with a solvent.

Metal film 109 after removal using a solvent
17C is formed into a film as shown in FIG. Here, nickel was vacuum-deposited as the metal film 109 by a sputtering method.

Metal layer 1 using the metal film 109 as an electrode
When 10 is electroformed, it becomes as shown in FIG. Here, the same kind of nickel as the metal film 109 is electroformed as the metal layer 110. The metal film 109 and the metal film 110 may be different.

Then, the mother stamper is peeled off from the master 104.

Using a hydrogen peroxide-ammonia type silver stripping solution, the metal film 108 remaining on the mother stamper is removed.

When the mother stamper is used as a mold and the metal layer 111 is further electroformed, it becomes as shown in FIG. 18 (b). Although nickel was electroformed here, this nickel Ni
Vacuum electroplating of AgCu alloy before electroforming,
It is also possible to adopt a method in which ashing treatment or the like is performed to facilitate separation from the metal plate.

By separating from the mother stamper and processing the inner and outer dies, an optical recording medium stamper 112 is formed as shown in FIG. 18C.

FIG. 19 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 17 (a) to 17 (c) and FIGS. 18 (a) to 18 (c).

Reference numeral 113 is a width determined by the diffraction limit of the optical system used for laser cutting. 114 is the width of the lower part of the developing portion, which is narrower than 113. Reference numeral 115 is a non-developed portion of the resist layer 105, and 116 is the resist layer 10.
5 is a metal film formed in the developing section of 5 and is the same as the metal film 108,
Reference numeral 117 is a glass master and is the same as the master 104.

When a negative resist 105 is formed on a glass master 117 and exposed and developed at the diffraction limit of the optical system, 114 is left undeveloped. The developing portion has the property of having an inverted trapezoid shape. The trapezoidal shape changes depending on the properties of the resist layer 105 used and the exposure conditions. Then, even if the surface portion of the resist layer 105 has a width of 113 which is the diffraction limit, since the resist layer 105 is a negative type, the non-developed portion of 115 can be made as narrow as possible. In other words, the developing unit is not more than 11 below the diffraction limit of the optical system.
A width of 4 can be achieved.

Therefore, when the fusible metal film 116 is vacuum-deposited later, its width becomes 114, which is narrower than the diffraction limit of the optical system used for exposure. After that, the resist layer 105 remaining on the master 117 is removed by a solvent. Then, a metal such as nickel serving as a base of the stamper for the optical recording medium is vacuum-deposited, and the vacuum film-deposited portion is used as an electrode for further electroforming to increase the thickness, and is peeled from the master 117 to form a master stamper. Further, by electroforming the master stamper as a mold, it becomes possible to form a stamper for an optical recording medium having a groove and a pit smaller than those of the conventional one. The capacity of the optical recording medium can be increased by using this stamper for optical recording medium.

(Embodiment 7) A seventh aspect of the present invention will be described below with reference to the drawings. 20 (a) to 20
FIGS. 21 (c) and 21 (a) to 21 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 118 is a glass master, 119 is a metal film, 120 is a metal layer, 121 is a negative resist layer, and 1 is a negative resist layer.
22 is an exposed part of the resist layer 121, 123 is a developed part of the resist layer 121, 124 is a metal film formed on 123, and 125 is a metal film 124 formed on an undeveloped part of the resist layer 121. 126 are stampers for optical recording media.

20 (a) to 20 (c) and FIG.
The method for producing the stamper for an optical recording medium shown in FIGS. 1 (a) to 21 (c) is as follows.

A metal film 11 on the glass master 118.
9 is deposited. Here, in order to facilitate separation from the glass master 118, a silver-silicon alloy was vacuum-deposited by a sputtering method.

The metal layer 120 was electroformed using the metal film 119 as an electrode. Nickel was electroformed as the metal layer 120.

When a negative type resist layer 121 is applied onto the metal layer 120 by spin coating, FIG.
As shown in (a).

While rotating the master 118, the light of the HeCd laser using the objective lens with NA of 0.9 is condensed to almost the diffraction limit and the specific region of the resist layer 121 is changed according to the pattern of the optical recording medium. When exposed, the exposed portion of the resist layer 121 of 122 is formed 122, as shown in FIG.
As shown in (b).

When the unexposed portion of the resist layer 121 is developed with a solvent type developing solution, a developed portion 123 of the resist layer 121 is formed, as shown in FIG. 20 (c).

When the metal film 124 of the same kind as the metal film 119 is formed after the development, it becomes as shown in FIG.
Here, the same kind of nickel as the metal layer 120 was vacuum-deposited by a sputtering method.

Resist layer 1 remaining on the master 118
21 and the metal film 124 and the metal film 125 formed on the resist thereof are removed by using a solvent or a dry etching method, as shown in FIG.

After that, the inner and outer dies are processed to form the stamper 126 for the optical recording medium.
As shown in (c).

FIG. 22 is a view for explaining the principle of producing the stamper for an optical recording medium shown in FIGS. 20 (a) to 20 (c) and FIGS. 21 (a) to 21 (c).

127 is a width determined by the diffraction limit of the optical system used for laser cutting. 128 is the width of the lower portion of the developing portion, which is narrower than 127. Reference numeral 129 is a non-developed portion of the resist layer 121, and 130 is the resist layer 12.
The metal films 124 and 131 formed on the developing unit 1 are the metal layers 120 and 132 formed on the glass master plate 132, which is the same as 118.

A metal film 119 is formed on a glass master plate 132, the metal film 119 is used as an electrode to electroform a metal layer 120, and a negative resist layer 121 is formed on the electroformed metal layer to form an optical system. When exposed and developed at the diffraction limit of, the portion 129 remains undeveloped. The developing portion has the property of having an inverted trapezoid shape. The inverse trapezoidal shape changes depending on the properties of the resist layer 121 used and the exposure conditions. Then, even if the surface portion of the resist layer 121 has a diffraction limit of 127, since the resist layer 121 is a negative type,
The non-developed area of 9 can be as narrow as possible. That is, the developing portion can achieve a width of 128, which is less than the diffraction limit of the optical system, and the metal layer 1 formed on the glass master 132.
20 is exposed. Then, with the width of 128, the metal film 124
When the film is formed on the metal layer 120 formed on the glass master 132, the width becomes 128, which is narrower than the diffraction limit of the optical system. After that, by peeling from the master 132 and processing the inner and outer dies, it becomes possible to form a stamper for an optical recording medium having thinner grooves and smaller pits than in the conventional case, and by using this, the capacity of the optical recording medium is increased. Can be made

(Embodiment 8) The eighth aspect of the present invention will be described below with reference to the drawings. 23 (a) to 23
24 (c) and FIGS. 24 (a) to 24 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 133 is a glass master, 134 is a positive resist layer, 135 is an amorphous silicon film, an amorphous metal film or a microcrystalline metal film, 136 is a positive resist layer, 1
37 is an exposed portion of the resist layer 136, 138 is a developed portion of the resist layer 136, 139 is an etched portion of an amorphous silicon film, an amorphous metal film or a microcrystalline metal film, 140 is an exposed portion of the resist layer 134, 141 is the resist layer 13
4 is a developing portion, 142 is a metal film, and 143 is a metal film 142.
Is an electroformed metal layer, 144 is an optical recording medium stamper.

23 (a) to 23 (c) and FIG.
The method for producing the stamper for optical recording media shown in FIGS. 4 (a) to 24 (c) is as follows.

The surface of the glass master 133 is HMDS
And a treatment for improving the adhesiveness with the resist.

The positive resist layer 13 on the master 133
4 is applied by spin coating.

An amorphous silicon film, an amorphous metal film or a microcrystalline metal film 135 is formed on the resist layer 134. Here, a vacuum deposition was performed using a sputtering method.

A positive resist layer 136 is further applied on the amorphous silicon film, amorphous metal film or microcrystalline metal film 135 by spin coating.

While rotating the master 133, the light of the HeCd laser using the objective lens having the NA of 0.9 is condensed to almost the diffraction limit, and the specific area of the resist layer 136 is changed according to the pattern of the optical recording medium. When exposed, an exposed portion 137 of the resist layer 136 is formed, as shown in FIG.

When the exposed portion is developed with an inorganic alkaline developing solution, the developed portion 138 of the resist layer 136
Are formed, as shown in FIG.

An amorphous silicon film, an amorphous metal film, or a microcrystalline metal film when dry etching is performed up to the middle of the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 135 opened in the developed portion. An etched portion 139 of the film is created.

When the entire surface of the resist layer 136 is exposed to light to expose the resist layer 136 below the dry-etched part of the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 135, the resist layer 134 is exposed. The exposed portion 140 is formed, as shown in FIG.
2 (c).

