JPH05228623A - Soldering tool of diamond polycrystalline body - Google Patents
Soldering tool of diamond polycrystalline bodyInfo
- Publication number
- JPH05228623A JPH05228623A JP2939492A JP2939492A JPH05228623A JP H05228623 A JPH05228623 A JP H05228623A JP 2939492 A JP2939492 A JP 2939492A JP 2939492 A JP2939492 A JP 2939492A JP H05228623 A JPH05228623 A JP H05228623A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- base material
- soldering
- diamond
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 25
- 239000010432 diamond Substances 0.000 title claims abstract description 25
- 238000005476 soldering Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 72
- 238000001308 synthesis method Methods 0.000 claims abstract description 3
- 239000012808 vapor phase Substances 0.000 claims abstract description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000005304 joining Methods 0.000 description 11
- 230000000737 periodic effect Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- -1 cemented carbide Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
(57)【要約】
【目的】 半田付け工具の寿命向上を図り、半田の付着
を防止する。
【構成】 室温から１０００℃までの線膨脹係数が３×
１０-6〜６×１０-6／℃の基材１の先端面を気相合成法
により合成されたダイヤモンド多結晶体４で被覆して工
具素材Ａを形成する。この工具素材Ａを工具母材Ｂの先
端に接合する。
(57) [Summary] [Purpose] To improve the life of soldering tools and prevent solder adhesion. [Structure] The linear expansion coefficient from room temperature to 1000 ° C is 3 ×
A tool material A is formed by coating the tip surface of the base material 1 at 10 −6 to 6 × 10 −6 / ° C. with the diamond polycrystalline body 4 synthesized by the vapor phase synthesis method. This tool material A is joined to the tip of the tool base material B.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電気回路の配線工程
に使用される半田付け工具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering tool used in an electric circuit wiring process.
【０００２】[0002]
【従来の技術】自動半田付け装置に組込まれる半田付け
工具として、熱伝導性の高い銅（Ｃｕ）を工具素材と
し、工具全体または先端部にクロムメッキを施して耐摩
耗性、耐食性、耐熱性を高めたものが従来から知られて
いる。2. Description of the Related Art As a soldering tool incorporated in an automatic soldering apparatus, copper (Cu) having high thermal conductivity is used as a tool material, and the entire tool or a tip portion is plated with chrome to provide wear resistance, corrosion resistance and heat resistance. The ones that have improved
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記従来の
半田付け工具においては、使用中に工具先端に半田が付
着することが多くあり、高圧エアの吹付け等によって付
着半田を除去する必要がある。また、連続した半田付け
作業によって、工具先端に繰り返し応力が作用するた
め、メッキ膜に剥れが生じ易く、そのメッキ膜の剥れに
よって溶融半田が付着する。この半田の付着力はきわめ
て強く、高圧エアの吹付けだけでは除去することができ
ず、半田付け工具の取り替えを必要とし、その工具の取
り替え時、装置を停止させる必要があるため、装置の稼
働率を著しく低下させる問題がある。By the way, in the above-mentioned conventional soldering tool, solder is often attached to the tip of the tool during use, and it is necessary to remove the attached solder by blowing high-pressure air or the like. .. Further, since stress is repeatedly applied to the tool tip due to continuous soldering work, the plating film is likely to peel off, and the molten solder adheres due to the peeling off of the plating film. This solder has an extremely strong adhesive force and cannot be removed only by blowing high-pressure air, so it is necessary to replace the soldering tool, and it is necessary to stop the device when replacing the tool. There is a problem of significantly lowering the rate.
【０００４】この発明は、上記従来の問題点を解決し、
半田付け工具の寿命向上を図り、半田の付着を防止する
ことを技術的課題としている。The present invention solves the above-mentioned conventional problems,
A technical issue is to prevent the adhesion of solder by improving the life of the soldering tool.
【０００５】[0005]
【課題を解決するための手段】上記の課題を解決するた
めに、この発明においては室温から１０００℃までの線
膨脹係数が３×１０-6〜６×１０-6／℃の基材の先端面
を気相合成法により合成されたダイヤモンド多結晶体で
被覆したものを工具素材とし、この工具素材を工具母材
の先端に接合した構成を採用したのである。In order to solve the above problems, according to the present invention, the tip of a base material having a linear expansion coefficient from room temperature to 1000 ° C. of 3 × 10 −6 to 6 × 10 −6 / ° C. A tool material is obtained by coating the surface with a diamond polycrystal synthesized by the vapor phase synthesis method, and this tool material is joined to the tip of the tool base material.
【０００６】ここで、基材の線膨脹係数が３×１０-6／
℃より小さく６×１０-6／℃を越えると、ダイヤモンド
多結晶体と基材の密着強度が低くなり、ダイヤモンド多
結晶体が剥れ落ち易くなる。Here, the linear expansion coefficient of the substrate is 3 × 10 -6 /
When the temperature is lower than 6 ° C and exceeds 6 x 10 -6 / ° C, the adhesion strength between the diamond polycrystal and the substrate becomes low, and the diamond polycrystal easily peels off.
【０００７】したがって、基材の線膨脹係数は、上記の
範囲内とする。このような基材として、Ｓｉ、ＳｉＣ、
Ｓｉ3 Ｎ4 、Ｍｏ、Ｗ、超硬合金等を挙げることができ
る。Therefore, the coefficient of linear expansion of the substrate is within the above range. As such a base material, Si, SiC,
Examples thereof include Si 3 N 4 , Mo, W, cemented carbide and the like.
【０００８】また、工具母材と工具素材の線膨脹係数が
大きく相違すると、両部材の接合時に、工具母材と工具
素材の熱膨脹差から応力が発生し、工具素材に亀裂が入
り易くなる。Further, if the linear expansion coefficients of the tool base material and the tool material are greatly different, stress is generated due to the difference in thermal expansion between the tool base material and the tool material when joining the two members, and the tool material is likely to be cracked.
【０００９】したがって、工具母材は、工具素材と略同
等の線膨脹係数を有する材料で形成し、室温から６００
℃までの線膨脹係数が３×１０-6〜７．５×１０-6／℃
の範囲にある材料を用いるのがよい。Therefore, the tool base material is formed of a material having a coefficient of linear expansion substantially equal to that of the tool material, and is from room temperature to 600.
Linear expansion coefficient up to ℃ 3 × 10 -6 ~ 7.5 × 10 -6 / ℃
It is preferable to use a material in the range of.
【００１０】そのような材料として、Ｓｉ、ＳｉＣ、Ｓ
ｉ3 Ｎ4 、Ｍｏ、Ｗ、超硬合金、Ｆｅ−Ｎｉ合金、鋼等
の金属や合金、セラミック等を挙げることができる。As such materials, Si, SiC, S
Examples thereof include i 3 N 4 , Mo, W, cemented carbide, Fe—Ni alloy, metals and alloys such as steel, and ceramics.
【００１１】工具素材の先端面に被覆したダイヤモンド
多結晶体の厚みがきわめて薄くなると、良好なダイヤモ
ンド多結晶体を得ることができず、一方、厚みが厚くな
ると基材との密着力が低下する。このため、ダイヤモン
ド多結晶体の厚みは、０．００１〜０．５mm程度が好ま
しい。If the thickness of the diamond polycrystal coated on the tip end surface of the tool material is extremely thin, a good diamond polycrystal cannot be obtained. On the other hand, if the thickness of the diamond polycrystal is increased, the adhesion with the base material is reduced. .. Therefore, the thickness of the diamond polycrystal is preferably 0.001 to 0.5 mm.
【００１２】また、ダイヤモンド多結晶体の半田と接触
する部分の面粗度は、半田の付着を防止する上において
細かい程好ましいが、細かくなると、高精度の研磨を必
要とし、工具のコストが高くなる。このため、上記面粗
度はＲｍａｘ０．００５μｍ〜０．５μｍ程度とするの
がよい。Further, the surface roughness of the portion of the diamond polycrystal that comes into contact with the solder is preferably as small as possible in order to prevent the adhesion of the solder, but when it becomes fine, high precision polishing is required, and the cost of the tool is high. Become. Therefore, it is preferable that the surface roughness is about Rmax 0.005 μm to 0.5 μm.
【００１３】工具母材と工具素材の接合には、ロウ材を
用いるロウ接法や金をインサートとする熱圧法を採用す
ることができる。For joining the tool base material and the tool material, a brazing method using a brazing material or a thermocompression method using gold as an insert can be adopted.
【００１４】ロウ接法を採用する場合は、３００℃以上
の融点を有するロウ材を用いる。融点が低すぎると、母
材と素材の接合強度がロウ付け中に低下する。そのよう
なロウ材として、周期律表第IVa 、Va、VIa 、VIIa族元
素の少なくとも１種以上を１〜４０重量％含有し、残部
が周期律表第VIII族、Ｃｕ、Ａｇ、Ａｕ、Ｂ、Ｉｎ、Ｓ
ｎの少なくとも１種以上から成る合金を挙げることがで
きる。When the brazing method is used, a brazing material having a melting point of 300 ° C. or higher is used. If the melting point is too low, the bonding strength between the base material and the raw material decreases during brazing. As such a brazing material, 1 to 40% by weight of at least one element of Group IVa, Va, VIa and VIIa of the Periodic Table is contained, and the balance is Group VIII of the Periodic Table, Cu, Ag, Au and B. , In, S
An alloy composed of at least one of n can be mentioned.
【００１５】上記ロウ接法を採用する接合において、工
具素材の接合面に周期律表第IVa 、Va、VIa 、VIIa族元
素の少なくとも１種以上から成る金属、合金又はこれら
元素の化合物から成る薄膜と、周期律表第VIII族、Ｃ
ｕ、Ａｇ、Ａｕの１種以上から成る薄膜をその順番で被
覆し、その被覆層を介して工具母材を工具素材とをロウ
接合することにより、工具母材と工具素材をより強固に
接合することができる。In the joining using the above-mentioned brazing method, a thin film made of a metal, an alloy, or a compound of these elements, which is made of at least one of Group IVa, Va, VIa, and VIIa elements of the periodic table, is formed on the joining surface of the tool material And the periodic table, Group VIII, C
By bonding a thin film of at least one of u, Ag, and Au in that order, and by brazing the tool base material and the tool material through the coating layer, the tool base material and the tool material are joined more firmly. can do.
【００１６】一方、熱圧着法を採用する接合において、
工具素材と工具母材の接合面の少なくとも一方に周期律
表第IVa 、Va、VIa 、VIIa族元素の少なくとも１種以上
から成る金属あるいは合金、又はこれら元素の化合物か
ら成る薄膜状の接着強化層と、Ｐｔ、Ｐｄ、Ｗ、Ｍｏ、
Ｔａ、Ｎｉの少なくとも１種以上からなる金属あるいは
合金の薄膜状の拡散防止層とを、拡散防止層が外側にな
るよう被覆しておくことにより、工具母材と工具素材と
を強固に接合することができる。On the other hand, in joining using the thermocompression bonding method,
A metal or alloy containing at least one of Group IVa, Va, VIa, and VIIa elements of the periodic table, or a thin-film adhesion-strengthening layer containing a compound of these elements, on at least one of the joining surfaces of the tool material and the tool base material. And Pt, Pd, W, Mo,
A metal or alloy thin film diffusion prevention layer made of at least one of Ta and Ni is coated so that the diffusion prevention layer is on the outer side, so that the tool base material and the tool material are firmly joined. be able to.
【００１７】[0017]
【実施例１】図１（ａ）に示すように、ＳｉＣから成る
角形基材１の面取り２を有する先端面３に熱フィラメン
ト法によってダイヤモンド多結晶体４を１０時間合成し
た。その結果、図１（ｂ）に示すように、基材１の先端
面を厚さ０．０３mm、面粗度Ｒｍａｘ３．５μｍのダイ
ヤモンド多結晶体４で被覆することができた。これを工
具素材Ａとし、その素材Ａのダイヤモンド多結晶体４を
ダイヤモンド砥石でラップして半田とする部分の面粗度
をＲｍａｘ０．０５μｍとした。Example 1 As shown in FIG. 1A, a diamond polycrystal body 4 was synthesized for 10 hours on a tip surface 3 having a chamfer 2 of a rectangular base material 1 made of SiC by a hot filament method. As a result, as shown in FIG. 1B, the front end surface of the base material 1 could be coated with the diamond polycrystalline body 4 having a thickness of 0.03 mm and a surface roughness Rmax of 3.5 μm. This was used as the tool material A, and the surface roughness of the portion where the diamond polycrystal body 4 of the material A was lapped with a diamond grindstone to be solder was Rmax 0.05 μm.
