JPH0461191A - Electronic component removal device with desoldering mechanism - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [-Industrial Application Field] The present invention relates to an apparatus equipped with an electronic component removal mechanism and a solder removal mechanism, and particularly in an electronic component soldered on a test board. The present invention relates to a technique that is effective when applied to an electronic component removal device with a solder removal mechanism that allows residual solder to be removed after the electronic component is removed.

BACKGROUND TECHNOLOGY] As electronic components soldered onto test boards, semiconductor integrated circuit components such as XC5LSI have become mainstream, and in particular, multi-lead integrated circuit components are mounted.

Conventionally, this type of component removal device has been equipped with a dedicated transport jig that has the function of chucking electronic components mounted on a test board, as described in, for example, Japanese Patent Application Laid-open No. 128594/1983. Some devices are constructed of a conveyor chain that transports the transport jig, and a heating tank, such as a solder bath, that heats the substrate. 1. The board that has been jacked onto the transport jig is transported by a conveyor chain while being heated over the solder bath, the solder that connects the board and the leads of the component is melted, and the electronic component is lifted and the component is removed. Removal takes place.

In addition, as a device for removing solder, for example, a device for sucking up molten solder as described in Japanese Utility Model Application No. 55-68381, and a metal fiber capillary device as described in Japanese Patent Application Laid-Open No. 57-115277. Tools that suck up molten solder due to this phenomenon are generally known.

That is, the former device for sucking up molten solder is the 18th device.
As shown in the figure, the suction pump 1 is connected and the through hole 2
soldering iron 3 with the remaining solder 5 on the board 4.
This device melts the residual solder 5 by pressing it against the solder, and removes the residual solder 5 using the suction force of the suction pump 1.

The latter tool for sucking up molten solder has a metal fiber 7 attached to the tip of a soldering iron 6 as shown in FIG.
By pressing the metal fibers 7 against the residual solder 5, the residual solder 5 is melted, and the residual solder 5 is absorbed into the metal fibers 7 by capillary action.

[Problem B to be solved by the invention] However, in the prior art as described above, the test board is used as a ladle for the purpose of confirming the function of electronic components, and after the function is confirmed, the electronic parts attached to the test board are The components are removed, excess solder from the electronic components is removed, and the electronic components are mounted on the actual circuit board. Therefore, due to the miniaturization of electronic components and the increase in the number of connection points accompanying recent high-density packaging, conventional techniques have the following problems.

(1) A dedicated transport jig is required to transport electronic components;
As electronic components become smaller, chucking them becomes more difficult. Additionally, there is a need for a soft conveyance method that does not require chucking.

(2) When considering the repeated use of the test board,
The conventional heating method using a solder bath cannot be used as a heating means for residual solder because the solder adheres to the back surface of the substrate. Further, with conventional heating means, it is not possible to set an arbitrary temperature. However, although this is possible by changing the conveyance speed, it is not possible to perform constant takt processing of the device.

(3) When removing solder using a suction pump, the solder removal area cannot be enlarged, so the operation requires a long time, and the amount of removed solder varies widely, making it impossible to remove the solder uniformly.

(4) In the method of removing solder using metal fibers, since the area of the metal fibers is large, too much solder may be removed, and the electrode surface of the substrate may be oxidized and the solder wettability may deteriorate.

Therefore, conventional component removal devices and desoldering devices each have the above-mentioned problems, and cannot be well applied to test boards due to the recent miniaturization of electronic components and increase in the number of connection points. There's a problem.

Therefore, an object of the present invention is to enable a series of continuous processing in which the electronic component is removed from the board and the residual solder of the electronic component is further removed, especially for electronic components soldered on a board. An object of the present invention is to provide an electronic component removal device with a soldering mechanism that enables the reuse of a board from which a removed board has been removed, and at the same time can obtain an electronic component that is well applicable to mounting on a board for an actual device. be.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[Means for solving the problem] A brief overview of typical inventions disclosed in this application! ! If you do so, it will be as follows.

That is, the electronic component removal and mounting with a soldering mechanism of the present invention includes a soldering mechanism that removes the electronic component 4 from the electronic component with a board on which the electronic component is soldered and further removes the residual solder of the electronic component. The electronic component removal device includes a heating stage for heating an electronic component with a board, a separating means for separating the electronic component with a board into a board and an electronic component, and a separating means for separating the separated electronic component into a board and an electronic component for removing solder. A mounting means for mounting the electronic component on the metal plate, a heating means for heating the electronic component mounted on the metal plate, a pressing knife for pressing the mounted electronic component against the metal plate, and a pressing knife for pressing the electronic component mounted on the metal plate. It is equipped with a removing means for uniformly removing residual solder by separating it from the gold plate.

In this case, the electronic component with the board is supplied at any time depending on the state of removal of the electronic component.

Further, the heating means is a divided heat block whose temperature can be controlled arbitrarily.

Furthermore, the metal plate is made of a copper plate having a concave shape that allows easy mounting of electronic components and reliable removal of solder.

Further, the pressing means is configured to follow the pressing surface of the electronic component.

Further, the removing means is configured to transfer residual solder onto the metal plate by peeling the electronic component away from the metal plate.

Further, the electronic component with the board and the electronic component are transported by cam driving by a cam mechanism.

Furthermore, a series of operations of removing the electronic component from the electronic component with the board and removing residual solder from the electronic component are automatically performed.

[Function] According to the above-mentioned electronic component removal device with a soldering mechanism, there is provided a heating means for heating an electronic component with a board on which an electronic component is soldered, and a heating means for heating an electronic component with a board on which an electronic component is soldered, and a heating means for heating the electronic component with a board, and separating the electronic component with a board into a board and an electronic component. separating means for attaching the separated electronic components to a metal plate for soldering; heating means for heating the electronic components attached to the metal plate; The electronic component can be removed from the electronic component with a board 5 by being equipped with a pressing means for pressing the electronic component and a removing means for separating the pressed electronic component from the metal plate and uniformly removing residual solder. A series of operations for removing residual solder can be performed in succession.

