JPH05163344A - Method for producing polyphenylene ether having silyl group - Google Patents
Method for producing polyphenylene ether having silyl groupInfo
- Publication number
- JPH05163344A JPH05163344A JP32875591A JP32875591A JPH05163344A JP H05163344 A JPH05163344 A JP H05163344A JP 32875591 A JP32875591 A JP 32875591A JP 32875591 A JP32875591 A JP 32875591A JP H05163344 A JPH05163344 A JP H05163344A
- Authority
- JP
- Japan
- Prior art keywords
- group
- polyphenylene ether
- silyl
- aromatic
- alkenyl group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001955 polyphenylene ether Polymers 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 title abstract description 11
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 30
- -1 silane compound Chemical class 0.000 claims abstract description 30
- 125000003118 aryl group Chemical group 0.000 claims abstract description 16
- 229910000077 silane Inorganic materials 0.000 claims abstract description 13
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 9
- 125000005843 halogen group Chemical group 0.000 claims abstract description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 5
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims abstract description 5
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 9
- 125000005370 alkoxysilyl group Chemical group 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 21
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000003054 catalyst Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 8
- 125000000524 functional group Chemical class 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- ICMZFZGUTLNLAJ-UHFFFAOYSA-N 2,6-dimethyl-7-oxabicyclo[4.1.0]hepta-2,4-diene Chemical compound CC1=CC=CC2(C)OC12 ICMZFZGUTLNLAJ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- WREVCRYZAWNLRZ-UHFFFAOYSA-N 2-allyl-6-methyl-phenol Chemical compound CC1=CC=CC(CC=C)=C1O WREVCRYZAWNLRZ-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 125000004103 aminoalkyl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- WXNOJTUTEXAZLD-UHFFFAOYSA-L benzonitrile;dichloropalladium Chemical compound Cl[Pd]Cl.N#CC1=CC=CC=C1.N#CC1=CC=CC=C1 WXNOJTUTEXAZLD-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000004696 coordination complex Chemical class 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RMXNSQWYMVTLEU-UHFFFAOYSA-N 2,6-bis(prop-2-enyl)phenol Chemical compound OC1=C(CC=C)C=CC=C1CC=C RMXNSQWYMVTLEU-UHFFFAOYSA-N 0.000 description 1
- METWAQRCMRWDAW-UHFFFAOYSA-N 2,6-diethylphenol Chemical compound CCC1=CC=CC(CC)=C1O METWAQRCMRWDAW-UHFFFAOYSA-N 0.000 description 1
- HJZJMARGPNJHHG-UHFFFAOYSA-N 2,6-dimethyl-4-propylphenol Chemical compound CCCC1=CC(C)=C(O)C(C)=C1 HJZJMARGPNJHHG-UHFFFAOYSA-N 0.000 description 1
- ATGFTMUSEPZNJD-UHFFFAOYSA-N 2,6-diphenylphenol Chemical compound OC1=C(C=2C=CC=CC=2)C=CC=C1C1=CC=CC=C1 ATGFTMUSEPZNJD-UHFFFAOYSA-N 0.000 description 1
- MTLWTRLYHAQCAM-UHFFFAOYSA-N 2-[(1-cyano-2-methylpropyl)diazenyl]-3-methylbutanenitrile Chemical compound CC(C)C(C#N)N=NC(C#N)C(C)C MTLWTRLYHAQCAM-UHFFFAOYSA-N 0.000 description 1
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 1
- BKZXZGWHTRCFPX-UHFFFAOYSA-N 2-tert-butyl-6-methylphenol Chemical compound CC1=CC=CC(C(C)(C)C)=C1O BKZXZGWHTRCFPX-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- AZZWZMUXHALBCQ-UHFFFAOYSA-N 4-[(4-hydroxy-3,5-dimethylphenyl)methyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(CC=2C=C(C)C(O)=C(C)C=2)=C1 AZZWZMUXHALBCQ-UHFFFAOYSA-N 0.000 description 1
- OSDLLIBGSJNGJE-UHFFFAOYSA-N 4-chloro-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Cl OSDLLIBGSJNGJE-UHFFFAOYSA-N 0.000 description 1
- CWEMEMQGPCUERS-UHFFFAOYSA-N 5-chloro-2-prop-2-enylphenol Chemical compound OC1=CC(Cl)=CC=C1CC=C CWEMEMQGPCUERS-UHFFFAOYSA-N 0.000 description 1
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- IKKXPXJPIVNOEZ-UHFFFAOYSA-N C1=CC=C(C=C1)CCO[SiH](OCCC2=CC=CC=C2)OCCC3=CC=CC=C3 Chemical compound C1=CC=C(C=C1)CCO[SiH](OCCC2=CC=CC=C2)OCCC3=CC=CC=C3 IKKXPXJPIVNOEZ-UHFFFAOYSA-N 0.000 description 1
- VEIAUUYAKFOSEH-UHFFFAOYSA-N CCCCO[SiH](OC)OCCCC Chemical compound CCCCO[SiH](OC)OCCCC VEIAUUYAKFOSEH-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical class [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical group OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920006097 Ultramide® Polymers 0.000 description 1
- GFBOYIQELHSHRP-UHFFFAOYSA-N [Ni].CP(C)C Chemical compound [Ni].CP(C)C GFBOYIQELHSHRP-UHFFFAOYSA-N 0.000 description 1
- PXCBSZFSOJWBGA-UHFFFAOYSA-N [Pt].C(CCC)P(CCCC)CCCC Chemical compound [Pt].C(CCC)P(CCCC)CCCC PXCBSZFSOJWBGA-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- LJWBIAMZBJWAOW-UHFFFAOYSA-N benzhydryloxysilane Chemical compound C=1C=CC=CC=1C(O[SiH3])C1=CC=CC=C1 LJWBIAMZBJWAOW-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- ZCSQPOLLUOLHHF-UHFFFAOYSA-M carbanide;iodoplatinum Chemical compound [CH3-].[CH3-].[CH3-].[Pt]I ZCSQPOLLUOLHHF-UHFFFAOYSA-M 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- SOYVLBDERBHIME-UHFFFAOYSA-N chloro(diethyl)silicon Chemical compound CC[Si](Cl)CC SOYVLBDERBHIME-UHFFFAOYSA-N 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- YCITZMJNBYYMJO-UHFFFAOYSA-N chloro(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](Cl)C1=CC=CC=C1 YCITZMJNBYYMJO-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- LNEYYSPXDKDADL-UHFFFAOYSA-M cobalt;triphenylphosphane;chloride Chemical compound [Cl-].[Co].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 LNEYYSPXDKDADL-UHFFFAOYSA-M 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- PFMKUUJQLUQKHT-UHFFFAOYSA-N dichloro(ethyl)silicon Chemical compound CC[Si](Cl)Cl PFMKUUJQLUQKHT-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- XNAFLNBULDHNJS-UHFFFAOYSA-N dichloro(phenyl)silicon Chemical compound Cl[Si](Cl)C1=CC=CC=C1 XNAFLNBULDHNJS-UHFFFAOYSA-N 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- DGXPASZXUJQWLQ-UHFFFAOYSA-N diethyl(methoxy)silane Chemical compound CC[SiH](CC)OC DGXPASZXUJQWLQ-UHFFFAOYSA-N 0.000 description 1
- QFEOTYVTTQCYAZ-UHFFFAOYSA-N dimanganese decacarbonyl Chemical compound [Mn].[Mn].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] QFEOTYVTTQCYAZ-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- QKOQRGFJYNZGJV-UHFFFAOYSA-N dimethoxy(phenoxy)silane Chemical compound CO[SiH](OC)OC1=CC=CC=C1 QKOQRGFJYNZGJV-UHFFFAOYSA-N 0.000 description 1