After that, by developing with an inorganic alkaline developing solution, the developed portion of the resist layer 136 becomes 14
1 is formed.

When the resist layer 136 and the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 135 which remain without being developed are removed, it becomes as shown in FIG. 13 (a).

A resist layer 136 and an amorphous silicon film,
After removing the amorphous metal film or the microcrystalline metal film 135, the metal film 142 is formed. Here, as the metal film 142, a silver-copper alloy was vacuum-deposited by a sputtering method.

Metal layer 1 using the metal film 142 as an electrode
When the 43 film is electroformed, it becomes as shown in FIG. Here, nickel was electroformed as the metal layer 143.

Amorphous silicon film separated from the master 133
The amorphous metal film or the microcrystalline metal film 135 and the metal film 142 are removed.

After that, by processing the inner and outer dies, a stamper 144 for an optical recording medium is formed,
As shown in (c).

FIG. 25 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 23 (a) to 23 (c) and FIGS. 24 (a) to 24 (c).

145 is a width determined by the diffraction limit of the optical system used for laser cutting. 146 is the width of the lower portion of the resist layer 33 formed by development, which is narrower than 145. 147 is an amorphous silicon film,
The width of the lower portion of the groove formed by etching the amorphous metal film or the microcrystalline metal film 135, 14
Narrower than 6. Reference numeral 148 is a developing portion formed by exposing and developing the resist layer 136, 149 is a glass master and is the same as the master 133, 150 is a non-developing portion of the resist layer 134, 151 is an amorphous silicon film, and The non-etched portion of the crystalline metal film or the microcrystalline metal film 135,
Reference numeral 152 is a non-developed portion of the resist layer 136.

A positive resist layer 134, an amorphous silicon film, an amorphous metal film or a microcrystalline metal film 135, and a positive resist layer 136 are sequentially formed on a glass master 149. Then, the laser light is condensed to form the resist layer 1
When a specific region of 36 is exposed and developed according to the pattern of the optical recording medium, the developing portion 148 and the resist layer 13 formed by exposing and developing the resist layer 136.
6 non-developed portions 152 are formed. In this case, in the developing portion 148 of the resist layer 136, when the upper portion has a width determined by the diffraction limit 145 of the optical system used for laser cutting, the lower portion has a width of 146, which is less than the diffraction limit of the optical system. Then, when the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 135 which is opened with the width of 146 is partially etched by dry etching, the width of 147 is achieved. A non-etched portion 151 of the crystalline metal film or the microcrystalline metal film is formed. Then, in the etched portion, the transmittance is increased at the central portion and is not so increased at the end portions. That is, it becomes possible to have a distribution of transmittance. Therefore, by utilizing this transmittance distribution and exposing and developing the resist layer 134 formed thereunder, the non-developed portion 150 of the resist layer 134 is formed, and in the developed portion, diffraction of the optical system used for laser cutting is performed. A width of 146 narrower than the width 145 determined by the limit is achieved. As a result, it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than that of a conventional one, and by using this, the capacity of the optical recording medium can be increased.

(Embodiment 9) The ninth aspect of the present invention will be described below with reference to the drawings. FIG. 26A to FIG.
27 (c) and FIGS. 27 (a) to 27 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 153 is a glass master, 154 is an amorphous silicon film, an amorphous metal film or a microcrystalline metal film, 155 is a positive resist layer, 156 is a mask, 157 is an exposed portion of the resist layer 155. Reference numeral 158 denotes a developed portion of the resist layer 155, 159 denotes an etched portion of an amorphous silicon film, an amorphous metal film or a microcrystalline metal film, 160 denotes a metal film, 16
Reference numeral 1 is a metal layer, and 162 is a stamper for an optical recording medium.

26 (a) to 26 (c) and FIG.
The method of producing the stamper for optical recording medium shown in FIGS. 7A to 27C is as follows.

An amorphous silicon film, an amorphous metal film or a microcrystalline metal film 154 is formed on the glass master 153. Here, the film was formed in vacuum by a sputtering method.

A positive resist layer 155 of 155 is applied on the amorphous silicon film, amorphous metal film or microcrystalline metal film 154 by spin coating.

The resist layer 155 is heated by heating the master 153.
Pre-bake.

When the resist layer 155 is exposed by using the mask 156 corresponding to the grooves or pits of the optical recording medium, the exposed portion 157 of the resist layer 155 is formed, as shown in FIG.

When the exposed portion is developed with an alkaline developer, a developed portion 158 of the resist layer 155 is formed, as shown in FIG. 26 (b).

The master 153 is heated and the undeveloped resist layer 155 is afterbaked.

When the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 154 appearing in the developed portion is dry-etched, the etched portion 159 is formed.
6 (c).

When the undeveloped resist layer 155 is removed by using a solvent, it becomes as shown in FIG. 27 (a).

Form the metal film 160. Here, a silver-copper alloy was vacuum deposited as the metal film 160.

When the same or different kind of metal layer 161 as the metal film 160 is electroformed, it becomes as shown in FIG. 27 (b). Here, since nickel is electroformed as the metal layer 161, a metal different from the metal film 160 is used. However, it is also possible to use the same kind of metal in which the metal film 160 is nickel and the metal layer 161 is nickel.

By separating from the master 153 and processing the inner and outer dies, an optical recording medium stamper 162 is formed as shown in FIG. 27 (c).

FIG. 28 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 26 (a) to 26 (c) and FIGS. 27 (a) to 27 (c).

163 is a width determined by the diffraction limit of the optical system used for laser cutting. Reference numeral 164 denotes the width of the lower portion of the resist layer 155 formed by development, which is narrower than 163. 165 is a resist layer 1
55 by exposing and developing 55, an amorphous silicon film, an amorphous metal film or a microcrystalline metal film, 166
Is a glass master and is the same as the master 153, 167 is a non-etched portion of an amorphous silicon film, an amorphous metal film or a microcrystalline metal film, and 168 is a non-developed portion of the resist layer 155.

A glass master 166 has an amorphous silicon film,
An amorphous metal film or a microcrystalline metal film 154 and a positive resist layer 155 are sequentially formed. And mask 1
56 is used to expose a specific region of the resist layer 155 according to the pattern of the optical recording medium and develop the resist layer 155.
Of the non-developed portion 168 is formed. In this case, resist layer 1
In the developing unit 55, when the upper portion has a width 163 determined by the diffraction limit of the optical system used for laser cutting, the lower portion has a width of 164, which is less than the diffraction limit of the optical system. Then, the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 165 opened with a width of 164 is etched by dry etching. Then, a non-etched portion 167 of an amorphous silicon film, an amorphous metal film, or a microcrystalline metal film is formed. Then, by utilizing the etching portion, the metal film 16
0 is formed, and the metal film 160 is used as an electrode to form the metal layer 16
By electroforming 1 and peeling it from the glass master 166, it becomes possible to form a stamper for an optical recording medium having narrower grooves and smaller pits than before, and by using this, the capacity of the optical recording medium can be increased. Can be increased.

(Embodiment 10) A tenth aspect of the present invention will be described below with reference to the drawings. FIG. 29A to FIG.
9 (c) and FIGS. 30 (a) to 30 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 169 is a glass master, 170 is a positive resist layer, 171 is a metal film, and 172 is resist layer 1.
70 is an exposed portion, 173 is a developed portion of the resist layer 170, 174 is a metal film, 175 is a metal layer electroformed using 174 as an electrode, and 176 is an optical recording medium stamper.

29 (a) to 29 (c) and FIG.
The method for producing the stamper for an optical recording medium shown in FIGS. 0 (a) to 30 (c) is as follows.

The surface of the glass master 169 is HMDS
And a treatment for improving the adhesiveness with the resist.

A positive resist layer 1 on the master 169
70 is applied by a spin coating method.

Metal film 17 on the resist layer 170
When 1 is formed into an extremely thin film, it becomes as shown in FIG.
Here, the aluminum-zinc alloy was formed into a film having a thickness of 15 nm, but the film is not limited to this, and it can be dissolved in an inorganic alkaline developing solution, and if it is extremely thin, there is no problem as long as the transmittance can be secured to some extent. ..

While rotating the master 169, the light of the HeCd laser using the objective lens having the NA of 0.9 is condensed to almost the diffraction limit, and the specific region of the resist layer 170 is changed according to the pattern of the optical recording medium. Upon exposure, an exposed portion 172 of the resist layer 170 is formed, as shown in FIG. 29 (b).

When the metal film 171 and the exposed portion are developed using an inorganic alkaline developing solution, a developed portion 173 of the resist layer 170 is formed, as shown in FIG. 29 (c).