In this case, by supplying electronic components with a board at any time according to the removal status of the N child components, the operator can supply electronic components with a board at any time even while the electronic component removal device is in operation. . Thereby, long-term continuous operation of removing and mounting electronic components with a solder removal mechanism can be performed.

In addition, since the heating means is a split-type heat block that can control the temperature arbitrarily, the temperature can be controlled individually, so the temperature of the heat block can be controlled in stages, and at the same time, the temperature can be controlled in stages. Any temperature conditions that are optimal for the parts can be set. This improves the temperature accuracy of the beat block and enables highly reliable temperature control. At the same time, the electrode surface of the substrate does not deteriorate and the substrate is not damaged unlike in the conventional case, so the substrate can be reused.

Furthermore, the metal plate is made of a concave copper plate that makes it easy to attach electronic components and ensures the removal of solder, making it easy to supply and transport the metal plate, and at the same time prevent flux from flowing out. can be prevented. Thereby, stable automatic processing of mounting and dismounting of electronic components can be performed without contamination due to flux.

Moreover, by tracing the surface of the pressing means along the pressing surface of the electronic component, it can follow the inclination of the electronic component and always apply a force in the vertical direction when it comes into contact with the electronic component. This makes it possible to uniformly heat and pressurize the electronic component without applying pressure to it.

Further, the residual solder is transferred to the metal plate by peeling the electronic component away from the metal plate, so that the residual solder is removed in a short time by a simple mechanism,
It is possible to uniformly remove solder from the electrodes of electronic components. Thereby, it is possible to obtain an electronic component that can be well applied to mounting on a board for an actual device.

In addition, since electronic components with a board and electronic components are transported by a cam drive by a cam mechanism, the electronic components with a board and electronic components can be transported at low speed in the vertical direction and in the horizontal direction without having to grip the electronic components with a board or electronic components. Can be driven at high speed. As a result, the board-attached electronic component and the electronic component can be smoothly raised and lowered, and can be transported reliably with speed controllable software without causing damage.

Furthermore, by automatically performing a series of operations to remove the electronic component from the electronic component with the board and remove the residual solder from the electronic component, the electronic component can be removed from the supply of the electronic component with the board, and the residual solder can be removed. , and storage of electronic components can be carried out in continuous operation.

[Example] Fig. 1 shows an example of an unexploded t-shirt with a solder removal mechanism.
r A perspective view showing the entire component removal device, FIG. 2 is a perspective view showing the electronic component with a board used in this embodiment, FIG. 3 is a perspective view showing a pallet for storing the electronic component with the board, and FIG.
The figure is a perspective view showing a metal plate for removing solder, Figure 5 (a)
, (b) and (C) are configuration diagrams showing the electronic component supply unit with a board, FIGS. 6(a) to (e) are explanatory diagrams showing the operation of the electronic component supply unit with a board, and FIG. 7 (al, (b
) and (C) are configuration diagrams showing the electronic component removal unit, FIG. 8 is an explanatory diagram showing the operation of the electronic component removal unit, FIG. 9 is an explanatory diagram showing temperature control of the heat block of the electronic component removal unit, and FIG. Figure 10 is a cross-sectional view showing the gold @ plate of the metal plate supply unit, Figures 11 (a), (b) and Figures 12 (a), (b) are block diagrams showing the metal plate supply unit, and Figure 13. (a) and (b) are block diagrams showing the solder removal unit, Figures 14 and 15 are block diagrams showing the heating head of the solder removal unit, and Figure 16 (a).
), ra), and (C) are explanatory diagrams showing the operation of the soldering unit, and FIG. 17 is an explanatory diagram showing the operation of the electronic component removal device with a soldering mechanism of this embodiment.

First, the configuration of an electronic component removal device with a solder removal mechanism according to the present embodiment will be explained with reference to FIG.

The electronic component removal device with a solder removal mechanism of this embodiment is, for example, a device equipped with a mechanism for removing electronic components mounted on a test board, and a mechanism for removing residual solder from the removed electronic components, A board-mounted electronic component supplying unit 100 for supplying board-mounted electronic components on which electronic components are mounted on a test board; A board recovery unit 300 that collects test boards from which components have been removed, a metal plate supply unit 400 that supplies metal plates for desoldering, and a desoldering unit 500 that removes residual solder from removed electronic interface components. and an electronic component storage unit 600 that stores electronic components from which residual solder has been removed, and each of them is arranged on a pedestal 700.

Further, the electronic component 10 with a board includes, as shown in FIG. 2, an electronic component 11 soldered to a test board 12, and further, as shown in FIG.
It is stored on a pallet 13 that can store. moreover,
To remove the solder, a metal plate 14 made of a copper plate and having a concave shape as shown in FIG. 4 is used.
As shown in FIG. 6 and FIG. 6, a pallet 13 containing electronic components 10 with circuit boards, for example, is fed by a worker as it ascends, and a loader section 101 separates the pallets 13 stacked in multiple stages, and a sensor section 102 that detects the presence of the electronic component 10 with a board in the pallet 13, a handling section 103 that grips the electronic component 10 with a board in the pallet 13, and a slide unit section 104 that transports the electronic component 10 with a board onto the heat block. and an unloader section 105 which has the same mechanism as the loader section 101 and stacks empty pallets 13 in multiple stages.

The loader section 101 also includes a claw 106 that separates the pallets 13 stacked in multiple stages one by one as shown in FIG. 6, and an elevating stage 107 that receives and receives the separated pallets 13.

Furthermore, the sensor unit 102 has 7<-1'- as shown in FIG.
Detection A of electronic component 104 with board inside pallet 13
In addition, the handling unit 1 () 3 includes a chuck cylinder 110 that chucks the electronic component 10 with a board from the pallet 13 that is transported via the transport stage 109, and an elevating cylinder 111 that drives the cylinder 110 in the 10F direction;
It is composed of a positioning cylinder 112 for positioning the board-attached electronic component 10 within the fly knot 13.