- CIQDYIQMZXESRD-UHFFFAOYSA-N dimethoxy(phenyl)silane Chemical compound CO[SiH](OC)C1=CC=CC=C1 CIQDYIQMZXESRD-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- YSLVSGVAVRTLAV-UHFFFAOYSA-N ethyl(dimethoxy)silane Chemical compound CC[SiH](OC)OC YSLVSGVAVRTLAV-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- FUKUFMFMCZIRNT-UHFFFAOYSA-N hydron;methanol;chloride Chemical compound Cl.OC FUKUFMFMCZIRNT-UHFFFAOYSA-N 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- CNFDGXZLMLFIJV-UHFFFAOYSA-L manganese(II) chloride tetrahydrate Chemical compound O.O.O.O.[Cl-].[Cl-].[Mn+2] CNFDGXZLMLFIJV-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- MDLRQEHNDJOFQN-UHFFFAOYSA-N methoxy(dimethyl)silicon Chemical compound CO[Si](C)C MDLRQEHNDJOFQN-UHFFFAOYSA-N 0.000 description 1
- MKIWITMRHCETNB-UHFFFAOYSA-N methoxy(diphenoxy)silane Chemical compound C=1C=CC=CC=1O[SiH](OC)OC1=CC=CC=C1 MKIWITMRHCETNB-UHFFFAOYSA-N 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- ZBRJXVVKPBZPAN-UHFFFAOYSA-L nickel(2+);triphenylphosphane;dichloride Chemical compound [Cl-].[Cl-].[Ni+2].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 ZBRJXVVKPBZPAN-UHFFFAOYSA-L 0.000 description 1
- QCYXGORGJYUYMT-UHFFFAOYSA-N nickel;triphenylphosphane Chemical compound [Ni].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QCYXGORGJYUYMT-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical group 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- SYKXNRFLNZUGAJ-UHFFFAOYSA-N platinum;triphenylphosphane Chemical compound [Pt].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 SYKXNRFLNZUGAJ-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- SONJTKJMTWTJCT-UHFFFAOYSA-K rhodium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3] SONJTKJMTWTJCT-UHFFFAOYSA-K 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003613 toluenes Chemical class 0.000 description 1
- IBOKZQNMFSHYNQ-UHFFFAOYSA-N tribromosilane Chemical compound Br[SiH](Br)Br IBOKZQNMFSHYNQ-UHFFFAOYSA-N 0.000 description 1
- UCSBCWBHZLSFGC-UHFFFAOYSA-N tributoxysilane Chemical compound CCCCO[SiH](OCCCC)OCCCC UCSBCWBHZLSFGC-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- WPPVEXTUHHUEIV-UHFFFAOYSA-N trifluorosilane Chemical compound F[SiH](F)F WPPVEXTUHHUEIV-UHFFFAOYSA-N 0.000 description 1
- RLZISQMHTCXVOA-UHFFFAOYSA-N trioctoxysilane Chemical compound CCCCCCCCO[SiH](OCCCCCCCC)OCCCCCCCC RLZISQMHTCXVOA-UHFFFAOYSA-N 0.000 description 1
- XJXSSNSCWGKDOW-UHFFFAOYSA-N tripentoxysilane Chemical compound CCCCCO[SiH](OCCCCC)OCCCCC XJXSSNSCWGKDOW-UHFFFAOYSA-N 0.000 description 1
- OZWKZRFXJPGDFM-UHFFFAOYSA-N tripropoxysilane Chemical compound CCCO[SiH](OCCC)OCCC OZWKZRFXJPGDFM-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyethers (AREA)
Abstract
(57)【要約】
【構成】 アルケニル基を有するポリフェニレンエーテ
ルと一般式Iで表されるシラン化合物とを反応させてシ
リル変性ポリフェニレンエーテルを製造する方法。
【化1】
H−Si(Q1 )n (Q2 )3-n (I)
(式中、nは1〜3の整数、Q1 は、炭素数1〜20の
アルコキシ基、芳香族オキシ基またはハロゲン基を示
す。Q2 は、水素原子、芳香族基、炭素数1〜20のア
ルキル基または炭素数1〜20の芳香族アルキル基を示
す。nまたは(3−n)が2以上の時、それぞれの
Q1 、Q2 は異なっていてもよい。)
【効果】 本発明法によれば極めて収率よくシリル変性
ポリフェニレンエーテルを製造することができる。この
アルコキシシリル基、アリーロキシシリル基またはハロ
ゲン化シリル基により官能化されたポリフェニレンエー
テルは、ポリマーアロイの相溶化剤として有用である。(57) [Summary] [Structure] A method for producing a silyl-modified polyphenylene ether by reacting a polyphenylene ether having an alkenyl group with a silane compound represented by the general formula I. Embedded image H-Si (Q 1 ) n (Q 2 ) 3-n (I) (In the formula, n is an integer of 1 to 3, Q 1 is an alkoxy group having 1 to 20 carbon atoms, an aromatic oxy group. .Q 2 showing a group or a halogen group, a hydrogen atom, an aromatic group, an aromatic alkyl group of the alkyl group or C1-20 C20 .n or (3-n) is 2 or more At this time, Q 1 and Q 2 may be different from each other.) [Effect] According to the method of the present invention, a silyl-modified polyphenylene ether can be produced in an extremely high yield. The polyphenylene ether functionalized with the alkoxysilyl group, aryloxysilyl group or halogenated silyl group is useful as a compatibilizing agent for polymer alloys.
Description
【0001】[0001]
【産業上の利用分野】本発明は、ハイドロシリレーショ
ン反応により加水分解可能な置換基を有するシリル基を
任意の数有するシリル変性ポリフェニレンエーテルを製
造する方法に関する。この官能基を有するポリフェニレ
ンエーテルは、塗装性、印刷性、接着性、ガス透過性、
架橋性に優れた樹脂であり、フィルム、ガス分離膜、容
器、車部材、電気部材、ポリマーアロイの相溶化剤、ポ
リフェニレンエーテルの改質剤として有用である。TECHNICAL FIELD The present invention relates to a method for producing a silyl-modified polyphenylene ether having an arbitrary number of silyl groups having a hydrolyzable substituent by a hydrosilylation reaction. Polyphenylene ether having this functional group has coating properties, printability, adhesiveness, gas permeability,
It is a resin having excellent cross-linking properties, and is useful as a film, a gas separation membrane, a container, a vehicle member, an electric member, a compatibilizer for polymer alloys, and a modifier for polyphenylene ether.
【0002】[0002]
【従来の技術】近年、成形用樹脂に対する要求は多様
化、高度化の一途をたどっている。そのため、官能基を
有する樹脂の開発が求められており、ポリフェニレンエ
ーテルについても例外ではない。例えば、ポリフェニレ
ンエーテルと、これとは非相溶性の樹脂、例えばポリエ
チレンテレフタレート、ポリブチレンテレフタレート、
ポリプロピレン、ナイロン6、ナイロン6,6、ナイロ
ン4,6、ナイロン6,10、ナイロン6,12、ポリ
フェニレンスルフィド等とのブレンドにおいて、ミクロ
分散形態を示しかつ強靱な界面強度を得るためにブレン
ドする双方の樹脂それぞれに対して親和性を有するセグ
メントよりなるブロック体や、グラフト体を相溶化剤と
して用いることが有効である。これらを合成する為の重
要な方法の一つは互いに反応する官能基を有するポリマ
ー同士の結合である。また、合成される相溶化剤の収量
は、ポリマー中の官能基の濃度に大きく依存すると考え
られる。2. Description of the Related Art In recent years, demands for molding resins have been diversified and sophisticated. Therefore, development of a resin having a functional group is required, and polyphenylene ether is no exception. For example, polyphenylene ether and a resin incompatible with it, such as polyethylene terephthalate, polybutylene terephthalate,
In the blend with polypropylene, nylon 6, nylon 6,6, nylon 4,6, nylon 6,10, nylon 6,12, polyphenylene sulfide, etc., both are blended in order to exhibit a micro-dispersed form and to obtain a tough interfacial strength. It is effective to use, as a compatibilizer, a block body or a graft body composed of a segment having an affinity for each of the resins. One of the important methods for synthesizing these is the bonding of polymers with functional groups that react with each other. Further, it is considered that the yield of the compatibilizing agent synthesized depends largely on the concentration of the functional group in the polymer.
