JPH0514423B2

JPH0514423B2 -

Info

Publication number: JPH0514423B2
Application number: JP12262288A
Authority: JP
Inventors: Takaaki Yokoyama
Original assignee: Sanken Electric Co Ltd
Current assignee: Sanken Electric Co Ltd
Priority date: 1988-05-19
Filing date: 1988-05-19
Publication date: 1993-02-25
Also published as: JPH01291434A

Description

【発明の詳細な説明】〔産業上の利用分野〕本発明は樹脂封止型電子部品の製造方法に関
し、更に詳細には支持板の下面側にも薄い樹脂層
を良好に形成することができる樹脂封止型電子部
品の製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a resin-sealed electronic component, and more specifically, a thin resin layer can be satisfactorily formed on the lower surface side of a support plate. The present invention relates to a method for manufacturing resin-sealed electronic components.

[Problems to be solved by conventional technology and invention]

支持板の下面を含めて、支持板の全面を樹脂封
止体で被覆した樹脂封止型半導体装置がある。こ
の種の半導体装置は放熱体等への取り付けの際に
絶縁シートを必要としない。しかし、支持板の下
面にも樹脂封止体の一部が形成されるため、支持
板の下面が露出したタイプの樹脂封止型半導体装
置に比べて放熱性の点では不利である。したがつ
て、支持板の下面側の樹脂封止体を厚さ0.5mm程
度の薄い層にすることにより、この不利を少なく
している。しかし、この下面側の樹脂封止体は支
持板と成形空所の沿面とがわずか0.5mmの間隔で
対向した領域に封止樹脂を押圧注入して形成する
ため、良好な樹脂層が得られ難かつた。 There is a resin-sealed semiconductor device in which the entire surface of a support plate, including the lower surface of the support plate, is covered with a resin sealant. This type of semiconductor device does not require an insulating sheet when attached to a heat sink or the like. However, since a portion of the resin sealing body is also formed on the lower surface of the support plate, it is disadvantageous in terms of heat dissipation compared to a resin-sealed semiconductor device of the type in which the lower surface of the support plate is exposed. Therefore, this disadvantage is reduced by forming the resin sealing body on the lower surface side of the support plate into a thin layer with a thickness of about 0.5 mm. However, since the resin sealant on the bottom side is formed by press-injecting the sealing resin into an area where the supporting plate and the creeping surface of the molding cavity face each other with a spacing of only 0.5 mm, a good resin layer cannot be obtained. It was difficult.

上記問題を解決するための方法として、特開昭
60−257529号公報に成形金型の上型に樹脂の注入
方向に交差するように突出部を設け、これにより
支持板上面側の樹脂の流れを抑制して相対的に支
持板下面の樹脂の流れを強めた製造方法が開示さ
れている。しかし、上記の方法では支持板を固定
するためにピンや支持板支持用のリードを必要と
し、外部リード以外の金属部の全面を樹脂封止体
にて被覆することが困難であつた。 As a method to solve the above problem,
No. 60-257529 discloses that a protrusion is provided on the upper mold of the molding die so as to cross the injection direction of the resin, thereby suppressing the flow of the resin on the upper surface of the support plate and relatively reducing the flow of the resin on the lower surface of the support plate. A manufacturing method with enhanced flow is disclosed. However, the above method requires pins and leads for supporting the support plate in order to fix the support plate, and it is difficult to cover the entire surface of the metal parts other than the external leads with a resin sealant.

そこで、特開昭60−130129号公報には、上記の
支持板固定用のピンを可動ピンとした製造方法が
開示されている。しかし、可動ピンの制御は極め
て困難であつた。即ち、可動ピンの引き抜き時期
が早すぎると支持板が傾斜してしまい、可動ピン
の引き抜き時期が遅すぎると可動ピンの移動によ
り生じた空所に封止樹脂が注入されなくなる。 Therefore, Japanese Patent Application Laid-open No. 130129/1983 discloses a manufacturing method in which the pin for fixing the support plate is a movable pin. However, controlling the movable pin was extremely difficult. That is, if the movable pin is pulled out too early, the support plate will be tilted, and if the movable pin is pulled out too late, the sealing resin will not be injected into the void created by the movement of the movable pin.