As shown in FIGS. 7, 8, and 9, the electronic component removal unit (separation means) 200 heats and transports a cam mechanism section 201 directly connected to a drive motor (not shown) and the electronic component 10 with a board. The heating conveyance section 202 is configured to remove the electronic component 11 from the electronic component 10 with a board.

The cam mechanism section 201 also includes a cam rotation shaft 204 that is directly connected to a drive motor (not shown) as shown in FIG. These vertical movement cams 205
and a vertical movement cam follower 209 and a horizontal movement cam follower 210 that are always made to follow the cam curve of the horizontal movement cup 206 by each spring 207 and 208, and an island that transmits the operation of the vertical movement cam follower 209 and horizontal movement cam follower 210. Vertical movement rod 2
11. Horizontal movement rod 212 and 1. shaped guide 213
It is composed of.

Furthermore, as shown in FIG. 7, the heating conveyance unit 202 includes a base 215 that is driven in the vertical direction along a vertical movement guide 214 fastened to the pedestal by a vertical movement rod 211 of the cam mechanism unit 201, and A horizontal movement guide 216 horizontally fastened to the horizontal movement guide 215, a slide base 217 supported horizontally movably by the horizontal movement guide 216, and a transfer 219 fastened to the slide base 217 by a support guide 218.
and a split-type heat block (heating means) 220 that heats the entire transported electronic component 10 with a substrate from the bottom surface.

Further, the split-type heat block 220 has a built-in cartridge heater and a temperature detection sensor (not shown), and the heating temperature is controlled by a temperature regulator.

Further, the component removal section 203 is illustrated as shown in FIG. 8, and has a base 222 which is driven via a rodless cylinder 221 so as to be movable in the horizontal direction on a stand.
The head base 224 is driven via a slide unit 223 so as to be movable in the vertical direction on the base 222, and the head base 224 becomes free by being removed from a positioning pin (not shown) press-fitted into the head base 224. A suction rack 225 for removing the electronic component 11 , a cooling conveyor 226 that cools the test board 12 after removing the electronic component 11 and transports it to the board recovery unit 300 , and a cooling conveyor 226 that carries the test board 12 . The electronic component 11 separated from the board-attached electronic component 1o is transferred and the heat blotter 228 is attached to the metal plate 14.

As shown in FIG. 8, the board recovery unit is disposed on the extension side of the cooling conveyor 226 that constitutes the electronic component removal unit 200, and is connected to the electronic component supply unit 10 with ledger described above.
The test board 12 from which the electronic components 11 have been removed is stored in an empty barrel 1-13, and the pallets 13 are stacked in multiple stages.

The metal plate supply unit (installation means) 400 is shown in FIG.
As shown in FIGS. 11 and 12, there is a metal plate ejecting section 401 that ejects the metal plate 14 housed in the cartridge, and a metal plate receiving section 402 that receives the ejected metal plate 14.
, a handling unit 403 that grips the metal plate 14, a conveyance unit 404 that conveys the metal plate 14, and a flux application 8405 that applies flux to the metal plate.

Further, as shown in FIG. 11, the metal plate ejection unit 401 includes a slide unit 407 equipped with a slide table that moves up and down by rotating a ball screw (not shown) fixed to a support base 406, and a slide unit 407 that is rotated by a motor (not shown). and an index unit 408 that can be rotated intermittently in response to a stop command.

This index unit 408 is equipped with guide roots 410 to which a metal plate cartridge 409 can be attached and detached at six locations at the same angle on a concentric circle, and also has guide roots 410 that can be detached from six locations on a concentric circle at the same angle.
Metal plates 14 are housed in 9 at a predetermined pitch.

On the other hand, as shown in FIG. 12, the slide unit 407 includes an air cylinder 411 fixed to a support base 406, and a slide claw 413 that allows the air cylinder 411 to move back and forth through a link 412. There is.

Further, the metal plate support portion 402 has a through hole 414 formed therein as shown in FIG. , a guide claw 417 that prevents the metal plate 14 from bouncing when it is sucked, and an air cylinder 418 that opens and closes the guide claw 417 .

Furthermore, as shown in FIG. 12, the handling 8403 includes a suction rod 419 that suctions the metal plate 14, an air cylinder 420 and a slide rail 421 that drive the suction rod 419 in the vertical direction, and a horizontal suction head 419. It is composed of an air cylinder 422 and a slide rail 423 that are driven in the direction. This suction head 419
includes a suction pad 424 made of a tab material and a guide 425 that supports suction of the metal plate 14.

Furthermore, as shown in FIG. 11, the conveyor 404 includes a conveyor 426 that conveys the metal plate 14 coated with flux at a predetermined pitch using a motor and a chain (not shown).
In the flux application section 405, a predetermined amount of flux 428 is supplied to the metal plate 14, as shown in FIG.

The solder removal unit (removal means) 500 is shown in FIG.
As shown in FIGS. 14, 15, and 16, a cam mechanism section 501 that is directly connected to a drive motor (not shown), a heating conveyance section 502 that heats and conveys the electronic component 11,
It is composed of a heating head section 503 that contacts and heats the electronic component 11.

The cam mechanism section 501 and the heating conveyance section 502
As shown in Figure 3, the above electronic component removal unit 200
The configuration is similar to that of the cam mechanism section 201 and the heating conveyance section 202. Therefore, the description of each component will be omitted by replacing the number 200 of the electronic component removal unit with the number 500.

As shown in FIG. 14, the heating head section 503 includes a heating head (pressing means) 521 that contacts the electronic component 11 in a surface-copying manner, and a heating head 521 that is connected to the slide rail 5.
It is composed of a link 523 and a cam connecting rod 524 that are driven in the vertical direction via 22, and a support base 525 that supports the link 523 so that it can be driven.