【0003】この官能基としてアルコキシシリル基、芳
香族オキシ基、ハロゲン化シリル基等があげられる。こ
れらの内、アルコキシシリル基をポリフェニレンエーテ
ルに導入する方法として特表昭63−503392号公
報には、ビニルトリメトキシシランをクロロベンゼン
中、ラジカル開始剤存在下でポリフェニレンエーテルと
グラフト反応させる方法が開示されている。しかし、こ
の方法にはアルコキシシリル基の導入量が制御できない
欠点がある。Examples of this functional group include an alkoxysilyl group, an aromatic oxy group and a halogenated silyl group. Among these, as a method of introducing an alkoxysilyl group into polyphenylene ether, JP-A-63-503392 discloses a method of graft-reacting vinyltrimethoxysilane with polyphenylene ether in the presence of a radical initiator in chlorobenzene. ing. However, this method has a drawback that the amount of alkoxysilyl groups introduced cannot be controlled.
【0004】[0004]
【発明が解決しようとする課題】本発明は、反応性官能
基であるアルコキシシリル基、芳香族オキシシリル基ま
たはハロゲン化シリル基を分子中に任意の個数有するシ
リル変性ポリフェニレンエーテルの製造方法を提供する
ものである。DISCLOSURE OF THE INVENTION The present invention provides a method for producing a silyl-modified polyphenylene ether having an alkoxysilyl group, an aromatic oxysilyl group or a silyl halide group, which is a reactive functional group, in an arbitrary number in a molecule. It is a thing.
【0005】[0005]
【課題を解決するための手段】本発明はアルケニル基を
有するポリフェニレンエーテルと、一般式Iで表される
シラン化合物とを反応させてシリル化変性ポリフェニレ
ンエーテルを製造する方法を提供するものである。The present invention provides a method for producing a silylated modified polyphenylene ether by reacting a polyphenylene ether having an alkenyl group with a silane compound represented by the general formula I.
【0006】[0006]
【化3】 H−Si(Q1 )n (Q2 )3-n (I)Embedded image H-Si (Q 1 ) n (Q 2 ) 3-n (I)
【0007】(式中、nは1〜3の整数、Q1 は、炭素
数1〜20のアルコキシ基、芳香族オキシ基またはハロ
ゲン基を示す。Q2 は、水素原子、芳香族基、炭素数1
〜20のアルキル基または炭素数1〜20の芳香族アル
キル基を示す。nまたは(3−n)が2以上の時、それ
ぞれのQ1 、Q2 は異なっていてもよい。)本発明で使
用するアルケニル基を有するポリフェニレンエーテル樹
脂とは、一般式IIで示すモノマー化合物の一種ないし二
種以上を酸化重合して得られるポリフェニレンエーテル
である。(In the formula, n is an integer of 1 to 3, Q 1 is an alkoxy group having 1 to 20 carbon atoms, an aromatic oxy group or a halogen group. Q 2 is a hydrogen atom, an aromatic group or a carbon atom. Number 1
Is a C20 alkyl group or a C1-20 aromatic alkyl group. When n or (3-n) is 2 or more, Q 1 and Q 2 may be different from each other. The alkenyl group-containing polyphenylene ether resin used in the present invention is a polyphenylene ether obtained by oxidative polymerization of one or more monomer compounds represented by the general formula II.
【0008】[0008]
【化4】 [Chemical 4]
【0009】(式中、mは1から4までの整数であり、
少なくとも1つのRがアルケニル基であり、他のRは独
立にハロゲン原子、炭素数が1から20の第1級もしく
は第2級のアルキル、アリール、ハロアルキル、アミノ
アルキル、炭化水素オキシ、または、ハロゲン原子と酸
素原子が少なくとも2個の炭素原子を介して結合してい
るハロ炭化水素オキシ基を表わす。) この式IIで示されるモノマー化合物としては、2−アリ
ルフェノール、2,6−ジアリルフェノール及び2−ア
リル−6−メチルフェノール、2−アリル−5クロロフ
ェノール、2−アリル−3−メトキシフェノール、2−
アリル−3−イソブチル−6−メチルフェノール、2−
アリル−6−エチルフェノール等があり、好ましくは、
2−アリル−6−メチルフェノールである。(Where m is an integer from 1 to 4,
At least one R is an alkenyl group, and the other R is independently a halogen atom, a primary or secondary alkyl having 1 to 20 carbon atoms, aryl, haloalkyl, aminoalkyl, hydrocarbon oxy, or halogen. It represents a halohydrocarbonoxy group in which an atom and an oxygen atom are bonded via at least two carbon atoms. ) Examples of the monomer compound represented by the formula II include 2-allylphenol, 2,6-diallylphenol and 2-allyl-6-methylphenol, 2-allyl-5chlorophenol, 2-allyl-3-methoxyphenol, 2-
Allyl-3-isobutyl-6-methylphenol, 2-
Allyl-6-ethylphenol and the like, and preferably,
2-allyl-6-methylphenol.
【0010】また、必要に応じてフェノール、またはフ
ェノール誘導体のうち、置換基にハロゲン原子、第1級
もしくは第2級のアルキル、アリール、ハロアルキル、
アミノアルキル、炭化水素オキシ、または、ハロゲン原
子と酸素原子は少なくとも2個の炭素原子を介して結合
しているハロ炭化水素オキシ(ハロゲン原子と酸素原子
は少なくとも2個の炭素原子によって隔てられている)
を有するモノマー化合物を上記一般式IIで示されるモノ
マー化合物と酸化共重合したものであってもよく、後者
誘導体の代表的なモノマーとしては、o−、m−又はp
−クレゾール、2,6−、2,5−、2,4−又は3,
5−ジメチルフェノール、2,6−ジフェニルフェノー
ル、2,6−ジエチルフェノール、2,3,5−、2,
3,6−トリメチルフェノール、2−メチル−6−t−
ブチルフェノールなどがあげられる。これらの中で好適
なものは2,6−ジメチルフェノール等である。Further, if necessary, a halogen atom, a primary or secondary alkyl, aryl, haloalkyl, or a phenol or a phenol derivative is used as a substituent.
Aminoalkyl, hydrocarbon oxy, or a halohydrocarbonoxy in which a halogen atom and an oxygen atom are bound via at least two carbon atoms (a halogen atom and an oxygen atom are separated by at least two carbon atoms) )
The monomer compound having the formula (I) may be oxidatively copolymerized with the monomer compound represented by the general formula II, and typical examples of the latter derivative include o-, m- or p-
-Cresol, 2,6-, 2,5-, 2,4- or 3,
5-dimethylphenol, 2,6-diphenylphenol, 2,6-diethylphenol, 2,3,5-, 2,
3,6-Trimethylphenol, 2-methyl-6-t-
Butylphenol and the like. Among these, 2,6-dimethylphenol and the like are preferable.
【0011】上記のモノマー化合物を主成分とし、ビス
フェノールA、テトラブロモビスフェノールA、レゾル
シン、ハイドロキノン、2.2−ビス(3′,5′−ジ
メチル−4′−ヒドロキシ−フェニル)プロパン、ビス
(3,5−ジメチル−4−ヒドロキシ−フェニル)メタ
ン、または3,3′,5,5′−テトラメチル−4.
4′−ジヒドロキシ4,4′−ジヒドロキシビフェニル
のごとき多価ヒドロキシ芳香族化合物を共重合成分とし
た重合体を用いることもできる。Main components are the above-mentioned monomer compounds, and bisphenol A, tetrabromobisphenol A, resorcin, hydroquinone, 2.2-bis (3 ', 5'-dimethyl-4'-hydroxy-phenyl) propane, bis (3 , 5-Dimethyl-4-hydroxy-phenyl) methane, or 3,3 ', 5,5'-tetramethyl-4.
It is also possible to use a polymer having a polyvalent hydroxyaromatic compound such as 4'-dihydroxy 4,4'-dihydroxybiphenyl as a copolymerization component.
【0012】また、当該重合体の製造は通常のポリフェ
ニレンエーテルの酸化重合と同様に行なうことができ、
例えば米国特許3,422,062号、米国特許第3,
306,874号、同第3,306,875号、同第
3,257,257号及び同第3,257,358号各
明細書に記載されている。酸化重合に用いられる触媒
は、特に限定される物ではなく、所望の重合度が得られ
る如何なる触媒でもよい。当分野では第1銅塩−アミ
ン、第2銅塩−アミン−アルカリ金属水酸化物、マンガ
ン塩−第1アミンなどよりなる多くの触媒系が公知であ
る。Further, the production of the polymer can be carried out in the same manner as the usual oxidative polymerization of polyphenylene ether,
For example, US Pat. No. 3,422,062, US Pat.
No. 306,874, No. 3,306,875, No. 3,257,257, and No. 3,257,358. The catalyst used for the oxidative polymerization is not particularly limited, and any catalyst capable of obtaining a desired degree of polymerization may be used. Many catalyst systems are known in the art consisting of cuprous salt-amine, cupric salt-amine-alkali metal hydroxide, manganese salt-primary amine, and the like.
【0013】以上に示されるアルケニル基を有するポリ
フェニレンエーテルの数平均重合度は10〜400が好
ましい。400を越えると、溶融粘度の増加による成形
加工性の低下など取扱いが容易でない。また、共重合体
の場合、ランダム共重合体でもブロック共重合体でも良
い。前記一般式IIに示すシラン化合物の具体例として
は、トリメトキシシラン、トリエトキシシラン、トリプ
ロポキシシラン、トリブトキシシラン、トリペントキシ
シラン、シリヘキサノキシシラン、トリヘプトキシシラ
ン、トリオクトキシシラン、トリフェノキシシラン、ト
リス(メチルフェノキシ)シラン、トリベンジルオキシ
シラン、トリス(フェニルエトキシ)シラン、トリス
(フェニルプロポキシ)シラン、トリス(フェニルブト
キシ)シラン、メトキシジブトキシシラン、メトキシジ
フェノキシシラン、ジメトキシブトキシシラン、ジメト
キシフェノキシシラン、トリクロロシラン、トリブロモ
シラン、トリフルオロシラン、メチルジクロロシラン、
ジメチルクロロシラン、メチルジメトキシシラン、ジメ
チルメトキシシラン、エチルジクロロシラン、ジエチル
クロロシラン、エチルジメトキシシラン、ジエチルメト
キシシラン、フェニルジクロロシラン、ジフェニルクロ
ロシラン、フェニルジメトキシシラン、ジフェニルメト
キシシラン等を挙げることができる。この中で好ましい
のは、トリメトキシシラン、トリエトキシシランであ
る。The number average degree of polymerization of the polyphenylene ether having an alkenyl group shown above is preferably 10 to 400. When it exceeds 400, handling is not easy such as deterioration of molding processability due to increase of melt viscosity. Further, in the case of a copolymer, it may be a random copolymer or a block copolymer. Specific examples of the silane compound represented by the general formula II include trimethoxysilane, triethoxysilane, tripropoxysilane, tributoxysilane, tripentoxysilane, silylhexanoxysilane, triheptoxysilane, trioctoxysilane. , Triphenoxysilane, tris (methylphenoxy) silane, tribenzyloxysilane, tris (phenylethoxy) silane, tris (phenylpropoxy) silane, tris (phenylbutoxy) silane, methoxydibutoxysilane, methoxydiphenoxysilane, dimethoxybutoxy Silane, dimethoxyphenoxysilane, trichlorosilane, tribromosilane, trifluorosilane, methyldichlorosilane,
Examples thereof include dimethylchlorosilane, methyldimethoxysilane, dimethylmethoxysilane, ethyldichlorosilane, diethylchlorosilane, ethyldimethoxysilane, diethylmethoxysilane, phenyldichlorosilane, diphenylchlorosilane, phenyldimethoxysilane and diphenylmethoxysilane. Among these, trimethoxysilane and triethoxysilane are preferable.
【0014】本発明の官能化ポリフェニレンエーテルの
製造において、シラン化合物の使用量は、通常、アルケ
ニル基を有するポリフェニレンエーテル中のアルケニル
基対し1〜25倍モル、好ましくは1〜15倍モルであ
る。使用量が1倍モル未満の場合、アルケニル基の反応
率が低下し、一方、25倍モルを越える場合には、未反
応のシラン化合物が増えることとなるので、経済性に問
題が生ずる。In the production of the functionalized polyphenylene ether of the present invention, the amount of the silane compound used is usually 1 to 25 times mol, preferably 1 to 15 times mol, of the alkenyl group in the polyphenylene ether having an alkenyl group. When the amount used is less than 1-fold mole, the reaction rate of the alkenyl group decreases, while when it exceeds 25-fold mole, unreacted silane compound increases, which causes a problem in economic efficiency.
【0015】使用可能な反応溶媒として、アルケニル基
を有するポリフェニレンエーテルおよび一般式IIで示さ
れるシラン化合物を溶解するものであれば特に制限はな
いが、例えば、ベンゼン、トルエン、キシレン、メシチ
レン、クロロベンゼン、ジクロロベンゼン、クロロホル
ム、テトラヒドロフラン等が挙げられる。これらの反応
溶媒の使用量は、アルケニル基を有するポリフェニレン
エーテルの0.01から60重量%、好ましくは1から
30重量%であり、0.01重量%未満では反応速度が
遅く、60重量%を越えると攪拌が困難になる場合があ
る。The reaction solvent that can be used is not particularly limited as long as it can dissolve the polyphenylene ether having an alkenyl group and the silane compound represented by the general formula II. For example, benzene, toluene, xylene, mesitylene, chlorobenzene, Dichlorobenzene, chloroform, tetrahydrofuran and the like can be mentioned. The amount of these reaction solvents used is 0.01 to 60% by weight, preferably 1 to 30% by weight, of the polyphenylene ether having an alkenyl group. If it exceeds, stirring may be difficult.
【0016】本発明のシリル変性ポリフェニレンエーテ
ルの製造において、必要により用いられる触媒として
は、スズ、ニッケル、パラジウム、白金、コバルト、ロ
ジウム、イリジウム、鉄、ルテニウム、オスミウム、マ
ンガン、テクネチウム、クロム、モリブテン、タングス
テン等の周期率表のIVB,VIA,VIIAもしくはVIIIA の金
属、金属塩、並びにこれらの金属の有機金属化合物及び
金属錯体を挙げることができる。In the production of the silyl-modified polyphenylene ether of the present invention, as a catalyst optionally used, tin, nickel, palladium, platinum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, technetium, chromium, molybdenum, Mention may be made of metals such as tungsten such as IVB, VIA, VIIA or VIIIA in the periodic table, metal salts, and organometallic compounds and metal complexes of these metals.
【0017】有機金属化合物及び金属錯体としては、例
えばジブチルスズラウリレート、ジメチルビス(トリメ
チルホスフィン)ニッケル(II)、ジエチル(2,2′
−ビピリジル)ニッケル(II)、ジメチルビス(トリフ
ェニルホスフィン)パラジウム(II)、ヨードトリメチ
ル白金(IV)、トリカルボニル(7−アリル)コバルト
(I)等のアルキル金属化合物、ニッケルテトラカルボ
ニル、ドデカカルボニル四ロジウム、ペンタカルボニル
鉄、デカカルボニル二マンガン(0)、ヘキサカルボニ
ルクロム(0)、ヘキサカルボニルモリブデン(0)、
ヘキサカルボニルタングステン(0)等の金属カルボニ
ル化合物、塩化ニッケル、塩化白金酸、塩化コバルト、
塩化ロジウム等の金属錯塩、ジクロロビス(トリフェニ
ルホスフィン)ニッケル(II)、テロラキス(トリフェ
ニルホスフィン)ニッケル(0)、ジクロロビス(ベン
ゾニトリル)パラジウム(II)、テトラキス(トリフェ
ニルホスフィン)パラジウム(0)、ジクロロビス(ト
リブチルホスフィン)白金(II)、テトラキス(トリフ
ェニルホスフィン)白金(0)、クロルトリス(トリフ
ェニルホスフィン)コバルト(I)、クロルトリス(ト
リフェニルホスフィン)ロジウム(I)等の塩基性配位
子を有する金属錯体を挙げることができる。Examples of the organic metal compound and the metal complex include dibutyltin laurate, dimethylbis (trimethylphosphine) nickel (II), diethyl (2,2 ').
-Bipyridyl) nickel (II), dimethylbis (triphenylphosphine) palladium (II), iodotrimethylplatinum (IV), tricarbonyl (7-allyl) cobalt (I) and other alkyl metal compounds, nickel tetracarbonyl, dodecacarbonyl Tetra rhodium, pentacarbonyl iron, decacarbonyl dimanganese (0), hexacarbonyl chromium (0), hexacarbonyl molybdenum (0),
Metal carbonyl compounds such as hexacarbonyltungsten (0), nickel chloride, chloroplatinic acid, cobalt chloride,
Metal complex salts such as rhodium chloride, dichlorobis (triphenylphosphine) nickel (II), terrorakis (triphenylphosphine) nickel (0), dichlorobis (benzonitrile) palladium (II), tetrakis (triphenylphosphine) palladium (0), Basic ligands such as dichlorobis (tributylphosphine) platinum (II), tetrakis (triphenylphosphine) platinum (0), chlorotris (triphenylphosphine) cobalt (I), and chlorotris (triphenylphosphine) rhodium (I) are used. The metal complex which it has can be mentioned.
【0018】これら触媒のうち、好ましいのは担体とな
る炭素粉末上に分散したパラジウムまたは白金、ジブチ
ルスズラウリレート、ペンタカルボニル鉄、塩化白金
酸、ジクロロビス(ベンゾニトリル)パラジウム(I
I)、クロルトリス(トリフェニルホスフィン)ロジウ
ム(I)、テトラキス(トリフェニルホスフィン)パラ
ジウム(0)等があり、中でも塩化白金酸が好ましい。Of these catalysts, preferred are palladium or platinum dispersed on carbon powder as a carrier, dibutyltin laurate, pentacarbonyliron, chloroplatinic acid, dichlorobis (benzonitrile) palladium (I
I), chlorotris (triphenylphosphine) rhodium (I), tetrakis (triphenylphosphine) palladium (0) and the like, and among them, chloroplatinic acid is preferable.
【0019】触媒の使用量は、通常、アルケニル基を有
するポリフェニレンエーテルのアルケニル基の1×10
-4から0.1モル倍であり、1×10-4モル倍未満では
アルケニル基の反応率が低く、一方0.1モル倍を越え
ると急激な反応が起こる場合があり危険である。また、
上記金属触媒のほかに、ジベンゾイルパーオキサイド、
ジ−t−ブチルパーオキサイド、ジクミルパーオキサイ
ド、t−ブチルパーオキシベンゾエート等で例示される
有機過酸化物、アゾビスイソブチロニトリル、アゾビス
イソバレロニトリル等で例示されるアゾ化合物で代表さ
れるラジカル開始剤を用いることや、紫外線を照射する
ことも有効である。The amount of the catalyst used is usually 1 × 10 5 of the alkenyl group of the polyphenylene ether having an alkenyl group.
-4 to 0.1 mol times, and if it is less than 1 x 10 -4 mol times, the reaction rate of the alkenyl group is low, while if it exceeds 0.1 mol times, a rapid reaction may occur, which is dangerous. Also,
In addition to the above metal catalysts, dibenzoyl peroxide,
Representative of organic peroxides exemplified by di-t-butyl peroxide, dicumyl peroxide, t-butyl peroxybenzoate, etc., and azo compounds exemplified by azobisisobutyronitrile, azobisisovaleronitrile etc. It is also effective to use such a radical initiator or to irradiate with ultraviolet rays.
【0020】本発明の官能化ポリフェニレンエーテルの
製造において、反応温度は、通常、0〜300℃、好ま
しくは50〜150℃であり、0℃未満では反応速度が
遅く、一方、300℃を越えると触媒の急激な分解及び
副反応が起こる場合がある。反応雰囲気は、還元性また
は不活性ガス中で行うことが触媒の失活を防ぐために好
ましく、そのようなガスとしては、水素、ヘリウム、ア
ルゴン、窒素などが用いられる。これらのガスは、副反
応を防ぐため、乾燥状態で用いることが好ましい。また
同様の理由により、前記反応溶媒は乾燥したものを使用
することが好ましいが、市販の溶媒中に含まれる水、例
えば数ppm から数%の水は反応の本質を変えるものでは
ない。In the production of the functionalized polyphenylene ether of the present invention, the reaction temperature is usually 0 to 300 ° C., preferably 50 to 150 ° C. When the temperature is lower than 0 ° C., the reaction rate is slow, while when it exceeds 300 ° C. Rapid decomposition and side reactions of the catalyst may occur. The reaction atmosphere is preferably carried out in a reducing or inert gas in order to prevent deactivation of the catalyst, and as such a gas, hydrogen, helium, argon, nitrogen or the like is used. It is preferable to use these gases in a dry state in order to prevent side reactions. For the same reason, it is preferable to use a dried reaction solvent, but water contained in a commercially available solvent, for example, several ppm to several% of water does not change the essence of the reaction.
【0021】アルケニル基を有するポリフェニレンエー
テル、シラン化合物、触媒の添加順序は特に制限されな
いが、通常、アルケニル基を有するポリフェニレンエー
テル、シラン化合物の溶液に触媒を添加することが好ま
しい。シリル基変性ポリフェニレンエーテルの反応溶液
からの回収方法は、加熱ないし加熱減圧下において溶媒
や、未反応のシラン化合物を除去する方法や、メタノー
ル、エタノール、プロパノール、ブタノール、アセトニ
トリルなど貧溶媒によって析出させる方法がある。The order of adding the alkenyl group-containing polyphenylene ether, the silane compound and the catalyst is not particularly limited, but it is usually preferable to add the catalyst to a solution of the alkenyl group-containing polyphenylene ether and the silane compound. The method of recovering the silyl group-modified polyphenylene ether from the reaction solution is a method of removing the solvent or unreacted silane compound under heating or heating under reduced pressure, or a method of precipitating with a poor solvent such as methanol, ethanol, propanol, butanol, or acetonitrile. There is.
【0022】また、本発明の官能化ポリフェニレンエー
テルの製造は上記アルケニル基を有するポリフェニレン
エーテルとシラン化合物を押出機、バンバリミキサー、
ニーダー、ラボプラストミル等を用いて溶融混練するこ
とによっても実施可能である。この場合も、用いるシラ
ン化合物の量、及び必要によって用いる触媒の量は上記
に示したものと略同じである。反応温度は200℃〜3
20℃の範囲で実施可能である。200℃より低いとア
ルケニル基を有するポリフェニレンエーテルが溶融しに
くく、また320℃より高いとアルケニル基を有するポ
リフェニレンエーテルの劣化が問題となる。The production of the functionalized polyphenylene ether of the present invention is carried out by using the above-mentioned polyphenylene ether having an alkenyl group and a silane compound in an extruder, a Banbury mixer,
It can also be carried out by melt-kneading using a kneader, Labo Plastomill or the like. Also in this case, the amount of the silane compound used and the amount of the catalyst used if necessary are substantially the same as those shown above. The reaction temperature is 200 ° C to 3
It can be carried out in the range of 20 ° C. If the temperature is lower than 200 ° C, the polyphenylene ether having an alkenyl group is difficult to melt, and if the temperature is higher than 320 ° C, deterioration of the polyphenylene ether having an alkenyl group becomes a problem.
【0023】得られる官能化ポリフェニレンエーテルの
シリル基による変性の割合は、ポリフェニレンエーテル
中のアルケニル基の含量によって任意にコントロールす
ることが可能であるが、相溶化剤として考えた場合、シ
リル基の含量はポリフェニレンエーテル1分子当り、3
0個以下好ましくは1〜25個である。30個を越える
とゲル化を生じ易く、また、成形が困難となる。数平均
重合度は10〜400である。400を越えると、溶融
粘度の増加による成形加工性の低下など取扱いが容易で
ない。The rate of modification of the resulting functionalized polyphenylene ether with a silyl group can be arbitrarily controlled by the content of the alkenyl group in the polyphenylene ether, but when considered as a compatibilizer, the content of the silyl group is considered. Is 3 per molecule of polyphenylene ether
0 or less, preferably 1 to 25. If the number exceeds 30, gelation is likely to occur and molding becomes difficult. The number average degree of polymerization is 10 to 400. When it exceeds 400, handling is not easy such as deterioration of molding processability due to increase of melt viscosity.
【0024】〔官能化ポリフェニレンエーテルの応用〕
本発明で得られたシリル変性ポリフェニレンエーテルを
用いることで、ポリフェニレンエーテルと異種ポリマー
との相溶性が向上し、島となるポリマーが海となるポリ
マー中に均一に微細分散することが可能となる。これに
よりポリフェニレンエーテルの持つ欠点、例えば、成形
性、耐溶剤性が改良される。詳しくは、本発明で得られ
たシリル変性ポリフェニレンエーテルと異種ポリマーと
を9:1〜1:9の重量比で溶融混練して、微細分散し
た樹脂組成物を得ることができる。[Application of functionalized polyphenylene ether]
By using the silyl-modified polyphenylene ether obtained in the present invention, the compatibility between the polyphenylene ether and the different polymer is improved, and the island polymer can be uniformly finely dispersed in the sea polymer. This improves the drawbacks of polyphenylene ether, such as moldability and solvent resistance. Specifically, the silyl-modified polyphenylene ether obtained in the present invention and the different polymer are melt-kneaded at a weight ratio of 9: 1 to 1: 9 to obtain a finely dispersed resin composition.
【0025】異種ポリマーとして、本発明で得られる官
能化ポリフェニレンエーテル中の官能基であるシリル基
と反応可能な部位を有するポリマーであればよく、具体
的には、ポリアミド、ポリエチレンテレフタレート、ポ
リブチレンテレフタレート等が挙げられる。また、反応
可能部位を官能化によって有した各種変性ポリマー、例
えば、無水マレイン酸変性ポリオレフィン、水酸基変性
ポリオレフィン、不飽和カルボン酸変性ポリフェニレン
スルフィド等を用いることも可能である。The heterogeneous polymer may be any polymer having a site capable of reacting with a silyl group which is a functional group in the functionalized polyphenylene ether obtained in the present invention, and specifically, polyamide, polyethylene terephthalate, polybutylene terephthalate. Etc. It is also possible to use various modified polymers having functionalized reactive sites, such as maleic anhydride modified polyolefin, hydroxyl group modified polyolefin, and unsaturated carboxylic acid modified polyphenylene sulfide.
【0026】組成物を調製する溶融混練装置は、ラボプ
ラストミル、バンバリーミキサー、押出機等が例示され
る。また、その他の装置でもいわゆる高粘度攪拌機、な
いし高粘度混合機であればよく、例えば、多軸混練機、
横型二軸多円板装置や横型二軸表面更新機のような横型
二軸攪拌機並びにダブルヘリカルリボン攪拌機のような
縦型攪拌機等が利用できる。Examples of the melt-kneading device for preparing the composition include a Labo Plastomill, a Banbury mixer, an extruder and the like. Also, other devices may be so-called high-viscosity stirrer or high-viscosity mixer, for example, multi-screw kneader,
A horizontal biaxial stirrer such as a horizontal biaxial multi-disk device or a horizontal biaxial surface renewer, or a vertical stirrer such as a double helical ribbon stirrer can be used.
【0027】混練温度は、150℃〜380℃の範囲で
実施可能であるが、好ましくは、200℃〜320℃の
範囲である。混練時間については、好ましくは0.5分
〜20分、更に好ましくは1分〜10分である。組成物
の構成は、本発明で得られたシリル変性ポリフェニレン
エーテル(A)、異種ポリマー(B)とから成り、
(A)および(B)成分の組成比は重量比で(A):
(B)が10:90〜90:10の範囲であり、好まし
くは、20:80〜80:20の範囲である。また、成
分(A)は、未変性のポリフェニレンエーテル(C)に
置き換えることも可能で、その量は次に示す通りであ
る。A,BおよびC成分の和は100重量%である。The kneading temperature may be in the range of 150 ° C to 380 ° C, but is preferably in the range of 200 ° C to 320 ° C. The kneading time is preferably 0.5 minutes to 20 minutes, more preferably 1 minute to 10 minutes. The composition of the composition is composed of the silyl-modified polyphenylene ether (A) obtained in the present invention and a different polymer (B),
The composition ratio of the components (A) and (B) is a weight ratio (A):
(B) is in the range of 10:90 to 90:10, preferably 20:80 to 80:20. Further, the component (A) can be replaced with an unmodified polyphenylene ether (C), and the amount thereof is as shown below. The sum of the components A, B and C is 100% by weight.
【0028】(A)10〜90重量% (B)10〜90重量% (C)0〜80重量% 必要により、ガラス繊維、顔料、無機充填剤、難燃剤、
抗酸化剤、滑剤、帯電防止剤、紫外線吸収剤等を配合す
ることができる。(A) 10 to 90% by weight (B) 10 to 90% by weight (C) 0 to 80% by weight If necessary, glass fiber, pigment, inorganic filler, flame retardant,
Antioxidants, lubricants, antistatic agents, ultraviolet absorbers and the like can be added.
【0029】[0029]
【作用】アルケニル基を任意数有するポリフェニレンエ
ーテルに一般式Iに示すシラン化合物を反応させるの
で、公知のポリ(2,6−ジメチルフェニレンエーテ
ル)に後からビニルシランをグラフトさせて官能化シリ
ル基を導入するよりも、シリル基含量の制御がし易い。
また、多くの個数のシリル基を導入することができる。Since a phenylene ether having an arbitrary number of alkenyl groups is reacted with a silane compound represented by the general formula I, a known poly (2,6-dimethylphenylene ether) is later grafted with vinylsilane to introduce a functionalized silyl group. It is easier to control the silyl group content than is the case.
Also, a large number of silyl groups can be introduced.
【0030】[0030]
【実施例】本発明を更に具体的に示すためその例を以下
に示すが、本発明はそれらに限定されるものではない。
なお、以下での部およびはパーセントの表示は重量基準
による。ポリフェニレンエーテル中のアルケニル基の含
量用、反応率は主鎖フェニレン環数を基準にモル%で示
し、 1H−NMRの積分強度より算定した。また、数平
均分子量(Mnとする)、分子量分布値(Q値とする)
はGPCにより測定したポリスチレン換算値である。EXAMPLES In order to more specifically illustrate the present invention, examples thereof will be shown below, but the present invention is not limited thereto.
The parts and percentages shown below are based on weight. For the content of alkenyl groups in the polyphenylene ether, the reaction rate was shown in mol% based on the number of main chain phenylene rings, and calculated from the integrated intensity of 1 H-NMR. Also, the number average molecular weight (assumed to be Mn) and the molecular weight distribution value (assumed to be Q value)
Is a polystyrene conversion value measured by GPC.
【0031】〔合成例1〕アルケニル基を有するポリフェニレンエーテルの合成例 2−アリル−6−メチルフェノール61部、2,6−ジ
メチルフェノール950部および水酸化ナトリウム9.
1部とをキシレン2890部とメタノール766部の混
合溶剤に溶かした。次に、ジエタノールアミン20.5
部、ジブチルアミン12.6部、メタノール316部に
溶かした塩化マンガン4水和物0.48部をこの順に加
えた。重合反応は2段に分かれており、前段は、温度を
40℃に保ち酸素ガスを流量0.8リットル/分の割合
で導入して反応を行ない、固体が析出するまで行った。
後段は、温度を30℃に保ち、酸素ガスを流量0.8リ
ットル/分、および窒素ガス8リットル/分の割合で導
入し、ポリマーの析出が止まるまで行った。ポリマーを
塩酸酸性のメタノールで洗浄し、触媒を失活させた。こ
れにより、次式III と式IVに示す構造ユニットがランダ
ムに重合した(モル比5:99)ポリフェニレンエーテ
ルを得た。Synthesis Example 1 Synthesis example of polyphenylene ether having alkenyl group 2-61 parts of allyl-6-methylphenol, 950 parts of 2,6-dimethylphenol and sodium hydroxide 9.
1 part was dissolved in a mixed solvent of 2890 parts of xylene and 766 parts of methanol. Next, diethanolamine 20.5
Parts, dibutylamine 12.6 parts, and manganese chloride tetrahydrate 0.48 parts dissolved in methanol 316 parts were added in this order. The polymerization reaction was divided into two stages, and in the former stage, the temperature was kept at 40 ° C., oxygen gas was introduced at a flow rate of 0.8 liter / min to carry out the reaction, and the reaction was continued until a solid was deposited.
In the latter stage, the temperature was kept at 30 ° C., oxygen gas was introduced at a flow rate of 0.8 liter / min, and nitrogen gas was introduced at 8 liter / min until the precipitation of the polymer stopped. The polymer was washed with hydrochloric acid-methanol to deactivate the catalyst. As a result, polyphenylene ether in which the structural units represented by the following formulas III and IV were randomly polymerized (molar ratio 5:99) was obtained.
【0032】[0032]
【化5】 [Chemical 5]
【0033】[0033]
【化6】 [Chemical 6]
【0034】アルケニル基含量;4.8モル% ポリマー収率;86% Mn;15,800 Q値;2.58Alkenyl group content: 4.8 mol% Polymer yield: 86% Mn: 15,800 Q value: 2.58
【0035】〔合成例2〕アルケニル基を有するポリフェニレンエーテルの合成例 2−アリル−6−メチルフェノールの使用量を243部
および2,6−ジメチルフェノールの使用量を800部
と変更する他は合成例1と同様にして反応を行った。こ
れにより、上記の式III 、IVに示す構造ユニットがラン
ダムに重合した(モル比25:94)ポリフェニレンエ
ーテルを得た。 アルケニル基含量;21モル% ポリマー収率;81% Mn;11,800 Q値;2.57[Synthesis Example 2] Synthesis Example of Polyphenylene Ether Having Alkenyl Group 2- Synthesis except that the amount of allyl-6-methylphenol used was 243 parts and the amount of 2,6-dimethylphenol used was 800 parts. The reaction was carried out as in Example 1. As a result, polyphenylene ether in which the structural units represented by the above formulas III and IV were randomly polymerized (molar ratio 25:94) was obtained. Alkenyl group content; 21 mol% Polymer yield; 81% Mn; 11,800 Q value; 2.57
【0036】〔合成例3〕ビニルトリメトキシシランによるポリフェニレンエーテ
ルの官能基化 窒素ガス雰囲気下、ビニルトリメトキシシラン50部と
ポリフェニレンエーテル〔日本ポリエーテル社製、ポリ
(2,6−ジメチルフェニレンエーテル)、30℃クロ
ロホルム中で測定した固有粘度が0.31dl/gのも
の〕100部とをクロロベンゼンに溶かした。還流温度
にて5%のジクミルパーオキサイドのクロロベンゼン溶
液100部を滴下し、3時間反応を行った。反応終了
後、多量のメタノールでポリマーを再沈、洗浄した。最
後に真空下100℃で乾燥し、ビニルトリメトキシシラ
ングラフト変性ポリフェニレンエーテルを得た。 収率;96%[Synthesis Example 3] Polyphenylene ether with vinyltrimethoxysilane
Of 50 parts vinyltrimethoxysilane and polyphenylene ether [manufactured by Nippon Polyether Co., Ltd., poly (2,6-dimethylphenylene ether), intrinsic viscosity of 0.31 dl measured in chloroform at 30 ° C. / G)] 100 parts was dissolved in chlorobenzene. At the reflux temperature, 100 parts of a 5% solution of dicumyl peroxide in chlorobenzene was added dropwise and the reaction was carried out for 3 hours. After the reaction was completed, the polymer was reprecipitated and washed with a large amount of methanol. Finally, it was dried under vacuum at 100 ° C. to obtain vinyltrimethoxysilane graft-modified polyphenylene ether. Yield: 96%
【0037】〔実施例1〕窒素ガス雰囲気下、合成例1
で得られたアルケニル基を有するポリフェニレンエーテ
ル150部に、脱水処理したトルエン1300部、トリ
メトキシシラン78部を順次加えた後、温度を80℃に
保ち均一溶液とした。ここに触媒(0.001モル/リ
ットルの塩化白金酸のイソプロパノール溶液)を24部
添加し、80℃のまま、12時間反応した。反応終了
後、多量のメタノールでポリマーを再沈、洗浄した。最
後に真空下100℃で乾燥し、目的のトリメトキシシリ
ル基で官能化したポリフェニレンエーテルを得た。 収率;89% アリル基の反応率;約100%Example 1 Synthesis Example 1 under nitrogen gas atmosphere
After 1300 parts of dehydrated toluene and 78 parts of trimethoxysilane were sequentially added to 150 parts of the polyphenylene ether having an alkenyl group obtained in above, the temperature was kept at 80 ° C. to obtain a uniform solution. 24 parts of a catalyst (0.001 mol / liter of chloroplatinic acid in isopropanol) was added thereto, and the mixture was reacted at 80 ° C. for 12 hours. After the reaction was completed, the polymer was reprecipitated and washed with a large amount of methanol. Finally, it was dried under vacuum at 100 ° C. to obtain the desired polyphenylene ether functionalized with a trimethoxysilyl group. Yield: 89% Reaction rate of allyl group: About 100%
【0038】〔実施例2〕合成例2で得られたアルケニ
ル基を有するポリフェニレンエーテルを150部、トリ
メトキシシランを64部用いる他は実施例1と同条件で
反応を行った。 収率;95% アリル基の反応率;84%Example 2 The reaction was carried out under the same conditions as in Example 1 except that 150 parts of the polyphenylene ether having an alkenyl group obtained in Synthesis Example 2 and 64 parts of trimethoxysilane were used. Yield: 95% Reaction rate of allyl group: 84%
【0039】〔応用例〕実施例1で得たトリメトキシシ
リル変性ポリフェニレンエーテルとポリアミド−6〔B
ASF社製ウルトラミッドKR4411(商品名)〕を
表1に示す組成に従って、各成分を、東洋精機製作所製
ラボプラストミル混練機を用い、280℃、180回転
にて5分間混練した後、粉砕して粒状の樹脂組成物を得
た。この樹脂組成物を280℃でプレス成形し、厚さ2
mmのシートを作成した。このシートより、試験片を切
り出し、物性評価を行った。[Application Example] Trimethoxysilyl-modified polyphenylene ether obtained in Example 1 and polyamide-6 [B
ASF Ultramid KR4411 (trade name)] according to the composition shown in Table 1, each component was kneaded at 280 ° C. and 180 rpm for 5 minutes using a Labo Plastomill kneader manufactured by Toyo Seiki Seisakusho, and then pulverized. To obtain a granular resin composition. This resin composition was press-molded at 280 ° C. to give a thickness of 2
mm sheets were created. Test pieces were cut out from this sheet and evaluated for physical properties.