そこで、本発明は支持板の下面側に良好な樹脂
層を形成でき、かつ外部リード以外に金属の露出
部分がない樹脂封止型電子部品を容易に得ること
ができる製造方法を提供することを目的とする。 Therefore, it is an object of the present invention to provide a manufacturing method that can form a good resin layer on the lower surface side of a support plate and easily obtain a resin-sealed electronic component that has no exposed metal parts other than the external leads. purpose.

[Means to solve the problem]

上記目的を達成するための本発明は、リードフ
レームの支持板の一方の主面に電子素子及び／又
は回路基板が固着されており、前記支持板の一方
の端部側に外部リードが配置されているリードフ
レーム組立体を用意する工程と、前記支持板の一
方の主面側と他方の主面側との両方を樹脂封止す
ることができるように形成された成形空所を有す
る成形用型を用意し、前記成形空所内に進退可能
な第１及び第２のスライド型によつて前記支持板
の他方の端部側を挾持して前記支持板の他方の主
面とこれに対向する前記成形空所の壁面との間隔
が前記支持板の一方の主面とこれに対向する前記
成形空所の壁面との間隔よりも小さくなるように
前記リードフレーム組立体を前記成形用型に配置
し、前記支持板の上面よりも下方に位置する前記
樹脂注入口から流動化した封止用樹脂を前記成形
空所内に押圧注入する工程と、前記成形空所の略
半分以上が前記封止用樹脂にて充填された後に、
前記第１及び第２のスライド型を前記支持板から
離間するように移動し、前記第１及び第２のスラ
イド型の移動により形成された空所に前記封止用
樹脂を注入する工程とを有することを特徴とする
樹脂封止型電子部品の製造方法に係わるものであ
る。 To achieve the above object, the present invention has an electronic element and/or a circuit board fixed to one main surface of a support plate of a lead frame, and external leads are arranged on one end side of the support plate. and a molding method having a molding cavity formed so that both one main surface side and the other main surface side of the support plate can be sealed with resin. A mold is prepared, and the other end side of the support plate is sandwiched between first and second slide molds that can move forward and backward into the molding cavity, and the other end side of the support plate is opposed to the other main surface of the support plate. The lead frame assembly is arranged in the molding mold such that the distance between the lead frame assembly and the wall surface of the molding cavity is smaller than the distance between one main surface of the support plate and the opposing wall surface of the molding cavity. a step of press-injecting fluidized sealing resin from the resin injection port located below the upper surface of the support plate into the molding cavity, and approximately half or more of the molding cavity is filled with the sealing resin; After being filled with resin,
moving the first and second slide molds away from the support plate, and injecting the sealing resin into the void formed by the movement of the first and second slide molds. The present invention relates to a method of manufacturing a resin-sealed electronic component characterized by having the following features.

[Effect]

本発明の第１及び第２のスライド型は支持板を
所定の位置に固定する作用を有し、第１又は第２
のスライド型は支持板の一方の主面側に流れる封
止用樹脂を抑制する作用を有する。これにより、
支持板の他方の主面側への封止用樹脂の注入を相
対的に強められる。また、第１及び第２のスライ
ド型はいずれも支持板の他端側に配置されるた
め、第１及び第２のスライド型の移動後に形成さ
れる空所に封止用樹脂を確実に注入できる。 The first and second slide molds of the present invention have the function of fixing the support plate in a predetermined position, and
The sliding type has the effect of suppressing the sealing resin flowing toward one main surface side of the support plate. This results in
Injection of the sealing resin onto the other main surface side of the support plate can be relatively strengthened. In addition, since both the first and second slide molds are placed on the other end side of the support plate, the sealing resin can be reliably injected into the void formed after the first and second slide molds are moved. can.

〔Example〕

第１図〜第６図を参照して本発明の一実施例に
係わる樹脂封止型半導体装置の製造方法を説明す
る。 A method of manufacturing a resin-sealed semiconductor device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.

