JPH0482880U - - Google Patents
Info
- Publication number
- JPH0482880U JPH0482880U JP12506490U JP12506490U JPH0482880U JP H0482880 U JPH0482880 U JP H0482880U JP 12506490 U JP12506490 U JP 12506490U JP 12506490 U JP12506490 U JP 12506490U JP H0482880 U JPH0482880 U JP H0482880U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring board
- printed wiring
- pair
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例によるプリント配線
板の構成を説明する図、第２図は本考案の他の実
施例によるプリント配線板の構成を示す断面図、
第３図は本考案のさらに他の実施例によるプリン
ト配線板の構成を説明する図、第４図は従来のプ
リント配線板の構成を示す断面図である。
１ａ，１ｂ，１ｃ……導体パターン、２……有
機基板、３……はんだ、４ａ，４ｂ……電極、５
……はんだレジスト、６……絶縁性スペーサ、７
……はんだレジスト、８……導体。
FIG. 1 is a diagram illustrating the configuration of a printed wiring board according to one embodiment of the present invention, and FIG. 2 is a sectional view showing the configuration of a printed wiring board according to another embodiment of the present invention.
FIG. 3 is a diagram illustrating the configuration of a printed wiring board according to still another embodiment of the present invention, and FIG. 4 is a sectional view showing the configuration of a conventional printed wiring board. 1a, 1b, 1c...conductor pattern, 2...organic substrate, 3...solder, 4a, 4b...electrode, 5
...Solder resist, 6...Insulating spacer, 7
...Solder resist, 8...Conductor.
Claims (1)
を実装する一対の第１の導体パターンと、前記一
対の第１の導体パターン間に形成されかつ前記チ
ツプ部品を実装しない電気的に独立する第２の導
体パターンとを備え、前記第２の導体パターン上
に所定寸法の絶縁性スペーサを混入したはんだレ
ジストで被覆することを特徴としたプリント配線
板。 A pair of first conductor patterns formed on a printed wiring board and mounting chip components; and an electrically independent second conductor formed between the pair of first conductor patterns and not mounting the chip components. 1. A printed wiring board comprising: a solder resist having a predetermined size of an insulating spacer mixed therein on the second conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12506490U JPH0482880U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12506490U JPH0482880U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482880U true JPH0482880U (en) | 1992-07-20 |
Family
ID=31872684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12506490U Pending JPH0482880U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482880U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0638273U (en) * | 1992-10-13 | 1994-05-20 | 株式会社村田製作所 | Chip part mounting structure |
| JP2016001717A (en) * | 2014-05-22 | 2016-01-07 | ソニー株式会社 | Circuit board, power storage device, battery pack and electronic apparatus |
-
1990
- 1990-11-29 JP JP12506490U patent/JPH0482880U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0638273U (en) * | 1992-10-13 | 1994-05-20 | 株式会社村田製作所 | Chip part mounting structure |
| JP2016001717A (en) * | 2014-05-22 | 2016-01-07 | ソニー株式会社 | Circuit board, power storage device, battery pack and electronic apparatus |