Furthermore, as shown in FIG. 15, the heating head 521 includes a heating block 527 in which a suction port 526 for sucking the electronic component 11 is formed, and a heating block 527 that is attached to the electronic component 11.
a positioning bin 528 that is in a free state upon contact with 1;
A pressing spring 52 that presses along the slope of the electronic component 11
9.

The electronic component storage unit 600 is disposed on the extension side of the heat block 520 that constitutes the soldering unit 500 in FIG.
0, electronic components 11 from which residual solder has been removed are stored in an empty pallet 13, and this pallet 1
3 is stacked in multiple stages.

Next, the operation of this embodiment will be explained based on FIG. 17.

In step 5170, the case where the board-attached electronic component supply unit 100 supplies the board-attached electronic component 10 will be described based on FIGS. 5 and 6.

First, the pallets 13, which are supplied from time to time by an operator and stacked in multiple stages, are separated according to the procedure shown in FIG. 6(a) to FIG. 6(e).

First, as shown in Fig. 9J46 (a), the pallets 13 stacked in multiple stages are held by the claws 106 and raised, and then raised (Fig. 6 (t)).
The claws 106 are lowered in synchronization by a motor and an eccentric cutter (not shown), and at the same time the 1g lifting stage 107 is raised by 1''.

Then, after opening the nails for 10 days as shown in Figure 6 (C),
As shown in FIG. 6(d), the pallet 13 is transferred onto the lifting stage 107 and lowered.

Furthermore 1. As shown in FIG. 6(e), the pallet 13 is raised by holding the second and above parts from the bottom with the claws 106.

As described above, by repeating the operations shown in FIGS. 6(a) to 6(e), the stacked pallets 13 can be automatically separated one by one.

In this case, by adopting an open structure in which the pallets 13 can be supplied by the operator from above the loader section 101, an arbitrary number of pallets 13 can be supplied even during automatic operation of the electronic component supply unit 100 with board. Can be stacked in multiple stages.

Next, as shown in FIG. 5, the conveyance stage 109 is conveyed at a predetermined pitch, in this case, at the storage pitch of the board-attached electronic components 10 in the pallet 13 by a stepping motor (not shown).

First, after being transported to the sensor section 102, the two attached detection sensors 108 detect the presence of the board-attached electronic component 10, and hold data on presence/absence.

After being transported to the lower part of the handling section 103, the electronic component 10 with a board is gripped by the chuck cylinder 110 based on the above data, and is raised by the lifting cylinder 111.

Furthermore, after positioning is performed using the positioning cylinder 112, the electronic component 10 with a board held by the slide unit section 104 is removed and supplied to 22) 200. By repeating the above operations, the electronic components 10 with boards in the stacked pallets 13 are transferred to the heating conveyance section 20 where the electronic component removal unit 200 is configured.
The data is sequentially supplied to the first station of No.2.

Further, the empty pallet 13 that has been completely supplied is transported to the unloader section 105 by the transport stage 109. Then, the unloader section 105 transfers the empty pallet 13 to the loader section 1.
They are stacked in multiple stages and collected by the reverse process of step 01.

In this case, by detecting the presence of the board-attached electronic component 10 in the pallet 13 using the detection sensor 108, the handling unit 103 detects the presence of the board-attached electronic component 10 based on the detection data of the detection sensor 108. Since the pallet 13 is picked up with priority given to the side that has a
There is no temporary stoppage of the board-equipped electronic component supply unit 100 for supplying electronic components, and there is no unnecessary operation of the handling unit 103, and efficient continuous operation can be realized.

In step 5171, electronic component removal unit 2
The case where the electronic component 10 with a board is heated and transported by the cam mechanism section 201 and the heating transport section 202 of 00 will be explained based on FIG. 7.

First, the board-attached electronic component 10 supplied from the board-attached electronic component supply unit 100 to the leading station of the heating conveyance section 202 of the electronic component removal unit 200 is entirely heated from the bottom surface of the board by the split-type heat block 220 . After being heated for a predetermined time at the first station, the transfer 219 is operated to transport it to the next station.

In this case, the electronic component 10 with a board is transported by the cam mechanism section 2.
01 as shown below.

First, the rotation of the drive motor (not shown) is determined by the cam rotation 11i1.
1204 to the vertical movement cam 205 and the horizontal movement cam 206, and the vertical movement cam follower 209 and the horizontal movement cam follower 210 follow both cam curves, so that the vertical movement rod 211 and the horizontal movement rod 2
12 is moved up and down.

Furthermore, the vertical movement of the horizontal movement rod 212 is controlled by the L-shaped guide 2.
．． 13 into a horizontal motion and transmit it to the slide base 217. That is, the base 215 is raised via the vertical movement rod 21, and the horizontal movement guide 216 and slide base 217 attached to the base 215 are
, the support guide 218 and the transfer shaft 219 are raised.

At this time, the substrate-attached electronic component 10 is supported by the transfer 219 at both ends of the lower surface of the substrate, and is lifted away from the heating surface of the heat block 220 to a height that does not interfere with the split type heat block 220 during horizontal operation.

Next, the vertical movement rod 211 and the 1□-shaped guide 21
In the state where the base 215 is located at the upper limit due to the operation No. 3, the slide base 217 is horizontally moved along the horizontal movement guide 216 by the horizontal movement conversion of the L-shaped guide 213. At this time, by horizontally moving the support guide 218 and the transfer 219, the electronic component 10 with a board, which is located at the upper limit, is transferred to the split-type heat block 22.
Move horizontally to just above the station next to 0.