第６図に示すリードフレーム１は放熱機能を有
する支持板２と、この支持板２の一端に配置され
た外部リード３を有している。実際のリードフレ
ーム１は複数個の支持板２を有する多素子取り用
のリードフレームとなつている。リードフレーム
１の支持板２上には半導体チツプ４が半田（図示
せず）を介して固着されかつ半導体チツプ４と外
部リード３がリード細線５によつて電気的に接続
されてチツプ・リードフレーム組立体６（以下、
リードフレーム組立体と呼ぶ）が形成されてい
る。 The lead frame 1 shown in FIG. 6 has a support plate 2 having a heat dissipation function and an external lead 3 disposed at one end of the support plate 2. The lead frame 1 shown in FIG. The actual lead frame 1 is a multi-element lead frame having a plurality of support plates 2. A semiconductor chip 4 is fixed onto the support plate 2 of the lead frame 1 via solder (not shown), and the semiconductor chip 4 and the external leads 3 are electrically connected by thin lead wires 5 to form a chip lead frame. Assembly 6 (hereinafter,
A lead frame assembly (referred to as a lead frame assembly) is formed.

リードフレーム組立体６に第６図で点線で示す
ように、樹脂封止体７を形成する時には、第１図
に示すようにリードフレーム組立体６を周知のト
ランスフアモールド用の成形用の金型８に配置す
る。第１図の金型８は上型９と下型１０から成
り、上型９には円柱状の凸部１１が形成されてい
る。凸部１１は支持板２に形成された取付用孔２
ａに挿入されている。但し、凸部１１は取付用孔
２ａの内周面とは離間している。したがつて、取
付用孔２ａの内周面は露出せずに樹脂封止体７の
一部にて被覆される。下型１０には外部リード３
が収められる溝部が形成されている。上記構造は
従来と何ら変わるところはない。本実施例の特徴
は第１図及び第２図に示すように金型８が上型９
と下型１０の他に第１のスライド型１２、第２の
スライド型１３及び第３のスライド型１４を有し
ていることと、樹脂注入口としてのゲート１５が
第１のスライド型１２の底面の下方に位置してい
ることにある。第１のスライド型１２は上型９に
対して相対的に上下動可能に設けられており、第
２及び第３のスライド型１３，１４は下型１０に
対して相対的に上下動可能に設けられている。こ
れらのスライド型１２，１３，１４の横幅W₁，
W₂，W₃は第２図に示すように第１のスライド型
１２の横幅W₁が大きく、第２及び第３のスライ
ド型１３，１４の横幅W₂，W₃はそれより小さ
い。なお本実施例では第１のスライド型１２の横
幅W₁はゲート１５の横幅よりも大きくなつてい
る。ゲート１５及びそれにつながるランナ１６は
下型１０と上型９との境界面に形成されている。
上型９と下型１０を閉じることで、上型９に形成
された凹部１７と下型１０に形成された凹部１８
により金型８内に樹脂封止体７に対応した成形空
所１９が形成される。 When forming the resin sealing body 7 on the lead frame assembly 6 as shown by the dotted line in FIG. Place in mold 8. The mold 8 shown in FIG. 1 consists of an upper mold 9 and a lower mold 10, and the upper mold 9 has a cylindrical convex portion 11 formed therein. The convex portion 11 is a mounting hole 2 formed in the support plate 2.
It is inserted in a. However, the convex portion 11 is spaced apart from the inner peripheral surface of the attachment hole 2a. Therefore, the inner peripheral surface of the mounting hole 2a is covered with a part of the resin sealing body 7 without being exposed. The lower mold 10 has external leads 3
A groove is formed in which the The above structure is no different from the conventional one. The feature of this embodiment is that, as shown in FIGS. 1 and 2, the mold 8 is an upper mold 9.
In addition to the lower mold 10, it has a first slide mold 12, a second slide mold 13, and a third slide mold 14, and the gate 15 as a resin injection port is connected to the first slide mold 12. This is because it is located below the bottom. The first slide mold 12 is movable up and down relative to the upper mold 9, and the second and third slide molds 13 and 14 are movable up and down relative to the lower mold 10. It is provided. The width W ₁ of these slide molds 12, 13, 14,
As for W ₂ and W ₃ , as shown in FIG. 2, the width W ₁ of the first slide mold 12 is large, and the width W ₂ and W ₃ of the second and third slide molds 13 and 14 are smaller than that. In this embodiment, the width W ₁ of the first slide die 12 is larger than the width of the gate 15 . The gate 15 and the runner 16 connected thereto are formed at the interface between the lower mold 10 and the upper mold 9.
By closing the upper mold 9 and the lower mold 10, a recess 17 formed in the upper mold 9 and a recess 18 formed in the lower mold 10 are removed.
As a result, a molding cavity 19 corresponding to the resin sealing body 7 is formed in the mold 8.