When the metal film 174 is formed on the developed portion and the non-developed portion, it becomes as shown in FIG. 30 (a). Here, a silver-copper alloy was vacuum-deposited as the metal film 174 by a sputtering method.

When the same or different kind of metal layer 175 as the metal film 174 is electroformed, it becomes as shown in FIG. 30 (b). Although nickel is electroformed here as the metal layer 175, the same kind of metal film can be used as the metal film 174.

By separating from the master 169 and processing the inner and outer dies, an optical recording medium stamper 167 is formed as shown in FIG. 30 (c).

FIG. 31 is a diagram for explaining the principle of producing the stamper for an optical recording medium shown in FIGS. 29 (a) to 29 (c) and FIGS. 30 (a) to 30 (c).

177 is a width determined by the diffraction limit of the optical system used for laser cutting. Reference numeral 178 denotes the width of the resist layer 170 formed by development, which is narrower than 177. Reference numeral 179 denotes a developing portion formed by exposing and developing the resist layer 170, 1
Reference numeral 80 is a glass master and is the same as 169, and 181 is a non-developed portion of the resist layer 170.

A positive resist layer 17 is formed on the master 180.
0 is applied, and a metal film 171 is formed on the resist layer 170.
Is formed into an extremely thin film, and the laser light is condensed to form the metal film 17
1 to expose a specific region of the resist layer 170, and develop the metal film 171 and the exposed portion with a developing solution to expose and develop the resist layer 170 and the resist layer 170. Although the non-developed portion 181 of the resist layer 170 is formed, the edge portion of the intensity distribution of the laser light is absorbed by the metal film 171.
Does not reach Therefore, only the influence of the central portion where the intensity of the laser light is strong appears on the resist layer 170, and the width 178 of the resist layer 170 formed by developing is achieved, which is due to the diffraction of the optical system used for laser cutting 177. It becomes narrower than the width determined by the limit. A metal film 174 is formed on the developed portion and the non-developed portion,
By electroforming the metal film 174 and the same kind or different kind of layer 175, it becomes possible to form a stamper for an optical recording medium having narrower grooves and smaller pits than ever before, and by using this, the capacity of the optical recording medium is increased. Can be increased.

(Eleventh Embodiment) The eleventh embodiment of the present invention will be described below with reference to the drawings. FIG. 32 (a) to FIG.
2 (c) and FIGS. 33 (a) to 33 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 182 is a glass master disk, 183 is a positive resist layer, 184 is a metal film, 185 is a mask, and 18 is a mask.
6 is an etched portion of the metal film 184, 187 is an exposed portion of the resist layer 183, 188 is a developed portion of the resist layer 183, 189 is a metal film, 190 is a metal layer, and 191 is a stamper for an optical recording medium.

32 (a) to 32 (c) and FIG.
The method of producing the stamper for an optical recording medium shown in FIGS. 3 (a) to 33 (c) is as follows.

The surface of the glass master 182 is HMDS
And a treatment for improving the adhesiveness with the resist.

-Positive resist layer 1 on the master 182
83 is applied by spin coating.

A metal film 184 is formed on the resist. Here, an aluminum-magnesium alloy was vacuum-deposited by a sputtering method.

When the metal film 184 is subjected to reactive ion etching using a mask 185 corresponding to the pattern of the optical recording medium, an etched portion 186 of the metal film 184 is formed, as shown in FIG. 32 (a). ..

When the light having the photosensitive wavelength of the resist layer 183 is applied to the entire surface of the ion-etched portion to expose the resist layer 183 opened to the ion-etched portion, the resist layer 18 is exposed.
The exposed portion 187 of No. 3 is formed, as shown in FIG.

When the exposed portion 187 of the resist layer 183 is developed, a developed portion 188 of the resist layer 183 is formed.

When the metal film 184 that has not been etched is removed, it becomes as shown in FIG. 32 (c).

When the metal film 189 is formed, FIG. 33 (a)
As shown in.

Metal layer 1 using the metal film 189 as an electrode
When 90 is electroformed, it becomes as shown in FIG. Here, nickel was electroformed as the metal layer 190.

The optical recording medium stamper 191 is formed as shown in FIG. 33 (c) by processing the inner and outer molds by peeling from the master 182.

FIG. 34 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 32 (a) to 32 (c) and FIGS. 33 (a) to 33 (c).

192 is a width determined by the diffraction limit of the optical system. Reference numeral 193 denotes the width of the resist layer 183 formed by development, which is narrower than 192. 19
4 is a glass master and is the same as 182, 195 is a non-etched portion of the metal film 184, and 196 is a resist layer 183.
This is a non-developing part.

A positive resist layer 18 is formed on the master 194.
3 is applied, a metal film 184 is formed on the resist, and the metal film is subjected to reactive ion etching using a mask corresponding to the pattern of the optical recording medium. At this time, if the mask is formed with a width of 192 which is the diffraction limit of the optical system, the etched portion formed by the mask has a width of 192, but that portion is trapezoidal by etching. Therefore, the lower part of that part is 19
The width is 3. Then, the non-etched portion 195 of the metal film 184 is formed. Next, the entire surface of the ion-etched portion is irradiated with light having a photosensitive wavelength of the resist layer 183 to expose the resist layer 183 opened in the ion-etched portion, and the metal film 184 remaining in the non-etched portion 195 of the metal film 184 is exposed.
When the resist is removed and developed, the non-developed portion 19 of the resist layer 183 is removed.
6 is formed. After that, a metal film 189 is formed, and the metal layer 190 is electroformed using the metal film 189 as an electrode, whereby it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than that of a conventional one. By using this, the capacity of the optical recording medium can be increased.

(Embodiment 12) A twelfth aspect of the present invention will be described below with reference to the drawings. FIG. 35 (a) to FIG.
5 (c) and FIGS. 36 (a) to 36 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 197 is a glass master, 198 is a resist layer, 199 is a metal film, 200 is a positive resist layer,
201 is an exposed portion of the resist layer 200, 202 is an etched portion of the metal film 199, 203 is a developed portion of the resist layer 198, 204 is a metal film, 205 is a metal layer electroformed using the metal film 204 as an electrode, and 206 is It is a stamper for an optical recording medium.

FIGS. 35 (a) to 35 (c) and FIG.
The method for producing the stamper for an optical recording medium shown in FIGS. 6 (a) to 36 (c) is as follows.

The surface of the glass master 197 is HMDS
And a treatment for improving the adhesiveness with the resist.

-Positive resist layer 1 on the master 197
98 is applied by a spin coating method.

The metal film 19 is formed on the resist layer 198.
9 films are formed. Here, a silver-copper alloy was formed by vacuum film formation by a sputtering method.

A positive resist layer 200 is further applied on the metal film 199 by spin coating.

While rotating the master 197, the light of the HeCd laser using the objective lens with NA of 0.9 is condensed to almost the diffraction limit and the specific region of the resist layer 200 is changed according to the pattern of the optical recording medium. When exposed, an exposed portion 201 of the resist layer 200 is formed, as shown in FIG.

The exposed portion is developed with a developing solution.

When the metal film 199 film opened in the developed portion is etched, the etching portion 202 of the metal film 199 is formed, as shown in FIG. 35 (b).

The entire surface of the etched portion 202 is irradiated with light having the photosensitive wavelength of the resist layer 198 to expose the resist layer 198 opened in the etched portion.

When the exposed portion of the resist layer 198 and the resist layer 200 are developed with a developing solution, the pattern shown in FIG.
As shown in (c), the developed portion 203 of the resist layer 198.
Is formed.

The metal film 199 film that has not been etched is removed.

When the metal film 204 is formed, FIG. 36 (a)
As shown in.

Metal layer 2 using the metal film 204 as an electrode
When 05 is electroformed, it becomes as shown in FIG. Here, nickel was electroformed as the metal layer 205.

The optical recording medium stamper 206 is formed as shown in FIG. 36 (c) by processing the inner and outer dies by separating from the master 197.

FIG. 37 is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 35 (a) to 35 (c) and FIGS. 36 (a) to 36 (c).