When the electronic component 10 with a board reaches directly above the next station, the base 2 is moved by the operation of the vertical movement cam 205.
15 is lowered via the vertical movement rod 211, and by this operation, the electronic component with board 10 is placed on the surface of the heated split-type heat block 220 of the next station. At this time, the downward movement by the vertical movement cam 205 is lowered to a position where the transfer 219 does not interfere with the board-attached electronic component 10 during horizontal movement, and when it reaches the lower limit, which is the initial position in the vertical direction, the horizontal movement cam 206 moves. The transfer 219 is returned to the horizontal retraction limit, which is the horizontal initial position.

In this case, by operating the transfer 219 by cam drive without jacking the electronic component 10 with a board, the electronic component 10 with a board can be raised and lowered smoothly compared to low-speed drive, and can be driven at high speed when horizontally driven. Therefore, it is possible to perform soft and reliable transportation without damaging the electronic component 10 with a board.

By repeating the above operations, electronic components with board】0
are sequentially conveyed to each station on the split-type heat block 22G. And each split type heat block 2
20 is heated to the melting point temperature of the solder that connects the electronic component 11 and the test board 12 until the electronic component 10 with a board reaches the final station of the heating transport unit 202.

In this case, by using the split type heat block 220, the temperature can be controlled individually.
As shown in the figure, the two-stage temperature setting eliminates the heat stress caused by sudden temperature rises, unlike conventional methods.
Heating conditions can be set arbitrarily, and the temperature accuracy of the heat block 220 can be improved.

Then, it reaches the final station of the heating conveyance section 202,
The electronic component 11 is removed from the board-attached electronic component IO that has been heated to the solder melting point temperature.

In step 5172, electronic component removal unit 2
The case where the electronic component 11 is removed from the board-attached electronic component 10 by the component removal 1m203 of 00 will be explained based on FIG.

First, the electronic component 10 with a substrate transported to the final station of the heating transport section 202 is chucked by the transfer chuck hand 227 that descends by the operation of a cylinder (not shown), thereby positioning the electronic component IQ with a substrate. Fix it.

Furthermore, the slide unit 223 moves the slide unit 223 to lower the suction pad 225 for component removal and bring it into contact with the upper surface of the electronic component 11 . In this case, the suction herad 225
When the electronic component 11 is removed from a positioning pin (not shown) press-fitted into the head base 224, it becomes free, and even if the electronic component 11 is tilted, the electronic component 11 is brought into contact following the tilt of the electronic component 11.

At the same time, the electronic component 11 is
is attracted to this suction head 225, and the electronic component 11 thus attracted is separated from the test board 12 by the upward movement of the slide unit 223. At this time, the test board 12 is fixed by the transfer chuck hand 227 in order to prevent it from floating up due to the lifting operation of the electronic component 11.

Furthermore, when the suction head 225 reaches its upper limit, the rodless cylinder 221 operates to move the electronic component 11 while suctioning it to above the heat block 228, and the metal plate 14 from the metal plate supply unit 400 is supplied. Wait until.

On the other hand, the transfer chuck hand 227, which had positioned and fixed the test substrate 12, was raised and rotated 1]0 degrees 11]1 by the operation of the cylinder, and the transfer chuck hand 227, which had been positioning and fixing the test substrate 12, was raised and rotated 1]0 degrees 11]1 degrees, and the transfer chuck hand 227, which had been positioning and fixing the test substrate 12, was raised and rotated 1]0 degrees. Land and transfer.

Then, the substrate is cooled and transported to the substrate recovery unit 300 connected to the conveyor 226.

In step 5173, the test substrate 1 transferred to the cooling conveyor 226 by the substrate recovery unit 300.
2 is stored in an empty pallet 13 by the same operation as the above electronic component supply unit 100, and the pallet 13 is stacked in multiple stages to collect test boards 12.

In step 5174, the metal plate supply unit 400
The case of supplying the metal plate 14 for soldering will be explained based on FIG. 10, FIG. 11, and FIG. 12.

First, the cartridge 409 of the metal plate 14, which is removably held at six locations on the index unit 408, is automatically moved up and down at a predetermined pitch, intermittent rotation, and stopping in sequence. As shown in FIG. 12, the vertical movement of the air cylinder 411 fixed to the support base 406 moves the slide claw 413 back and forth via the link 412, and the metal plate 14 in the cartridge 409 is moved from the metal temporary holder. 4
Push out to 02.

When this metal plate 14 is pushed out, the air cylinder 41
6, the guide 415 is moved toward the cartridge 409 side. Then, the extruded metal plate 14 is guided to the guide 41.
5 for guidance and positioning.

Furthermore, a through hole 41 provided on the lower surface of the guide 415.
, 4 to attract and hold the metal plate 14, and guide claws 4
After opening 17, the suction head 419 is lowered by an air cylinder 420 via a slide rail 421. After the metal plate 14 is sucked by the suction head 419, it is raised by the air cylinder 420, and then moved to the conveying section 404 by the air cylinder 422 and the slide rail 423.
move it to

In this case, by sucking the metal plate 14 in the through hole 414, it is possible to prevent the metal plate 14 from bouncing when the guide claw 417 is opened, so that it can be used favorably for conveying lightweight objects.

In addition, the suction pad 424 of the suction head 419 uses a rubber material to make it easy and reliable to suction the metal plate 14. There is a risk that the posture of the person may become tilted. For this reason, by providing a guide 425, the metal plate 14 after suction is brought into contact with the guide 425, and in this case, the suction pad 424 is sufficiently deformed due to the rubber material, and its posture can always be kept parallel. .

Furthermore, the metal plate 14 transported by the handling unit 403
is transferred to one end of the transport section 404.

Then, the conveyor 426 is conveyed at a predetermined pitch, in this case at five pitches, by a motor and a chain (not shown) of the conveyance unit 404. Then, when the metal plate 14 is transported to the lower surface of the flux application section 405, a predetermined amount of flux 428 is supplied to the metal plate J4 as shown in FIG. Thereafter, the electronic component 11 transported from the electronic component removal unit is mounted on the metal plate 14 coated with flux 428.

In step 5175, the desoldering unit) 500
8, the case where the electronic component 11 is mounted on the metal plate 14 coated with the flux 428 will be explained.

First, the metal plate 14 coated with flux 428 is conveyed by the conveyor 426 of the metal plate supply unit 400.
is chucked and raised by a supply chuck 427 that is lowered by the operation of an inlinder (not shown), and moved to above the heat block 228 and lowered by a slide unit (not shown) movable in a direction parallel to the conveyor 426.

Further, the supply chuck 427 is kept open and on standby,
Component removal section 2 of the electronic component removal unit 200 described above
The electronic component 11 that was removed by step 03 and suctioned by the suction head 225 is mounted on the metal plate 14. Then, the vacuum suction of the suction head 225 is turned off, and the slide unit 22
3 and the horizontal movement of the rodless cylinder 221 to return it to the initial position.

Further, when the suction head 225 reaches its upper limit, the supply chuck 427 for the metal plate 14 is raised and returned to the initial position. Then, the metal plate 14 on which the electronic component 11 is mounted is supplied to the leading station of the heating conveyance section 502.

In step 817G, the desoldering coat 500
The case of heating and transporting the electronic component 11 mounted on the metal plate 14 will be explained based on FIG. 13.

First, in the same manner as the operation of the electronic component removal unit 200 described above, the electronic components 11 mounted on the metal plate 14 supplied to the first station of the heating conveyance section 502 are removed as a whole from the bottom surface of the board using the split-type heat block 520. Heat to. Then, after being heated for a predetermined time at the first station, the transfer 519 is operated to transport it to the next station.

Then, the rotational movement of the cam rotation shaft 504 is controlled on the split-type heat block 520, which is individually damped by L degrees. and L-shaped guide 513
It is converted into vertical movement and horizontal movement by , and sequentially transported and heated by transfer Y-519.

In this case, like the electronic component removal unit 200 described above, arbitrary heating conditions can be set using the split type heat block 520, and the accuracy of temperature control can be improved. Furthermore, the cam drive system enables stable transportation and soft lifting and lowering of lightweight items such as the electronic components 11 and the metal plates 14.

Furthermore, each station on the heat block 520 is sequentially transported until the electronic component 11 reaches the final station of the heating transport section 502, where the residual solder of the electronic component 11 heated to the solder melting point temperature is removed by the heating head section 503.

In step 5177, desoldering unit 500
The case where residual solder is removed from the electronic component 11 will be explained based on FIG. 14, FIG. 15, and FIG. 16.

First, a link 523 and a cam connecting rod 524 are attached to the upper surface of the electronic component 11 mounted on the metal plate 14 that has been transported to the final station of the heating transport section 502 in synchronization with a rotational drive shaft (not shown). The rad 521 is brought into contact with the heating of the heating head portion 503, which is lowered by the cam movement.

In this case, since the heating pad 521 can be lowered at a constant speed using the cam drive method, there is no impact upon contact. In addition, when the heating block 527 comes into contact with the electronic component 11, it comes off the positioning pin 528 and becomes free, so even if the electronic component 11 is tilted, it follows the tilt of the electronic component 11 and is always supported by the pressing spring 529. Force is applied vertically. For this reason, it is possible to uniformly heat and pressurize the electronic component 11 without applying pressure to it.

After heating for a preset time, the electronic component 11 is suctioned and pulled up by the suction port 526 of the heating block 527.

As a result of the above operations, as shown in FIG. 16(a), the electronic component 11 with residual solder remaining on the electrode 15 immediately after being removed is transferred to the metal plate 14 coated with flux 428.
After being heated and transported, the heating head 521 presses and contacts the metal plate 14 for a certain period of time, as shown in FIGS. Then, as shown in FIG. 16(C), the electronic component 11
The remaining solder 16 is transferred to and removed from the metal plate 14 by being sucked and pulled up, and the solder on the electrodes 15 of the electronic component 11 can be removed uniformly.

In step 5178, the metal plate supply unit 400
The metal plate 14 with the residual solder 16 transferred thereto is transferred to a conveyor (not shown), and the metal plate 14 is recovered by the same operation as the substrate recovery unit 300 described above.

In step 5179, the electronic component storage unit 60
Electronic component 11 from which residual solder 16 has been removed by
is transferred to a conveyor (not shown), and the electronic components 11 are stored in an empty pallet 13 by the same operation as the electronic component supply unit 100 with circuit board described above.
3 are stacked in multiple stages to store electronic components.

As described above, according to the electronic component removal device with a soldering mechanism of the present embodiment, the split-type heat block 220, which is a heating means for heating the electronic component 10 with a board, and the electronic component 10 with a board, which is a heating means for heating the electronic component 10 with a board, are provided. Test board 12 and electronic components 11
Electronic component removal unit (separation means for separating) 20
0, a metal plate supply unit 400 that is a mounting means for mounting the separated electronic components 11 on the metal plate 14 for soldering, and a heating means for heating the electronic components 11 mounted on the metal plate 14. Split type beat block 520
A heating head 521, which is a pressing means for pressing the mounted electronic component 11 against the metal plate 14, separates the pressed electronic component 11 from the metal plate 14 and removes the residual solder 1.
By including a solder removal unit 500 which is a removing means for uniformly removing solder 6, a series of operations of removing the electronic component 11 from the electronic component 10 with a board and further removing the residual solder 16 of the electronic component 11 can be performed continuously. It can be done by

At the same time, the electronic components 10 with boards can be arbitrarily supplied by the operator and stacked in multiple stages, and the test board 12 from which the electronic components 1j have been removed and the electronic components 11 from which the residual solder 16 has been removed are stacked in multiple stages. Since it can be collected and stored, continuous operation for a long time is possible.

In addition, especially since the metal plate 14 is made of a concave copper plate, the metal plate 14 can be easily supplied and transported, and the flux 428 can be prevented from flowing out. Disassembly can be processed continuously.

As above, the invention made by the present inventor has been specifically explained based on Examples, but it should be noted that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.

For example, in the electronic component removal device with a soldering mechanism of this embodiment, the electronic component 10 with a board and the metal plate 14 are
As a heating means for heating the electronic component 11 attached to the
Divided heat block 220 with individual temperature control.
520, the present invention is not limited to the above embodiment, and for example, far infrared N2
It is also widely applicable to heating means using non-contact heating by transporting the material in an atmosphere furnace.

Further, regarding the solder removal unit 500 which is a means for removing residual solder 16 of the electronic component 11, the flux 42
Modifications such as spraying with N2 gas or immersion in a jet solder bath are possible without using the metal plate 14 coated with No. 8.

Furthermore, the metal plate 14 is not limited to the metal plate 14 formed of a concave copper plate as shown in FIG. 4, and its shape and material can be changed in various ways. For example, it is also possible to use a metal plate made of a continuous hoop material, and in this case, processing into a concave shape can be made unnecessary.

In the above description, the invention made by the present inventor will mainly be described in its field of application, particularly an electronic component removal device with a solder removal mechanism used for a board-attached electronic component 10 in which an electronic component 11 is soldered to a test board 12. Although we have explained the case where it is applied, it is not limited to this.
The present invention can also be widely applied to an electronic component removal device with a desoldering mechanism for other board-attached electronic components, such as electronic components soldered to a board for actual equipment.

[1. Effects of the Invention] Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

(1) An electronic component comprising an electronic component with a board on which the electronic component is soldered, and a desoldering mechanism for removing the electronic component from the electronic component and removing residual solder from the electronic component. The removal device includes a heating means for heating an electronic component with a board, a separating means for separating the electronic component with a board into a board and an electronic component, and mounting the separated electronic component on a metal plate for soldering. a mounting means, a heating stage for heating the electronic component mounted on the metal plate, a pressing means for pushing the mounted electronic component onto the metal plate, and a pushing means for separating the pressed electronic component from the metal plate. By providing a removing means that uniformly removes residual solder, it is possible to continuously perform a series of operations of removing the electronic component from the electronic component with the board and further removing the residual solder from the electronic component. It can be well applied to electronic components that are becoming smaller due to recent high-density packaging and increasing the number of connection points.

(2) Electronic components with a board can be supplied at any time according to the removal status of the electric Y/components, so that the operator can supply electronic components with a board at any time even while the electronic component removal device is in operation. Therefore, the electronic component removal device with a solder removal mechanism can be operated continuously for a long time.

(3) By using the heating means as a split-type heat block that can control the temperature arbitrarily, the temperature can be controlled individually, so the temperature of the heat block can be controlled in stages, and at the same time, electronic components with substrates can be heated. Since it is possible to set and set arbitrary temperature conditions that are optimal for the electronic components, the temperature accuracy of the heat block is improved and highly reliable temperature control is possible. At the same time, the electrode surface of the substrate does not deteriorate and the substrate is not damaged as in the conventional case, so the substrate can be reused.

(4) The metal plate is made of a copper plate with a concave shape that makes it easy to attach electronic components and ensures the removal of solder, making it easy to supply and transport the metal plate and at the same time It is possible to prevent the outflow of
It is possible to stably and automatically attach and detach electronic components without causing flux contamination.

(5) By tracing the surface of the pressing surface of the electronic component, the pressing means can follow the inclination of the electronic component when making contact with the electronic component, and can always apply force in the vertical direction. Uniform heating and pressurization can be performed without applying pressure to the surface.

(6) The removal means transfers the residual solder to the metal plate by separating the electronic component from the metal plate, so that the residual solder is removed in a short time by a simple mechanism;
Since the solder on the electrodes of the electronic component can be removed uniformly, the electronic component can be easily applied to mounting on a board for an actual device.

(7) The electronic components with a board and the electronic components are transported by the cam drive by the cam mechanism, so the electronic components with the board and the electronic components are transported at low speed in the vertical direction and horizontally by the cam mechanism without gripping the electronic components with the board and the electronic components. Since the direction can be driven at high speed, electronic components with substrates and electronic components can be smoothly raised and lowered, and can be transported reliably with speed controllable software without causing damage.

(8) By automatically performing a series of operations to remove the electronic component from the electronic component with the board and further remove the residual solder from the electronic component, the supply of the electronic component with the board, the removal of the electronic component, and the removal of the residual solder are performed. The removal of electronic components and the storage of electronic components can be carried out in continuous operation.

(9) According to (1) to (8) above, it is possible to perform a series of continuous processes for removing electronic components and removing residual solder. It is possible to obtain a type f component removal device with a solder removal mechanism that can be successfully applied to actual machines.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the entire electronic component removal device with a splatter removal mechanism, which is an embodiment of the present invention. FIG. Figure 3 is a perspective view showing a pallet for storing electronic components with circuit boards, Figure 4 is a perspective view showing a metal plate for removing solder, and Figure 5 (
, 11), (b) and (C) are configuration diagrams showing the electronic component supply unit with a board, FIGS. 6(a,) to (e) are explanatory diagrams showing the operation of the electronic component supply unit with a board, Figures (a), 3) and (C) are configuration diagrams showing the electronic component removal unit, Figure 8 is an explanatory diagram showing the operation of the electronic component removal unit, and Figure 9 is the electronic component removal unit 20. 0) Temperature control of the heat block]<#-Explanatory diagram, Figure 10 is a sectional view showing the metal plate of the metal plate supply knit, Figures 11 (a), (b) and 12 Figure (a),
(bl) is a block diagram showing the gold IXI & supply unit, Figures 13 (a) and (b) are block diagrams showing the soldering unit, and Figures 14 and 15 are heating and
Figures 16 (a), (b) and (C) are explanatory diagrams showing the operation of the solder removal unit. Figure 17 is a diagram showing the removal of one part of the layer f with the solder removal mechanism of this embodiment. An explanatory diagram showing the operation of the apparatus, FIGS. 18 and 19 are configuration diagrams showing a conventional solder removal mechanism. DESCRIPTION OF SYMBOLS 1... Suction pump, 2... Through hole, 3... Soldering iron 1.4... Board, 5... Residual solder, 6...
Soldering iron, 7... Metal fiber, 10... Electronic component with board, 11... Electronic component, 12... Test board (board), 13... Pallet, 14... Metal plate , 15・
...Electrode, 16...Residual solder, 100...Electronic component supply unit with board, 101...+:'-da 1.1
02...Sensor part, 103...Handling part, 1
04...Slide unit part, 1o5...Unloader part, 106...Claw, 107...Elevating stage, 1
08...Detection sensor, 109...Transportation stage, 1
DESCRIPTION OF SYMBOLS 10... Chuck cylinder, 111... Lifting cylinder, 112... Positioning cylinder, 200... Electronic component removal unit (separation means), 201... Cam mechanism section, 2゜2... Heating conveyance Part, 203... Parts removal part, 204... Cam rotation shaft, 205... For vertical movement, l, 206... Cam for horizontal movement, 207 208...
・Spring, 209...camfoil for vertical movement"-21
0... Cam follower for horizontal movement 21 Yu... Rod for vertical movement, 2] 2... Rod for horizontal movement, 213... L-shaped guide, 214... Guide for vertical movement, 215... Base, 216... ...Horizontal movement guide, 217...Slide base 2, 218...Support kite, 219...Transfer 220...Heat τ7 hook (heating means), 221...Rodless cylinder, 222
... base, 223 ... slide unit), 224
・ ・ ・Head base, 225 ・ ・ ・Suction head, 226 ・ Cooling conveyor, 227 ・ Transfer chuck hand, 228 ・ Heat block, 300 ・
...Substrate collection unit, 400...Metal plate supply unit (installation means), 401...Metal plate discharge section, 402...
...Metal temporary holding department, 403...Handling department, 40
4... Conveyance section, 405... Flux coating '1f1 part, 406... Support stand, 407... Slide unit, 408... Index unit, 409...
Cartridge, 410... Guide plate, 411... Air cylinder, 412... Link, 413... Slide claw, 414... Through hole, 415... Guide, 416
...Air cylinder, 417...Guide claw, 418.
・・Air cylinder, 419・・Suction head, 420・
・・Air cylinder, 421 ・・Slide rail,
422... Air cylinder, 423... Slide rail, 424... Suction pad, 425... Guide, 426... Conveyor, 427... Supply chuck, 428... Flux, 500... Solder removal unit, 501... Cam mechanism section, 502... Heating conveyance section, 503... Heating head section, 504... Cam rotation shaft, 505... Cam for vertical movement, 506... For horizontal movement Cam, 507, 508... Spring, 509.
... Cam follower for vertical movement 510... Cam follower for horizontal movement 511... Rod for vertical movement, 512...
Horizontal movement rod, 513... L-shaped guide, 514...
・Downward movement guide, 515...Base, 516...
Horizontal movement guide, 517...Slide base, 518
...Support guide, 519...Transfer 52
0... Heat block (heating means), 521...
Heating head (pressing means), 522... Slide rail, 523... Link, 524... Cam connecting rod, 52
5... Support stand, 526... Adsorption [1,527...
Heating book, 528... Positioning bin, 529...
Pressing spring, (S00...Electronic parts storage court, 700... Frame
. Agent Patent Attorney Daiwa Tsutsui Figure 10 Figure A Figure 10 Figure 9 Figure 10 Figure 7/ 1 ≧ ni light 3 Figure 11 (b) Figure 13 520: Heat blower (heating means) Fig. 2 (b) Fig. 521: Heating head (pressing means) Fig. 16 (a) 16: Residual solder Fig. 18 Fig. 4 21 Ki Fig. 19

Claims (8)

[Claims] 1. An electronic component removal device comprising a desoldering mechanism for removing an electronic component from a board-attached electronic component having an electronic component soldered onto a board, and further removing residual solder from the electronic component, the electronic component removing device including the board-attached electronic component. a heating means for heating the electronic component with the board, a separating means for separating the electronic component with the board into the board and the electronic component, a mounting means for mounting the separated electronic component on a metal plate for soldering; heating means for heating the mounted electronic component; pressing means for pressing the mounted electronic component against the metal plate; and removal for uniformly removing residual solder by separating the pressed electronic component from the metal plate. What is claimed is: 1. An electronic component removal device with a desoldering mechanism, characterized by comprising means for removing solder. 2. 2. The electronic component removal device with a solder removal mechanism according to claim 1, wherein the electronic component with a board is supplied at any time depending on the state of removal of the electronic component. 3. 2. The electronic component removal device with a solder removal mechanism according to claim 1, wherein said heating means is a split-type heat block whose temperature can be controlled arbitrarily. 4. 2. The electronic component removal device with a solder removal mechanism according to claim 1, wherein the metal plate is formed of a concave copper plate that facilitates mounting of the electronic component and ensures reliable removal of solder. . 5. 2. The electronic component removal device with a solder removal mechanism according to claim 1, wherein the pressing means is configured to perform surface tracing along the pressing surface of the electronic component. 6. 2. The electronic component removal device with a solder removal mechanism according to claim 1, wherein said removing means transfers said residual solder to said metal plate by separating said electronic component from said metal plate. 7. The transportation of the electronic component with a board and the electronic component,
2. The electronic component removal device with a soldering mechanism according to claim 1, wherein the soldering is performed by cam driving by a cam mechanism. 8. 2. The electronic component removal device with a solder removal mechanism according to claim 1, wherein a series of operations for removing the electronic component from the electronic component with a board and further removing residual solder from the electronic component are performed automatically.