リードフレーム組立体６の配置の際、外部リー
ド３は下型１０に設けられた溝に嵌合されて上型
９と下型１０で挾持される。また、支持板２の外
部リード３が導出された側と反対側の端部の肉薄
部分は第１のスライド型１２と第２及び第３のス
ライド型１３，１４とで挾持される。このため、
支持板２の下面が成形空所１９の底面から0.5mm
程度の小さい間隔L₁で浮いた状態にて両持ち支
持される。第１、第２及び第３のスライド型１
２，１３，１４はリードフレーム組立体６を配置
した後に下降及び上昇させて支持板２を挾持し
た。しかし、上型９と下型１０を閉じる前に予め
スライド型１２，１３，１４を上型９及び下型１
０から成形空所１９内に突出させておいてもよ
い。 When placing the lead frame assembly 6, the external leads 3 are fitted into grooves provided in the lower mold 10 and are held between the upper mold 9 and the lower mold 10. Further, a thin portion of the support plate 2 at the end opposite to the side from which the external leads 3 are led out is held between the first slide mold 12 and the second and third slide molds 13 and 14. For this reason,
The lower surface of the support plate 2 is 0.5 mm from the bottom of the molding cavity 19.
Both sides are supported in a floating state with a small distance _L1 . First, second and third slide molds 1
2, 13, and 14 were lowered and raised to sandwich the support plate 2 after the lead frame assembly 6 was placed. However, before closing the upper mold 9 and the lower mold 10, the slide molds 12, 13, and 14 are inserted into the upper mold 9 and the lower mold 1.
0 into the molding cavity 19.

次に、第１図に示すように円柱状の樹脂ブロツ
ク２０をポツト（樹脂投入口）２１に投入する。
ポツト２１及び金型８は予め160℃程度に加熱さ
れており、樹脂ブロツク２０は溶融し流動化す
る。ポツト２１はランナ１６及びゲート１５を通
じて成形空所１９につながつており、樹脂ブロツ
ク２０はプランジヤ（押し型）２２に押圧される
ことで成形空所１９に流入する。この実施例では
ポツト２１がこれを中心に対称に配置された２つ
の成形空所１９につながつているので、樹脂ブロ
ツク２０も２つの樹脂封止型半導体装置の樹脂封
止体７に対応する。本実施例ではゲート１５が支
持板２の上面より下方に位置し、かつゲート１５
の上方にはその全幅長にわたつて第１のスライド
型１２が配置されている。このため、ゲート１５
は支持板２の下面側の領域に通じ、注入された封
止用樹脂は下側の領域に流れ易く、上側の領域へ
の流入は第１のスライド型１２及び支持板２にて
抑制され弱められる。つまり、第１のスライド型
１２は従来例の上型の突出部の作用をする。ただ
し、第１のスライド型１２はゲート１５の近傍に
設けられているため、封止用樹脂の支持板２の上
面への流れ抑制効果は従来例の突出部よりも一段
と向上している。また、第３図に示すように、支
持板２のゲート１５側の端部には突出部２ｂが設
けられており、支持板２の他端とそれに対向する
成形空所１９の壁面との間隔が狭められている。
これにより、封止用樹脂の上面側への流れの抑制
効果がさらに向上している。 Next, as shown in FIG. 1, a cylindrical resin block 20 is put into a pot (resin inlet) 21.
The pot 21 and the mold 8 are previously heated to about 160° C., and the resin block 20 is melted and fluidized. The pot 21 is connected to the molding cavity 19 through the runner 16 and the gate 15, and the resin block 20 flows into the molding cavity 19 by being pressed by a plunger 22. In this embodiment, since the pot 21 is connected to two molding cavities 19 arranged symmetrically about the pot 21, the resin block 20 also corresponds to the resin molded body 7 of the two resin molded semiconductor devices. In this embodiment, the gate 15 is located below the upper surface of the support plate 2, and the gate 15
A first slide mold 12 is disposed above the mold over its entire width. For this reason, gate 15
communicates with the region on the lower surface side of the support plate 2, and the injected sealing resin easily flows into the lower region, and the flow into the upper region is suppressed by the first slide mold 12 and the support plate 2 and is weakened. It will be done. In other words, the first slide die 12 acts as a protrusion of the upper die of the conventional example. However, since the first slide mold 12 is provided in the vicinity of the gate 15, the effect of suppressing the flow of the sealing resin toward the upper surface of the support plate 2 is further improved than that of the protruding portion of the conventional example. Further, as shown in FIG. 3, a protrusion 2b is provided at the end of the support plate 2 on the gate 15 side, and the distance between the other end of the support plate 2 and the wall surface of the molding cavity 19 facing thereto is is narrowed.
This further improves the effect of suppressing the flow of the sealing resin toward the upper surface side.