207 is a width determined by the diffraction limit of the optical system used for laser cutting. Reference numeral 208 denotes the width of the lower portion of the resist layer 200 formed by development, which is narrower than 207. 209 is a metal film 199
The width of the lower part of the groove formed by etching the film, which is narrower than 208. Reference numeral 210 is a glass master and is the same as the master 197, and 211 is a resist layer 198.
Of the metal film 199,
213 is a non-developed portion of the resist layer 200. Master 21
0 is coated with a positive resist layer 198, a metal film 199 film is formed on the resist layer 198, a positive resist layer 200 is further coated on the metal film 199 film, and laser light is applied. Is exposed to light to expose a specific region of the resist layer 200, and the exposed portion is developed with a developing solution to form a non-developed portion 211 of the resist layer 198. In this case, the non-developed portion 211 is formed on the developed portion. Is the width 2 determined by the diffraction limit of the optical system used for laser cutting
Although it is 07, the width of the lower part is 207. When the metal film 199 film opened in the developed portion is etched, the non-etched portion 212 of the metal film 199 film is formed.
At that time, the etching shape becomes a trapezoid, so the upper part is 20
It has a width of 8 but a width of 209 at the lower part. Then, light having a photosensitive wavelength of the resist layer 198 is irradiated on the entire surface of the etched portion, and the resist layer 19 opened on the etched portion.
8 is exposed, the exposed portion of the resist layer 198 and the non-developed portion 213 of the resist layer 200 are removed using a developing solution, the non-etched portion of the metal film 199 is removed, and the metal film 2 is removed.
04, and the metal film 204 is used as an electrode for the metal layer 2
By electroforming No. 05, it becomes possible to form a stamper for an optical recording medium having a smaller groove or a smaller pit than ever before, and by using this, the capacity of the optical recording medium can be increased.

(Thirteenth Embodiment) The thirteenth embodiment of the present invention will be described below with reference to the drawings. FIG. 38 (a) to FIG.
8 (c) and FIGS. 39 (a) to 39 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 214 is a glass master, 215 is a positive resist layer, 216 is an exposed portion of the resist layer 215,
Reference numeral 217 is a developed portion of the resist layer 215, and 218 is LB.
(Langmuir-Blodgett) film, 219 is a metal film,
220 is a metal layer electroformed using the metal film 219 as an electrode,
221 is a stamper for an optical recording medium.

38 (a) to 38 (c) and FIG.
The method for producing the stamper for an optical recording medium shown in FIGS. 9 (a) to 39 (c) is as follows.

The surface of the glass master 214 is HMDS
And a treatment for improving the adhesiveness with the resist.

A positive resist layer 2 on the master 214
Apply 15.

When the specific area of the resist layer 215 is exposed according to the pattern of the optical recording medium while condensing the laser beam and rotating the master 214, the exposed portion 216 of the resist layer 215 is formed, as shown in FIG. ).

When the exposed portion of the resist layer 215 is developed with a developing solution, a developed portion 217 of the resist is formed, as shown in FIG. 38 (b).

LB film 2 after developing resist layer 215
When 18 is formed and the groove of the developing portion is made thin and shallow, FIG.
As shown in (c).

When the metal film 219 is formed on the LB film 218, it becomes as shown in FIG. 39 (a). Here, a silver-copper alloy was vacuum-deposited as the metal film 219 by a sputtering method.

When the same or different kind of metal layer 220 as the metal film 219 is electroformed, it becomes as shown in FIG. 39 (b). Here, nickel is electroformed as the metal layer 220.

The optical recording medium stamper 221 is formed as shown in FIG. 39 (c) by processing the inner and outer dies by peeling from the master 214.

FIG. 40 is a view for explaining the principle of producing the stamper for an optical recording medium shown in FIGS. 38 (a) to 38 (c) and FIGS. 39 (a) to 39 (c).

A width 222 is determined by the diffraction limit of the optical system used for laser cutting. 223 is LB
The width is narrowed by the membrane and is narrower than 222.
224 is a glass master and is the same as the master 214, 22
Reference numeral 5 is a non-developed portion of the resist layer 215, and 226 is a portion where the LB film was present.

A positive resist layer 21 is formed on the master 224.
5 is applied, the laser beam is condensed, the master 224 is rotated to expose a specific region of the resist layer 215, and the exposed portion of the resist layer 215 is developed with a developing solution. It is formed. After that, an LB film is formed to thin and shallow the groove in the developing portion. Then, a width 223 narrower than the width 222 determined by the diffraction limit of the optical system used for laser cutting is achieved. After that, a metal film 219 is formed, and a metal layer 220 that is the same as or different from the metal film 219 is electroformed,
By peeling from the master 224, the groove becomes thin and shallow by the amount corresponding to the LB film of 226. As a result, it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than conventional ones, and by using this, the capacity of the optical recording medium can be increased.

In this embodiment, the system using the LB film has been described, but the invention is not limited to this. It is only necessary that the LB film can be formed to have a uniform thickness, and therefore the same result can be obtained when the organic film is formed by a method such as sputtering or CVD.

(Fourteenth Embodiment) The fourteenth embodiment of the present invention will be described below with reference to the drawings. 41 (a) to 4
1 (c) and FIGS. 42 (a) to 42 (c) are conceptual views of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 227 is a glass master, 228 is a metal film, 229 is a metal layer electroformed using the metal film 228 as an electrode, 230 is a positive resist layer, 231 is an exposed portion of the resist layer 230, and 232 is A developed portion of the resist layer 230, 233 is an etched portion of the metal layer 229, 234 is a metal film, 235 is a metal layer electroformed using the metal film 234 as an electrode, and 236 is a stamper for an optical recording medium.

41 (a) to 41 (c) and FIG.
The method of producing the stamper for an optical recording medium shown in FIGS. 2 (a) to 42 (c) is as follows.

The surface of the glass master 227 is HMDS
And a treatment for improving the adhesiveness with the resist.

A metal film 228 is formed on the master 227. Here, a silver-copper alloy was vacuum-deposited as the metal film 228 by a sputtering method.

Metal layer 2 using the metal film 228 as an electrode
29 is electroformed. Here, a nickel layer was electroformed as the metal layer 229.

A positive resist layer 230 is applied on the metal layer 229.

The resist layer 2 that focuses laser light
When the specific region of 30 is exposed according to the pattern of the optical recording medium, as shown in FIG.
The exposed portion 231 is formed.

When the exposed portion is developed with a developing solution, a developed portion 232 of the resist layer 230 is formed as shown in FIG. 41 (b). In this case, the development of the resist tends to have a trapezoidal shape in which the upper part is wider than the lower part, which makes it possible to draw a thinner line than before.

When the metal film 228 exposed at the developed portion is etched by dry etching, an etched portion 233 of the metal layer 229 is formed as shown in FIG. 41 (c).

The resist layer 230 not developed with the solvent is removed.

When the metal film 234 is formed, FIG. 42 (a)
As shown in. Here, a silver-copper alloy was vacuum-deposited as the metal film 234 by a sputtering method.

When a metal layer 235 is electroformed on the metal film 234, it becomes as shown in FIG. 42 (b). Here, nickel was electroformed as the metal layer 235.

The metal film 234 is peeled off from the master 227.
42 (c) by removing the
As shown in, a stamper 236 for an optical recording medium is formed. FIG. 43 shows FIGS. 41 (a) to 41 (c) and FIG.
FIG. 43A is a view for explaining the principle of manufacturing the stamper for an optical recording medium shown in FIGS. 2A to 42C.

237 is a width determined by the diffraction limit of the optical system used for laser cutting. Reference numeral 238 denotes the width of the lower portion of the resist layer 230 formed by development, which is narrower than 237. 239 is a glass master and is the same as the master 227, and 240 is a resist layer 230.
, 241 is a non-etched portion of the metal layer 229.

A metal film 228 is formed on the master 239,
The metal layer 229 is electroformed by using the metal film 228 as an electrode,
A positive type resist layer 230 is applied on the metal layer 229, a laser beam is condensed to expose a specific region of the resist layer 230, and the exposed portion is developed with a developing solution. The non-developed portion 240 of
Since the upper portion of the developed portion has a broad trapezoidal shape, the upper portion of the developed portion has a width 237 determined by the diffraction limit of the optical system used for laser cutting, and the lower portion has a width 238. Then, by etching the metal film 228 exposed in the developed portion by dry etching, the non-developed portion 240 of the resist layer 230 is formed.
Thereafter, the non-developed portion 240 of the resist layer 230 is removed by using a solvent, a metal film 234 is formed, a metal layer 235 is electroformed on the metal film 234, and peeled from the master 239 to form the metal film 234. By removing it, it becomes possible to form a stamper for an optical recording medium having a narrower groove or smaller pit than ever, and by using this, the capacity of the optical recording medium can be increased.

(Fifteenth Embodiment) The fifteenth embodiment of the present invention will be described below with reference to the drawings. FIG. 44 (a) to FIG.
4 (c) and FIGS. 45 (a) to 45 (c) are conceptual diagrams of a method of manufacturing a stamper used for producing the optical recording medium according to the present invention.

Reference numeral 242 is a glass master, 243 is a metal film, 244 is a positive resist layer, 245 is an exposed portion of the resist layer 244, 246 is a developed portion of the resist layer 244, 247 is a silicon oxide layer, and 248 is a resist. The non-developed portion of the layer 244, 249 is the etched portion of the metal film 243,
Reference numeral 250 is a metal film, 251 is a metal layer electroformed using the metal film of 250 as an electrode, and 252 is a stamper for an optical recording medium.

44 (a) to 44 (c) and FIG.
The method for producing the stamper for optical recording medium shown in FIGS. 5 (a) to 45 (c) is as follows.

The metal film 24 on the master 242 made of glass
3 is deposited.

Here, a silver-copper alloy was vacuum-deposited as the metal film 243 by a sputtering method.

A resist layer 24 on the metal film 243
4 is applied by spin coating.

When a specific region of the resist layer 244 is exposed using a HeCd laser that has focused almost to the diffraction limit using an optical system with an NA of 0.9, exposed portions of 20 resists 245 are formed, It becomes as shown in FIG.

When the exposed portion is developed with an inorganic alkaline developer, the developed portion 246 of the resist layer 244 is formed.
Is formed.

When the silicon oxide layer 247 is formed, it becomes as shown in FIG. 44 (b).

When the non-developed portion of the resist layer 244 is removed by dry etching, it becomes as shown in FIG. 44 (c). In this case, by narrowing the non-exposed portion of the resist layer 244, that portion is etched later, so that the resolution can be freely set, whereby a high resolution can be realized.

When the metal film 243 exposed in the removed portion of the resist layer 244 is etched, an etched portion 249 of the metal film 243 is formed.

When the silicon oxide layer 247 is also removed by etching, it becomes as shown in FIG.

Form the metal film 250. Here, as the metal film 250, nickel was vacuum-deposited by a sputtering method.

When the metal layer 251 is electroformed on the metal film 250, it becomes as shown in FIG. 45 (b). Here, nickel is electroformed as the metal film 250.

-Peeled from the master 242, the metal film 243
45 (c) by removing the mold and processing the inner and outer molds.
As shown in 252, a stamper 252 for an optical recording medium is formed. FIG. 46 shows FIGS. 44 (a) to 44 (c) and FIG.
It is a figure for demonstrating the creation principle of the stamper for optical recording media shown to 5 (a) to FIG. 45 (c).

253 is a width determined by the diffraction limit of the optical system used for laser cutting. 254 is the width of the groove of the metal film 243 formed by etching. Numeral 255 is a glass master and is the same as the master 242, and 256 is a silicon oxide layer and 257 is a non-etched portion of the silicon oxide layer.

A metal film 243 is formed on the glass master 255.
Is formed, a resist layer 244 is applied on the metal film 243, a specific region of the resist layer 244 is exposed by using a laser beam, and the exposed portion is developed by using a developing solution. Then, a non-developed portion of the resist layer 244 is formed. Then, a silicon oxide layer is formed, and the non-developed portion of the resist layer 244 is removed by dry etching. At this time, the non-developed portion of the resist layer 244 is sandwiched between the developed portions and can be made narrow.
Then, when the metal film 243 that appears in the removed portion is etched, the etched portion can be made narrower than 253 which is the diffraction limit of the optical system. Then the metal film 2
By removing the silicon oxide layer 247 remaining on 43, a non-etched portion 257 of the silicon oxide layer 247 is formed. Then, the metal film 250 is formed, the metal layer 251 is electroformed on the metal film 250, and the metal film 250 is peeled off from the master 255.
By removing 43, it becomes possible to form a stamper for an optical recording medium having a groove or a pit smaller than that of the conventional one, and by using this, the capacity of the optical recording medium can be increased.

(Comparison with Conventional Example) FIG. 1 shows a conceptual diagram of an optical recording medium using an optical recording medium stamper manufactured by the method described in each item of this example. 1 is a polycarbonate substrate, 2 and 4 are SiAlN ceramic layers, 3
Is a recording layer, 5 is a reflective layer, 6 is a protective coat layer, 7 is a hard coat layer, and 8 is a hub. Using a stamper for an optical recording medium manufactured by the method described in each item of this example, a polycarbonate substrate was molded, and recording and reproduction were performed using a short wavelength laser of 415 nm. It was possible to increase from 4 times.

The polycarbonate substrate 1 was prepared by injection compression molding using the stamper prepared by the method described in each item of this embodiment. This substrate manufacturing method is not limited to injection compression molding, and a photopolymer method using an ultraviolet curable resin may be used. The SiAlN ceramic layers 2 and 4 were formed by an RF reactive magnetron sputtering method by introducing a mixed gas of nitrogen and argon using a sintered target of SiAl. Most of the ceramic layers can be used as long as they are transparent to the light used for recording / reproducing of the optical recording medium.
N, AlN or the like may be used. The stamper for optical recording medium described in each item of these examples has a groove width of 0.25 μm.
m, and the track groove pitch was 0.9 μm. As the recording film 3, a Pt / Co-based periodic multilayer film was used so as to have a large Kerr rotation angle near 400 nm. This Pt / Co
The system periodic multilayer film is formed by alternately depositing Co and Pt in multiple layers. This recording film contains TbFeCoCr / NdCo /
TbFeCo multilayer film and NdDyFeCo / NdCo /
NdDyFeCo, NdDyTbFeCo / NdCo /
Similar results were obtained using NdDyTbFeCo. The reflective layer 5 was formed by a DC magnetron sputtering method by introducing an argon gas using an alloy target of aluminum and titanium. Protective coat layer 6
For this, an ultraviolet curable resin applied by a spin coating method and cured was used. An ultraviolet curable resin was also used for the hard coat layer 7, but one that was thinner than the protective coat layer 6 and had a high surface hardness after curing was used.

Next, a comparison with the case of the conventional method will be described. In the conventional method, first, a glass master is vapor-treated with HMDS and a positive resist is applied to form a resist layer of about 1500 Å. 44
A HeCd gas laser having a wavelength of 2 nm is focused, and a specific region of the applied and prebaked resist layer is exposed according to the pattern of the optical recording medium. Then, the substrate is rinsed with water to accelerate the reaction of the exposed portion of the naphthoquinonediazide in the resist to an indenecarboxylic acid. Then, the resist layer in the exposed portion is developed using an inorganic or organic alkaline developer. After the development is completed, the resist is after-baked, and a nickel layer is sputtered on the surface of the resist for about 100 minutes.
0Å Film formation. Then, using the formed nickel layer as an electrode, nickel is further electroformed. After that, the electroformed nickel layer is peeled off from the glass master, and the outer peripheral portion and the inner peripheral portion are processed to form a stamper for an optical recording medium. In this case, since the diameter of the spot of the laser beam does not become smaller than 0.4 μm even if the NA of the objective lens is set to almost the maximum of 0.9 using a HeCd laser, the groove width and pit diameter obtained are approximately 0.4 μm. Met.

As described above, in the conventional case, the spot diameter is approximately 0.4 μm, and the width of the formed groove or pit is 0.
In contrast to the thickness of 4 μm, the present Examples 1 to 12
When the method according to the present invention shown in FIG.
It was possible to form grooves and pits with a width of 2 μm.

As the methods of pre-baking and after-baking shown in each item of this embodiment, a method of placing a master on a hot plate for heating, a method of using a hot air circulation dryer, infrared heating, an oven baking method, etc. are used. You can The positive resist used in each item of this example was a naphthoquinonediazide-novolacno resin system.
The present invention should not be considered to be limited to these examples, and various modifications can be made without departing from the spirit of the present invention.

For example, in the first to fifteenth embodiments, the glass master is used, but not limited to glass, alumina, silica, magnesia, sialon, silicon carbide,
Ceramics such as silicon wafers, silicon nitride, aluminum nitride, and semi-metal materials may be used.

Further, two conditions are required for the metal film to be dissolved after shown in each item of this embodiment. One is that the grain size is small when vacuum-deposited, and the other is that it can be separated under a condition different from the metal used as the material of the stamper for an optical recording medium. That is, it is necessary to be able to dissolve with a special solution.
Therefore, as in this example, a hydrogen peroxide-ammonia-based silver stripper is used to remove silver containing a metal such as silicon, copper, germanium, aluminum, magnesium, or zinc so that the grain size becomes small when vacuum-deposited. It is also possible to take advantage of the difference in reactivity, such as exfoliating with a liquid, or adding various impurities to amphoteric metals such as aluminum, magnesium, and zinc to reduce the grain size and then dissolving with an alkaline solution. it can.

