JPH05299406A - Substrate washing tub - Google Patents

Abstract

PURPOSE:To prevent a re-adhesion of dust which has once been isolated by a method wherein an inflow and outflow fluid straightening plate of a washing tub is provided in parallel with a side well of the washing tub so that the washing fluid may flow in parallel with a substrate and a carrier. CONSTITUTION:A washing fluid supplied from a washing fluid inlet 2 flows into in the arrow-shaped direction and passes through the flow-in hole 2 of an inflow fluid straightening plate 1b and flows in the level direction along a substrate 7 and flows out from a flow-out hole 4 of a flow-out fluid straightening plate 1c to an external unit of a washing tub 1. At this time, minute dust, etc., adhered to the substrate 7 is washed out by the flow of horizontal direction of the washing liquid. Simultaneously, by causing an ultrasonic oscillation by an oscillation plate, the isolation of dust of the substrate 7 is aided. The dust isolated by washing operations flows out from the flow-out hole 4 along a flow of the washing fluid. Thus, it is possible to prevent a re-adhesion of the dust which has once been isolated from the substrate.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning tank for cleaning a semiconductor substrate in pretreatment of a semiconductor device manufacturing process. 2. Description of the Related Art In recent years, as the density of semiconductor devices has increased, the pattern to be formed has become finer, and the yield depends on the presence or absence of minute dust adhering to the surface of a semiconductor substrate in the manufacturing process of the semiconductor device. It has come to influence.
Therefore, a step of cleaning a semiconductor substrate (hereinafter referred to as a substrate) becomes important as a pretreatment in the manufacturing process. In this substrate cleaning step, generally, a semiconductor substrate is installed in a carrier (conveying means), the semiconductor substrate is inserted into a cleaning tank, and the cleaning liquid is injected from the cleaning liquid supply port to deposit dust on the substrate. With the cleaning liquid. As a specific example, in Japanese Patent Laid-Open No. 2-137321, as shown in FIG. 2, a diaphragm 10 for improving the cleaning effect of dust on the cleaning liquid supply port 20a at the center of the bottom surface of the cleaning tank 20 and its surroundings. Is provided, and a rectifying plate 11 for rectifying the cleaning liquid is provided in parallel with the bottom surface, and after inserting the carrier 6 on which the substrate 7 is installed into the cleaning tank 20, the cleaning liquid is supplied. When it is made to flow in through the port 20a, it is jetted through the flow straightening plate 11 as shown by the arrow and flows out from the peripheral portion of the cleaning tank 20 to the outside. In this case, the cleaning liquid (arrow) flowing upward near the peripheral edge portion is strongly discharged by the outward force and is discharged over the peripheral edge portion. However, in the above conventional substrate cleaning layer, the cleaning liquid flowing upward in the central portion of the cleaning tank 20 has an outward force due to the surface resistance of the substrate 7 and the carrier 6. Since the stagnation is weak and a stagnation with a slow moving speed is generated in the central layer portion of the cleaning tank 20, the dust released from the substrate 7 gathers and floats in the central portion of the upper layer of the cleaning tank 20, so that the substrate 7 is cleaned. There was a problem that the dust that had been washed once and re-attached to it again when it was taken out from the container. Therefore, the object of the present invention is to solve the above-mentioned problems of the prior art, and to remove the substrate from the cleaning tank,
It is an object of the present invention to provide a substrate cleaning apparatus that can perform effective cleaning without dust once detached from reattaching. [0006] The gist of the present invention is to rectify the cleaning liquid supplied from the cleaning liquid supply port and the external cleaning liquid supply port and direct the rectified liquid toward the substrate installed on the carrier. In a substrate cleaning tank provided with an inflow liquid rectifying plate having a plurality of inflow holes and a vibration plate provided on the bottom face of the tank, the inflow liquid rectifying plate is provided in a direction perpendicular to the bottom face of the tank, and An outflow liquid straightening plate having a plurality of outflow holes for allowing the cleaning liquid having passed through the inflow hole to flow horizontally along the surface of the substrate is provided in parallel with the inflow liquid straightening plate. There is something. Therefore, the cleaning liquid supplied from the cleaning liquid supply port flows horizontally along the surface of the substrate through the inflow hole of the inflow liquid straightening plate, and flows out from the outflow hole of the outflow liquid straightening plate to the outside. To do. At this time, the dust attached to the substrate is released by the vibration of the diaphragm, and flows out to the outside. Further, dust is not redeposited even when the substrate is taken out of the bath. Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, a cleaning tank (substrate cleaning tank) 1 includes
A cleaning liquid supply port 2 is provided on the side wall 1 a, and the side wall 1 a
Inflow liquid rectifying plate 1b having a plurality of inflow holes 3 through which the cleaning liquid passes in parallel with a and a plurality of outflow holes 4 are provided, and the inflow liquid and the rectifying plate 1b are parallel to the inflow liquid. An effluent rectifying plate 1c is provided (oppositely). And
A carrier 6 having a substrate 7 is inserted and arranged at an intermediate position between the inflow liquid rectifying plate 1b and the outflow liquid rectifying plate 1c, and the bottom of the cleaning tank 1 facing the carrier 6 helps release of dust. A vibrating plate 10 is installed. In the above structure, the cleaning liquid supplied from the cleaning liquid supply port 2 flows in the direction of the arrow, and the inflow liquid straightening plate 1
It flows in the horizontal direction along the surface of the substrate 7 through the inflow hole 2 of b, and flows out of the cleaning tank 1 through the outflow hole 4 of the outflow liquid rectifying plate 1c. At this time, minute dust and the like adhering to the substrate 7 is washed by the horizontal flow of the cleaning liquid, and at the same time, ultrasonic vibration is generated by the vibration plate 10 to help release the dust on the substrate 7. The dust released by this cleaning action flows out from the outflow hole 4 along the flow of the cleaning liquid. As described above, since the cleaning liquid flows parallel (horizontal) to the substrate 7 and the carrier 6, the cleaning liquid cannot stagnate in the central portion of the cleaning tank 1 as in the conventional case, and the substrate 7 is taken out from the cleaning tank 1. In this case, once released dust does not reattach. As described above, according to the present invention, the inflow and outflow liquid rectifying plates of the cleaning tank are arranged so that the cleaning liquid flows in parallel (horizontal) to the substrate and the carrier. Since it is installed parallel to the side wall (perpendicular to the bottom surface), it prevents the stagnation of the cleaning liquid as in the past and prevents the dust once detached from the substrate from reattaching when the substrate is taken out from the cleaning tank. Is something that can be done.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side sectional view of a substrate cleaning tank showing an embodiment of the present invention. FIG. 2 is a side sectional view showing a conventional substrate cleaning tank. [Explanation of Codes] 1 cleaning tank 1b inflow liquid rectifying plate 1c outflow liquid rectifying plate 2 cleaning liquid supply port 3 inflow hole 4 outflow hole 6 carrier 7 substrate 10 diaphragm

Claims (1)

Claims [Claim 1] Inflow liquid rectification having a cleaning liquid supply port and a plurality of inflow holes for rectifying the cleaning liquid supplied from the outer cleaning liquid supply port and directing the rectified liquid toward the substrate installed on the carrier. In a substrate cleaning tank comprising a plate and a vibrating plate provided on the bottom surface of the tank, the inflow liquid rectifying plate is provided in a direction perpendicular to the bottom surface of the tank, and the cleaning liquid passing through the inflow hole is Substrate cleaning, characterized in that an outflow liquid rectifying plate having a plurality of outflow holes for flowing out to the outside after flowing in the horizontal direction along the surface of the substrate is provided in parallel with the inflow liquid rectifying plate. Tank.