第１図では支持板２の上面側と下面側とがほぼ
完全に分離されていて、支持板２の上面にはほと
んど封止用樹脂が注入されないように思われる
が、実際には第１のスライド型１２の側方及び支
持板２の側方において支持板２の上面側の領域と
下面側の領域とがつながつているので、封止用樹
脂は支持板２の上面側と下面側とにバランス良く
注入される。 In FIG. 1, the upper surface side and the lower surface side of the support plate 2 are almost completely separated, and it seems that almost no sealing resin is injected into the upper surface of the support plate 2, but in reality, the first Since the upper and lower regions of the support plate 2 are connected on the sides of the slide mold 12 and on the sides of the support plate 2, the sealing resin is applied to the upper and lower sides of the support plate 2. Injected in a well-balanced manner.

成形空所１９のほぼ全体が封止用樹脂にて充填
されたら、第１のスライド型１２と第２及び第３
のスライド型１３，１４を支持板２から離間する
ように移動する。これによつて、支持板２の他端
の挾持は解かれ、支持板２は片持ち状態となる。
しかし、成形空所１９はすでに第４図に示すよう
に封止用樹脂にてほぼ全体が充填されており、か
つその一部は硬化しつつある。したがつて、この
状態にてさらに封止用樹脂を注入しても支持板２
が傾斜することはない。スライド型１２，１３，
１４を移動したことにより形成された空所にはゲ
ート１５より封止用樹脂が注入されて充填され
る。本実施例ではスライド型１２，１３，１４を
ゲート１５の設けられている成形空所１９の沿面
に当接させ、かつゲート１５の近傍に配置した。
このため、スライド型１２，１３，１４の移動後
に形成される空所はゲート１５に直接に通じる位
置にある。したがつて、封止用樹脂を空所に確実
に注入することが可能である。また、スライド型
１２，１３，１４の移動時期が遅くなり、スライ
ド型１２，１３，１４の周囲の封止用樹脂の流動
性が失われても、空所にゲート１５から直接的に
封止用樹脂を注入できる。したがつて、スライド
型１２，１３，１４の移動時期を従来例よりも遅
くできる。言い換れば成形空所１９に多量の封止
用樹脂を注入してからスライド型１２，１３，１
４を移動できるので、支持板２の傾斜を確実に防
止できる。 When almost the entire molding cavity 19 is filled with the sealing resin, the first slide mold 12 and the second and third molds are
The slide molds 13 and 14 are moved away from the support plate 2. As a result, the other end of the support plate 2 is released, and the support plate 2 becomes cantilevered.
However, as shown in FIG. 4, the molding cavity 19 is already almost entirely filled with the sealing resin, and a portion of the sealing resin is being cured. Therefore, even if the sealing resin is further injected in this state, the support plate 2
is not tilted. Slide type 12, 13,
A sealing resin is injected from the gate 15 into the void formed by moving the gate 14 to fill it. In this embodiment, the slide molds 12, 13, and 14 were placed in contact with the surface of the molding cavity 19 in which the gate 15 was provided, and in the vicinity of the gate 15.
Therefore, the void formed after the slide molds 12, 13, and 14 are moved is in a position that directly communicates with the gate 15. Therefore, it is possible to reliably inject the sealing resin into the cavity. In addition, even if the movement timing of the slide molds 12, 13, 14 is delayed and the fluidity of the sealing resin around the slide molds 12, 13, 14 is lost, the void can be directly sealed from the gate 15. Can be injected with resin. Therefore, the movement timing of the slide molds 12, 13, and 14 can be made later than in the conventional example. In other words, after injecting a large amount of sealing resin into the molding cavity 19, the slide molds 12, 13, 1
4 can be moved, it is possible to reliably prevent the support plate 2 from tilting.