In this embodiment, the optical recording medium having a single plate structure has been described. However, a structure in which a single plate structure is adhered with a hot-melt type adhesive, an adhesive made of epoxy resin, urethane resin or the like is also used. It can be applied without any problems.

Furthermore, the resolution method below the diffraction limit of the optical system used in each item of this embodiment can be applied to many resolution methods using a resist such as a semiconductor.

[0315]

As described above, according to the present invention, since the width of the track groove of the stamper used for the optical recording medium can be made narrower and the pits can be made smaller than the conventional one, the recording density of the optical recording medium can be improved. It is possible to provide a substrate necessary for a system using a recording film for increasing short wavelength recording, and thereby it is possible to increase the recording density of an optical recording medium. Further, since the conventional optical system can be used to form a groove or a smaller pit than the conventional one, there is also an effect that the resolution can be increased in resolution using a resist such as a semiconductor.

[Brief description of drawings]

FIG. 1 is a basic configuration diagram of an optical recording medium of the present invention.

2 (a) to 2 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 1 of the present invention.

3 (a) to 3 (c) are also conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 1 according to the present invention, which is a continuation of FIG.

FIG. 4 is a diagram for explaining the principle of producing a stamper used to produce the recording medium according to the present invention as defined in claim 1;

5 (a) to 5 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 2 of the present invention.

6 (a) to 6 (c) are also conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 2 according to the present invention, which is a continuation of FIG.

FIG. 7 is a diagram for explaining a principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 2;

8 (a) to 8 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 3 of the present invention.

9 (a) to 9 (c) are conceptual diagrams of a method for manufacturing the stamper for an optical recording medium according to claim 3 of the present invention, which is a continuation of FIG.

FIG. 10 is a diagram for explaining a principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 3;

11 (a) to 11 (c) are conceptual diagrams of a method of manufacturing a stamper for an optical recording medium according to claim 4 of the present invention.

12 (a) to 12 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 4 of the present invention, which is a continuation of FIG.

FIG. 13 is a diagram for explaining a principle of producing a stamper used for producing the optical recording medium according to the present invention shown in claim 4;

14 (a) to 14 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 5 of the present invention.

15 (a) to 15 (c) are conceptual diagrams of a method of manufacturing an optical recording medium stamper according to claim 5 of the present invention, which is a continuation of FIG.

FIG. 16 is a diagram for explaining a principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 5;

17 (a) to 17 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 6 of the present invention.

18 (a) to 18 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 6 of the present invention, which is a continuation of FIG.

FIG. 19 is a view for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 6;

20 (a) to 20 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 7 of the present invention.

21 (a) to 21 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 7 of the present invention, which is a continuation of FIG. 20.

FIG. 22 is a diagram for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 7;

23 (a) to 23 (c) are conceptual diagrams of a method for manufacturing an optical recording medium stamper according to claim 8 of the present invention.

24 (a) to 24 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 8 of the present invention, which is a continuation of FIG. 23.

FIG. 25 is a diagram for explaining a principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 8;

26 (a) to 26 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 9 of the present invention.

27 (a) to 27 (c) are conceptual diagrams of a method for manufacturing the stamper for an optical recording medium according to claim 9 of the present invention, which is a continuation of FIG. 26.

FIG. 28 is a diagram for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 9;

29 (a) to 29 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to a tenth aspect of the present invention.

30 (a) to 30 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to claim 10 of the present invention, which is a continuation of FIG. 29.

FIG. 31 is a diagram for explaining the principle of forming a stamper used for forming the optical recording medium according to the present invention as defined in claim 10;

32 (a) to 32 (c) are conceptual diagrams of a method of manufacturing an optical recording medium stamper according to claim 11 of the present invention.

33 (a) to 33 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 11 of the present invention, which is a continuation of FIG. 32.

FIG. 34 is a diagram for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 11;

35 (a) to 35 (c) are conceptual diagrams of a method of manufacturing a stamper for an optical recording medium according to a twelfth aspect of the present invention.

36 (a) to 36 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 12 of the present invention, which is a continuation of FIG. 35.

FIG. 37 is a diagram for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 12;

38 (a) to 38 (c) are conceptual diagrams of a method for manufacturing an optical recording medium stamper according to claim 13 of the present invention.

39 (a) to 39 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 13 of the present invention, which is a continuation of FIG.

FIG. 40 is a diagram for explaining a principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 13;

41 (a) to 41 (c) are conceptual diagrams of a method of manufacturing a stamper for an optical recording medium according to a fourteenth aspect of the present invention.

42 (a) to 42 (c) are conceptual diagrams of a method of manufacturing the stamper for an optical recording medium according to claim 14 of the present invention, which is a continuation of FIG. 41.

FIG. 43 is a view for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention as defined in claim 14;

44 (a) to 44 (c) are conceptual views of a method for manufacturing a stamper for an optical recording medium according to a fifteenth aspect of the present invention.

45 (a) to 45 (c) are conceptual diagrams of a method for manufacturing a stamper for an optical recording medium according to a fifteenth aspect of the present invention, which is a continuation of FIG. 44.

FIG. 46 is a diagram for explaining the principle of producing a stamper used for producing the optical recording medium according to the present invention shown in claim 15;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Polycarbonate substrate 2 ... SiAlN layer 3 ... Recording layer 4 ... SiAlN layer 5 ... Reflective layer 6 ... Protective coat layer 7 ... Hard coat layer 8 ... Hub 9 ... Glass master 10 ... Positive resist layer 11 ... Organic silica layer 12 ... Positive resist layer 13 ... Exposure portion of resist 14 ... Development portion of resist 15 ... Organic silica layer 16 ・ ・ Etched part of organic silica layer 17 ・ ・ Part of resist development 18 ・ ・ Development part of resist 19 ・ ・ Metal film 20 ・ ・ Metal film 21 ・ ・ Metal film 20 as electrode Metal layer 22 ... Stamper for optical recording medium 23. Width determined by diffraction limit of optical system used for laser cutting 24. Resist layer 1 formed by development
Lower width of 2 25. Lower width formed by etching organic silica layer 11 26. Glass master and same as master 27. Non-developed part of resist layer 28. Organic Non-etched part of silica layer 29..Non-developed part of resist layer 12..Glass master 31..Positive resist layer 32..Organic silica layer 33..Positive resist layer 34..Resist Exposed portion of layer 33 35. Development portion of resist layer 33 36. Etched portion of organic silica layer 32 37. Development portion of resist layer 38 38. Development portion of resist layer 39 39. Metal film 40・ ・ Metal film 41 ・ ・ Metal layer 42 ・ ・ Metal film 43 ・ ・ Metal layer 44 ・ ・ Stamper for optical recording medium 45 ・ ・ Due to the diffraction limit of the optical system used for laser cutting Resist layer 3 formed by the width 46 ... development determined
Width of lower part of 3 47 .. Width of lower part of groove formed by etching organic silica layer 32. 48. Development part opened on glass master 30 by exposing and developing resist layer 31. A glass master and the same as the master 30 50 A non-development part 51 of the resist layer 31 A non-etching part 52 of the organic silica layer 32 A non-development part 53 of the resist layer 33 A glass master 54 ..Metal film 55..Metal layer 56..Positive resist layer 57..Organic silica layer 58..Positive resist layer 59..Exposure part of resist layer 60 ... Development part of resist layer 56. ..Etched portion of the organic silica layer 57 62..etched portion of the organic silica layer 63 ... development portion of the resist layer 56 64..metal film 65..completed Stamper for optical recording medium 66..width determined by diffraction limit of optical system used for laser cutting 67..resist layer 5 formed by development
Width 68 at the bottom of 8 68 Width at the bottom of the groove formed by etching the organic silica layer 57 69 Development unit that opens on the glass master 71 by exposing and developing the resist layer 56 70 A metal film 64 71 formed on the metal layer 55 exposed by etching the resist layer 56 71 a glass master and the same as the master 53 72 a metal layer formed by electroforming and a metal layer 5
Same as No. 5 73. Non-development part of resist layer 56 74. Non-etching part of organic silica layer 57 75. Non-development part of resist layer 58 76. Glass master 77 .. Positive resist layer 78 ..Surface-treated portion of resist layer 77 79..exposed portion of resist layer 77 80..development portion without surface treatment 81..development portion when surface treatment by DeepUV treatment or heat treatment 82..ultraviolet Developed portion of resist layer 77 when the surface-treated portion is removed by irradiation or ozone treatment during development 83. Metal film 84. Metal layer 85 .. Optical recording medium stamper 86 .. Optical system used for laser cutting Width determined by diffraction limit 87 .. Resist layer 7 formed by development
Width of 7 88 ··· Glass master and the same as master 76 89 · Width determined by the diffraction limit of the optical system used for laser cutting of the non-developed area of the resist layer 77 · 90 · Glass master 91 · Positive type Resist layer 92 ··· water-soluble resin layer 93 having the property of increasing the transmittance of laser light used for cutting by laser light irradiation ··· exposed portion of water-soluble resin layer 92 and resist layer 91 · · water-soluble resin layer Developing part 95 .. Developing part of resist layer 91 .. Metal film 97 .. Metal layer electroformed by using metal film of 96 as electrode 98 .. Stamper for optical recording medium 99 .. Optical used for laser cutting The width determined by the diffraction limit of the system 100, the width formed by development 101, the glass master and the same as the master 90 102, the resist layer 1 part 103 · Water-soluble resin layer to be removed Width determined by diffraction limit of optical system used for laser cutting 104 · Glass master 105 · Negative resist layer 106 · Exposed portion of resist layer 105 · Resist layer 105 Development part 108, metal film 109, metal film 110, metal layer 111 electroformed using metal film 109 as an electrode, metal layer 112 electroformed using a mother stamper as a mold, stamper 113 for optical recording medium, used for laser cutting A width 114 determined by the diffraction limit of the optical system, a width 115 below the developed portion 115, a non-developed portion 116 of the resist layer 105, and a metal film formed on the developed portion of the resist layer 105, which is the same as the metal film 108 117 The same master as the master 104 118. Glass master 119. Metal film 120. Metal 121-negative resist layer 122-exposed portion of resist layer 121 123-developed portion of resist layer 121 124-metal film 125 formed on 123-formed on undeveloped portion of resist layer 121 Metal film 124 126, stamper 127 for optical recording medium, width 128 determined by diffraction limit of optical system used for laser cutting, width 129 under developed portion 129, non-developed portion 130 of resist layer 121, developed portion of resist layer 121 Metal film 124 131 formed on the metal layer 1 formed on the glass master plate 132
20 132 ・ Glass master and same as 118 133 ・ Glass master 134 ・ Positive resist layer 135 ・ Amorphous silicon film, amorphous metal film or microcrystalline metal film 136 ・ Positive resist Layer 137, exposed portion of resist layer 136 138, developed portion of resist layer 136 139, etched portion of amorphous silicon film, amorphous metal film or microcrystalline metal film 140, exposed portion of resist layer 134 141, resist Development portion 142 of layer 134, metal film 143, metal layer 144 electroformed using metal film 142 as an electrode, stamper 145 for optical recording medium, width 146 determined by diffraction limit of optical system used for laser cutting, and development Resist layer 3 formed by
Width 147 of the lower part of 3 and width 148 of the lower part of the groove formed by etching the amorphous silicon film, the amorphous metal film or the microcrystalline metal film 135. By exposing and developing the resist layer 136. Developed part 149. A master plate made of glass, which is the same as the master plate 150. 150. Non-developed part of resist layer 134. 151. Non-etched part of amorphous silicon film, amorphous metal film or microcrystalline metal film 135. 152-non-development part 153 of resist layer 136-glass master 154-amorphous silicon film, amorphous metal film or microcrystalline metal film 155-positive resist layer 156-mask 157-resist layer 155 Exposed part 158 / Development part of resist layer 155 159 / Etched part of amorphous silicon film, amorphous metal film or microcrystalline metal film 160 / Metal film 161 Resist layer 1 formed by the width 164 and development determined by the diffraction limit of the optical system used in the stamper 163, laser cutting metal layer 162, an optical recording medium
Width of the lower part of 55 165. The lower amorphous silicon film, the amorphous metal film or the microcrystalline metal film 166 which appears by exposing and developing the resist layer 155. The glass master and the same as the master 153. 167 -Amorphous silicon film, non-etched portion of amorphous metal film or microcrystalline metal film 168-Non-developed portion of resist layer 155 169-169 is a glass master 170-Positive resist layer 171-Metal film 172. Exposed portion of resist layer 170. 173. Development portion of resist layer 170. 174. Metal film 175. Metal layer electroformed by using 174 as an electrode. 176. Stamper 177 for optical recording medium. Diffraction of optical system used for laser cutting. Width determined by limit 178. Resist layer 1 formed by developing
Width of 70 179. Development part 180 formed by exposing and developing resist layer 170. Same as glass master 181. 181. Non-development part of resist layer 170 182. Glass master 183. Positive type. Resist layer 184, metal film 185, mask 186, etched portion of metal film 184 187, exposed portion of resist layer 183 188, developed portion of resist layer 183 189, metal film 190, metal layer 191, stamper for optical recording medium 192・ Width 193 determined by diffraction limit of optical system ・ Resist layer 1 formed by development
The width of 83 is 194. It is a master of glass and is the same as 182. 195 is the non-etched part of the metal film 184. The non-developed part of the resist layer 183 is the master of glass 198. The resist layer is 199. The metal film is 200. Resist layer 201, exposed portion of resist layer 200 202, etched portion of metal film 199 203, developed portion of resist layer 198 204, metal film 205, metal layer electroformed using metal film 204 as an electrode 206, optical recording Stamper 207 for medium, width 208 determined by diffraction limit of optical system used for laser cutting, resist layer 2 formed by developing
Width 209 at the bottom of 00. Width at the bottom of the groove formed by etching the metal film 199. 210. A master plate made of glass and the same as the master plate 197. 211. Non-development part 212 of the resist layer 198. Non-etched portion 213, non-developed portion 214 of resist layer 200, glass master 215, positive resist layer 216, exposed portion 217 of resist layer 215, developed portion 218 of resist layer 215, LB (Langmuir-Blodgett) ) Film 219, metal film 220, metal layer 221 electroformed using metal film 219 as an electrode, stamper 222 for optical recording medium, width 223 determined by diffraction limit of optical system used for laser cutting, and LB film Width 224. It is a glass master and is the same as the master 214 225. Resist layer 215 Non-development area 226. Portion where LB film was 227. Glass master 228. Metal film 229. Metal layer 230 electroformed by using metal film 228 as an electrode. Positive resist layer 231. Exposure of resist layer 230. Part 232, developing part 233 of resist layer 230, etching part 234 of metal layer 229, metal film 235, metal layer 236 electroformed by using metal film 234 as an electrode, stamper 237 for optical recording medium, and optics used for laser cutting The width 238 determined by the diffraction limit of the system. The resist layer 2 formed by development.
The width of the lower part of 30 is 239. It is a glass master and is the same as the master 227 240. Non-development part 241 of the resist layer 230, non-etching part 242 of the metal layer 229, glass master 243, metal film 244, positive type Resist layer 245, exposed portion of resist layer 244 246, developed portion of resist layer 244 247, silicon oxide layer 248, undeveloped portion of resist layer 244 249, etched portion of metal film 243 250, metal film 251 and metal film of 250 Layer 252 that is electroformed by using as an electrode, stamper 253 for optical recording medium, width 254 determined by the diffraction limit of the optical system used for laser cutting, groove width 255 of metal film 243 formed by etching, glass It is a master and is the same as the master 242. Non-etched part

Claims (15)

[Claims] 1. A positive resist layer 10 is applied on a master 9, an organic silica layer 11 is formed on the resist layer 10, and a positive resist layer 1 is further formed on the organic silica layer 11.
2 is applied, the laser beam is focused, the specific region of the resist layer 12 is exposed while the master 9 is rotated, the exposed portion of the resist layer 12 is developed, and then the developed portion of the resist layer 12 is exposed. The organic silica layer 11 that has been opened is etched, and the resist layer 12 that has not been developed and the resist layer 10 that has been opened in the etched portion of the organic silica layer 11 have been etched, and that has not been etched in the first etching. The organic silica layer 11 is etched to form a metal film 19, a metal film 20 is further formed, and the metal film 19 and the metal film 20 are used as electrodes to form a metal layer 21 of the same kind or different kind as the metal film 20. An optical recording medium comprising a stamper formed by electroforming, peeling from the master 9, and removing the metal film 19. 2. A positive resist layer 31 on the master 30.
Is applied to form an organic silica layer 32 on the resist layer 31, and a positive type resist layer 3 is further formed on the organic silica layer 32.
3 is applied, the laser beam is focused, the specific region of the resist layer 33 is exposed while the master 30 is rotated, and the exposed portion of the resist layer 33 is developed, and then the resist layer 33 is opened in the developed portion. The organic silica layer 32 is etched, the resist layer 31 opened in the etched portion of the organic silica layer 32 is etched, a metal film 39 is formed, and the resist 31 remaining on the master 30 is etched. The organic silica layer 32 and the resist layer 33 are removed, a metal film 40 is further formed, and the metal film 40 is used as an electrode to electroform a metal layer 41 of the same kind or different kind as the metal film 40,
A metal plate is peeled off from the master 30, the metal film 30 remaining on the metal plate is removed to form a metal film 42, and a metal layer 43 of the same kind or different kind as the metal film 40 is electroformed. An optical recording medium characterized by using a stamper produced by peeling the metal plate from the metal plate. 3. A metal film 54 is formed on a master 53, and a metal layer 55 of the same kind or different kind as the metal film 54 is electroformed by using the metal film 54 as an electrode. Applying a positive resist layer 56,
An organic silica layer 57 is formed on the resist 56, and a positive resist layer 5 is further formed on the organic silica layer 57.
8 is applied, a laser beam is condensed, the master 53 is rotated to expose a specific region of the resist 58, the exposed portion of the resist 58 is developed, and then the opened portion of the resist 58 is opened. The organic silica layer 57 is etched, the resist layer 56 opened in the etched portion of the organic silica layer 57 is etched, and a metal film 64 of the same kind as the metal layer 55 is formed and left on the master 53. An optical recording medium comprising a stamper produced by removing the resist layer 56, the organic silica layer 57 and the resist layer 58 which are present. 4. A positive resist layer 77 on the master 76.
And exposing the specific area of the resist 77 while rotating the master disk 76 by converging a laser beam to develop the exposed portion of the resist 77, and the metal film 83 on the developed and non-developed portions. In a stamper for an optical recording medium produced by electroforming a metal layer 84 of the same or different type as the metal film 83, and exposing the entire surface of the resist 77 to ultraviolet light before exposing the resist 77 to light. An optical recording medium characterized by using a stamper produced by deep UV irradiation, ozone treatment, or heat treatment. 5. A positive resist layer 91 on the master 90.
And exposing the specific region of the resist layer 91 while rotating the master 90 by rotating laser light to develop the exposed portion of the resist layer 91, and then applying a metal to the developed portion and the non-developed portion. In a stamper for an optical recording medium, which is formed by forming a film 96, and using the metal film 96 as an electrode, and electroforming a metal layer 97 of the same or different kind as the metal film 96, a water-soluble stamper is formed on the resist layer 91. Including a step of exposing a specific region of the resist layer 91 after forming the water-soluble resin layer 92, the water-soluble resin layer 92 having a property of increasing the transmittance by heat, or generating cations by light, An optical recording medium characterized by using a stamper which has a property of increasing the transmittance of light used for the exposure by the cation. 6. A negative resist layer 1 on the master 104.
05 is applied, the laser beam is condensed, the specific region of the resist layer 105 is exposed while rotating the master 104, and the non-exposed portion is developed, and then the metal film 108 is formed on the developed portion and the non-developed portion. The non-development portion and the metal film 108 formed on the non-development portion are removed, a metal film 109 is formed, and the metal layer 110 is electroformed using the metal film 109 as an electrode to form the master disc. An optical recording medium comprising a mother stamper separated from 104, a metal plate 111 being electroformed with a metal plate as a mold, and the stamper prepared by separating from the mother stamper. 7. A metal film 119 is formed on the master 118, a metal layer 120 of the same kind as or different from the metal film 119 is electroformed, and a negative resist layer 121 is formed on the metal layer of 120. After coating, the laser beam is condensed to expose a specific region of the resist layer 121, and the exposed portion is developed, and then a metal film 124 of the same type as the metal layer 120 is formed and left on the master 118. An optical recording medium using a stamper formed by removing the resist layer 121 and the metal film 124 formed on the resist. 8. A positive resist layer 13 on the master 133.
4 is applied, and an amorphous silicon film, an amorphous metal film or a microcrystalline metal film 135 is formed on the resist layer 134, and the amorphous silicon film, the amorphous metal film or the microcrystalline film is formed. Metal film 1
35 is further coated with a positive resist layer 136, the laser beam is focused to expose a specific region of the resist layer 136, the exposed portion is developed, and the amorphous portion opened in the developed portion. The silicon film, the amorphous metal film, or the microcrystalline metal film is partially etched, and the entire surface is irradiated with light so that the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film is partially etched. The resist layer 134 in the exposed portion is exposed, and the resist layer 134 and the amorphous silicon film, the amorphous metal film, or the microcrystalline metal film 135 left undeveloped are exposed.
After removing the metal film 142, the metal film 142 is formed, and the same or different metal layer 143 as that of the metal film 142 is electroformed, and the metal film 142 is peeled off from the master 133. An optical recording medium comprising a stamper made by removing the crystalline metal film and the metal film 142. 9. An amorphous silicon film, an amorphous metal film or a microcrystalline metal film 154 is formed on a master 153, and the amorphous silicon film, the amorphous metal film or the microcrystalline metal film is formed. 1
54 is coated with a positive resist layer 155, exposed using a mask corresponding to the grooves and pits of the optical recording medium, and then the exposed portion is developed, and the amorphous silicon film opened in the developed portion. The amorphous metal film or the microcrystalline metal film 154 is etched, the undeveloped resist layer 155 is removed, the metal film 160 is formed, and the same or different metal layer 161 film as the metal film 160 is formed. An optical recording medium comprising a stamper formed by electroforming and peeling from the master 153. 10. A positive type resist layer 170 is applied on a master 169, a metal film 171 is formed extremely thinly on the resist layer 170, and laser light is condensed to form a metal film from above the metal film 171. A specific region of the resist layer 170 is exposed, the metal film 171 and the exposed portion are developed, and a metal film 174 is formed on the developed portion and the non-developed portion. An optical recording medium using a stamper made by electroforming a metal. 11. A positive type resist layer 183 is applied on a master 182, a metal film 184 is formed on the resist 183, and the metal film 184 is formed using a mask corresponding to the pattern of the optical recording medium. The resist layer 183 is exposed to light having a photosensitive wavelength to irradiate the entire surface of the etched portion to expose the resist layer 183 opened in the etched portion, and the exposed portion is developed. An optical recording medium comprising a stamper formed by removing the film 184, forming a metal film 189, and electroforming the metal layer 190 using the metal film 189 as an electrode. 12. A positive resist layer 198 is applied on a master 197, a metal film 199 film is formed on the resist layer 198, and a positive resist layer 20 is further formed on the metal film 199 film.
0 is applied, laser light is focused to expose a specific area of the resist layer 200, the exposed portion is developed, and the metal film 199 opened in the developed portion is etched to expose the resist layer 198. By irradiating the entire surface of the etched portion with light having a wavelength, the resist layer 198 opened in the etched portion is exposed, and the exposed portion of the resist layer 198 and the resist layer 200 are developed with a developing solution, and the resist layer 198 is not etched. An optical recording medium comprising a stamper formed by removing the metal film 199, forming the metal film 204, and electroforming the metal layer 205 using the metal film 204 as an electrode. 13. A positive type resist layer 215 is coated on the master plate 214, and a specific region of the resist layer 215 is exposed while condensing laser light to rotate the master plate 214. A stamper for an optical recording medium, which is produced by developing the exposed part, forming a metal film 219 on the developed part and the non-developed part, and electroforming a metal layer 220 of the same kind or different kind as the metal film 219, Before forming the metal film 219, the resist layer 21
5. An optical recording medium, characterized by using a stamper prepared by forming a LB film after developing No. 5, and including a step of making the groove of the developed portion thin and shallow. 14. A metal film 228 is formed on a master 227, a metal layer 229 is electroformed by using the metal film 228 as an electrode, and a positive resist layer 230 is applied on the metal layer 229. Exposing a specific region of the resist layer 230 by condensing laser light, developing the exposed portion, etching the metal layer 229 film exposed in the developed portion, and exposing the undeveloped resist layer 230. The metal film 234 is removed, the metal layer 235 is electroformed on the metal film 234, the metal film 234 is separated from the master 227, and the stamper formed by removing the metal film 234 is used. Characteristic optical recording medium. 15. A metal film 243 is formed on the master 242, a resist layer 244 is applied on the metal film 243, a specific region of the resist layer 244 is exposed by using a laser beam, and the exposure is performed. After developing the portion, a silicon oxide layer is formed, the non-developed portion of the resist layer 244 is removed by etching, the metal film 243 that appears in the removed portion is etched, and the silicon oxide layer is removed. A stamper formed by forming a film 250, electroforming a metal layer 251 on the metal film 250, peeling the metal layer 251 from the master 242, and removing the metal film 243 is used. recoding media.