【００１８】一方、図２に示すようにコバール（Ｆｅ−
Ｎｉ合金）から成る円柱状の工具母材Ｂを準備し、その
工具母材Ｂの先端に工具素材ＡをＡｇ−Ｃｕ−Ｔｉ合金
のロウ材で真空ロウ付けし、図３に示す半田付け工具Ｃ
を形成した。On the other hand, as shown in FIG. 2, Kovar (Fe-
A cylindrical tool base material B made of Ni alloy) is prepared, and the tool material A is vacuum brazed to the tip of the tool base material B with a brazing material of Ag-Cu-Ti alloy, and the soldering tool shown in FIG. C
Formed.
【００１９】上記半田付け工具Ｃを加熱温度２００℃、
荷重０．３ｋｇで半田付け作業を繰り返し行なったとこ
ろ、ダイヤモンド多結晶体４の摩耗は殆どなく、３０万
回の使用に充分耐え、半田の付着は全くなかった。The soldering tool C is heated to 200 ° C.,
When the soldering work was repeated with a load of 0.3 kg, the diamond polycrystal body 4 was hardly worn, could withstand 300,000 times of use, and had no solder adhesion.
【００２０】その比較として、銅から成る工具素材にク
ロムメッキを施した従来の半田付け工具を同条件で半田
付け作業を行なったところ、約１万回の使用によって付
着した半田が除去できなくなった。As a comparison, when a conventional soldering tool in which a tool material made of copper is plated with chrome is soldered under the same conditions, the solder adhered cannot be removed after about 10,000 times of use. ..
【００２１】このことから、本発明の半田付け工具は、
従来の工具に比較して３０倍以上の寿命をもつことが分
かる。From this, the soldering tool of the present invention is
It can be seen that the tool life is 30 times or more that of the conventional tool.
【００２２】[0022]
【実施例２】実施例１と同様の製造方法によって、表１
に示すダイヤモンド多結晶体半田付け工具を形成した。Example 2 Table 1 was prepared by the same manufacturing method as in Example 1.
The diamond polycrystalline soldering tool shown in FIG.
【００２３】[0023]
【表１】 [Table 1]
【００２４】これらの半田付け工具の製作結果を表２に
示し、同時に実施例１と同条件での半田付けテストの結
果を示す。The production results of these soldering tools are shown in Table 2 and at the same time the results of the soldering test under the same conditions as in Example 1 are shown.
【００２５】[0025]
【表２】 [Table 2]
【００２６】[0026]
【実施例３】基材がＳｉＣから成る工具素材と数種の工
具母材とを下記３つの接合方法により接合してＮｏ，Ｈ
乃至Ｍの工具を形成し、各工具の工具素材と工具母材の
接合強度（剪断強度）を測定した。その結果を表３に示
す。[Embodiment 3] No. H by joining a tool material whose base material is SiC and several kinds of tool base materials by the following three joining methods.
The tools M to M were formed, and the bonding strength (shear strength) between the tool material and the tool base material of each tool was measured. The results are shown in Table 3.
【００２７】接合方法 （Ｉ）：６０Ａｇ−３０Ｃｕ−１０Ｔｉ（重量％）のロ
ウ材を用いるロウ付け方法 （ＩＩ）：工具素材の接合面に厚さ１μｍのＴｉとＮｉ
を被覆し、７０Ａｇ−３０Ｃｕのロウ材を用いるロウ付
け方法。Joining method (I): Brazing method using a brazing material of 60Ag-30Cu-10Ti (wt%) (II): Ti and Ni with a thickness of 1 μm on the joining surface of the tool material
And a brazing method using a brazing material of 70Ag-30Cu.
【００２８】（ＩＩＩ）：工具素材−工具母材の接合面
に厚さ１μｍのＴａとＰｔを被覆し、Ａｕをインサート
とする圧着方法。(III): A pressure bonding method in which the joining surface of the tool material-tool base material is coated with Ta and Pt having a thickness of 1 μm and Au is used as an insert.
【００２９】[0029]
【表３】 [Table 3]
【００３０】[0030]
【発明の効果】以上のように、この発明に係る半田付け
工具においては、耐摩耗性、耐食性、耐熱性に優れたダ
イヤモンド多結晶体の被覆を有する工具素材を工具母材
に接合したので、工具の寿命の大幅な向上を図ることが
できると共に、ダイヤモンド多結晶体は濡れ性が少ない
ため半田の付着がなく、半田の除去工程を省くことがで
きる。As described above, in the soldering tool according to the present invention, since the tool material having the diamond polycrystal coating excellent in wear resistance, corrosion resistance and heat resistance is bonded to the tool base material, The life of the tool can be significantly improved, and since the diamond polycrystal has a low wettability, no solder is attached and the step of removing the solder can be omitted.
【図１】（ａ）はこの発明に用いる基材の斜視図、
（ｂ）はその基材にダイヤモンド多結晶体を被覆した工
具素材の斜視図FIG. 1A is a perspective view of a base material used in the present invention,
(B) is a perspective view of a tool material whose base material is coated with a polycrystalline diamond.
【図２】この発明に用いる工具母材の斜視図FIG. 2 is a perspective view of a tool base material used in the present invention.
【図３】この発明に係る半田付け工具の正面図FIG. 3 is a front view of a soldering tool according to the present invention.
Ａ 工具素材 Ｂ 工具母材 １ 基材 ３ 先端面 ４ ダイヤモンド多結晶体 A Tool material B Tool base material 1 Base material 3 Tip surface 4 Polycrystalline diamond
Claims (4)
３×１０-6〜６×１０-6／℃の基材の先端面を気相合成
法により合成されたダイヤモンド多結晶体で被覆したも
のを工具素材とし、この工具素材を工具母材の先端に接
合したダイヤモンド多結晶体半田付け工具。1. A front end face of a base material having a linear expansion coefficient of 3 × 10 −6 to 6 × 10 −6 / ° C. from room temperature to 1000 ° C. is coated with a diamond polycrystal synthesized by a vapor phase synthesis method. A diamond polycrystalline soldering tool in which a tool material is used and this tool material is joined to the tip of the tool base material.
×１０-6〜７．５×１０-6／℃の範囲にある金属、合
金、セラミックのいずれかを工具母材とした請求項１に
記載のダイヤモンド多結晶体半田付け工具。2. The linear expansion coefficient from room temperature to 600 ° C. is 3.
The diamond polycrystalline soldering tool according to claim 1, wherein any one of a metal, an alloy, and a ceramic in a range of × 10 -6 to 7.5 × 10 -6 / ° C is used as a tool base material.
Ｗ、超硬合金、Ｆｅ−Ｎｉ合金、鋼のいずれか１つから
成る請求項１又は２に記載のダイヤモンド多結晶体半田
付け工具。3. The tool base material is SiC, Si 3 N 4 , Mo,
The polycrystalline diamond soldering tool according to claim 1 or 2, which is made of any one of W, cemented carbide, Fe-Ni alloy, and steel.
4 、Ｍｏ、Ｗ、超硬合金のいずれか１つから成る請求項
１乃至３のいずれか１つに記載のダイヤモンド多結晶体
半田付け工具。4. The material of the base material is Si, SiC, Si 3 N
The diamond polycrystalline soldering tool according to any one of claims 1 to 3, which comprises any one of 4 , Mo, W and cemented carbide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2939492A JPH05228623A (en) | 1992-02-17 | 1992-02-17 | Soldering tool of diamond polycrystalline body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2939492A JPH05228623A (en) | 1992-02-17 | 1992-02-17 | Soldering tool of diamond polycrystalline body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05228623A true JPH05228623A (en) | 1993-09-07 |
Family
ID=12274929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2939492A Pending JPH05228623A (en) | 1992-02-17 | 1992-02-17 | Soldering tool of diamond polycrystalline body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05228623A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6478843B1 (en) | 1998-05-18 | 2002-11-12 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V | Anti-adherent coating and method for the production thereof |
-
1992
- 1992-02-17 JP JP2939492A patent/JPH05228623A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6478843B1 (en) | 1998-05-18 | 2002-11-12 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V | Anti-adherent coating and method for the production thereof |
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