本実施例ではスライド型１２，１３，１４の移
動時期の制御はプランジヤ２２の高さ位置によつ
て行う。即ち、成形空所１９に注入される封止用
樹脂の量はプランジヤ２２の降下した距離に依存
する。したがつて、プランジヤ２２が所定の高さ
まで降下して成形空所１９のほぼ全体が封止用樹
脂にて充填されたらスライド型１２，１３，１４
を支持板２から離間させる。なお、同一のポツト
２１から複数素子分の成形空所１９に延びる樹脂
注入路の長さ（ランナ１６とゲート１５を加えた
長さ）は等しくなつているため、それらの成形空
所１９に注入される封止用樹脂の量は等しい。な
お、樹脂注入路の長さは異つても、容量が同じで
あれば同様の効果が得られる。 In this embodiment, the movement timing of the slide molds 12, 13, and 14 is controlled by the height position of the plunger 22. That is, the amount of sealing resin injected into the molding cavity 19 depends on the distance that the plunger 22 has descended. Therefore, when the plunger 22 descends to a predetermined height and almost the entire molding cavity 19 is filled with the sealing resin, the slide molds 12, 13, 14
is separated from the support plate 2. Note that since the length of the resin injection path extending from the same pot 21 to the molding cavities 19 for multiple elements (the length including the runner 16 and the gate 15) is equal, the resin injection path can be injected into those molding cavities 19. The amount of sealing resin applied is the same. Note that even if the length of the resin injection path is different, the same effect can be obtained as long as the capacity is the same.

成形空所１９に注入された封止用樹脂が固化し
た後、リードフレーム組立体６を金型８から取り
出して外部リード３を平行に連結するタイバー及
び連結条を切断除去する。これにより第５図に示
すような樹脂封止型半導体装置２３が完成する。
図示のように本実施例にて得られる半導体装置２
３は支持板２の裏面を含む全面が樹脂封止体７に
て被覆され、外部リード３以外に金属の露出部分
がない。 After the sealing resin injected into the molding cavity 19 is solidified, the lead frame assembly 6 is taken out from the mold 8, and the tie bars and connecting strips connecting the external leads 3 in parallel are cut and removed. As a result, a resin-sealed semiconductor device 23 as shown in FIG. 5 is completed.
As shown in the figure, a semiconductor device 2 obtained in this example
3, the entire surface including the back surface of the support plate 2 is covered with a resin sealing body 7, and there is no exposed metal part other than the external lead 3.

本実施例の効果を要約すると以下のとおりであ
る。 The effects of this embodiment are summarized as follows.

(1) 支持板２の上面側と下面側とに封止用樹脂を
バランス良く注入できるので、支持板２の下面
側に良好な樹脂封止体７を形成できる。(1) Since the sealing resin can be injected into the upper surface side and the lower surface side of the support plate 2 in a well-balanced manner, a good resin sealing body 7 can be formed on the lower surface side of the support plate 2.

(2) 支持板２の全面を封止用樹脂にて被覆できる
ので、絶縁耐圧の高い樹脂封止型半導体装置を
提供できる。(2) Since the entire surface of the support plate 2 can be covered with the sealing resin, a resin-sealed semiconductor device with high dielectric strength can be provided.

(3) スライド型１２，１３，１４がゲート１５の
設けられた成形空所１９の沿面に略当接し、か
つゲート１５の近傍に設けられているため、ス
ライド型１２，１３，１４の移動時期の自由度
が大きい。したがつて、スライド型１２，１
３，１４の移動制御が容易である。(3) Since the slide molds 12, 13, and 14 are in approximate contact with the surface of the molding cavity 19 where the gate 15 is provided and are provided near the gate 15, the movement timing of the slide molds 12, 13, and 14 is limited. has a large degree of freedom. Therefore, the slide type 12,1
3 and 14 are easy to control.

(4) 支持板２を両持ち支持して樹脂封止できる。
したがつて、支持板２の下面側に厚みが一定の
薄い樹脂層を形成できる。(4) Support plate 2 can be supported on both sides and sealed with resin.
Therefore, a thin resin layer with a constant thickness can be formed on the lower surface side of the support plate 2.