【0040】〔比較応用例〕実施例1で得た官能化ポリ
フェニレンエーテルの代わりに、合成例3で得たビニル
トリメトキシシラングラフト変性官能化ポリフェニレン
エーテルを用いる他は応用例と同様に反応を行った。Comparative Application Example The reaction was carried out in the same manner as in the application example except that the vinyltrimethoxysilane graft-modified functionalized polyphenylene ether obtained in Synthesis Example 3 was used in place of the functionalized polyphenylene ether obtained in Example 1. It was
【0041】応用例、比較応用例で得られた樹脂組成物
の特性は、以下の方法によって測定評価した。測定結果
を表1に示した。 (1)アイゾット衝撃強度:JIS K7110に準じ
て、厚さ2mmの試験片を3枚重ねにて、23℃のノッ
チ無しアイゾッド衝撃強度を測定した。 (2)曲げ弾性率:幅25×長さ80mmの試験片を切
削加工し、JIS K7203に準拠して、インストロ
ン試験機を用いて測定した。The characteristics of the resin compositions obtained in the application examples and comparative application examples were measured and evaluated by the following methods. The measurement results are shown in Table 1. (1) Izod impact strength: In accordance with JIS K7110, three notched Izod impact strengths at 23 ° C. were measured by stacking three 2 mm-thick test pieces. (2) Flexural modulus: A test piece having a width of 25 mm and a length of 80 mm was cut, and measured according to JIS K7203 using an Instron tester.
【0042】[0042]
【表1】 [Table 1]
【0043】[0043]
【発明の効果】アルコキシシリル基、アリーロキシシリ
ル基またはハロゲン化シリル基により官能化されたポリ
フェニレンエーテルは、ポリマーアロイの相溶化剤とし
て有用である。The polyphenylene ether functionalized with an alkoxysilyl group, aryloxysilyl group or halogenated silyl group is useful as a compatibilizing agent for polymer alloys.
【図1】合成例1のアルケニル基を有するポリフェニレ
ンエーテルの 1H−NMRチャートである。FIG. 1 is a 1 H-NMR chart of polyphenylene ether having an alkenyl group in Synthesis Example 1.
【図2】実施例1で得られたトリメトキシシリル変性ポ
リフェニレンエーテルの 1H−NMRチャートである。FIG. 2 is a 1 H-NMR chart of trimethoxysilyl-modified polyphenylene ether obtained in Example 1.
Claims (2)
ーテルと、一般式Iで表されるシラン化合物とを反応さ
せてシリル変性ポリフェニレンエーテルを製造する方
法。 【化1】 H−Si(Q1 )n (Q2 )3-n (I) (式中、nは1〜3の整数、Q1 は、炭素数1〜20の
アルコキシ基、芳香族オキシ基またはハロゲン基を示
す。Q2 は、水素原子、芳香族基、炭素数1〜20のア
ルキル基または炭素数1〜20の芳香族アルキル基を示
す。nまたは(3−n)が2以上の時、それぞれの
Q1 、Q2 は異なっていてもよい。)1. A method for producing a silyl-modified polyphenylene ether by reacting a polyphenylene ether having an alkenyl group with a silane compound represented by the general formula I. Embedded image H-Si (Q 1 ) n (Q 2 ) 3-n (I) (In the formula, n is an integer of 1 to 3, Q 1 is an alkoxy group having 1 to 20 carbon atoms, an aromatic oxy group. .Q 2 showing a group or a halogen group, a hydrogen atom, an aromatic group, an aromatic alkyl group of the alkyl group or C1-20 C20 .n or (3-n) is 2 or more , Then each Q 1 and Q 2 may be different.)
ーテルと、一般式Iに示す化合物とを周期律表IVB,VIA,
VIIA,VIIIAの金属、並びにこれらの金属を含む化合物の
存在下に反応させシリル変性ポリフェニレンエーテルを
製造する方法。 【化2】 H−Si(Q1 )n (Q2 )3-n (I) (式中、nは1〜3の整数、Q1 は、炭素数1〜20の
アルコキシ基、芳香族オキシ基またはハロゲン基を示
す。Q2 は、水素原子、芳香族基、炭素数1〜20のア
ルキル基または炭素数1〜20の芳香族アルキル基を示
す。nまたは(3−n)が2以上の時、それぞれの
Q1 、Q2 は異なっていてもよい。)2. A polyphenylene ether having an alkenyl group and a compound represented by the general formula I are represented by periodic tables IVB, VIA,
A method for producing a silyl-modified polyphenylene ether by reacting in the presence of a metal of VIIA or VIIIA and a compound containing these metals. Embedded image H-Si (Q 1 ) n (Q 2 ) 3-n (I) (In the formula, n is an integer of 1 to 3, Q 1 is an alkoxy group having 1 to 20 carbon atoms, an aromatic oxy group. .Q 2 showing a group or a halogen group, a hydrogen atom, an aromatic group, an aromatic alkyl group of the alkyl group or C1-20 C20 .n or (3-n) is 2 or more , Then each Q 1 and Q 2 may be different.)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32875591A JPH05163344A (en) | 1991-12-12 | 1991-12-12 | Method for producing polyphenylene ether having silyl group |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32875591A JPH05163344A (en) | 1991-12-12 | 1991-12-12 | Method for producing polyphenylene ether having silyl group |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05163344A true JPH05163344A (en) | 1993-06-29 |
Family
ID=18213800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32875591A Pending JPH05163344A (en) | 1991-12-12 | 1991-12-12 | Method for producing polyphenylene ether having silyl group |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05163344A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08201734A (en) * | 1995-01-26 | 1996-08-09 | Menicon Co Ltd | Lens material for eye |
JP2007211201A (en) * | 2006-02-13 | 2007-08-23 | Hitachi Ltd | Low dielectric loss resin, resin composition and method for producing low dielectric loss resin |
WO2008032539A1 (en) * | 2006-09-13 | 2008-03-20 | Kaneka Corporation | MOISTURE-CURABLE POLYMER HAVING SiF GROUP AND CURABLE COMPOSITION CONTAINING THE SAME |
JP2008127451A (en) * | 2006-11-20 | 2008-06-05 | Hitachi Ltd | Process for producing poly (phenylene ether) and poly (phenylene ether) |
JP2018035217A (en) * | 2016-08-29 | 2018-03-08 | 旭化成株式会社 | Thermosetting resin composition, and prepreg, metal-clad laminate or printed wiring board using the same |
JP2019077761A (en) * | 2017-10-24 | 2019-05-23 | 信越化学工業株式会社 | Organic silicon compound, method for producing the same, and curable composition |
WO2022229842A1 (en) * | 2021-04-27 | 2022-11-03 | Shpp Global Technologies B.V. | Bifunctional sizing agent for improved adhesion to substrates |
TWI877482B (en) | 2021-04-27 | 2025-03-21 | 荷蘭商Shpp全球科技公司 | Bifunctional sizing agent for improved adhesion to substrates |
-
1991
- 1991-12-12 JP JP32875591A patent/JPH05163344A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08201734A (en) * | 1995-01-26 | 1996-08-09 | Menicon Co Ltd | Lens material for eye |
JP2007211201A (en) * | 2006-02-13 | 2007-08-23 | Hitachi Ltd | Low dielectric loss resin, resin composition and method for producing low dielectric loss resin |
WO2008032539A1 (en) * | 2006-09-13 | 2008-03-20 | Kaneka Corporation | MOISTURE-CURABLE POLYMER HAVING SiF GROUP AND CURABLE COMPOSITION CONTAINING THE SAME |
US8124690B2 (en) | 2006-09-13 | 2012-02-28 | Kaneka Corporation | Moisture curable polymer having SiF group, and curable composition containing the same |
JP5500824B2 (en) * | 2006-09-13 | 2014-05-21 | 株式会社カネカ | Moisture curable polymer having SiF group and curable composition containing the same |
JP2008127451A (en) * | 2006-11-20 | 2008-06-05 | Hitachi Ltd | Process for producing poly (phenylene ether) and poly (phenylene ether) |
JP2018035217A (en) * | 2016-08-29 | 2018-03-08 | 旭化成株式会社 | Thermosetting resin composition, and prepreg, metal-clad laminate or printed wiring board using the same |
JP2019077761A (en) * | 2017-10-24 | 2019-05-23 | 信越化学工業株式会社 | Organic silicon compound, method for producing the same, and curable composition |
WO2022229842A1 (en) * | 2021-04-27 | 2022-11-03 | Shpp Global Technologies B.V. | Bifunctional sizing agent for improved adhesion to substrates |
TWI877482B (en) | 2021-04-27 | 2025-03-21 | 荷蘭商Shpp全球科技公司 | Bifunctional sizing agent for improved adhesion to substrates |
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