[Modified example]

本発明は上述の実施例に限定されるものでな
く、例えば次の変形が可能なものである。 The present invention is not limited to the above-described embodiments, but can be modified, for example, as follows.

(1) ゲートを複数個設けて、支持板２の上面より
上方に位置するゲートから支持板２の上面側へ
の樹脂注入を行つてもよい。この場合、成形空
所１９の半分以上が充填されるまで、この上方
に位置するゲートは第１のスライド型１２で閉
塞しておく。また、複数個のゲートはそれぞれ
異なるポツトに通じていてもよい。(1) A plurality of gates may be provided, and the resin may be injected into the upper surface of the support plate 2 from the gate located above the upper surface of the support plate 2. In this case, the gate located above is closed by the first slide mold 12 until more than half of the molding cavity 19 is filled. Further, each of the plurality of gates may lead to different pots.

(2) ゲート１５の上面を支持板２の上面より上方
に位置させてもよい。この場合、支持板２の上
面より上方の部分は支持板２を挾持している際
に、第１のスライド型１２で閉塞しておく。(2) The top surface of the gate 15 may be located above the top surface of the support plate 2. In this case, the portion above the upper surface of the support plate 2 is closed by the first slide die 12 when the support plate 2 is being held.

〔Effect of the invention〕

上述のように、本発明によれば、信頼性、特性
がともに良好な高絶縁耐圧の樹脂封止型電子部品
を容易に提供できる。 As described above, according to the present invention, a resin-sealed electronic component with high dielectric strength and excellent reliability and characteristics can be easily provided.

[Brief explanation of drawings]

第１図は本発明の実施例に係わるリードフレー
ム組立体と金型を第６図の−線に相当する部
分で示す断面図、第２図は第１図の−線にお
ける断面図、第３図は第２図の−線の一部を
示す断面図、第４図はスライド型を移動した状態
を第１図に対応する部分で示す断面図、第５図は
完成した半導体装置を示す斜視図、第６図はリー
ドフレーム組立体を示す平面図である。１……リードフレーム、２……支持板、３……
外部リード、４……半導体チツプ、６……チツ
プ・リードフレーム組立体、７……樹脂封止体、
８……金型、９……上型、１０……下型、１２…
…第１のスライド型、１３……第２のスライド
型、１４……第３のスライド型、１５……ゲー
ト、１９……成形空所。 1 is a sectional view showing a lead frame assembly and a mold according to an embodiment of the present invention at a portion corresponding to the line - in FIG. 6; FIG. 2 is a sectional view taken along the line - in FIG. 1; The figure is a sectional view showing a part of the - line in Fig. 2, Fig. 4 is a sectional view showing a state in which the slide mold has been moved and the part corresponding to Fig. 1, and Fig. 5 is a perspective view showing the completed semiconductor device. 6 are plan views showing the lead frame assembly. 1...Lead frame, 2...Support plate, 3...
External lead, 4... semiconductor chip, 6... chip/lead frame assembly, 7... resin sealing body,
8...Mold, 9...Upper die, 10...Lower die, 12...
...First slide mold, 13...Second slide mold, 14...Third slide mold, 15...Gate, 19...Molding cavity.

Claims

[Scope of Claims] 1. A lead frame in which an electronic element and/or a circuit board is fixed to one main surface of a support plate of the lead frame, and external leads are arranged on one end side of the support plate. a step of preparing an assembly, and preparing a mold having a molding cavity formed so that both one main surface side and the other main surface side of the support plate can be sealed with resin. , the other end side of the support plate is held between the other end side of the support plate by first and second slide molds that can move forward and backward into the molding cavity, and the other main surface of the support plate and the molding cavity opposite thereto. The lead frame assembly is arranged in the molding mold such that the distance between the lead frame assembly and the wall surface of the support plate is smaller than the distance between one main surface of the support plate and the wall surface of the molding cavity opposite thereto; Pressing and injecting fluidized sealing resin into the molding cavity from the resin injection port located below the top surface of the plate, and filling approximately half or more of the molding cavity with the sealing resin. After that, the first and second slide molds are moved away from the support plate, and the sealing resin is injected into the void formed by the movement of the first and second slide molds. 1. A method for manufacturing a resin-sealed electronic component, comprising the steps of: